JP2015149392A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2015149392A JP2015149392A JP2014021247A JP2014021247A JP2015149392A JP 2015149392 A JP2015149392 A JP 2015149392A JP 2014021247 A JP2014021247 A JP 2014021247A JP 2014021247 A JP2014021247 A JP 2014021247A JP 2015149392 A JP2015149392 A JP 2015149392A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- nitride semiconductor
- layer
- semiconductor device
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 250
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 150000004767 nitrides Chemical class 0.000 claims description 101
- 238000002955 isolation Methods 0.000 claims description 28
- 229910002704 AlGaN Inorganic materials 0.000 claims 5
- 230000004888 barrier function Effects 0.000 abstract description 60
- 230000005533 two-dimensional electron gas Effects 0.000 abstract description 17
- 238000009413 insulation Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 395
- 239000010408 film Substances 0.000 description 230
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 38
- 229910002601 GaN Inorganic materials 0.000 description 37
- 238000000034 method Methods 0.000 description 35
- 238000004519 manufacturing process Methods 0.000 description 34
- 239000011229 interlayer Substances 0.000 description 30
- 230000006911 nucleation Effects 0.000 description 25
- 238000010899 nucleation Methods 0.000 description 25
- 229920002120 photoresistant polymer Polymers 0.000 description 21
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000001681 protective effect Effects 0.000 description 13
- 230000010287 polarization Effects 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 239000000470 constituent Substances 0.000 description 9
- 239000012535 impurity Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000005684 electric field Effects 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- -1 nitrogen ions Chemical class 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052735 hafnium Inorganic materials 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910003855 HfAlO Inorganic materials 0.000 description 1
- 229910004143 HfON Inorganic materials 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- CEPICIBPGDWCRU-UHFFFAOYSA-N [Si].[Hf] Chemical compound [Si].[Hf] CEPICIBPGDWCRU-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1087—Substrate region of field-effect devices of field-effect transistors with insulated gate characterised by the contact structure of the substrate region, e.g. for controlling or preventing bipolar effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/4175—Source or drain electrodes for field effect devices for lateral devices where the connection to the source or drain region is done through at least one part of the semiconductor substrate thickness, e.g. with connecting sink or with via-hole
