JP2017017286A - チャックテーブル及び洗浄装置 - Google Patents
チャックテーブル及び洗浄装置 Download PDFInfo
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- JP2017017286A JP2017017286A JP2015135409A JP2015135409A JP2017017286A JP 2017017286 A JP2017017286 A JP 2017017286A JP 2015135409 A JP2015135409 A JP 2015135409A JP 2015135409 A JP2015135409 A JP 2015135409A JP 2017017286 A JP2017017286 A JP 2017017286A
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- Prior art keywords
- wafer
- chuck table
- adhesive tape
- suction
- annular frame
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims description 37
- 239000002390 adhesive tape Substances 0.000 claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 239000012530 fluid Substances 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 81
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
【解決手段】 環状フレームの開口を覆うように該環状フレームに貼着された粘着テープでウェーハが支持されたウェーハユニットを保持するチャックテーブルであって、該環状フレームの開口より小さくウェーハの直径より大きく形成され、平坦な底面を有する凹部と、該粘着テープを介して保持したウェーハを囲繞する領域の該凹部の該底面又は内周面に形成された複数の吸引孔と、該複数の吸引孔を吸引源に連通する吸引路と、を備え、該ウェーハユニットを保持する際は、該粘着テープで覆われた該凹部に負圧を発生させ、該粘着テープを介してウェーハを該底面で吸引保持することを特徴とする。
【選択図】図4
Description
12 スピンナー洗浄装置
16 チャックテーブル
18 テーブルベース
19 ウェーハユニット
20 保持テーブル
22 円形凹部
24 環状凸部
26 吸引孔
28,30 吸引路
34 吸引源
38 流体供給ユニット
44 洗浄水ノズル
46 エアノズル
48 除電ユニット
50 イオン化エアノズル
T 粘着テープ(ダイシングテープ)
F 環状フレーム
Claims (3)
- 環状フレームの開口を覆うように該環状フレームに貼着された粘着テープでウェーハが支持されたウェーハユニットを保持するチャックテーブルであって、
該環状フレームの開口より小さくウェーハの直径より大きく形成され、平坦な底面を有する凹部と、
該粘着テープを介して保持したウェーハを囲繞する領域の該凹部の該底面又は内周面に形成された複数の吸引孔と、
該複数の吸引孔を吸引源に連通する吸引路と、を備え、
該ウェーハユニットを保持する際は、該粘着テープで覆われた該凹部に負圧を発生させ、該粘着テープを介してウェーハを該底面で吸引保持することを特徴とするチャックテーブル。 - 環状フレームの開口を覆うように該環状フレームに貼着された粘着テープでウェーハが支持されたウェーハユニットの該ウェーハを洗浄する洗浄装置であって、
回転可能に支持された請求項1記載のチャックテーブルと、
該チャックテーブルに保持されたウェーハに流体を供給する流体供給手段と、
を備えたことを特徴とする洗浄装置。 - 該チャックテーブルに保持されたウェーハにイオン化エアを供給する除電手段を更に備えたことを特徴とする請求項2記載の洗浄装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015135409A JP6494451B2 (ja) | 2015-07-06 | 2015-07-06 | チャックテーブル及び洗浄装置 |
TW105117412A TWI681485B (zh) | 2015-07-06 | 2016-06-02 | 工作夾台及洗淨裝置 |
KR1020160082689A KR102435772B1 (ko) | 2015-07-06 | 2016-06-30 | 척 테이블 및 세정 장치 |
CN201610522459.7A CN106340483B (zh) | 2015-07-06 | 2016-07-05 | 卡盘工作台和清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015135409A JP6494451B2 (ja) | 2015-07-06 | 2015-07-06 | チャックテーブル及び洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017017286A true JP2017017286A (ja) | 2017-01-19 |
JP6494451B2 JP6494451B2 (ja) | 2019-04-03 |
Family
ID=57826939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015135409A Active JP6494451B2 (ja) | 2015-07-06 | 2015-07-06 | チャックテーブル及び洗浄装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6494451B2 (ja) |
KR (1) | KR102435772B1 (ja) |
CN (1) | CN106340483B (ja) |
TW (1) | TWI681485B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020136357A (ja) * | 2019-02-14 | 2020-08-31 | 株式会社ディスコ | チャックテーブル及び検査装置 |
JP2021108338A (ja) * | 2019-12-27 | 2021-07-29 | パナソニックIpマネジメント株式会社 | 樹脂塗布装置、樹脂膜形成方法ならびに素子チップの製造方法 |
JP7442342B2 (ja) | 2020-02-28 | 2024-03-04 | 株式会社ディスコ | 搬出方法及び搬出装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018167367A (ja) * | 2017-03-30 | 2018-11-01 | 株式会社ディスコ | 研削装置 |
JP6994852B2 (ja) * | 2017-06-30 | 2022-01-14 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
JP7108424B2 (ja) * | 2018-02-20 | 2022-07-28 | 株式会社ディスコ | 保護膜形成装置 |
