JP2017191903A - 半導体装置の放熱構造 - Google Patents
半導体装置の放熱構造 Download PDFInfo
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- JP2017191903A JP2017191903A JP2016081963A JP2016081963A JP2017191903A JP 2017191903 A JP2017191903 A JP 2017191903A JP 2016081963 A JP2016081963 A JP 2016081963A JP 2016081963 A JP2016081963 A JP 2016081963A JP 2017191903 A JP2017191903 A JP 2017191903A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 230000005855 radiation Effects 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims description 49
- 238000009413 insulation Methods 0.000 abstract description 11
- 238000004088 simulation Methods 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】基板20と電気的に接続される電気的接合面11aと、その反対側の放熱面11bとを有する半導体デバイス10の放熱構造103であって、放熱面11bが導電性TIM33を介してヒートスプレッダ31に接触するとともに、このヒートスプレッダ31が絶縁性TIM43を介してヒートシンク30に接触しており、ヒートスプレッダ31の半導体デバイス10側の面が、半導体デバイス10の外周の近傍の少なくとも一部に凹部31aを有している。
【選択図】図1
Description
図1は本発明の第1実施形態に係る放熱構造103の概略を示す断面図である。
図2は本発明の第1実施形態の変形例に係る半導体デバイス10の放熱構造103Aの概略を示す断面図である。なお、第1実施形態と同じ構成部材には同じ参照符号を付し、以下では主として相違点について説明する。
11 パッケージ
12 電極
13 電極
20 基板
30 ヒートシンク
31 ヒートスプレッダ
33 導電性TIM
43 絶縁性TIM
51 導電性ネジ
52 絶縁性ネジ
Claims (3)
- 基板と電気的に接続される電気的接合面と、その反対側の放熱面とを有する半導体装置の放熱構造であって、
前記放熱面が非絶縁部材を介して導電性高熱伝導部材に接触するとともに、
この導電性高熱伝導部材が絶縁部材を介して放熱部品に接触しており、
前記導電性高熱伝導部材の前記半導体装置側の面が、前記半導体装置の外周の近傍の少なくとも一部に凹部を有していることを特徴とする、半導体装置の放熱構造。 - 請求項1に記載の半導体装置の放熱構造において、
前記基板が前記導電性高熱伝導部材に、前記基板のパターンの少なくとも一部が前記導電性高熱伝導部材と導通するように、導電性固定具によって固定されていることを特徴とする、半導体装置の放熱構造。 - 請求項1または2に記載の半導体装置の放熱構造において、
前記基板が前記導電性高熱伝導部材にさらに絶縁性固定具によって固定されていることを特徴とする、半導体装置の放熱構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016081963A JP6790432B2 (ja) | 2016-04-15 | 2016-04-15 | 半導体装置の放熱構造 |
US15/756,047 US10304754B2 (en) | 2016-04-15 | 2017-01-25 | Heat dissipation structure of semiconductor device |
PCT/JP2017/002440 WO2017179264A1 (ja) | 2016-04-15 | 2017-01-25 | 半導体装置の放熱構造 |
EP17782083.4A EP3327768B1 (en) | 2016-04-15 | 2017-01-25 | Heat dissipation structure of semiconductor device |
KR1020187001995A KR20180019221A (ko) | 2016-04-15 | 2017-01-25 | 반도체 장치의 방열 구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016081963A JP6790432B2 (ja) | 2016-04-15 | 2016-04-15 | 半導体装置の放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017191903A true JP2017191903A (ja) | 2017-10-19 |
JP6790432B2 JP6790432B2 (ja) | 2020-11-25 |
Family
ID=60041590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016081963A Active JP6790432B2 (ja) | 2016-04-15 | 2016-04-15 | 半導体装置の放熱構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10304754B2 (ja) |
EP (1) | EP3327768B1 (ja) |
JP (1) | JP6790432B2 (ja) |
KR (1) | KR20180019221A (ja) |
WO (1) | WO2017179264A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109637988A (zh) * | 2019-01-29 | 2019-04-16 | 西安微电子技术研究所 | 一种低热阻压力可控式散热盒体结构 |
EP3951863A1 (de) * | 2020-08-07 | 2022-02-09 | Siemens Aktiengesellschaft | Kontaktsystem mit zuverlässiger isolierung |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05183076A (ja) * | 1992-01-07 | 1993-07-23 | Fujitsu Ltd | 半導体パッケージ |
JP2007258448A (ja) * | 2006-03-23 | 2007-10-04 | Fujitsu Ltd | 半導体装置 |
JP2008300476A (ja) * | 2007-05-30 | 2008-12-11 | Sumitomo Electric Ind Ltd | パワーモジュール |
JP2009283768A (ja) * | 2008-05-23 | 2009-12-03 | Yokogawa Electric Corp | 冷却シールド装置 |
JP2012160646A (ja) * | 2011-02-02 | 2012-08-23 | Shindengen Electric Mfg Co Ltd | 電子回路装置及びその製造方法 |
US20140262192A1 (en) * | 2013-03-18 | 2014-09-18 | International Business Machines Corporation | Thermally reversible thermal interface materials with improved moisture resistance |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3451979B2 (ja) | 1999-04-28 | 2003-09-29 | 株式会社日立製作所 | 半導体装置 |
JP4555057B2 (ja) | 2004-11-19 | 2010-09-29 | ホシザキ電機株式会社 | 冷却貯蔵庫の運転制御装置 |
JP6075218B2 (ja) | 2013-06-11 | 2017-02-08 | 株式会社デンソー | 半導体装置 |
-
2016
- 2016-04-15 JP JP2016081963A patent/JP6790432B2/ja active Active
-
2017
- 2017-01-25 US US15/756,047 patent/US10304754B2/en active Active
- 2017-01-25 WO PCT/JP2017/002440 patent/WO2017179264A1/ja unknown
- 2017-01-25 EP EP17782083.4A patent/EP3327768B1/en active Active
- 2017-01-25 KR KR1020187001995A patent/KR20180019221A/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05183076A (ja) * | 1992-01-07 | 1993-07-23 | Fujitsu Ltd | 半導体パッケージ |
JP2007258448A (ja) * | 2006-03-23 | 2007-10-04 | Fujitsu Ltd | 半導体装置 |
JP2008300476A (ja) * | 2007-05-30 | 2008-12-11 | Sumitomo Electric Ind Ltd | パワーモジュール |
JP2009283768A (ja) * | 2008-05-23 | 2009-12-03 | Yokogawa Electric Corp | 冷却シールド装置 |
JP2012160646A (ja) * | 2011-02-02 | 2012-08-23 | Shindengen Electric Mfg Co Ltd | 電子回路装置及びその製造方法 |
US20140262192A1 (en) * | 2013-03-18 | 2014-09-18 | International Business Machines Corporation | Thermally reversible thermal interface materials with improved moisture resistance |
Also Published As
Publication number | Publication date |
---|---|
EP3327768A1 (en) | 2018-05-30 |
KR20180019221A (ko) | 2018-02-23 |
US10304754B2 (en) | 2019-05-28 |
EP3327768A4 (en) | 2019-05-01 |
WO2017179264A1 (ja) | 2017-10-19 |
JP6790432B2 (ja) | 2020-11-25 |
US20190027421A1 (en) | 2019-01-24 |
EP3327768B1 (en) | 2021-01-06 |
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