JP2015179879A - 電子部品内蔵印刷回路基板 - Google Patents
電子部品内蔵印刷回路基板 Download PDFInfo
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- JP2015179879A JP2015179879A JP2015134194A JP2015134194A JP2015179879A JP 2015179879 A JP2015179879 A JP 2015179879A JP 2015134194 A JP2015134194 A JP 2015134194A JP 2015134194 A JP2015134194 A JP 2015134194A JP 2015179879 A JP2015179879 A JP 2015179879A
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 19
- 230000003746 surface roughness Effects 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 12
- 238000009413 insulation Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 description 19
- 238000012545 processing Methods 0.000 description 13
- 239000011810 insulating material Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 238000005554 pickling Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
- H01L2224/251—Disposition
- H01L2224/2518—Disposition being disposed on at least two different sides of the body, e.g. dual array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
- H01L2224/82009—Pre-treatment of the connector or the bonding area
- H01L2224/8203—Reshaping, e.g. forming vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3512—Cracking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
まず、図1は本発明による電子部品内蔵印刷回路基板の断面図である。
前記のように構成された本実施形態の電子部品内蔵印刷回路基板に対する製造方法について以下に図示された図面を参照して説明すると次のとおりである。
前記のような製造工程により図1及び図2a〜図2fのように製作された電子部品内蔵印刷回路基板の電子部品に対する外部電極とビア形成領域の接合信頼性をサンプリング測定すると、下記のように電子部品の外部電極が低粗面を形成することなく粗面のみが形成されて製作された場合より、外部電極に低粗面を形成して印刷回路基板を製作した場合の方が外部電極と絶縁層の接合力を向上させるとともにビアとメッキ層のクラック発生を防止することができることが分かる。
111 キャビティ
120 絶縁層
121 ビア
130 外部回路パターン
200 電子部品
201 本体
202 外部電極
202a 粗面
202b 低粗面
A ビア形成領域
Claims (6)
- キャビティが形成されたコアと、
前記コアの上部及び下部に積層され、前記キャビティ内に挿入された電子部品の外周面と接合する絶縁層と、
前記キャビティに挿入され、両側部に設けられた外部電極の表面に、表面粗さ(Ra)が0.05〜1μmの範囲である粗面が形成され、該粗面における前記絶縁層に形成されたビアの下部と接続するビア形成領域に低粗面が形成された電子部品と、
前記絶縁層上に設けられる外部回路パターンと、を含む、電子部品内蔵印刷回路基板。 - 前記電子部品は、両側部に設けられた外部電極と、前記外部電極の間に設けられた本体と、を含むMLCCである、請求項1に記載の電子部品内蔵印刷回路基板。
- 前記絶縁層に形成されたビアは、前記外部回路パターン及び前記外部電極を電気的に連結する請求項1に記載の電子部品内蔵印刷回路基板。
- 前記絶縁層は、前記キャビティと、前記電子部品との間の空間を充填する、請求項1に記載の電子部品内蔵印刷回路基板。
- 前記コアの上面及び下面に所定パターンの回路層が形成され、上面及び下面の回路層がスルーホールを介して電気的に連結される、請求項1に記載の電子部品内蔵印刷回路基板。
- 前記低粗面は、前記外部電極での表面粗さ(Ra)が0.03μm以下である、請求項1に記載の電子部品内蔵印刷回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0155031 | 2012-12-27 | ||
KR20120155031A KR101497192B1 (ko) | 2012-12-27 | 2012-12-27 | 전자부품 내장 인쇄회로기판 및 그 제조방법 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013218117A Division JP2014131006A (ja) | 2012-12-27 | 2013-10-21 | 電子部品内蔵印刷回路基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015179879A true JP2015179879A (ja) | 2015-10-08 |
JP6325489B2 JP6325489B2 (ja) | 2018-05-16 |
Family
ID=51015861
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013218117A Pending JP2014131006A (ja) | 2012-12-27 | 2013-10-21 | 電子部品内蔵印刷回路基板及びその製造方法 |
JP2014185127A Active JP5902266B2 (ja) | 2012-12-27 | 2014-09-11 | 電子部品内蔵印刷回路基板の製造方法 |
JP2015134194A Active JP6325489B2 (ja) | 2012-12-27 | 2015-07-03 | 電子部品内蔵印刷回路基板 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
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JP2013218117A Pending JP2014131006A (ja) | 2012-12-27 | 2013-10-21 | 電子部品内蔵印刷回路基板及びその製造方法 |
JP2014185127A Active JP5902266B2 (ja) | 2012-12-27 | 2014-09-11 | 電子部品内蔵印刷回路基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US10015884B2 (ja) |
JP (3) | JP2014131006A (ja) |
KR (1) | KR101497192B1 (ja) |
TW (1) | TWI504321B (ja) |
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JP2014131006A (ja) | 2014-07-10 |
JP6325489B2 (ja) | 2018-05-16 |
JP2014239258A (ja) | 2014-12-18 |
US20180279478A1 (en) | 2018-09-27 |
TW201429337A (zh) | 2014-07-16 |
KR101497192B1 (ko) | 2015-02-27 |
TWI504321B (zh) | 2015-10-11 |
JP5902266B2 (ja) | 2016-04-13 |
US10887995B2 (en) | 2021-01-05 |
US20140182911A1 (en) | 2014-07-03 |
US10015884B2 (en) | 2018-07-03 |
KR20140084974A (ko) | 2014-07-07 |
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