JP2018075688A - フランジ機構 - Google Patents
フランジ機構 Download PDFInfo
- Publication number
- JP2018075688A JP2018075688A JP2016220282A JP2016220282A JP2018075688A JP 2018075688 A JP2018075688 A JP 2018075688A JP 2016220282 A JP2016220282 A JP 2016220282A JP 2016220282 A JP2016220282 A JP 2016220282A JP 2018075688 A JP2018075688 A JP 2018075688A
- Authority
- JP
- Japan
- Prior art keywords
- cutting blade
- ring
- flange
- base
- spindle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 112
- 238000005520 cutting process Methods 0.000 claims abstract description 252
- 230000002093 peripheral effect Effects 0.000 claims abstract description 54
- 239000002699 waste material Substances 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 9
- 238000004891 communication Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2614—Means for mounting the cutting member
- B26D7/2621—Means for mounting the cutting member for circular cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
4 装置基台
4a 開口
6 X軸移動テーブル
8 防塵防滴カバー
10 チャックテーブル
10a 保持面
10b クランプ
12 突出部
14 切削ユニット
14a,76,86 切削ブレード
14b 側面
14c,80 基台
14d,78 装着穴
16 カセットエレベータ
18 カセット
20 支持構造
22 切削ユニット移動機構
24 Y軸ガイドレール
26 Y軸移動プレート
28 Y軸ボールねじ
30 Z軸ガイドレール
32 Z軸移動プレート
34 Z軸ボールねじ
36 Z軸パルスモータ
38 撮像ユニット(カメラ)
40 洗浄ユニット
42 スピンナテーブル
44 噴射ノズル
46 スピンドルハウジング
46a 端部
46b ねじ穴
48 スピンドル
48a テーパー部
48b 先端小径部
48c 雄ねじ
48d ねじ穴
50 ロータリージョイント
50a 円筒状ボス部
50b フランジ部
50c 収容穴
50d パイプ
50e 取り付け穴
50f ねじ
52,70,88 フランジ機構
54 スピンドル装着穴
56,72,90 ボス部
58,70a,94 フランジ部
58a,94a 支持面
58b 環状溝
58c 吸引孔
60,74,92a Oリング装着溝
60a,74a,92b Oリング
62 円筒部
62a 環状溝
62b 連通孔
64 連通路
66 ボルト
68,98 ナット
82 切り刃
84 識別コード
90a 雄ねじ
92 ブレード装着部
96 着脱フランジ
100 給気路
Claims (3)
- 中央に装着穴を有する円盤状の基台と、該基台の外周縁に設けられた切り刃と、を有する切削ブレードを、回転軸となるスピンドルに装着するためのフランジ機構であって、
前後方向に伸長する円柱状の形状で、Oリングが装着されるOリング装着溝を前方側の外周面に有するボス部と、
該ボス部の後方側から径方向外向きに突出し、該切削ブレードの該基台を支持し前方側に向いた支持面を有するフランジ部と、
該フランジ部の内側に設けられ、スピンドルの先端部が挿入されるスピンドル装着穴と、を備え、
該基台の装着穴の径よりも大きい外径のOリングが該Oリング装着溝に装着された該ボス部を該基台の該装着穴に挿入し、基台の内周面に該Oリングを接触させることで、該切削ブレードを支持することを特徴とするフランジ機構。 - 該フランジ部は、
該支持面に該ボス部を囲む環状の開口と、
内部に該開口と、吸引源と、を連通する吸引路と、を有し、
切削ブレードを吸引固定する機能を有することを特徴とする、請求項1に記載のフランジ機構。 - 中央に装着穴を有する円盤状の切り刃でなる切削ブレードを、回転軸となるスピンドルに装着するためのフランジ機構であって、
前後方向に伸長する円柱状の形状で、前方側の外周に雄ねじを有するボス部と、
該ボス部の後方側から径方向外向きに突出し、Oリングが装着されるOリング装着溝を外周面に有するブレード装着部と、
該ブレード装着部の後方側から径方向外向きに該ブレード装着部よりも突出し、該切削ブレードを支持し前方側に向いた支持面を有するフランジ部と、
該フランジ部の内側に設けられ、スピンドルの先端部が挿入されるスピンドル装着穴と、を備え、
該切削ブレードの該装着穴の径よりも大きい外径のOリングが該Oリング装着溝に装着された該ブレード装着部を該切削ブレードの該装着穴に挿入し、該切削ブレードの内周面に該Oリングを接触させることで、該切削ブレードを支持することを特徴とするフランジ機構。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016220282A JP6769680B2 (ja) | 2016-11-11 | 2016-11-11 | フランジ機構 |
TW106134889A TWI724247B (zh) | 2016-11-11 | 2017-10-12 | 凸緣機構 |
CN201711090646.3A CN108074859B (zh) | 2016-11-11 | 2017-11-08 | 凸缘机构 |
KR1020170148507A KR102223587B1 (ko) | 2016-11-11 | 2017-11-09 | 플랜지 기구 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016220282A JP6769680B2 (ja) | 2016-11-11 | 2016-11-11 | フランジ機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018075688A true JP2018075688A (ja) | 2018-05-17 |
JP6769680B2 JP6769680B2 (ja) | 2020-10-14 |
Family
ID=62149896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016220282A Active JP6769680B2 (ja) | 2016-11-11 | 2016-11-11 | フランジ機構 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6769680B2 (ja) |
KR (1) | KR102223587B1 (ja) |
CN (1) | CN108074859B (ja) |
TW (1) | TWI724247B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020199593A (ja) * | 2019-06-10 | 2020-12-17 | 株式会社ディスコ | フランジ機構 |
JP2020199592A (ja) * | 2019-06-10 | 2020-12-17 | 株式会社ディスコ | フランジ機構 |
JP2021030348A (ja) * | 2019-08-22 | 2021-03-01 | 株式会社ディスコ | フランジ機構 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113084564A (zh) * | 2021-03-09 | 2021-07-09 | 武汉镁里镁科技有限公司 | 一种长薄壁管件加工夹具及加工方法 |