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
以下、図面を参照しながら本実施の形態の半導体装置について詳細に説明する。
図1は、本実施の形態の半導体装置の構成を模式的に示す断面図である。図1に示す本実施の形態の半導体装置(半導体素子)は、窒化物半導体を用いたMIS(Metal Insulator Semiconductor)型の電界効果トランジスタ(FET;Field Effect Transistor)である。この半導体装置は、高電子移動度トランジスタ(HEMT:High Electron Mobility Transistor)型のパワートランジスタとして用いることができる。本実施の形態の半導体装置は、いわゆるリセスゲート型の半導体装置である。
εGaN・EGaN=εox・Eox ・・・(式1)
ただし、εGaNはGaNの比誘電率、εoxはゲート絶縁膜の比誘電率である。
Vth=φB+Eox・tox−ΔEC ・・・(式2)
(式1)を(式2)に代入すれば、閾値Vthはチャネル層(GaN)CHの電界EGaNの関数である次の関係式(式3)として得られる。
Vth=φB+(εGaN/εox)・EGaN・tox−ΔEC ・・・(式3)
この(式3)は、チャネル層(GaN)CHの電界EGaNが大きいほど閾値Vthが正側に増加することを示している。
σp=εGaN・EGaN+εAlGaN・EAlGaN ・・・(式4)
チャネル層(GaN)CHとバッファ層(AlGaN)BU2中の電位降下が等しいことから、次の関係式(式5)が得られる。
tGaN・EGaN=tAlGaN・EAlGaN ・・・(式5)
(式4)と(式5)とからEAlGaNを消去することにより、次の関係式(式6)が得られる。
バッファ層(AlGaN)BU2のAl濃度が高いほど負の分極電荷の絶対値σpは大きくなることが知られているため、(式3)、(式6)から、Al濃度が高いほど閾値Vthも高くなることがわかる。なお、このAl濃度については後述する(図13、図14参照)。
次いで、図7〜図12を参照しながら、本実施の形態の半導体装置の製造方法を説明するとともに、当該半導体装置の構成をより明確にする。図7〜図12は、本実施の形態の半導体装置の製造工程を示す断面図である。
実施の形態1においては、ソース電極SEの下に接続部VIAを設けたが、ソースパッドSPの下に接続部VIAを設けてもよい。
図15は、本実施の形態の半導体装置の構成を模式的に示す断面図である。本実施の形態の半導体装置(半導体素子)は、窒化物半導体を用いたMIS型の電界効果トランジスタである。この半導体装置は、高電子移動度トランジスタ(HEMT)型のパワートランジスタとして用いることができる。本実施の形態の半導体装置は、いわゆるリセスゲート型の半導体装置である。
次いで、図18〜図21を参照しながら、本実施の形態の半導体装置の製造方法を説明するとともに、当該半導体装置の構成をより明確にする。図18〜図21は、本実施の形態の半導体装置の製造工程を示す断面図である。
実施の形態1、2においては、基板Sの表面側に接続部VIAを設けたが、基板Sの裏面側に接続部VIAを設けてもよい。
図22は、本実施の形態の半導体装置の構成を模式的に示す断面図である。本実施の形態の半導体装置(半導体素子)は、窒化物半導体を用いたMIS型の電界効果トランジスタである。この半導体装置は、高電子移動度トランジスタ(HEMT)型のパワートランジスタとして用いることができる。本実施の形態の半導体装置は、いわゆるリセスゲート型の半導体装置である。
次いで、図25〜図28を参照しながら、本実施の形態の半導体装置の製造方法を説明するとともに、当該半導体装置の構成をより明確にする。図25〜図28は、本実施の形態の半導体装置の製造工程を示す断面図である。
上記実施の形態1においては、接続部VIAの底面を、バッファ層BU1の途中に配置しているが、接続部VIAの底面を、バッファ層BU1の底面より下方に配置してもよい。
上記実施の形態で説明した半導体素子(MISFET)の適用箇所に制限はないが、例えば、スイッチング電源、PFC回路、インバータなどを構成する半導体素子(MISFET)として適用することができる。また、スイッチング電源を応用した製品としては、例えば、サーバ電源、無停電電源、太陽光発電用パワーコンディショナー、HV・EV電源などがある。また、PFC回路を応用した製品としては、サーバ、モータなど各種産業用電源、家電用電源、各種携帯機器のアダプター電源などがある。また、インバータを応用した製品としては、モータ駆動電源、プラグインHV電源などがある。
2DEG2 二次元電子ガス
AC 活性領域
BA 障壁層
BE 裏面電極
BU1 バッファ層
BU2 バッファ層
C1D コンタクトホール
C1S コンタクトホール
C1SP コンタクトホール
CH チャネル層
DE ドレイン電極
DP ドレインパッド
GE ゲート電極
GI ゲート絶縁膜
GL ゲート線
GP ゲートパッド
IF1 絶縁膜
IL1 層間絶縁膜
ISO 素子分離領域
NUL 核生成層
PRO 保護膜
S 基板
SE ソース電極
SL 超格子層
SP ソースパッド
T 溝
TH 貫通孔
VIA 接続部
Claims (20)
- 基板の上方に形成された第1窒化物半導体層と、
前記第1窒化物半導体層上に形成された第2窒化物半導体層と、
前記第2窒化物半導体層上に形成された第3窒化物半導体層と、
前記第3窒化物半導体層上に形成された第4窒化物半導体層と、
前記第4窒化物半導体層を貫通し、前記第3窒化物半導体層の途中まで到達する溝と、
前記溝内にゲート絶縁膜を介して配置されたゲート電極と、
前記ゲート電極の両側の前記第4窒化物半導体層の上方にそれぞれ形成された第1電極および第2電極と、
を有し、
前記第4窒化物半導体層の電子親和力は、前記第3窒化物半導体層の電子親和力より小さく、
前記第3窒化物半導体層の電子親和力は、前記第2窒化物半導体層の電子親和力より大きく、
前記第2窒化物半導体層の電子親和力は、前記第1窒化物半導体層の電子親和力より小さく、
前記第1電極と前記第1窒化物半導体層とが接続された、半導体装置。 - 請求項1記載の半導体装置において、
前記第1電極の電位と前記第1窒化物半導体層の電位が同じである、半導体装置。 - 請求項1記載の半導体装置において、
前記第1電極の電位と前記第1窒化物半導体層の電位は、接地電位である、半導体装置。 - 請求項1記載の半導体装置において、
