M421587 五、新型說明： 【新型所屬之技術領域】 本創作是關於一種在加工晶圓的自動化設備中，用來將晶圓 平貼於工作台面之晶圓平貼裝置。特別是指一種針對變形翹曲晶 圓用之平貼裝置，能在平貼過程中避免晶圓破片。 【先前技術】 • 在現有的加工晶圓自動化設備中，當薄化之硬脆晶圓需平貼 於一真空平台上’通常是用真空平台直接對晶圓抽真空。但由於 薄化後的晶圓容易翹曲變形，所以常導致在真空吸附晶圓過程 中’因晶圓與真空平台之間有_: ’而造成晶圓無法均勻的被吸 附平貼於平台之上。另外，有時也會因真空吸附晶圓時，吸附力 罝不均勻，或真空平台設計不當，而造成晶圓破片現象。 φ 【新型内容】 因此本創作的主要目的是在設計一種晶圓用之平貼裝置，此 裝置具有吸盤來吸附翹曲變形的晶圓，以及具有一可調速之真空 吸附平台來壓f晶圓’藉由吸盤及真空平台對晶圓壓平後，再由 真二及附平台抽真空’將晶圓平貼於平台上。此種方式是先將翹 曲的晶圓壓平’真空平台再對晶關真空，可以聽晶圓與真空 平口之間有間隙’而在抽真空過程中造成吸附不良現象。 本創作的另一目的是在設計一種晶圓用之平貼裝置，此裝置 3 M421587 中具有可_之真^_平台’可以平緩的㈣晶圓，避免 磨掣晶圓過程中因施力不當而造成破片。 本創作所提供之晶_之平貼裝置，主要包括—吸附機構、 一抽真空平台及-昇降滑台。該吸附機構具有至少—可轴向移動 之位移桿，該位移桿的—端設置―軟質彈性體，用來吸附—翹曲 變形的晶圓。再由設有-馬達之昇降滑台控制該抽真空平台上升M421587 V. New Description: [New Technology Field] This creation is about a wafer flat-mounting device for flattening wafers on the work surface in automated equipment for processing wafers. In particular, it refers to a flat-panel device for deforming warped crystals, which can avoid wafer fragmentation during the flattening process. [Prior Art] • In existing processing wafer automation equipment, when thinned hard and crisp wafers need to be flat on a vacuum platform, it is usually vacuumed directly by the vacuum platform. However, since the thinned wafer is easily warped and deformed, it often causes the wafer to be uniformly adsorbed on the platform due to _: ' between the wafer and the vacuum platform during vacuum adsorption of the wafer. on. In addition, there are cases where the adsorption force is not uniform due to vacuum adsorption of the wafer, or the design of the vacuum platform is improper, resulting in wafer fragmentation. φ [New content] Therefore, the main purpose of this creation is to design a flat-panel device for wafers, which has a suction cup for adsorbing warped deformation wafers, and a vacuum adsorption platform with adjustable speed to press f crystal After the wafer is flattened by the suction cup and vacuum platform, and then vacuumed by the true two and the attached platform, the wafer is flat on the platform. In this way, the warped wafer is first flattened, and the vacuum platform is used to vacuum the crystal. The gap between the wafer and the vacuum flat can be heard, and the adsorption is poor during the vacuuming process. Another purpose of this creation is to design a flat-panel device for wafers. This device 3 M421587 has a smooth (four) wafer that can be used to avoid the improper application of the wafer. And caused a fragment. The flat-filming device provided by the present invention mainly includes an adsorption mechanism, a vacuuming platform and a lifting slide. The absorbing mechanism has at least an axially movable displacement rod, and the end of the displacement rod is provided with a soft elastomer for adsorbing-warping the deformed wafer. The vacuuming platform is controlled by a lifting slide provided with a motor.
