JP2017005094A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2017005094A JP2017005094A JP2015117171A JP2015117171A JP2017005094A JP 2017005094 A JP2017005094 A JP 2017005094A JP 2015117171 A JP2015117171 A JP 2015117171A JP 2015117171 A JP2015117171 A JP 2015117171A JP 2017005094 A JP2017005094 A JP 2017005094A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- type conductive
- printed wiring
- conductive pins
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 116
- 239000002184 metal Substances 0.000 claims abstract description 116
- 239000000758 substrate Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000007789 sealing Methods 0.000 description 11
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 229910006913 SnSb Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract
【解決手段】
第3種導電ピン33aは、島状領域の間隙に接する辺Laから測って、最も遠く離れた位置に配置されている第1種導電ピン31a1より遠い位置で、第1金属層12a1に接続されるように配置する。同様に、第3種導電ピン33bは、島状領域の間隙に接する辺Lbから測って、最も遠く離れた位置に配置されている第1種導電ピン31bより遠い位置で、第1金属層12b1に接続されるように配置する。
【選択図】図2
Description
例えば、チョッパー制御用の半導体装置200は、図5の等価回路に示されるように、直列接続されたMOSトランジスタ1aとダイオード1bとによって構成することができる。外部端子55に入力された制御信号によってMOSトランジスタ1aがオンした時は、実線の矢印によって示されるように、外部端子51から外部端子52に向かって電流が流れる。一方、MOSトランジスタ1aがオフした時は、破線の矢印によって示されるように、外部端子51から外部端子53に向かって電流が流れる。このように、半導体装置200は、電流の向きを交互に切り替えることができるので、例えばモーターを駆動する電気回路等に使用することができる。
本発明において、上記問題点は、半導体装置を下記のように構成することによって解決される。
本発明の半導体装置に係る他の実施形態について説明する。図3には、半導体装置101の平面図が示されている。図面を見易くするために絶縁回路基板の絶縁板、プリント配線板、外部端子、封止樹脂は図示せず、導電ピンの配置の説明に要する半導体素子1c、1d、絶縁回路基板の金属層12c、12d、第1種導電ピン31c1、31d1、第2種導電ピン32c1、32d1、第3種導電ピン33c1、33d1のみを図示している。金属層12c及び金属層12dは、それぞれ長方形の島状領域をなして、互いに隣接しており、これら2つの島状領域の間隙に接する辺を、それぞれ辺Lc、辺Ldとする。
本発明の半導体装置に係る他の実施形態について説明する。図4には、半導体装置102の平面図が示されている。図面を見易くするために絶縁回路基板の絶縁板、プリント配線板、外部端子、封止樹脂、ケースは図示せず、導電ピンの配置の説明に要する半導体素子1e、1f、1g、絶縁回路基板の金属層12e、12f、12g、第1種導電ピン31e、31f、31g、第2種導電ピン32e、32f、32g、第3種導電ピン33e、33fのみを図示している。金属層12e、12f、12gは、長方形の島状領域をなして、3つ横並びに隣接している。ここで、中央に位置する金属層12gの第1種導電ピン31gと第2種導電ピン32gは、図示しないプリント配線板を傾ける作用の支点となるピン、もしくは支点に隣接するピンであるから、力のモーメントとしては殆ど寄与しないため考慮せず、金属層12eに配置された導電ピンによる力のモーメントと、12fとに配置された導電ピンによる力のモーメントが均衡するように、第3種導電ピンを配置すればよい。
1b ダイオード(半導体素子)
1c、1d、1e、1f、1g 半導体素子
3a1、3b1、4a1、4a2、4b1 接合部材
10a、10b 絶縁回路基板
11a、11b 絶縁板
12a、12a1、12a2、12b、12b1、12b2、12b3、12c、12d、12e、12f、12g 半導体素子を接合する金属層
13a、13b 冷却器に接合される金属層
20 プリント配線板
21 プリント配線板の絶縁板
22、23 プリント配線板の金属層
31a、31b 第1種導電ピン
32a、32b 第2種導電ピン
33a、33b 第3種導電ピン
51、52、53、54、55 外部端子
70 封止樹脂
100、101、102、200 半導体装置
F 接合不良
P 支点
La、Lb、Lc、Ld、Le、Lf 島状領域の間隙に接する辺
Claims (2)
- 絶縁基板と、前記絶縁基板の一方の主面に配置され複数の島状領域に分かれている第1金属層と、前記絶縁基板の他方の主面に配置された第2金属層と、を有する絶縁回路基板と、
前記第1金属層に接合される半導体素子と、
前記第1金属層に対向して配置され、前記複数の島状領域に跨がるプリント配線板と、
一端が前記プリント配線板に固着され、他端が前記半導体素子の表面電極にはんだ接合されている第1種導電ピンと、
一端が前記プリント配線板に固着され、他端が前記第1金属層にはんだ接合されている第2種導電ピンと、
一端が前記プリント配線板に固着され、他端が前記第1金属層にはんだ接合され、電気回路から独立している第3種導電ピンと、
を備え、
前記第3種導電ピンは、隣接する前記島状領域のそれぞれにおいて、前記島状領域の間隙に接する辺から測って、最も遠く離れた位置に配置されている前記第1種導電ピン又は前記第2種導電ピンと同じ位置、もしくはより遠い位置で、前記第1金属層に接続されるように、前記プリント配線板上に配置されている半導体装置。 - 前記第3種導電ピンを配置する前記島状領域のうち、接続される前記第1種導電ピンと前記第2種導電ピンの合計本数の少ない方の島状領域に、前記第3種導電ピンが多く配置されている、請求項1に記載の半導体装置。
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