JP2017199900A5 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

Info

Publication number
JP2017199900A5
JP2017199900A5 JP2017081073A JP2017081073A JP2017199900A5 JP 2017199900 A5 JP2017199900 A5 JP 2017199900A5 JP 2017081073 A JP2017081073 A JP 2017081073A JP 2017081073 A JP2017081073 A JP 2017081073A JP 2017199900 A5 JP2017199900 A5 JP 2017199900A5
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacturing semiconductor
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017081073A
Other languages
English (en)
Other versions
JP6968567B2 (ja
JP2017199900A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2017199900A publication Critical patent/JP2017199900A/ja
Publication of JP2017199900A5 publication Critical patent/JP2017199900A5/ja
Application granted granted Critical
Publication of JP6968567B2 publication Critical patent/JP6968567B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017081073A 2016-04-22 2017-04-17 半導体装置の作製方法 Active JP6968567B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016086372 2016-04-22
JP2016086372 2016-04-22

Publications (3)

Publication Number Publication Date
JP2017199900A JP2017199900A (ja) 2017-11-02
JP2017199900A5 true JP2017199900A5 (ja) 2020-04-23
JP6968567B2 JP6968567B2 (ja) 2021-11-17

Family

ID=60090426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017081073A Active JP6968567B2 (ja) 2016-04-22 2017-04-17 半導体装置の作製方法

Country Status (2)

Country Link
US (2) US9947777B2 (ja)
JP (1) JP6968567B2 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10032918B2 (en) 2016-04-22 2018-07-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI737665B (zh) 2016-07-01 2021-09-01 日商半導體能源硏究所股份有限公司 半導體裝置以及半導體裝置的製造方法
US9978879B2 (en) 2016-08-31 2018-05-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2018138619A1 (en) 2017-01-30 2018-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US11699704B2 (en) * 2017-09-28 2023-07-11 Intel Corporation Monolithic integration of a thin film transistor over a complimentary transistor
US11205664B2 (en) 2017-12-27 2021-12-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US11929426B2 (en) 2018-09-05 2024-03-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
KR20210080432A (ko) * 2018-10-26 2021-06-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 금속 산화물의 제작 방법, 반도체 장치의 제작 방법
US10978563B2 (en) 2018-12-21 2021-04-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US20220189766A1 (en) * 2019-04-10 2022-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US11711922B2 (en) 2019-07-12 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Memory device with memory cells comprising multiple transistors
JPWO2022038447A1 (ja) * 2020-08-19 2022-02-24

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1998374A3 (en) 2005-09-29 2012-01-18 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device having oxide semiconductor layer and manufacturing method thereof
JP5078246B2 (ja) 2005-09-29 2012-11-21 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
WO2011007682A1 (en) * 2009-07-17 2011-01-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
WO2011052367A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101747158B1 (ko) 2009-11-06 2017-06-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치를 제작하기 위한 방법
WO2011142467A1 (en) * 2010-05-14 2011-11-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101680768B1 (ko) * 2010-12-10 2016-11-29 삼성전자주식회사 트랜지스터 및 이를 포함하는 전자장치
JP5784479B2 (ja) * 2010-12-28 2015-09-24 株式会社半導体エネルギー研究所 半導体装置
US9331206B2 (en) * 2011-04-22 2016-05-03 Semiconductor Energy Laboratory Co., Ltd. Oxide material and semiconductor device
JP6168795B2 (ja) 2012-03-14 2017-07-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US9190525B2 (en) * 2012-07-06 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor layer
KR102211215B1 (ko) * 2012-09-14 2021-02-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US9455349B2 (en) 2013-10-22 2016-09-27 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor thin film transistor with reduced impurity diffusion
US9960280B2 (en) 2013-12-26 2018-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9472678B2 (en) 2013-12-27 2016-10-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102325158B1 (ko) * 2014-01-30 2021-11-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 전자 기기, 및 반도체 장치의 제작 방법
TWI672804B (zh) * 2014-05-23 2019-09-21 日商半導體能源研究所股份有限公司 半導體裝置的製造方法
KR102441803B1 (ko) * 2014-09-02 2022-09-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 촬상 장치 및 전자 기기
US9768317B2 (en) * 2014-12-08 2017-09-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and electronic device
US9882061B2 (en) 2015-03-17 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US11189736B2 (en) 2015-07-24 2021-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6802656B2 (ja) 2015-07-30 2020-12-16 株式会社半導体エネルギー研究所 メモリセルの作製方法及び半導体装置の作製方法
WO2017081579A1 (en) * 2015-11-13 2017-05-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN113105213A (zh) * 2015-12-29 2021-07-13 株式会社半导体能源研究所 金属氧化物膜以及半导体装置
US10700212B2 (en) 2016-01-28 2020-06-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, semiconductor wafer, module, electronic device, and manufacturing method thereof
DE112017000905T5 (de) 2016-02-18 2018-10-25 Semiconductor Energy Laboratory Co., Ltd. Halbleitervorrichtung, Herstellungsverfahren dafür, Anzeigevorrichtung und elektronisches Gerät

Similar Documents

Publication Publication Date Title
JP2017199900A5 (ja) 半導体装置の作製方法
JP2019004144A5 (ja) 半導体デバイス
DE102016200026B8 (de) Wafer-Herstellungsverfahren
EP3379588A4 (en) Semiconductor device manufacturing method
HK1231630A1 (zh) 半導體器件以及半導體器件的製造方法
DE112017007068T8 (de) Halbleitervorrichtung
SG11201709671YA (en) Semiconductor device manufacturing method
TWI800057B (zh) 半導體裝置的製造方法
EP3279924A4 (en) Semiconductor device manufacturing method
SG10201605337UA (en) Manufacturing method of semiconductor device
TWI801301B (zh) 半導體記憶裝置
KR20180084795A (ko) 반도체 장치, 이 반도체 장치의 제작 방법, 또는 이 반도체 장치를 가지는 표시 장치
EP3442013A4 (en) SEMICONDUCTOR COMPONENT MANUFACTURING METHOD
ITUB20160027A1 (it) Procedimento per produrre dispositivi a semiconduttore e corrispondente dispositivo
TWI800873B (zh) 半導體記憶裝置
EP3442012A4 (en) SEMICONDUCTOR COMPONENT MANUFACTURING METHOD
GB201800780D0 (en) Semiconductor device and method for manufacturing semiconductor device
DK3093891T3 (da) Halvledersubstrat, halvlederindretning og fremgangsmåde til fremstilling af halvledersubstrat
TWI800668B (zh) 晶片製造方法
JPWO2019197946A5 (ja) 半導体装置
DE102017110821A8 (de) Halbleitervorrichtung
TWI800509B (zh) 器件晶片的製造方法
SG11201800460YA (en) Method for manufacturing semiconductor wafer
EP3439023A4 (en) METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
EP3439025A4 (en) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE