JP2015225842A - 接合材およびそれを用いた接合方法 - Google Patents
接合材およびそれを用いた接合方法 Download PDFInfo
- Publication number
- JP2015225842A JP2015225842A JP2014112212A JP2014112212A JP2015225842A JP 2015225842 A JP2015225842 A JP 2015225842A JP 2014112212 A JP2014112212 A JP 2014112212A JP 2014112212 A JP2014112212 A JP 2014112212A JP 2015225842 A JP2015225842 A JP 2015225842A
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- silver
- bonding material
- mass
- material according
- dispersant
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
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- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
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Abstract
【解決手段】ヘキサン酸などの炭素数8以下の有機化合物で被覆され平均一次粒子径1〜50nmの銀微粒子と、オレイン酸などの有機化合物で被覆された平均一次粒子径0.5〜4μmの銀粒子と、1級アルコール系溶剤とテルペン系アルコール溶剤とからなる溶剤と、リン酸エステル系分散剤(またはリン酸エステル系分散剤とアクリル樹脂系分散剤)からなる分散剤を含む銀ペーストからなる接合材において、銀微粒子の含有量が5〜30質量%、銀粒子の含有量が60〜90質量%、銀微粒子と前記銀粒子の合計の含有量が90質量%以上であり、エーテル結合を有するモノカルボン酸系焼結助剤が添加されている。
【選択図】なし
Description
ヘキサン酸で被覆された平均一次粒子径20nmの銀微粒子(DOWAエレクトロニクス株式会社製のDP−1)19.785質量%と、オレイン酸で被覆された平均一次粒子径0.8μmの銀粒子(DOWAハイテック株式会社製のAG2-1C)72.215質量%と、エーテル結合を有するモノカルボン酸系焼結助剤としてのブトキシエトキシ酢酸(BEA)(東京化成工業株式会社製)1.0質量%と、リン酸エステル系分散剤(Lubrizol社製のSOLPLUS D540)0.14質量%とを含み、溶剤として、1−デカノール(アルコール)3.64質量%とテルペン系アルコール溶剤(日本テルペン化学株式会社製のテルソルブMTPH)3.22質量%を含む銀ペーストからなる接合材を用意した。なお、この接合材中の銀濃度は91.32質量%であった。
ブトキシエトキシ酢酸(BEA)の量を0.5質量%とし、1−デカノール(アルコール)の量を4.14質量%とした以外は、実施例1と同様の銀ペーストからなる接合材を用意した。なお、この接合材中の銀濃度は91.36質量%であった。
ブトキシエトキシ酢酸(BEA)の量を0.3質量%とし、1−デカノール(アルコール)の量を4.34質量%とした以外は、実施例1と同様の銀ペーストからなる接合材を用意した。なお、この接合材中の銀濃度は91.36質量%であった。
リン酸エステル系分散剤に加えて、アクリル樹脂系分散剤(楠本化成株式会社製のV0340)1.0質量%を添加し、1−デカノール(アルコール)の量を2.64質量%とした以外は、実施例1と同様の銀ペーストからなる接合材を用意した。なお、この接合材中の銀濃度は91.32質量%であった。
ブトキシエトキシ酢酸(BEA)に代えて、エーテル結合を有するジカルボン酸系焼結助剤であるジグリコール酸(DGA)(みどり化学株式会社製)0.067質量%を使用し、1−デカノール(アルコール)の量を3.58質量%とした以外は、実施例4と同様の銀ペーストからなる接合材を用意した。なお、この接合材中の銀濃度は91.33質量%であった。
ジグリコール酸(DGA)(ジカルボン酸)の量を0.201質量%とし、1−デカノール(アルコール)の量を3.44質量%とした以外は、比較例1と同様の銀ペーストからなる接合材を用意した。なお、この接合材中の銀濃度は91.48質量%であった。
ブトキシエトキシ酢酸(BEA)の量を0.1質量%とし、1−デカノール(アルコール)の量を4.54質量%とした以外は、実施例1と同様の銀ペーストからなる接合材を用意した。なお、この接合材中の銀濃度は89.46質量%であった。
Claims (14)
- 平均一次粒子径1〜50nmの銀微粒子と平均一次粒子径0.5〜4μmの銀粒子と溶剤と分散剤を含む銀ペーストからなる接合材において、銀微粒子の含有量が5〜30質量%、銀粒子の含有量が60〜90質量%、銀微粒子と前記銀粒子の合計の含有量が90質量%以上であり、エーテル結合を有するモノカルボン酸系焼結助剤が添加されていることを特徴とする、接合材。
- 前記エーテル結合を有するモノカルボン酸系焼結助剤がブトキシエトキシ酢酸であることを特徴とする、請求項1に記載の接合材。
- 前記エーテル結合を有するモノカルボン酸系焼結助剤の量が前記銀ペーストに対して0.2〜1.5質量%であることを特徴とする、請求項1または2に記載の接合材。
- 前記分散剤がリン酸エステル系分散剤であることを特徴とする、請求項1乃至3のいずれかに記載の接合材。
- 前記リン酸エステル系分散剤の量が前記銀ペーストに対して0.01〜0.2質量%であることを特徴とする、請求項4に記載の接合材。
- 前記分散剤がアクリル樹脂系分散剤を含むことを特徴とする、請求項4または5に記載の接合材。
- 前記アクリル樹脂系分散剤の量が前記銀ペーストに対して2質量%以下であることを特徴とする、請求項6に記載の接合材。
- 前記溶剤が1級アルコール系溶剤とテルペン系アルコール溶剤とからなることを特徴とする、請求項1乃至7のいずれかに記載の接合材。
- 前記銀微粒子が炭素数8以下の有機化合物で被覆されていることを特徴とする、請求項1乃至8のいずれかに記載の接合材。
- 前記銀微粒子を被覆する有機化合物がヘキサン酸であることを特徴とする、請求項9に記載の接合材。
- 前記銀粒子が有機化合物で被覆されていることを特徴とする、請求項1乃至10のいずれかに記載の接合材。
- 前記銀粒子を被覆する有機化合物がオレイン酸であることを特徴とする、請求項11に記載の接合材。
- 前記接合材の粘度をレオメーターにより25℃において6.4rpmで測定したときの粘度が100Pa・s以下であることを特徴とする、請求項1乃至12のいずれかに記載の接合材。
- 請求項1乃至13のいずれかに記載の接合材を被接合物間に介在させて加熱することにより、接合材中の銀を焼結させて銀接合層を形成し、この銀接合層により被接合物同士を接合することを特徴とする、接合方法。
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