JP2017188498A - 拡張装置 - Google Patents
拡張装置 Download PDFInfo
- Publication number
- JP2017188498A JP2017188498A JP2016074261A JP2016074261A JP2017188498A JP 2017188498 A JP2017188498 A JP 2017188498A JP 2016074261 A JP2016074261 A JP 2016074261A JP 2016074261 A JP2016074261 A JP 2016074261A JP 2017188498 A JP2017188498 A JP 2017188498A
- Authority
- JP
- Japan
- Prior art keywords
- holding
- wafer
- frame
- adhesive tape
- expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims abstract description 76
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 230000008602 contraction Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/06—Severing by using heat
- B26F3/16—Severing by using heat by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
光源 :YAGパルスレーザ
波長 :1064nm
パルス出力 :0.8W
集光スポット径 :φ1.5μm
繰り返し周波数 :60kHz
加工送り速度 :600mm/s
12 デバイス
13 改質層
100 フレーム
110 粘着テープ
111 ウエーハ保持領域
112 収縮領域
20 レーザ加工装置
30 拡張装置
32 フレーム保持手段
321 フレーム保持部材
321a 載置面
322 クランプ機構
33 保持テーブル
332 吸着チャック
332a 保持面
334 拡張補助ローラ
34 進退手段
35 加熱手段
351 赤外線ヒータ
Claims (4)
- 環状のフレームの開口部を覆って装着されウエーハが貼着される熱収縮性及びエキスパンド性を有する粘着テープを拡張する拡張装置であって、
該フレームを保持するフレーム保持手段と、
該フレーム保持手段に保持された該フレームに装着された粘着テープの該ウエーハが貼着されているウエーハ保持領域を吸引保持する保持面を有する保持テーブルと、
該保持面と直交する軸方向に該フレーム保持手段と該保持テーブルとを基準位置と該保持面が該フレーム保持手段から突出した拡張位置との間で相対的に移動させる進退手段と、
該進退手段によって該ウエーハ保持領域と該フレームとの間で拡張した該粘着テープを収縮させる加熱手段と、を備え、
該保持テーブルは、該保持面の外周に、該ウエーハ保持領域と該フレームとの間の該粘着テープに作用する拡張補助ローラを有し、
該拡張補助ローラは、該保持面の径方向に拡張する際の該粘着テープの移動方向に倣う向きにのみ回転するワンウェイローラであることを特徴とする拡張装置。 - 該保持面が、複数の該拡張補助ローラで囲繞されている請求項1記載の拡張装置。
- 複数の該拡張補助ローラは、少なくとも一つが該ワンウェイローラである請求項2記載の拡張装置。
- 該ワンウェイローラは、所望の外径を有する円筒状のカバーローラと、該カバーローラの内側に嵌合したワンウェイクラッチと、を備え、一方向にのみ回転する請求項1から3のいずれか一項に記載の拡張装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016074261A JP6618412B2 (ja) | 2016-04-01 | 2016-04-01 | 拡張装置 |
TW106106090A TWI718262B (zh) | 2016-04-01 | 2017-02-23 | 擴張裝置 |
KR1020170038331A KR102168715B1 (ko) | 2016-04-01 | 2017-03-27 | 확장 장치 |
CN201710197604.3A CN107275256B (zh) | 2016-04-01 | 2017-03-29 | 扩展装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016074261A JP6618412B2 (ja) | 2016-04-01 | 2016-04-01 | 拡張装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017188498A true JP2017188498A (ja) | 2017-10-12 |
JP6618412B2 JP6618412B2 (ja) | 2019-12-11 |
Family
ID=60045001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016074261A Active JP6618412B2 (ja) | 2016-04-01 | 2016-04-01 | 拡張装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6618412B2 (ja) |
KR (1) | KR102168715B1 (ja) |
CN (1) | CN107275256B (ja) |
TW (1) | TWI718262B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019117896A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社ディスコ | 被加工物の分割方法及び分割装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7027137B2 (ja) * | 2017-11-30 | 2022-03-01 | 株式会社ディスコ | ウエーハの分割方法およびウエーハの分割装置 |