並壓¥晶圓’使原她曲的晶圓被壓平，再由抽真空平台對晶圓 抽真空，使晶圓平貼於抽真空平台上。 由於是利用能確實定位之馬達來控制抽真空吸盤上升的行 程，故’抽真奸台每次上升都是採預設的轉，抽真空平台接 觸晶圓後，更是緩緩的壓掣晶圓，所叫會有施力過#而造成破 片的問題。 與傳統直接以抽真空平台_曲晶_真空的做法相較，本 創作由於已事先藉由抽真空平台將晶醒平，所㈣鼠在抽真 鲁空平台上時，沒有間隙且施力平均，抽真空過程中不會造成晶圓 破片及不平貼之現象。且，本創作機具間的移動皆採數位化控制， 不會有突然強大的力㈣晶圓造成壓迫。因此，本創作晶圓用之 平貼裝置可以大幅提升晶圓的良率。 【實施方式】 以下配合圖式及元件符號對本創作之實施方式做更詳細的 M421587 說明，俾使熟習該項技藝者在研讀本書後能據以實施。 清參閱第-圖為本創作晶圓用之平貼裝置較佳實施例示意 圖。主要包括-吸附機構1、-抽真空平台2及—昇降滑台3。該 吸附機構1具有至少-可軸向移動之位移桿u，該位移桿η的一 端設置-軟質彈性體12,用來吸附一勉曲變形的晶圓(容後揭露）。 再由設有-飼服馬達(設於值滑台内部，圖未示)之該昇降滑台3 控制該抽真空平台2上升並壓¥晶圓，使縣_的晶圓被壓平， _再由抽真空平台2對晶圓抽真空，使晶圓平貼於抽真空平台2上。 由於已事先將晶圓壓平，所以晶圓與抽真空平台2之間沒有間隙， 抽真空過程中不會造成晶圓破片及不平貼之現象。其中，所述位 移桿11是受自重控制。 在本創作實施例中’所述吸附機構i進一步包括一基架13， 該基架η是用來設置所述位移桿n。位移桿u可以設^四根， 每-根位移桿η的-端皆設置該軟質彈性體12，藉由四個軟質彈 骞性體I2能牢固的吸附晶圓。在位移桿u及基架u之間設有一轴 承14，位移桿U是轴向穿設於該軸承u中，位移桿^的另一端 連結-真空管路15，受其自重控制，可使位移桿u相對於該轴承 14軸向移動，以調整軟質彈性體12的高度，使其可接觸到晶犷 而該晶圓是由-機械手臂(圖未示)送至吸附機構i下方。 一請參閱第二圖及第三圖’分戦所述軟質雜體吸附晶圓之 示意圖及局部。受其自重控制，使轉桿n向下移動而軟質 彈性體12接觸吸附晶圓4。軟質彈性體12包含呈—體結構之一接 5 ΜΦ21587 觸端12卜一頸部122與一基部123，該基部123與所述位移桿u 連接，該頸部122位於該基部123下方’該接觸端121位於該頸 部122下方’該頸部丨22的徑向尺寸小於該基部123及該接觸端 121之徑向尺寸’該接觸端121用來吸附所述晶圓4。接觸端121 呈盤狀，有較佳的吸附能力。受到真空源的吸附，晶圓4表面與 接觸端121之間形成一股緊密接觸的力量，此時，接觸端121因 具彈性變形能力’會隨著所接觸的晶圓4表面幅度變形，並服貼 • 於晶圓4表面，由第三圖可見，若晶圓4表面的翹曲形態是漸漸 朝晶圓4中央向上弧彎，與其接觸的接觸端121表面便形成一侧 向頸部122饋縮的狀態，使軟質彈性體12可吸附晶圓4。由此可 見，軟質彈性體4具有當頸部122愈具彈性，接觸端121能偏擺 的角度愈大之特性，使接觸端121能適應各種不同表面幅度之晶 圓。 請參閱第四圖為本創作昇降滑台與抽真空平台之分解圖。昇 ⑩降滑台3上具有一滑座31及一對稱滑槽&，該滑槽&是對稱開 設在昇降滑台3兩側，該滑座3丨滑動配合於該滑槽32，滑座31 戈到所述馬達(設於昇降滑台内冑，圖未示)的驅動而可沿著滑槽 幻軸向滑移，滑座31上設置所述抽真空平台2，因此藉由滑座η 的轴向滑動可以調整抽真空平台2相對於吸附機構！(參 的高度。 曰請配合第三圖並請參閱第五圖，第五圖為抽真空平台向上壓 掣曰曰圓之示意圖。由於勉曲的晶圓4受到軟質彈性體以的吸附， 6 M421587 因此當抽真空平台2壓掣晶圓4時，軟質彈性體12的接觸端121 會隨著晶圓4的翹曲形態而饋縮’晶圓4不會與抽真空平台2硬 碰硬而破裂，同時晶圓4會被壓平。 請參閱第六圖為本創作抽真空平台剖面圖。抽真空平台2具 有一氣道21，以及複數與該氣道21相通之槽道22，該氣道21連 結至一真空源(圖未示）。承前述，晶圓4被壓平後，該真空源對該 抽真空平台2抽真空，晶圓4脫離軟質彈性體12而平貼於抽真空 平台2上；由於晶圓4已事先壓平，因此於抽真空過程中晶圓不 會有破片及不平貼之現象。 以上所述者僅為用以轉本創作之較佳實施例 ’並非企圖據 T本創作做任何形式上之關’是以，凡有在相同之創作精神 本創作之任何修飾或變更，皆仍應包括在本創作意圖 保護之範疇。 口 M421587 【圖式簡單說明】 第一圖為本創作晶圓用之平貼裝置較佳實施例示意圖。 第二圖為本創作軟質彈性體吸附晶圓之示意圖。 第三圖為第二圖之局部詳圖。 第四圖為本創作昇降滑台與抽真空平台之分解圖。 第五圖為本創作抽真空平台向上壓掣晶圓之示意圖。 第六圖為本創作抽真空平台剖面圖。 【主要元件符號說明】 1. 吸附機構 11. 位移桿 12. 軟質彈性體 121. 接觸端 122. 頸部 123. 基部 13. 基架 14. 轴承 15. 真空管路 2. 抽真空平台 3. 昇降滑台 31. 滑座 32. 滑槽 4. 晶圓And press the wafer to make the original wafer of the wafer flattened, and then evacuate the wafer by the vacuuming platform to make the wafer flat on the vacuum platform. Since the motor that can be positioned is used to control the stroke of the vacuum suction cup, it is a preset rotation every time the pumping platform is lifted. After the vacuum platform contacts the wafer, it is slowly pressed. Round, the so-called will force the # # and cause fragmentation problems. Compared with the traditional practice of vacuuming the platform _ Qujing _ vacuum, the creation has been emptied by the vacuum platform in advance, and the (4) rat has no gap and average force when pumping the platform. The process of vacuuming will not cause wafer fragmentation and unevenness. Moreover, the movement between the creation tools is digitally controlled, and there is no sudden and powerful force (4) wafer pressure. Therefore, the flat device used in the creation of the wafer can greatly improve the yield of the wafer. [Embodiment] The following is a more detailed explanation of the implementation of this creation with the schema and component symbols, so that those skilled in the art can implement it after studying the book. BRIEF DESCRIPTION OF THE DRAWINGS A first embodiment of the present invention is a schematic