KR20230043981A (ko) * | 2020-07-31 | 2023-03-31 | 램 리써치 코포레이션 | 로우-틸팅 (low-tilt) 트렌치 에칭을 위한 박형 섀도우 링 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002313891A (ja) * | 2001-04-16 | 2002-10-25 | Matsushita Electric Ind Co Ltd | 基板搬送用トレーおよびその製造方法 |
JP2005066798A (ja) * | 2003-08-27 | 2005-03-17 | Disco Abrasive Syst Ltd | 加工装置のチャックテーブル |
JP2012049359A (ja) * | 2010-08-27 | 2012-03-08 | Disco Abrasive Syst Ltd | ダイシング加工装置 |
JP2015112552A (ja) * | 2013-12-12 | 2015-06-22 | 株式会社ディスコ | 静電気除去装置および加工機 |
Family Cites Families (14)
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JP2002203783A (ja) * | 2001-10-18 | 2002-07-19 | Tokyo Electron Ltd | 処理方法及び処理装置 |
JP4020938B2 (ja) * | 2005-08-22 | 2007-12-12 | 東京エレクトロン株式会社 | 半導体ウェハ用搬送トレイおよび半導体ウェハ搬送システム |
JP2007281050A (ja) * | 2006-04-04 | 2007-10-25 | Miraial Kk | 半導体ウエハのウエハトレイ |
JP2008283025A (ja) * | 2007-05-11 | 2008-11-20 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2009043771A (ja) * | 2007-08-06 | 2009-02-26 | Disco Abrasive Syst Ltd | チャックテーブル機構および被加工物の保持方法 |
JP2010016147A (ja) * | 2008-07-03 | 2010-01-21 | Disco Abrasive Syst Ltd | 粘着テープの貼着方法 |
JP5198203B2 (ja) * | 2008-09-30 | 2013-05-15 | 株式会社ディスコ | 加工装置 |
JP2010283286A (ja) | 2009-06-08 | 2010-12-16 | Disco Abrasive Syst Ltd | ワーク保持装置 |
JP2011135026A (ja) * | 2009-11-27 | 2011-07-07 | Disco Abrasive Syst Ltd | ワークユニットの保持方法および保持機構 |
JP5607965B2 (ja) * | 2010-03-23 | 2014-10-15 | 日東電工株式会社 | 半導体ウエハマウント方法および半導体ウエハマウント装置 |
JP5554617B2 (ja) * | 2010-04-12 | 2014-07-23 | 株式会社ディスコ | 保持テーブル |
JP6059921B2 (ja) * | 2012-08-31 | 2017-01-11 | 日東電工株式会社 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
JP6189700B2 (ja) * | 2013-10-03 | 2017-08-30 | 株式会社ディスコ | ウエーハの加工方法 |
JP6276988B2 (ja) * | 2013-12-27 | 2018-02-07 | 日東精機株式会社 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
-
2015
- 2015-07-06 JP JP2015135409A patent/JP6494451B2/ja active Active
-
2016
- 2016-06-02 TW TW105117412A patent/TWI681485B/zh active
- 2016-06-30 KR KR1020160082689A patent/KR102435772B1/ko active IP Right Grant
- 2016-07-05 CN CN201610522459.7A patent/CN106340483B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002313891A (ja) * | 2001-04-16 | 2002-10-25 | Matsushita Electric Ind Co Ltd | 基板搬送用トレーおよびその製造方法 |
JP2005066798A (ja) * | 2003-08-27 | 2005-03-17 | Disco Abrasive Syst Ltd | 加工装置のチャックテーブル |
JP2012049359A (ja) * | 2010-08-27 | 2012-03-08 | Disco Abrasive Syst Ltd | ダイシング加工装置 |
JP2015112552A (ja) * | 2013-12-12 | 2015-06-22 | 株式会社ディスコ | 静電気除去装置および加工機 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020136357A (ja) * | 2019-02-14 | 2020-08-31 | 株式会社ディスコ | チャックテーブル及び検査装置 |
JP7217165B2 (ja) | 2019-02-14 | 2023-02-02 | 株式会社ディスコ | チャックテーブル及び検査装置 |
DE102020201863B4 (de) | 2019-02-14 | 2024-02-22 | Disco Corporation | Einspanntisch und Untersuchungsvorrichtung |
JP2021108338A (ja) * | 2019-12-27 | 2021-07-29 | パナソニックIpマネジメント株式会社 | 樹脂塗布装置、樹脂膜形成方法ならびに素子チップの製造方法 |
JP7390615B2 (ja) | 2019-12-27 | 2023-12-04 | パナソニックIpマネジメント株式会社 | 樹脂塗布装置、樹脂膜形成方法ならびに素子チップの製造方法 |
JP7442342B2 (ja) | 2020-02-28 | 2024-03-04 | 株式会社ディスコ | 搬出方法及び搬出装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20170005762A (ko) | 2017-01-16 |
KR102435772B1 (ko) | 2022-08-23 |
TWI681485B (zh) | 2020-01-01 |
CN106340483A (zh) | 2017-01-18 |
CN106340483B (zh) | 2021-11-19 |
TW201703173A (zh) | 2017-01-16 |
JP6494451B2 (ja) | 2019-04-03 |
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