前記第1電極と前記第1窒化物半導体層とは、第1接続部を介して接続されている、半導体装置。 - 請求項4記載の半導体装置において、
前記第1接続部は、前記第4窒化物半導体層、前記第3窒化物半導体層および前記第2窒化物半導体層を貫通し、前記第1窒化物半導体層まで到達する貫通孔の内部に配置されている、半導体装置。 - 請求項5記載の半導体装置において、
前記第1接続部上には、前記第1電極が、配置されている、半導体装置。 - 請求項1記載の半導体装置において、
前記第2窒化物半導体層は、AlGaNであり、前記第1窒化物半導体層は、GaNである、半導体装置。 - 請求項7記載の半導体装置において、
前記第4窒化物半導体層は、AlGaNであり、前記第3窒化物半導体層は、GaNである、半導体装置。 - 請求項8記載の半導体装置において、
前記第4窒化物半導体層のAl組成は、前記第2窒化物半導体層のAl組成より大きい、半導体装置。 - 請求項7記載の半導体装置において、
前記第2窒化物半導体層のAl組成は、3%以上8%以下である、半導体装置。 - 請求項1記載の半導体装置において、
前記基板は、第1領域と第2領域とを有し、
前記ゲート電極、前記第1電極および前記第2電極は、前記第1領域に形成され、
前記第2領域は、前記第4窒化物半導体層および前記第3窒化物半導体層中に形成された素子分離領域であり、
前記第1電極と前記第1窒化物半導体層とは、第1接続部を介して接続され、
前記第1接続部は、前記素子分離領域および前記第2窒化物半導体層を貫通し、前記第1窒化物半導体層まで到達する貫通孔の内部に配置されている、半導体装置。 - 請求項11記載の半導体装置において、
前記第1接続部上には、前記第1電極と電気的に接続される第1端子部が、配置されている、半導体装置。 - 請求項11記載の半導体装置において、
前記第2窒化物半導体層は、AlGaNであり、前記第1窒化物半導体層は、GaNである、半導体装置。 - 請求項13記載の半導体装置において、
前記第4窒化物半導体層は、AlGaNであり、前記第3窒化物半導体層は、GaNである、半導体装置。 - 請求項14記載の半導体装置において、
前記第4窒化物半導体層のAl組成は、前記第2窒化物半導体層のAl組成より大きい、半導体装置。 - 請求項13記載の半導体装置において、
前記第2窒化物半導体層のAl組成は、3%以上8%以下である、半導体装置。 - 基板の上方に形成された第1窒化物半導体層と、
前記第1窒化物半導体層上に形成された第2窒化物半導体層と、
前記第2窒化物半導体層上に形成された第3窒化物半導体層と、
前記第3窒化物半導体層上に形成された第4窒化物半導体層と、
前記第4窒化物半導体層を貫通し、前記第3窒化物半導体層の途中まで到達する溝と、
前記溝内にゲート絶縁膜を介して配置されたゲート電極と、
前記ゲート電極の両側の前記第4窒化物半導体層の上方にそれぞれ形成された第1電極および第2電極と、
前記基板の下方側である裏面側から、前記基板を貫通し、前記第1窒化物半導体層まで到達する貫通孔の内部に配置された第1接続部と、
を有し、
前記第4窒化物半導体層の電子親和力は、前記第3窒化物半導体層の電子親和力より小さく、
前記第3窒化物半導体層の電子親和力は、前記第2窒化物半導体層の電子親和力より大きく、
前記第2窒化物半導体層の電子親和力は、前記第1窒化物半導体層の電子親和力より小さい、半導体装置。 - 請求項17記載の半導体装置において、
前記第1電極の電位と前記第1窒化物半導体層の電位が同じである、半導体装置。 - 請求項17記載の半導体装置において、
前記第4窒化物半導体層および前記第2窒化物半導体層は、AlGaNであり、前記第3窒化物半導体層および前記第1窒化物半導体層は、GaNである、半導体装置。 - 請求項19記載の半導体装置において、
前記第4窒化物半導体層のAl組成は、前記第2窒化物半導体層のAl組成より大きい、半導体装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014021247A JP6341679B2 (ja) | 2014-02-06 | 2014-02-06 | 半導体装置 |
US14/590,433 US9306051B2 (en) | 2014-02-06 | 2015-01-06 | Semiconductor device using a nitride semiconductor |
EP15150397.6A EP2913853A3 (en) | 2014-02-06 | 2015-01-08 | Semiconductor device |
TW104102935A TWI625796B (zh) | 2014-02-06 | 2015-01-29 | 半導體裝置 |
KR1020150016615A KR20150093117A (ko) | 2014-02-06 | 2015-02-03 | 반도체 장치 |
CN201510065057.4A CN104835847B (zh) | 2014-02-06 | 2015-02-06 | 半导体器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014021247A JP6341679B2 (ja) | 2014-02-06 | 2014-02-06 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015149392A true JP2015149392A (ja) | 2015-08-20 |
JP6341679B2 JP6341679B2 (ja) | 2018-06-13 |
Family
ID=52232111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014021247A Active JP6341679B2 (ja) | 2014-02-06 | 2014-02-06 | 半導体装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9306051B2 (ja) |
EP (1) | EP2913853A3 (ja) |
JP (1) | JP6341679B2 (ja) |
KR (1) | KR20150093117A (ja) |
CN (1) | CN104835847B (ja) |
