JP2018006374A - 基板昇降機構、基板載置台および基板処理装置 - Google Patents
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
Description
図1は、本発明の一実施形態が適用されるプラズマエッチング装置を示す断面図である。
図2は基板昇降機構8を示す断面図である。基板昇降機構8は、基板Gの周縁部と、中央部の複数個所に設けられている。基板昇降機構8の配置および個数は、基板Gの大きさや形状によって、撓みが少ない状態で基板Gを昇降できるように適宜設定される。
まず、プラズマエッチング処理の際に、昇降ピン51の昇降位置においてプラズマの不均一が生じないようにするために、予め、昇降ピン51の先端の高さ位置を基板載置台3の基板載置面から0.1mm以内に調整する。
2;チャンバー(処理容器)
3;基板載置台
5;基材
8;基板昇降機構
10;シャワーヘッド
15:処理ガス供給管
18:処理ガス供給源
24a,24b;整合器
25a,25b;高周波電源
30;排気部
40;制御部
51;昇降ピン
52;昇降・ガイド部
53;取り付け部
54;駆動部
55;カバー部材
61;ガイド部材
62;支柱部
63;昇降部材
64;ベローズ
73;シャフト
73b;中間シャフト部
81;ベース板
82;モーター
84;ロッド
85;昇降ヘッド
86;ロッドガイド部
91;シールドフィンガー
G;基板
Claims (11)
- 基板に対してプラズマ処理を行うプラズマ処理装置の処理容器内において基板を載置する基板載置台の載置台本体に複数設けられ、基板を昇降する基板昇降機構であって、
前記載置台本体の挿通孔に挿通され、基板載置面に対して突没するように昇降自在に設けられ、その先端で基板を支持する昇降ピンと、
前記昇降ピンをその内部で昇降可能に支持し、かつ昇降ピンをガイドする昇降・ガイド部と、
前記昇降ピンを昇降駆動する駆動部と
を有し、
前記昇降・ガイド部および前記駆動部は、前記載置台本体に支持され、かつ前記処理容器には支持されていないことを特徴とする基板昇降機構。 - 前記載置台本体の内部に設けられ、前記昇降・ガイド部が気密に取り付けられる取り付け部をさらに有することを特徴とする請求項1に記載の基板昇降機構。
- 前記昇降・ガイド部は、
前記取り付け部に気密に取り付けられ、内部に前記載置台本体の前記挿通孔に連通し、前記昇降ピンが挿通される第1空間を有し、前記昇降ピンをガイドするガイド部材と、
前記ガイド部材の前記第1空間に連通する第2空間を有し、前記昇降ピンの下端部が取り付けられ、前記昇降ピンが昇降とともに伸縮するベローズと、
前記駆動部により昇降され、前記ベローズの下端部を介して前記昇降ピンを昇降させる昇降部材と、
前記昇降部材の昇降路を形成する支柱部とを有し、
前記第1空間および前記第2空間は、前記挿通孔を介して前記処理容器内の真空雰囲気に連通していることを特徴とする請求項2に記載の基板昇降機構。 - 前記駆動部は、前記支柱部の下端部に取り付けられたベース板と、前記ベース板に取り付けられたモーターと、前記モーターから前記ベース板を貫通して上方に延びるロッドと、前記ロッドの先端に取り付けられ、前記昇降部材を昇降させる昇降ヘッドとを有するモーターシリンダーとして構成されることを特徴とする請求項3に記載の基板昇降機構。
- 前記駆動部は、前記ベース板に内蔵された、前記ロッドをガイドするロッドガイド部をさらに有することを特徴とする請求項4に記載の基板昇降機構。
- 前記載置台本体には高周波電力が印加され、前記基板昇降機構は、少なくとも前記昇降・ガイド部を覆うように設けられた、高周波を遮蔽するカバー部材をさらに有することを特徴とする請求項4または請求項5に記載の基板昇降機構。
- 前記カバー部材は、高周波を遮蔽するように、上端が前記処理容器の底部に固定され、下端が前記ベース板の下面にバネ材を介して接触されていることを特徴とする請求項6に記載の基板昇降機構。
- 前記支柱部は、前記昇降部材の昇降路に沿って上下に延びる複数のシャフトを有し、前記シャフトの中間部、および前記昇降部材は絶縁性材料からなり、これらが前記載置台本体からの高周波電力を遮断することを特徴とする請求項6または請求項7に記載の基板昇降機構。
- 前記昇降・ガイド部は、メンテナンスの際に前記載置台本体とともに吊り上げられることが可能であることを特徴とする請求項1から請求項8に記載の基板昇降機構。
- 基板に対してプラズマ処理を行うプラズマ処理装置の処理容器内において基板を載置する基板載置台であって、
載置台本体と、
前記載置台本体に複数設けられ、基板を昇降する基板昇降機構とを有し、
前記基板昇降機構は、請求項1から請求項9のいずれかの構成を有することを特徴とする基板載置台。 - 基板を収容する処理容器と、
前記処理容器内に設けられ、基板が載置される基板載置台と、
前記処理容器内に処理ガスを供給する処理ガス供給機構と、
前記処理容器内を排気する排気機構と、
前記処理容器内に処理ガスのプラズマを生成するプラズマ生成機構と
を具備し、
基板に対してプラズマ処理を施すプラズマ処理装置であって、
前記基板載置台は、
載置台本体と、
前記載置台本体に複数設けられ、基板を昇降する基板昇降機構とを有し、
前記基板昇降機構は、請求項1から請求項9のいずれかの構成を有することを特徴とする基板処理装置。