view of a preferred embodiment of a flat device for creating wafers. It mainly includes an adsorption mechanism 1, an evacuation platform 2, and a lifting slide 3. The suction mechanism 1 has at least an axially movable displacement rod u, and one end of the displacement rod η is provided with a soft elastomer 12 for adsorbing a tortuously deformed wafer (to be exposed later). The lifting slide 3, which is provided with a feeding motor (located inside the value sliding table, not shown), controls the vacuuming platform 2 to rise and press the wafer, so that the wafer of the county_ is flattened, _ The wafer is then evacuated by the vacuuming platform 2 to flatten the wafer onto the vacuuming platform 2. Since the wafer has been flattened beforehand, there is no gap between the wafer and the vacuuming platform 2, and the phenomenon of wafer fragmentation and unevenness is not caused during the vacuuming process. Among them, the displacement rod 11 is controlled by its own weight. In the present embodiment, the suction mechanism i further includes a base frame η for setting the displacement rod n. The displacement rod u can be set to four, and the soft elastic body 12 is disposed at the end of each of the displacement rods η, and the wafer can be firmly adsorbed by the four soft elastic bodies I2. A bearing 14 is disposed between the displacement rod u and the base frame u. The displacement rod U is axially disposed in the bearing u, and the other end of the displacement rod is coupled to the vacuum line 15, which is controlled by its own weight to enable the displacement rod The axial movement of the bearing 14 is adjusted to adjust the height of the soft elastic body 12 so as to be in contact with the wafer, and the wafer is sent to the lower side of the adsorption mechanism i by a mechanical arm (not shown). Please refer to the second and third figures for the schematic diagram and part of the soft hybrid adsorption wafer. Controlled by its own weight, the swivel n moves downward and the soft elastomer 12 contacts the adsorbent wafer 4. The soft elastomer 12 comprises one of the body-shaped structures, 5 Μ Φ21587, a contact portion 12, a neck portion 122, and a base portion 123. The base portion 123 is connected to the displacement rod u, and the neck portion 122 is located below the base portion 123. The end 121 is located below the neck 122. The radial dimension of the neck 22 is smaller than the radial dimension of the base 123 and the contact end 121. The contact end 121 is used to adsorb the wafer 4. The contact end 121 has a disk shape and has a better adsorption capacity. Under the adsorption of the vacuum source, a close contact force is formed between the surface of the wafer 4 and the contact end 121. At this time, the contact end 121 has an elastic deformation capability, which will deform according to the surface amplitude of the wafer 4 being contacted, and The surface of the wafer 4 is visible on the surface of the wafer 4. As shown in the third figure, if the warping pattern of the surface of the wafer 4 is gradually curved upward toward the center of the wafer 4, the surface of the contact end 