JP2016132017A - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
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- JP2016132017A JP2016132017A JP2015009273A JP2015009273A JP2016132017A JP 2016132017 A JP2016132017 A JP 2016132017A JP 2015009273 A JP2015009273 A JP 2015009273A JP 2015009273 A JP2015009273 A JP 2015009273A JP 2016132017 A JP2016132017 A JP 2016132017A
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- laser
- laser irradiation
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- holding
- laser beam
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- 230000001678 irradiating effect Effects 0.000 claims abstract description 7
- 238000003754 machining Methods 0.000 claims description 13
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Abstract
【解決手段】被加工物(11)を保持する保持手段(6)と、レーザー光線(L)を照射するレーザー照射手段(30)と、保持手段とレーザー照射手段とを加工送り方向に相対的に移動させる加工送り手段(8)と、保持手段とレーザー照射手段とを割り出し送り方向に相対的に移動させる割り出し送り手段(8)と、各部の動きを制御する制御手段(44)と、を備え、制御手段は、保持手段に対してレーザー照射手段を停止させる停止ステップに要する時間をta、レーザー光線の照射位置を次の分割予定ラインに合わせる割り出しステップに要する時間をtbとして、tb>taである場合、停止ステップと割り出しステップとを同時に開始し、停止ステップが終了した後の割り出しステップの残りの時間(tb−ta)を利用して、保持手段に対してレーザー照射手段を加速させる開始ステップを実施する。
【選択図】図1
Description
4 基台
6 チャックテーブル(保持手段)
6a 保持面
8 水平移動機構(加工送り手段、割り出し送り手段)
10 Y軸ガイドレール
12 Y軸移動テーブル
14 Y軸ボールネジ
16 Y軸パルスモータ
18 X軸ガイドレール
20 X軸移動テーブル
22 X軸ボールネジ
24 X軸パルスモータ
26 クランプ
28 支持構造
30 レーザー照射ユニット(レーザー照射手段)
32 鉛直移動機構
34 Z軸ガイドレール
36 支持ブロック
38 Z軸パルスモータ
40 支持アーム
42 カメラ
44 制御装置(制御手段)
T 軌跡
P1,P2,P3,P4,P5 点
Claims (1)
- レーザー光線を照射して被加工物を加工するレーザー加工装置であって、
被加工物を保持する保持手段と、
該保持手段に保持された被加工物にレーザー光線を照射するレーザー照射手段と、
該保持手段と該レーザー照射手段とを加工送り方向に相対的に移動させる加工送り手段と、
該保持手段と該レーザー照射手段とを割り出し送り方向に相対的に移動させる割り出し送り手段と、
各部の動きを制御する制御手段と、を備え、
該制御手段は、
該保持手段に対して該レーザー照射手段を該加工送り方向に平行な第1の向きに所定の速さで移動させながら、該レーザー照射手段からレーザー光線を照射して、該保持手段に保持された被加工物を任意の分割予定ラインに沿って被加工物の端部まで加工する加工ステップと、該加工ステップの後、該保持手段に対して該レーザー照射手段を停止させる停止ステップと、該保持手段と該レーザー照射手段とを該割り出し送り方向に相対的に移動させて、該レーザー光線の照射位置を次に加工する分割予定ラインの延長線上に合わせる割り出しステップと、該停止ステップの後、該保持手段に対して該レーザー照射手段を該第1の向きとは反対の第2の向きに加速させて、該レーザー光線が被加工物の端部に達する前に該所定の速さに到達させる開始ステップと、を実施する際に、
該停止ステップに要する時間をta、該割り出しステップに要する時間をtbとして、tb>taである場合、該加工ステップの後に該停止ステップと該割り出しステップとを同時に開始し、該停止ステップが終了した後の該割り出しステップの残りの時間(tb−ta)を利用して該開始ステップを実施することを特徴とするレーザー加工装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015009273A JP6501530B2 (ja) | 2015-01-21 | 2015-01-21 | レーザー加工装置 |
TW104141531A TWI670130B (zh) | 2015-01-21 | 2015-12-10 | 雷射加工裝置 |
SG10201510549SA SG10201510549SA (en) | 2015-01-21 | 2015-12-22 | Laser machining apparatus |
KR1020160002445A KR102351840B1 (ko) | 2015-01-21 | 2016-01-08 | 레이저 가공 장치 |
CN201610027648.7A CN105817768B (zh) | 2015-01-21 | 2016-01-15 | 激光加工装置 |
DE102016200527.8A DE102016200527A1 (de) | 2015-01-21 | 2016-01-18 | Laserbearbeitungsvorrichtung |
US15/001,447 US10532430B2 (en) | 2015-01-21 | 2016-01-20 | Laser machining apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015009273A JP6501530B2 (ja) | 2015-01-21 | 2015-01-21 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016132017A true JP2016132017A (ja) | 2016-07-25 |
JP6501530B2 JP6501530B2 (ja) | 2019-04-17 |
Family
ID=56293869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015009273A Active JP6501530B2 (ja) | 2015-01-21 | 2015-01-21 | レーザー加工装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10532430B2 (ja) |
JP (1) | JP6501530B2 (ja) |
KR (1) | KR102351840B1 (ja) |
CN (1) | CN105817768B (ja) |