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JP2016126599A JP6650841B2 (ja) | 2016-06-27 | 2016-06-27 | 基板昇降機構、基板載置台および基板処理装置 |
KR1020170080365A KR102002216B1 (ko) | 2016-06-27 | 2017-06-26 | 기판 승강 기구, 기판 탑재대 및 기판 처리 장치 |
CN201710499522.4A CN107546171B (zh) | 2016-06-27 | 2017-06-27 | 基板升降机构、基板载置台和基板处理装置 |
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JP2020036003A (ja) * | 2018-08-30 | 2020-03-05 | バット ホールディング アーゲー | 電気的に絶縁されたピンリフター |
KR20210024122A (ko) * | 2018-08-10 | 2021-03-04 | 베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디. | 리프트 핀 시스템, 반응 챔버 및 반도체 가공 디바이스 |
JP2021166251A (ja) * | 2020-04-07 | 2021-10-14 | 東京エレクトロン株式会社 | 基板処理装置 |
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KR101987577B1 (ko) * | 2018-01-24 | 2019-06-10 | 주식회사 기가레인 | 승강하는 유도부와 연동하는 배기조절부를 포함하는 기판 처리 장치 |
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JP7122907B2 (ja) * | 2018-08-24 | 2022-08-22 | 東京エレクトロン株式会社 | 昇降装置、半導体製造装置の組立装置、半導体製造装置の組立方法 |
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JP2020167288A (ja) * | 2019-03-29 | 2020-10-08 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理装置のメンテナンス方法 |
DE102019006050A1 (de) * | 2019-08-28 | 2021-03-04 | Vat Holding Ag | Stifthubvorrichtung mit Gleitführung |
CN110610895A (zh) * | 2019-09-29 | 2019-12-24 | 江苏鲁汶仪器有限公司 | 一种用于平台的弹簧顶针机构及真空等离子处理腔体 |
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KR20210024122A (ko) * | 2018-08-10 | 2021-03-04 | 베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디. | 리프트 핀 시스템, 반응 챔버 및 반도체 가공 디바이스 |
JP2021533569A (ja) * | 2018-08-10 | 2021-12-02 | 北京北方華創微電子装備有限公司Beijing Naura Microelectronics Equipment Co., Ltd. | リフトシンブルシステム、反応チャンバおよび半導体処理装置 |
KR102425674B1 (ko) | 2018-08-10 | 2022-07-27 | 베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디. | 리프트 핀 시스템, 반응 챔버 및 반도체 가공 디바이스 |
US11694880B2 (en) | 2018-08-10 | 2023-07-04 | Beijing Naura Microelectronics Equipment Co., Ltd | Lift thimble system, reaction chamber, and semiconductor processing equipment |
JP2020036003A (ja) * | 2018-08-30 | 2020-03-05 | バット ホールディング アーゲー | 電気的に絶縁されたピンリフター |
JP2021166251A (ja) * | 2020-04-07 | 2021-10-14 | 東京エレクトロン株式会社 | 基板処理装置 |
JP7446145B2 (ja) | 2020-04-07 | 2024-03-08 | 東京エレクトロン株式会社 | 基板処理装置 |
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CN107546171A (zh) | 2018-01-05 |
CN107546171B (zh) | 2021-01-19 |
JP6650841B2 (ja) | 2020-02-19 |
KR102002216B1 (ko) | 2019-07-19 |
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