TWI809493B (zh) * | 2021-09-02 | 2023-07-21 | 中國砂輪企業股份有限公司 | 可提供加工資訊的研磨工具及包含其的研磨系統 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57197456U (ja) * | 1981-06-11 | 1982-12-15 | ||
WO2001036157A1 (fr) * | 1999-11-12 | 2001-05-25 | Sankyo Diamond Industrial Co., Ltd. | Dispositif de fixation d'un element coupant rotatif a des outils electriques ou analogues et outil coupant rotatif pourvu d'un tel dispositif de fixation |
JP2005059151A (ja) * | 2003-08-13 | 2005-03-10 | Disco Abrasive Syst Ltd | 切削装置 |
JP2009196016A (ja) * | 2008-02-20 | 2009-09-03 | Tenryu Saw Mfg Co Ltd | 回転工具の取付け装置 |
JP2010036275A (ja) * | 2008-08-01 | 2010-02-18 | Disco Abrasive Syst Ltd | 切削装置 |
JP2011194477A (ja) * | 2010-03-17 | 2011-10-06 | Disco Corp | 切削ブレード |
JP2011251366A (ja) * | 2010-06-01 | 2011-12-15 | Disco Corp | 切削装置 |
JP2015023222A (ja) * | 2013-07-22 | 2015-02-02 | 株式会社ディスコ | 切削装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1140276A (en) * | 1966-10-01 | 1969-01-15 | E M S Electrical Products Ltd | Electric current collector |
US6375741B2 (en) * | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
JPH06283600A (ja) * | 1993-03-29 | 1994-10-07 | Shinko Electric Ind Co Ltd | ダイシング用テープおよびこれを用いた材料切断方法 |
JP2000190155A (ja) | 1998-10-14 | 2000-07-11 | Disco Abrasive Syst Ltd | ハブブレ―ド |
JP2002154054A (ja) | 2000-11-17 | 2002-05-28 | Disco Abrasive Syst Ltd | 切削ブレードの装着機構 |
JP2002219648A (ja) * | 2001-01-24 | 2002-08-06 | Disco Abrasive Syst Ltd | ブレードの装着方法及び切削装置 |
JP4680573B2 (ja) * | 2004-11-16 | 2011-05-11 | 株式会社ナベヤ | クランプ装置 |
JP4716012B2 (ja) * | 2005-10-14 | 2011-07-06 | Nok株式会社 | トルク変動吸収ダンパ |
JP5457131B2 (ja) | 2009-10-07 | 2014-04-02 | 株式会社ディスコ | ブレード交換装置 |
JP6341681B2 (ja) | 2014-02-12 | 2018-06-13 | 株式会社ディスコ | ブレード装着工具 |
-
2016
- 2016-11-11 JP JP2016220282A patent/JP6769680B2/ja active Active
-
2017
- 2017-10-12 TW TW106134889A patent/TWI724247B/zh active
- 2017-11-08 CN CN201711090646.3A patent/CN108074859B/zh active Active
- 2017-11-09 KR KR1020170148507A patent/KR102223587B1/ko active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57197456U (ja) * | 1981-06-11 | 1982-12-15 | ||
WO2001036157A1 (fr) * | 1999-11-12 | 2001-05-25 | Sankyo Diamond Industrial Co., Ltd. | Dispositif de fixation d'un element coupant rotatif a des outils electriques ou analogues et outil coupant rotatif pourvu d'un tel dispositif de fixation |
JP2005059151A (ja) * | 2003-08-13 | 2005-03-10 | Disco Abrasive Syst Ltd | 切削装置 |
JP2009196016A (ja) * | 2008-02-20 | 2009-09-03 | Tenryu Saw Mfg Co Ltd | 回転工具の取付け装置 |
JP2010036275A (ja) * | 2008-08-01 | 2010-02-18 | Disco Abrasive Syst Ltd | 切削装置 |
JP2011194477A (ja) * | 2010-03-17 | 2011-10-06 | Disco Corp | 切削ブレード |
JP2011251366A (ja) * | 2010-06-01 | 2011-12-15 | Disco Corp | 切削装置 |
JP2015023222A (ja) * | 2013-07-22 | 2015-02-02 | 株式会社ディスコ | 切削装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020199593A (ja) * | 2019-06-10 | 2020-12-17 | 株式会社ディスコ | フランジ機構 |
JP2020199592A (ja) * | 2019-06-10 | 2020-12-17 | 株式会社ディスコ | フランジ機構 |
KR20200141389A (ko) | 2019-06-10 | 2020-12-18 | 가부시기가이샤 디스코 | 플랜지 기구 |
JP2021030348A (ja) * | 2019-08-22 | 2021-03-01 | 株式会社ディスコ | フランジ機構 |
JP7446067B2 (ja) | 2019-08-22 | 2024-03-08 | 株式会社ディスコ | フランジ機構 |
Also Published As
Publication number | Publication date |
---|---|
KR102223587B1 (ko) | 2021-03-04 |
JP6769680B2 (ja) | 2020-10-14 |
CN108074859A (zh) | 2018-05-25 |
CN108074859B (zh) | 2023-05-12 |
KR20180053247A (ko) | 2018-05-21 |
TWI724247B (zh) | 2021-04-11 |
TW201820448A (zh) | 2018-06-01 |
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