JP2015058482A5 - - Google Patents

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Publication number
JP2015058482A5
JP2015058482A5 JP2013191678A JP2013191678A JP2015058482A5 JP 2015058482 A5 JP2015058482 A5 JP 2015058482A5 JP 2013191678 A JP2013191678 A JP 2013191678A JP 2013191678 A JP2013191678 A JP 2013191678A JP 2015058482 A5 JP2015058482 A5 JP 2015058482A5
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JP
Japan
Prior art keywords
grindstone
static pressure
approaches
outer periphery
width
Prior art date
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Application number
JP2013191678A
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Japanese (ja)
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JP2015058482A (en
JP6202959B2 (en
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Priority to JP2013191678A priority Critical patent/JP6202959B2/en
Priority claimed from JP2013191678A external-priority patent/JP6202959B2/en
Publication of JP2015058482A publication Critical patent/JP2015058482A/en
Publication of JP2015058482A5 publication Critical patent/JP2015058482A5/ja
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Publication of JP6202959B2 publication Critical patent/JP6202959B2/en
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Description

前記各静圧支持部は、前記砥石配置部に近い部分の外周が、前記砥石配置部に近づくにつれ幅が小さくなる形状であることが望ましい。前記補助静圧支持部は前記主静圧支持部よりも突出高さが小であってもよい。前記各静圧支持部は該静圧支持部の総面積が前記排出通路の総面積よりも小となる小面積であることが望ましい。 Each hydrostatic supporting portion, the outer periphery of the portion close to the front Symbol grindstone disposed portion, it is desirable width as it approaches the grindstone disposed portion is that a smaller shape. The auxiliary static pressure support portion may have a projecting height smaller than that of the main static pressure support portion. Each of the static pressure support portions preferably has a small area in which the total area of the static pressure support portions is smaller than the total area of the discharge passage.

Claims (1)

前記各静圧支持部は、前記砥石配置部に近い部分の外周が、
前記砥石配置部に近づくにつれ幅が小さくなる形状である
ことを特徴とする請求項１〜３の何れかに記載の両頭平面研削盤用の静圧パッド。 Each hydrostatic supporting portion, the outer periphery of the portion close to the front Symbol grindstone arrangement unit,
Static pressure pad for double head surface grinding machine according to any one of claims 1 to 3, wherein the width as it approaches the grindstone disposed portion is that a smaller shape.
JP2013191678A 2013-09-17 2013-09-17 Hydrostatic pad for double-sided surface grinding machine and double-sided surface grinding method for workpiece Active JP6202959B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013191678A JP6202959B2 (en) 2013-09-17 2013-09-17 Hydrostatic pad for double-sided surface grinding machine and double-sided surface grinding method for workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013191678A JP6202959B2 (en) 2013-09-17 2013-09-17 Hydrostatic pad for double-sided surface grinding machine and double-sided surface grinding method for workpiece

Publications (3)

Publication Number Publication Date
JP2015058482A JP2015058482A (en) 2015-03-30
JP2015058482A5 true JP2015058482A5 (en) 2016-08-18
JP6202959B2 JP6202959B2 (en) 2017-09-27

Family

ID=52816437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013191678A Active JP6202959B2 (en) 2013-09-17 2013-09-17 Hydrostatic pad for double-sided surface grinding machine and double-sided surface grinding method for workpiece

Country Status (1)

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JP (1) JP6202959B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114227524A (en) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 Double-side polishing apparatus and double-side polishing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5482497A (en) * 1992-12-30 1996-01-09 International Business Machines Corporation Method and apparatus for texturing zones of a magnetic disk
JP3474796B2 (en) * 1999-03-03 2003-12-08 日立建機株式会社 Method of manufacturing shoe for swash plate type hydraulic rotating machine
JP3993856B2 (en) * 2004-01-22 2007-10-17 光洋機械工業株式会社 Double-head surface grinding machine
WO2005095054A1 (en) * 2004-03-19 2005-10-13 Memc Electronic Materials, Inc. Wafer clamping device for a double side grinder
JP4670566B2 (en) * 2005-09-29 2011-04-13 信越半導体株式会社 Semiconductor wafer double-head grinding apparatus, hydrostatic pad and double-head grinding method using the same
JP2010064214A (en) * 2008-09-12 2010-03-25 Koyo Mach Ind Co Ltd Double head surface grinder and double-sided grinding method of workpiece

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