TW202119521A (zh) * | 2019-11-12 | 2021-05-16 | 力成科技股份有限公司 | 晶圓擴片裝置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0251248A (ja) * | 1988-08-15 | 1990-02-21 | Nitto Denko Corp | 半導体ウエハの自動貼付け装置 |
JPH07122583A (ja) * | 1993-10-26 | 1995-05-12 | Fujitsu Ltd | 半導体装置の製造方法及び半導体製造装置 |
JP2007123658A (ja) * | 2005-10-31 | 2007-05-17 | Disco Abrasive Syst Ltd | 粘着テープの拡張装置 |
JP2014063953A (ja) * | 2012-09-24 | 2014-04-10 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2015190562A (ja) * | 2014-03-28 | 2015-11-02 | キヤノン株式会社 | ワンウェイクラッチ、及び、シート搬送ローラ |
JP2015204362A (ja) * | 2014-04-14 | 2015-11-16 | 株式会社ディスコ | チップ間隔維持方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0212944A (ja) * | 1988-06-30 | 1990-01-17 | Nec Corp | 半導体装置製造用シート拡大装置 |
JP4390503B2 (ja) * | 2003-08-27 | 2009-12-24 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
JP2006173269A (ja) * | 2004-12-14 | 2006-06-29 | Hamamatsu Photonics Kk | 基板加工方法及びフィルム伸張装置 |
JP4851795B2 (ja) * | 2006-01-13 | 2012-01-11 | 株式会社ディスコ | ウエーハの分割装置 |
JP2009272503A (ja) * | 2008-05-09 | 2009-11-19 | Disco Abrasive Syst Ltd | フィルム状接着剤の破断装置及び破断方法 |
JP2013118326A (ja) | 2011-12-05 | 2013-06-13 | Disco Abrasive Syst Ltd | 分割装置 |
KR101322579B1 (ko) * | 2012-05-25 | 2013-10-28 | 세메스 주식회사 | 마운팅 테이프 확장 모듈 및 이를 포함하는 반도체 소자들을 픽업하기 위한 장치 |
JP5980600B2 (ja) * | 2012-07-12 | 2016-08-31 | 株式会社ディスコ | テープ拡張装置 |
-
2016
- 2016-04-01 JP JP2016074261A patent/JP6618412B2/ja active Active
-
2017
- 2017-02-23 TW TW106106090A patent/TWI718262B/zh active
- 2017-03-27 KR KR1020170038331A patent/KR102168715B1/ko active IP Right Grant
- 2017-03-29 CN CN201710197604.3A patent/CN107275256B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0251248A (ja) * | 1988-08-15 | 1990-02-21 | Nitto Denko Corp | 半導体ウエハの自動貼付け装置 |
JPH07122583A (ja) * | 1993-10-26 | 1995-05-12 | Fujitsu Ltd | 半導体装置の製造方法及び半導体製造装置 |
JP2007123658A (ja) * | 2005-10-31 | 2007-05-17 | Disco Abrasive Syst Ltd | 粘着テープの拡張装置 |
JP2014063953A (ja) * | 2012-09-24 | 2014-04-10 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2015190562A (ja) * | 2014-03-28 | 2015-11-02 | キヤノン株式会社 | ワンウェイクラッチ、及び、シート搬送ローラ |
JP2015204362A (ja) * | 2014-04-14 | 2015-11-16 | 株式会社ディスコ | チップ間隔維持方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019117896A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社ディスコ | 被加工物の分割方法及び分割装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6618412B2 (ja) | 2019-12-11 |
KR102168715B1 (ko) | 2020-10-21 |
TW201737391A (zh) | 2017-10-16 |
KR20170113271A (ko) | 2017-10-12 |
CN107275256B (zh) | 2022-02-22 |
TWI718262B (zh) | 2021-02-11 |
CN107275256A (zh) | 2017-10-20 |
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