TW (1) | TWI625796B (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6534791B2 (ja) | 2013-12-16 | 2019-06-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6565223B2 (ja) * | 2015-03-05 | 2019-08-28 | 富士通株式会社 | 半導体装置及びその製造方法、電源装置、高周波増幅器 |
JP6462456B2 (ja) * | 2015-03-31 | 2019-01-30 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
ITUB20155862A1 (it) * | 2015-11-24 | 2017-05-24 | St Microelectronics Srl | Transistore di tipo normalmente spento con ridotta resistenza in stato acceso e relativo metodo di fabbricazione |
TWI611505B (zh) * | 2016-06-02 | 2018-01-11 | 世界先進積體電路股份有限公司 | 溝槽隔離結構及其製造方法 |
US10347524B2 (en) | 2016-09-12 | 2019-07-09 | Vanguard International Semiconductor Corporation | Trench isolation structures and methods for forming the same |
DE102016122399A1 (de) | 2016-11-21 | 2018-05-24 | Forschungsverbund Berlin E.V. | Gate-Struktur und Verfahren zu dessen Herstellung |
IT201700064147A1 (it) * | 2017-06-09 | 2018-12-09 | St Microelectronics Srl | Transistore hemt normalmente spento con generazione selettiva del canale 2deg e relativo metodo di fabbricazione |
TWI793076B (zh) * | 2017-06-30 | 2023-02-21 | 晶元光電股份有限公司 | 半導體元件 |
JP7002015B2 (ja) * | 2017-07-07 | 2022-01-20 | パナソニックIpマネジメント株式会社 | 半導体装置およびその製造方法 |
TWI637515B (zh) * | 2017-07-12 | 2018-10-01 | 世界先進積體電路股份有限公司 | 高電子遷移率電晶體元件 |
JP2019050232A (ja) * | 2017-09-07 | 2019-03-28 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
US10325990B2 (en) | 2017-10-03 | 2019-06-18 | Vanguard International Semiconductor Corporation | High electron mobility transistor devices and method for fabricating the same |
US11489061B2 (en) * | 2018-09-24 | 2022-11-01 | Intel Corporation | Integrated programmable gate radio frequency (RF) switch |
US11387328B2 (en) * | 2018-09-27 | 2022-07-12 | Intel Corporation | III-N tunnel device architectures and high frequency mixers employing a III-N tunnel device |
CN111354789B (zh) * | 2018-12-24 | 2023-11-07 | 苏州捷芯威半导体有限公司 | 半导体器件及制作方法 |
CN111987156A (zh) * | 2020-08-31 | 2020-11-24 | 厦门市三安集成电路有限公司 | 氮化镓基晶体管器件外延结构及其制备方法、器件 |
CN115966605A (zh) * | 2020-12-18 | 2023-04-14 | 英诺赛科(苏州)科技有限公司 | 半导体器件 |
US11888054B2 (en) | 2020-12-18 | 2024-01-30 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device and method for manufacturing the same |
CN112864015B (zh) * | 2021-01-27 | 2022-07-05 | 浙江集迈科微电子有限公司 | GaN器件及制备方法 |
US20230078017A1 (en) * | 2021-09-16 | 2023-03-16 | Wolfspeed, Inc. | Semiconductor device incorporating a substrate recess |
CN117810253B (zh) * | 2024-02-23 | 2024-06-07 | 深圳天狼芯半导体有限公司 | 双栅hemt器件 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006196869A (ja) * | 2004-12-13 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2007128994A (ja) * | 2005-11-02 | 2007-05-24 | New Japan Radio Co Ltd | 半導体装置 |
JP2008211089A (ja) * | 2007-02-27 | 2008-09-11 | Fujitsu Ltd | 化合物半導体装置及びそれを用いたドハティ増幅器 |
JP2009026975A (ja) * | 2007-07-20 | 2009-02-05 | Toshiba Corp | 半導体装置 |
