JP2015142087A - 搬送機構 - Google Patents
搬送機構 Download PDFInfo
- Publication number
- JP2015142087A JP2015142087A JP2014015444A JP2014015444A JP2015142087A JP 2015142087 A JP2015142087 A JP 2015142087A JP 2014015444 A JP2014015444 A JP 2014015444A JP 2014015444 A JP2014015444 A JP 2014015444A JP 2015142087 A JP2015142087 A JP 2015142087A
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- JP
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- Prior art keywords
- wafer
- holding
- suction
- holding table
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007723 transport mechanism Effects 0.000 title claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000013459 approach Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 87
- 238000000034 method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
また、吸引保持部が内側位置と外側位置との間を移動可能であれば、ウェーハの外周部分が上向きに反っている場合には、吸引保持部を外側位置に配置することにより、押圧部材だけでなく、吸引保持部でも、ウェーハの外周部分を保持テーブルに向けて押圧することができる。また、ウェーハの外周部分が下向きに反っている場合には、吸引保持部を内側位置に配置することにより、ウェーハの外周部分を押圧部材で押えつつ、ウェーハの中央部分を吸引保持部で保持テーブルに向けて押圧することができる。これにより、ウェーハの外周部分が上向きに反っている場合でも、下向きに反っている場合でも、ウェーハの反りを矯正して、保持テーブルとの間の隙間をなくすことができ、保持テーブルがウェーハを吸引保持することができる。
図2に示すようにウェーハ60の外周部分が+Z方向に反っている場合(中凹の場合)は、吸引保持部24を外周側に移動させて外側位置に位置づけ、押圧移動手段26が押圧部材25を+Z方向に移動させて退避位置に位置づける。この状態で、保持ヘッド移動手段13がアーム32を回動させて、仮置きテーブルなどに載置されたウェーハ60の+Z方向に保持ヘッド12を位置づけ、保持ヘッド移動手段13がアーム32を−Z方向に移動させて、吸引保持部24をウェーハ60の外周部分に当接させる。その後、逆止弁42(図1参照)を開いて吸引源41(図1参照)による吸引を開始し、吸引保持部24がウェーハ60を吸引保持する。
図5に示すようにウェーハ60の外周部分が−Z方向に反っている場合(中凸の場合)は、吸引保持移動手段が吸引保持部24を中心側に移動させて内側位置に位置づけ、押圧移動手段26が押圧部材25を−Z方向に移動させて退避位置に位置づける。この状態で、保持ヘッド移動手段13がアーム32を回動させて、仮置きテーブルなどに載置されたウェーハ60の+Z方向に保持ヘッド12を位置づけ、保持ヘッド移動手段13がアーム32を−Z方向に移動させて、吸引保持部24をウェーハ60の中央付近に当接させる。その後、逆止弁42(図1参照)を開いて吸引源41(図1参照)による吸引を開始し、吸引保持部24がウェーハ60を吸引保持する。
21:中央部 22a〜22c,23a〜23c:腕部
24,24a〜24c:吸引保持部 25,25a〜25c:押圧部材
26,26a〜26c:押圧移動手段
13:保持ヘッド移動手段
31:支持部 32:アーム 33:軸部 41,43:吸引源 42,44:逆止弁
50:保持テーブル 51:保持面 60:ウェーハ
Claims (2)
- ウェーハを吸引保持する保持テーブルへウェーハを搬送する搬送機構であって、
ウェーハを吸引保持する複数の吸引保持部と、該保持テーブルに載置されたウェーハの外周部を該保持テーブルに向けて押圧する押圧位置と該吸引保持部に保持されたウェーハに接触しない退避位置との間を移動可能な複数の押圧部材と、を備えた保持ヘッドと、
該保持ヘッドを該保持テーブルに対して接近及び離反させる保持ヘッド移動手段と、
を備えた搬送機構。 - 前記複数の吸引保持部は、前記押圧部材よりも内側の内側位置と該押圧部材と同一円周上の外側位置との間を移動可能に配設される、
請求項1記載の搬送機構。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014015444A JP6255259B2 (ja) | 2014-01-30 | 2014-01-30 | 搬送機構 |
TW103142141A TWI611499B (zh) | 2014-01-30 | 2014-12-04 | 搬送機構 |
KR1020150001033A KR102154718B1 (ko) | 2014-01-30 | 2015-01-06 | 반송 기구 |
CN201510038481.XA CN104821288B (zh) | 2014-01-30 | 2015-01-26 | 搬运机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014015444A JP6255259B2 (ja) | 2014-01-30 | 2014-01-30 | 搬送機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015142087A true JP2015142087A (ja) | 2015-08-03 |
JP6255259B2 JP6255259B2 (ja) | 2017-12-27 |
Family
ID=53731546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014015444A Active JP6255259B2 (ja) | 2014-01-30 | 2014-01-30 | 搬送機構 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6255259B2 (ja) |
KR (1) | KR102154718B1 (ja) |