121 in contact with it forms a side to the neck 122. The state of feeding is such that the soft elastomer 12 can adsorb the wafer 4. It can be seen that the soft elastomer 4 has the characteristic that the greater the elasticity of the neck portion 122, the greater the angle at which the contact end 121 can be yawed, so that the contact end 121 can accommodate crystals of various surface sizes. Please refer to the fourth figure for an exploded view of the creation of the lifting slide and the vacuuming platform. The slewing platform 3 has a sliding seat 31 and a symmetrical sliding groove & the sliding groove & is symmetrically opened on both sides of the lifting sliding table 3, and the sliding seat 3 slidably fits on the sliding groove 32, and slides The seat 31 is driven by the motor (located in the lifting slide, not shown) to slide along the magical axis of the sliding slot, and the vacuuming platform 2 is disposed on the sliding seat 31, so that the sliding platform 2 is provided. The axial sliding of the seat η can adjust the vacuum platform 2 relative to the suction mechanism! (The height of the reference. 曰 Please cooperate with the third figure and refer to the fifth figure. The fifth picture is the schematic diagram of the vacuuming platform pressing up the circle. Since the distorted wafer 4 is adsorbed by the soft elastomer, 6 M421587 Therefore, when the vacuuming platform 2 presses the wafer 4, the contact end 121 of the soft elastomer 12 is fed along with the warped shape of the wafer 4, and the wafer 4 does not break with the vacuuming platform 2 and is broken. At the same time, the wafer 4 will be flattened. Please refer to the sixth drawing for a cross-sectional view of the vacuum pumping platform. The vacuuming platform 2 has an air passage 21 and a plurality of channels 22 communicating with the air passage 21, and the air passage 21 is coupled to the air passage 21. a vacuum source (not shown). After the wafer 4 is flattened, the vacuum source vacuums the vacuuming platform 2, and the wafer 4 is detached from the soft elastomer 12 and affixed to the vacuuming platform 2; Wafer 4 has been flattened beforehand, so there will be no fragmentation or unevenness in the wafer during vacuuming. The above is only a preferred embodiment for the creation of the script. Any form of the relationship is that, in the same creative spirit Any modification or modification shall be included in the scope of protection of this creation. Port M421587 [Simple description of the drawings] The first figure is a schematic diagram of a preferred embodiment of the flat device for creating a wafer. Schematic diagram of creating a soft elastomer to absorb the wafer. The third picture is a partial detail of the second figure. The fourth picture is an exploded view of the creation of the lifting slide and the vacuum platform. Fig. 6 is a schematic view of the vacuum pumping platform. [Main component symbol description] 1. Adsorption mechanism 11. Displacement rod 12. Soft elastomer 121. Contact end 122. Neck 123. Base 13. Base frame 14. Bearing 15. Vacuum line 2. Vacuum platform 3. Lifting slide 31. Slide 32. Chute 4. Wafer