DE (1) | DE102016200527A1 (ja) |
SG (1) | SG10201510549SA (ja) |
TW (1) | TWI670130B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180129641A (ko) | 2017-05-26 | 2018-12-05 | 가부시기가이샤 디스코 | 레이저 가공 장치 및 레이저 가공 방법 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6553940B2 (ja) * | 2015-05-15 | 2019-07-31 | 株式会社ディスコ | レーザー加工装置 |
CN108422114A (zh) * | 2017-02-14 | 2018-08-21 | 武汉楚天工业激光设备有限公司 | 一种多轴联动焊接仪表夹具 |
CN107097033B (zh) * | 2017-04-26 | 2019-11-01 | 西安建筑科技大学 | 一种90°弯管内壁堆焊变位装置 |
CN109249135A (zh) * | 2017-07-14 | 2019-01-22 | 上海菲克苏工具有限公司 | 一种光纤激光打标机 |
JP6677706B2 (ja) * | 2017-12-27 | 2020-04-08 | ファナック株式会社 | リンク情報生成装置、リンク情報生成方法及びリンク情報生成プログラム |
JP6998231B2 (ja) * | 2018-02-20 | 2022-01-18 | 株式会社ディスコ | 加工装置 |
CN109093260A (zh) * | 2018-10-13 | 2018-12-28 | 深圳市科斯福科技有限公司 | 治具及产品编码打印设备 |
CN109894739B (zh) * | 2019-03-04 | 2024-04-09 | 无锡蓝智自动化科技有限公司 | 用于发动机气缸圈的全自动激光刻印装置 |
Citations (3)
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JP2000106340A (ja) * | 1997-09-26 | 2000-04-11 | Nikon Corp | 露光装置及び走査露光方法、並びにステージ装置 |
JP2008042032A (ja) * | 2006-08-08 | 2008-02-21 | Sumitomo Heavy Ind Ltd | ステージ駆動方法及び該方法を用いたレーザ加工装置 |
JP2012161799A (ja) * | 2011-02-03 | 2012-08-30 | Disco Corp | レーザー加工装置 |
Family Cites Families (6)
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JP4394210B2 (ja) * | 1999-09-08 | 2010-01-06 | 株式会社ディスコ | 切削方法 |
TW594421B (en) | 2002-01-30 | 2004-06-21 | Toshiba Corp | Film forming method/device, image-forming method and semiconductor device manufacturing method |
JP4694900B2 (ja) * | 2005-06-28 | 2011-06-08 | 株式会社ディスコ | レーザー加工方法 |
TWI516327B (zh) | 2012-11-30 | 2016-01-11 | Lts有限公司 | 用於控制雷射圖案成形裝置之階段的方法 |
CN103111763B (zh) | 2013-02-04 | 2015-10-28 | 福建省威诺数控有限公司 | 一种晶圆切割机床的运动路径的控制方法 |
JP6084883B2 (ja) * | 2013-04-08 | 2017-02-22 | 株式会社ディスコ | 円形板状物の分割方法 |
-
2015
- 2015-01-21 JP JP2015009273A patent/JP6501530B2/ja active Active
- 2015-12-10 TW TW104141531A patent/TWI670130B/zh active
- 2015-12-22 SG SG10201510549SA patent/SG10201510549SA/en unknown
-
2016
- 2016-01-08 KR KR1020160002445A patent/KR102351840B1/ko active IP Right Grant
- 2016-01-15 CN CN201610027648.7A patent/CN105817768B/zh active Active
- 2016-01-18 DE DE102016200527.8A patent/DE102016200527A1/de active Pending
- 2016-01-20 US US15/001,447 patent/US10532430B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000106340A (ja) * | 1997-09-26 | 2000-04-11 | Nikon Corp | 露光装置及び走査露光方法、並びにステージ装置 |
JP2008042032A (ja) * | 2006-08-08 | 2008-02-21 | Sumitomo Heavy Ind Ltd | ステージ駆動方法及び該方法を用いたレーザ加工装置 |
JP2012161799A (ja) * | 2011-02-03 | 2012-08-30 | Disco Corp | レーザー加工装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180129641A (ko) | 2017-05-26 | 2018-12-05 | 가부시기가이샤 디스코 | 레이저 가공 장치 및 레이저 가공 방법 |
US10406631B2 (en) | 2017-05-26 | 2019-09-10 | Disco Corporation | Laser processing apparatus and laser processing method |
Also Published As
Publication number | Publication date |
---|---|
US10532430B2 (en) | 2020-01-14 |
CN105817768A (zh) | 2016-08-03 |
TWI670130B (zh) | 2019-09-01 |
TW201632285A (zh) | 2016-09-16 |
CN105817768B (zh) | 2019-08-16 |
KR102351840B1 (ko) | 2022-01-18 |
DE102016200527A1 (de) | 2016-07-21 |
SG10201510549SA (en) | 2016-08-30 |
US20160207145A1 (en) | 2016-07-21 |
JP6501530B2 (ja) | 2019-04-17 |
KR20160090243A (ko) | 2016-07-29 |
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