CN (1) | CN104821288B (ja) |
TW (1) | TWI611499B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018074118A (ja) * | 2016-11-04 | 2018-05-10 | 株式会社東京精密 | ウエハの搬送保持装置 |
JP2018176323A (ja) * | 2017-04-07 | 2018-11-15 | 株式会社ディスコ | 加工装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113003185A (zh) * | 2021-02-23 | 2021-06-22 | 胡慧红 | 一种晶圆光刻显影用的平贴设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086543A (ja) * | 2001-09-14 | 2003-03-20 | Disco Abrasive Syst Ltd | 板状物の搬送機構および搬送機構を備えたダイシング装置 |
JP2008227134A (ja) * | 2007-03-13 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 部品実装装置及び基板搬送方法 |
JP2009107097A (ja) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | 加工装置 |
JP2010076929A (ja) * | 2008-09-29 | 2010-04-08 | Ushio Inc | 基板搬送アーム |
JP2012099755A (ja) * | 2010-11-05 | 2012-05-24 | Disco Abrasive Syst Ltd | 搬送装置 |
JP2012156415A (ja) * | 2011-01-28 | 2012-08-16 | Lintec Corp | 板状部材の支持装置及び支持方法 |
JP2013098386A (ja) * | 2011-11-01 | 2013-05-20 | Disco Abrasive Syst Ltd | 搬送装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3993296B2 (ja) | 1998-03-27 | 2007-10-17 | 株式会社ディスコ | 吸着固定装置 |
JP4371939B2 (ja) * | 2004-08-03 | 2009-11-25 | パナソニック株式会社 | 基板搬入装置、部品実装装置、及び基板搬入方法 |
JP4841355B2 (ja) * | 2006-08-08 | 2011-12-21 | 日東電工株式会社 | 半導体ウエハの保持方法 |
TWM312404U (en) * | 2006-11-07 | 2007-05-21 | Hiwin Tech Corp | Arm mechanism for transporting wafer |
TWM410333U (en) * | 2011-01-18 | 2011-08-21 | Xintec Inc | Loading device |
TWM421587U (en) * | 2011-07-28 | 2012-01-21 | Nutrim Technology Inc | Leveling apparatus for wafer |
JP5877719B2 (ja) | 2012-01-13 | 2016-03-08 | 株式会社ディスコ | 搬送方法 |
-
2014
- 2014-01-30 JP JP2014015444A patent/JP6255259B2/ja active Active
- 2014-12-04 TW TW103142141A patent/TWI611499B/zh active
-
2015
- 2015-01-06 KR KR1020150001033A patent/KR102154718B1/ko active IP Right Grant
- 2015-01-26 CN CN201510038481.XA patent/CN104821288B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086543A (ja) * | 2001-09-14 | 2003-03-20 | Disco Abrasive Syst Ltd | 板状物の搬送機構および搬送機構を備えたダイシング装置 |
JP2008227134A (ja) * | 2007-03-13 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 部品実装装置及び基板搬送方法 |
JP2009107097A (ja) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | 加工装置 |
JP2010076929A (ja) * | 2008-09-29 | 2010-04-08 | Ushio Inc | 基板搬送アーム |
JP2012099755A (ja) * | 2010-11-05 | 2012-05-24 | Disco Abrasive Syst Ltd | 搬送装置 |
JP2012156415A (ja) * | 2011-01-28 | 2012-08-16 | Lintec Corp | 板状部材の支持装置及び支持方法 |
JP2013098386A (ja) * | 2011-11-01 | 2013-05-20 | Disco Abrasive Syst Ltd | 搬送装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018074118A (ja) * | 2016-11-04 | 2018-05-10 | 株式会社東京精密 | ウエハの搬送保持装置 |
JP2018176323A (ja) * | 2017-04-07 | 2018-11-15 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104821288A (zh) | 2015-08-05 |
KR20150090997A (ko) | 2015-08-07 |
CN104821288B (zh) | 2019-04-19 |
KR102154718B1 (ko) | 2020-09-10 |
JP6255259B2 (ja) | 2017-12-27 |
TW201537664A (zh) | 2015-10-01 |
TWI611499B (zh) | 2018-01-11 |
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