JP2018114559A - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
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- JP2018114559A JP2018114559A JP2017004807A JP2017004807A JP2018114559A JP 2018114559 A JP2018114559 A JP 2018114559A JP 2017004807 A JP2017004807 A JP 2017004807A JP 2017004807 A JP2017004807 A JP 2017004807A JP 2018114559 A JP2018114559 A JP 2018114559A
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- Prior art keywords
- wafer
- polishing
- center
- holding table
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005498 polishing Methods 0.000 title claims abstract description 146
- 238000003825 pressing Methods 0.000 claims abstract description 82
- 238000007517 polishing process Methods 0.000 claims description 17
- 230000000737 periodic effect Effects 0.000 claims description 4
- 230000002950 deficient Effects 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 230000001360 synchronised effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 164
- 238000004140 cleaning Methods 0.000 description 14
- 239000002002 slurry Substances 0.000 description 12
- 238000001514 detection method Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000003384 imaging method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Images
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
40 保持手段
41 保持テーブル
42 保持面
51 研磨手段
53 研磨パッド
61 研磨送り手段
71 判断手段
91a、91b、91c 押し付け力測定部
O 保持テーブルの中心
O1 ウエーハの中心
W ウエーハ
Claims (1)
- ウエーハを保持する保持面を有する保持テーブルを回転可能に装着する保持手段と、ウエーハを研磨する研磨面を有する研磨パッドを回転可能に装着し該保持テーブルが保持したウエーハに該研磨パッドを押し付けてウエーハを研磨する研磨手段と、該研磨手段を該保持テーブルに該保持面に対して垂直方向に研磨送りする研磨送り手段と、該研磨手段もしくは該保持手段に配設し該研磨パッドをウエーハに押し付ける押し付け力を測定する押し付け力測定部と、を備える研磨装置であって、
該保持テーブルの回転軸心と該研磨パッドの回転軸心とは、該保持面方向において一致していない位置に位置づけられていて、
研磨加工中において該押し付け力測定部が測定する押し付け力に該保持テーブルの回転数に同期した周期的な変化が存在していたら、該保持テーブルの中心に対して該保持テーブルが保持しているウエーハの中心がずれていると判断する判断手段を備え、
該判断手段によりウエーハの研磨加工不良を防止するために研磨加工を中断させることを可能にした研磨装置。
Priority Applications (1)
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JP2017004807A JP6906312B2 (ja) | 2017-01-16 | 2017-01-16 | 研磨装置 |
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JP2017004807A JP6906312B2 (ja) | 2017-01-16 | 2017-01-16 | 研磨装置 |
Publications (2)
Publication Number | Publication Date |
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JP2018114559A true JP2018114559A (ja) | 2018-07-26 |
JP6906312B2 JP6906312B2 (ja) | 2021-07-21 |
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JP2017004807A Active JP6906312B2 (ja) | 2017-01-16 | 2017-01-16 | 研磨装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020196078A (ja) * | 2019-05-31 | 2020-12-10 | 株式会社ディスコ | 研磨装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07122524A (ja) * | 1993-10-21 | 1995-05-12 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | 半導体ウエハを研削するための回転研削盤用ワークホルダ及び該ワークホルダを位置決めするための方法 |
JP2006066891A (ja) * | 2004-07-26 | 2006-03-09 | Toshiba Corp | 基板処理方法および基板処理装置 |
JP2012152859A (ja) * | 2011-01-26 | 2012-08-16 | Disco Corp | 研削装置 |
-
2017
- 2017-01-16 JP JP2017004807A patent/JP6906312B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07122524A (ja) * | 1993-10-21 | 1995-05-12 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | 半導体ウエハを研削するための回転研削盤用ワークホルダ及び該ワークホルダを位置決めするための方法 |
JP2006066891A (ja) * | 2004-07-26 | 2006-03-09 | Toshiba Corp | 基板処理方法および基板処理装置 |
JP2012152859A (ja) * | 2011-01-26 | 2012-08-16 | Disco Corp | 研削装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020196078A (ja) * | 2019-05-31 | 2020-12-10 | 株式会社ディスコ | 研磨装置 |
JP7246257B2 (ja) | 2019-05-31 | 2023-03-27 | 株式会社ディスコ | 研磨装置 |
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