JP2018114573A - 研削装置 - Google Patents
研削装置 Download PDFInfo
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- JP2018114573A JP2018114573A JP2017005928A JP2017005928A JP2018114573A JP 2018114573 A JP2018114573 A JP 2018114573A JP 2017005928 A JP2017005928 A JP 2017005928A JP 2017005928 A JP2017005928 A JP 2017005928A JP 2018114573 A JP2018114573 A JP 2018114573A
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- Prior art keywords
- grinding
- wafer
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- turntable
- wheel
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- 235000012431 wafers Nutrition 0.000 claims description 85
- 238000013459 approach Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
- B24B47/206—Drives or gearings; Equipment therefor relating to feed movement for centreless grinding machines; for machines comprising work supports, e.g. steady rests
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
41 ターンテーブル
42 チャックテーブル(保持テーブル)
46 粗研削手段(第1の研削手段)
49 第1の研削ホイール
50 粗研削砥石(第1の研削砥石)
51 仕上げ研削手段(第2の研削手段)
54 第2の研削ホイール
55 仕上げ研削砥石(第2の研削砥石)
61 第1の研削送り手段
62 ガイド
65 ボールネジ(進退軸)
71 第2の研削送り手段
72 ガイド
75 ボールネジ(進退軸)
W ウエーハ
A1、A2 研削領域
A1a、A2a 図心
A1b、A2b 弦
Claims (2)
- ターンテーブルと、該ターンテーブルの回転軸心を中心に等角度で複数配設したウエーハを保持する回転可能な保持テーブルと、環状に第1の研削砥石を配設した第1の研削ホイールを回転可能に装着して該保持テーブルが保持したウエーハの半径範囲で該第1の研削砥石を接触させウエーハをインフィード研削する第1の研削手段と、該第1の研削手段を該保持テーブルに対して接近および離間する研削送り方向に研削送りする第1の研削送り手段と、環状に第2の研削砥石を配設した第2の研削ホイールを回転可能に装着して該保持テーブルが保持したウエーハの半径範囲で該第2の研削砥石を接触させウエーハをインフィード研削する第2の研削手段と、該第2の研削手段を該保持テーブルに対して接近および離間する研削送り方向に研削送りする第2の研削送り手段と、を備える研削装置であって、
該第1の研削送り手段および該第2の研削送り手段は、
該研削送り方向に平行で該研削手段を挟んで配設する2本のガイドと、該ガイドにより方向づけられた該研削手段を該研削送り方向に進退させる進退軸と、をそれぞれ備え、
該第1の研削手段および該第2の研削手段が、該保持テーブルが保持したウエーハを研削する研削領域は、該研削砥石の幅で該研削ホイールの中心を中心とした円弧状で一方の端がウエーハの外周で他方の端がウエーハの中心に位置づけられ、
上矢視による該研削領域の図心を該2本のガイドのそれぞれの軸心を結んだ基準線上に配置し、該研削領域の該一方の端と該他方の端とを結んだ弦と該基準線とを直交に配置し、該第1の研削送り手段の該基準線と該第2の研削送り手段の該基準線とを該ターンテーブルの回転軸心を軸に対称位置に配置する研削装置。 - 該第1の研削手段の進退軸の軸心と該第2の研削手段の進退軸の軸心とを、それぞれの該基準線上に配置する請求項1記載の研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017005928A JP2018114573A (ja) | 2017-01-17 | 2017-01-17 | 研削装置 |
TW106142330A TWI746717B (zh) | 2017-01-17 | 2017-12-04 | 磨削裝置 |
CN201810022495.6A CN108326699B (zh) | 2017-01-17 | 2018-01-10 | 磨削装置 |
US15/873,216 US10522373B2 (en) | 2017-01-17 | 2018-01-17 | Grinding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017005928A JP2018114573A (ja) | 2017-01-17 | 2017-01-17 | 研削装置 |
Publications (1)
Publication Number | Publication Date |
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JP2018114573A true JP2018114573A (ja) | 2018-07-26 |
Family
ID=62841063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017005928A Pending JP2018114573A (ja) | 2017-01-17 | 2017-01-17 | 研削装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10522373B2 (ja) |
JP (1) | JP2018114573A (ja) |
CN (1) | CN108326699B (ja) |
TW (1) | TWI746717B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240031035A (ko) | 2022-08-29 | 2024-03-07 | 가부시기가이샤 디스코 | 웨이퍼의 연삭 방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108581676B (zh) * | 2018-08-15 | 2023-12-26 | 河南卫创轴承精工科技有限公司 | 一种用于圆锥滚子的球头端面磨削装置 |
CN111633531B (zh) * | 2020-06-10 | 2022-03-04 | 华海清科股份有限公司 | 一种具有单腔清洗装置的减薄设备 |
JP2022040720A (ja) * | 2020-08-31 | 2022-03-11 | 株式会社ディスコ | 加工装置 |
Citations (6)
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US20050176350A1 (en) * | 2004-02-05 | 2005-08-11 | Robert Gerber | Semiconductor wafer grinder |
JP2009141176A (ja) * | 2007-12-07 | 2009-06-25 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
JP2010172999A (ja) * | 2009-01-28 | 2010-08-12 | Disco Abrasive Syst Ltd | 加工装置 |
JP2012081556A (ja) * | 2010-10-12 | 2012-04-26 | Disco Corp | 加工装置 |
JP2014014877A (ja) * | 2012-07-06 | 2014-01-30 | Disco Abrasive Syst Ltd | 研削装置 |
JP2014083636A (ja) * | 2012-10-24 | 2014-05-12 | Disco Abrasive Syst Ltd | 研削装置 |
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JP2000015570A (ja) * | 1998-07-02 | 2000-01-18 | Disco Abrasive Syst Ltd | 研削装置 |
JP2002025961A (ja) * | 2000-07-04 | 2002-01-25 | Disco Abrasive Syst Ltd | 半導体ウエーハの研削方法 |
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JP5073962B2 (ja) * | 2006-05-12 | 2012-11-14 | 株式会社ディスコ | ウエーハの加工方法 |
JP4986568B2 (ja) * | 2006-10-11 | 2012-07-25 | 株式会社ディスコ | ウエーハの研削加工方法 |
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JP5149020B2 (ja) * | 2008-01-23 | 2013-02-20 | 株式会社ディスコ | ウエーハの研削方法 |
JP5406676B2 (ja) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | ウエーハの加工装置 |
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JP5943766B2 (ja) | 2012-08-06 | 2016-07-05 | 株式会社ディスコ | 研削装置 |
CN105150065B (zh) * | 2015-10-12 | 2018-02-16 | 广东博科数控机械有限公司 | 一种多工位圆盘式新型布轮抛光机 |
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2017
- 2017-01-17 JP JP2017005928A patent/JP2018114573A/ja active Pending
- 2017-12-04 TW TW106142330A patent/TWI746717B/zh active
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2018
- 2018-01-10 CN CN201810022495.6A patent/CN108326699B/zh active Active
- 2018-01-17 US US15/873,216 patent/US10522373B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050176350A1 (en) * | 2004-02-05 | 2005-08-11 | Robert Gerber | Semiconductor wafer grinder |
JP2009141176A (ja) * | 2007-12-07 | 2009-06-25 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
JP2010172999A (ja) * | 2009-01-28 | 2010-08-12 | Disco Abrasive Syst Ltd | 加工装置 |
JP2012081556A (ja) * | 2010-10-12 | 2012-04-26 | Disco Corp | 加工装置 |
JP2014014877A (ja) * | 2012-07-06 | 2014-01-30 | Disco Abrasive Syst Ltd | 研削装置 |
JP2014083636A (ja) * | 2012-10-24 | 2014-05-12 | Disco Abrasive Syst Ltd | 研削装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240031035A (ko) | 2022-08-29 | 2024-03-07 | 가부시기가이샤 디스코 | 웨이퍼의 연삭 방법 |
Also Published As
Publication number | Publication date |
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TW201829932A (zh) | 2018-08-16 |
US20180204746A1 (en) | 2018-07-19 |
CN108326699A (zh) | 2018-07-27 |
CN108326699B (zh) | 2021-06-11 |
US10522373B2 (en) | 2019-12-31 |
TWI746717B (zh) | 2021-11-21 |
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