JP2009200096A (ja) * | 2008-02-19 | 2009-09-03 | Sharp Corp | 窒化物半導体装置とそれを含む電力変換装置 |
WO2009113612A1 (ja) * | 2008-03-12 | 2009-09-17 | 日本電気株式会社 | 半導体装置 |
JP2010135640A (ja) * | 2008-12-05 | 2010-06-17 | Panasonic Corp | 電界効果トランジスタ |
US7939391B2 (en) * | 2007-09-14 | 2011-05-10 | Transphorm Inc. | III-Nitride devices with recessed gates |
JP2011181934A (ja) * | 2010-03-02 | 2011-09-15 | Samsung Electronics Co Ltd | デュアル・デプレションを示す高電子移動度トランジスタ及びその製造方法 |
JP2013038409A (ja) * | 2011-07-15 | 2013-02-21 | Internatl Rectifier Corp | 集積されたダイオードを備える複合半導体装置 |
US20130043484A1 (en) * | 2011-08-19 | 2013-02-21 | Infineon Technologies Austria Ag | Hemt with integrated low forward bias diode |
JP2013201371A (ja) * | 2012-03-26 | 2013-10-03 | Toshiba Corp | 窒化物半導体装置 |
JP2013211423A (ja) * | 2012-03-30 | 2013-10-10 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050145851A1 (en) | 2003-12-17 | 2005-07-07 | Nitronex Corporation | Gallium nitride material structures including isolation regions and methods |
JP2007103451A (ja) | 2005-09-30 | 2007-04-19 | Toshiba Corp | 半導体装置及びその製造方法 |
JP4478175B2 (ja) | 2007-06-26 | 2010-06-09 | 株式会社東芝 | 半導体装置 |
JP2009231508A (ja) * | 2008-03-21 | 2009-10-08 | Panasonic Corp | 半導体装置 |
JP5468768B2 (ja) * | 2008-12-05 | 2014-04-09 | パナソニック株式会社 | 電界効果トランジスタ及びその製造方法 |
JP5611653B2 (ja) * | 2010-05-06 | 2014-10-22 | 株式会社東芝 | 窒化物半導体素子 |
TWI544628B (zh) * | 2011-05-16 | 2016-08-01 | Renesas Electronics Corp | Field effect transistor and semiconductor device |
JP6214978B2 (ja) * | 2013-09-17 | 2017-10-18 | 株式会社東芝 | 半導体装置 |
JP6534791B2 (ja) * | 2013-12-16 | 2019-06-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6251071B2 (ja) * | 2014-02-05 | 2017-12-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2014
- 2014-02-06 JP JP2014021247A patent/JP6341679B2/ja active Active
-
2015
- 2015-01-06 US US14/590,433 patent/US9306051B2/en not_active Expired - Fee Related
- 2015-01-08 EP EP15150397.6A patent/EP2913853A3/en not_active Withdrawn
- 2015-01-29 TW TW104102935A patent/TWI625796B/zh active
- 2015-02-03 KR KR1020150016615A patent/KR20150093117A/ko not_active Application Discontinuation
- 2015-02-06 CN CN201510065057.4A patent/CN104835847B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006196869A (ja) * | 2004-12-13 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2007128994A (ja) * | 2005-11-02 | 2007-05-24 | New Japan Radio Co Ltd | 半導体装置 |
JP2008211089A (ja) * | 2007-02-27 | 2008-09-11 | Fujitsu Ltd | 化合物半導体装置及びそれを用いたドハティ増幅器 |
JP2009026975A (ja) * | 2007-07-20 | 2009-02-05 | Toshiba Corp | 半導体装置 |
US7939391B2 (en) * | 2007-09-14 | 2011-05-10 | Transphorm Inc. | III-Nitride devices with recessed gates |
JP2009200096A (ja) * | 2008-02-19 | 2009-09-03 | Sharp Corp | 窒化物半導体装置とそれを含む電力変換装置 |
WO2009113612A1 (ja) * | 2008-03-12 | 2009-09-17 | 日本電気株式会社 | 半導体装置 |
JP2010135640A (ja) * | 2008-12-05 | 2010-06-17 | Panasonic Corp | 電界効果トランジスタ |
JP2011181934A (ja) * | 2010-03-02 | 2011-09-15 | Samsung Electronics Co Ltd | デュアル・デプレションを示す高電子移動度トランジスタ及びその製造方法 |
JP2013038409A (ja) * | 2011-07-15 | 2013-02-21 | Internatl Rectifier Corp | 集積されたダイオードを備える複合半導体装置 |
US20130043484A1 (en) * | 2011-08-19 | 2013-02-21 | Infineon Technologies Austria Ag | Hemt with integrated low forward bias diode |
JP2013201371A (ja) * | 2012-03-26 | 2013-10-03 | Toshiba Corp | 窒化物半導体装置 |
JP2013211423A (ja) * | 2012-03-30 | 2013-10-10 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104835847A (zh) | 2015-08-12 |
CN104835847B (zh) | 2020-02-28 |
TW201546911A (zh) | 2015-12-16 |
TWI625796B (zh) | 2018-06-01 |
EP2913853A2 (en) | 2015-09-02 |
US20150221758A1 (en) | 2015-08-06 |
US9306051B2 (en) | 2016-04-05 |
EP2913853A3 (en) | 2016-03-02 |
KR20150093117A (ko) | 2015-08-17 |
JP6341679B2 (ja) | 2018-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6341679B2 (ja) | 半導体装置 | |
US10084077B2 (en) | Semiconductor device and method of manufacturing semiconductor device | |
JP6468886B2 (ja) | 半導体装置の製造方法および半導体装置 | |
US9620599B2 (en) | GaN-based semiconductor transistor | |
JP6251071B2 (ja) | 半導体装置 | |
US10249715B2 (en) | Semiconductor device and method of manufacturing the semiconductor device | |
US10256333B2 (en) | High electron mobility transistor | |
JP6066933B2 (ja) | 半導体デバイスの電極構造 | |
US8963207B2 (en) | Semiconductor device | |
US9590071B2 (en) | Manufacturing method of semiconductor device and semiconductor device | |
US9231105B2 (en) | Semiconductor device with group-III nitride compound semiconductor layer on substrate for transistor | |
JP2016127082A (ja) | 半導体装置および半導体装置の製造方法 | |
WO2015175915A1 (en) | Trenched vertical power field-effect transistors with improved on-resistance and breakdown voltage | |
CN108400170A (zh) | 半导体器件和半导体器件的制造方法 | |
JP2017157589A (ja) | 半導体装置および半導体装置の製造方法 | |
US10541321B2 (en) | Manufacturing method of semiconductor device | |
CN114556561A (zh) | 基于氮化物的半导体ic芯片及其制造方法 | |
US9831311B2 (en) | Semiconductor device and method of manufacturing the same | |
JP2018174196A (ja) | 半導体装置および半導体装置の製造方法 | |
TWI820820B (zh) | 半導體裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161024 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170726 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170801 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170929 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20171212 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180309 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180319 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180424 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180515 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6341679 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |