JP2015050263A - スピン処理装置 - Google Patents
スピン処理装置 Download PDFInfo
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- JP2015050263A JP2015050263A JP2013179910A JP2013179910A JP2015050263A JP 2015050263 A JP2015050263 A JP 2015050263A JP 2013179910 A JP2013179910 A JP 2013179910A JP 2013179910 A JP2013179910 A JP 2013179910A JP 2015050263 A JP2015050263 A JP 2015050263A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
3 カップ体
6 液受け部
6a 可動液受け部
6b 固定液受け部
7 仕切り部材
41a 傾斜板材
Claims (6)
- 基板を回転させて処理するスピン処理装置であって、
回転する基板をその外周から離間して囲むように環状に形成され、その回転する基板から飛散する液体を受けて収容する液受け部と、
前記液受け部をその外周から離間して囲むように環状に形成され、前記液受け部の上面から外周面に沿って気流を生じさせるための環状の外側排気流路を形成するカップ体と、
前記液受け部の環内に設けられて環状に形成され、前記液受け部の内周面に沿って気流を生じさせるための環状の内側排気流路を形成する仕切り部材と、
を備えることを特徴とするスピン処理装置。 - 前記液受け部は、
回転する基板の基板面に対して傾斜するように前記液受け部の内周面に個別に設けられ、回転する基板から飛散する液体をそれぞれ受ける複数の傾斜板材を具備することを特徴とする請求項1に記載のスピン処理装置。 - 基板を回転させて処理するスピン処理装置であって、
回転する基板をその外周から離間して囲むように環状に形成され、その回転する基板から飛散する液体を受けて収容する液受け部を備え、
前記液受け部は、
回転する基板の基板面に対して傾斜するように前記液受け部の内周面に個別に設けられ、回転する基板から飛散する液体をそれぞれ受ける複数の傾斜板材を具備する
ことを特徴とするスピン処理装置。 - 前記複数の傾斜板材は、前記基板の端から基板回転の接線方向に伸ばした仮想線に対して前記液受け部の内周面よりも先に交差するようにそれぞれ設けられていることを特徴とする請求項2又は請求項3に記載のスピン処理装置。
- 前記液受け部は、
昇降可能に形成され、前記複数の傾斜板材を内周面に有する環状の可動液受け部と、
前記複数の傾斜板材により受けた液体を収容する環状の固定液受け部と、
を具備することを特徴とする請求項2ないし請求項4のいずれか一項に記載のスピン処理装置。 - 前記液受け部は、フッ素樹脂により覆われ、網目状のフッ素樹脂体を内蔵する樹脂部材により形成されていることを特徴とする請求項1ないし請求項5のいずれか一項に記載のスピン処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013179910A JP6234736B2 (ja) | 2013-08-30 | 2013-08-30 | スピン処理装置 |
TW103127252A TWI620989B (zh) | 2013-08-30 | 2014-08-08 | 旋轉處理裝置 |
KR1020140113000A KR101634441B1 (ko) | 2013-08-30 | 2014-08-28 | 스핀 처리 장치 |
CN201410431485.XA CN104425235B (zh) | 2013-08-30 | 2014-08-28 | 自旋处理装置 |
US14/472,923 US9679787B2 (en) | 2013-08-30 | 2014-08-29 | Spin treatment apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013179910A JP6234736B2 (ja) | 2013-08-30 | 2013-08-30 | スピン処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015050263A true JP2015050263A (ja) | 2015-03-16 |
JP2015050263A5 JP2015050263A5 (ja) | 2017-05-18 |
JP6234736B2 JP6234736B2 (ja) | 2017-11-22 |
Family
ID=52581363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013179910A Active JP6234736B2 (ja) | 2013-08-30 | 2013-08-30 | スピン処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9679787B2 (ja) |
JP (1) | JP6234736B2 (ja) |
KR (1) | KR101634441B1 (ja) |
CN (1) | CN104425235B (ja) |
TW (1) | TWI620989B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017204517A (ja) * | 2016-05-10 | 2017-11-16 | トヨタ自動車株式会社 | 基板洗浄装置 |
WO2018055843A1 (ja) * | 2016-09-26 | 2018-03-29 | 株式会社Screenホールディングス | 基板処理装置 |
JP2019186529A (ja) * | 2018-03-30 | 2019-10-24 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
JP2021061294A (ja) * | 2019-10-04 | 2021-04-15 | 中興化成工業株式会社 | 洗浄装置 |
JP2023011058A (ja) * | 2017-09-26 | 2023-01-20 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
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JP6461617B2 (ja) * | 2015-01-20 | 2019-01-30 | 株式会社Screenホールディングス | 基板処理装置 |
KR101841342B1 (ko) * | 2015-03-30 | 2018-03-22 | 시바우라 메카트로닉스 가부시끼가이샤 | 스핀 처리 장치 |
TWI638394B (zh) * | 2016-07-25 | 2018-10-11 | 斯庫林集團股份有限公司 | 基板處理裝置 |
KR102226084B1 (ko) | 2017-02-06 | 2021-03-09 | 플레이너 세미컨덕터, 인크. | 나노미터 미만 수준 광-기반 기판 세정 메커니즘 |
TWI770115B (zh) | 2017-02-06 | 2022-07-11 | 新加坡商平面半導體公司 | 加工汙水之去除 |
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JP6841188B2 (ja) * | 2017-08-29 | 2021-03-10 | 東京エレクトロン株式会社 | 塗布処理装置及び塗布液捕集部材 |
KR102099105B1 (ko) | 2018-07-18 | 2020-05-15 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
KR102081706B1 (ko) | 2018-07-18 | 2020-02-27 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
KR102635385B1 (ko) * | 2020-11-23 | 2024-02-14 | 세메스 주식회사 | 기판 처리 장치 |
KR20220108560A (ko) * | 2021-01-27 | 2022-08-03 | 삼성전자주식회사 | 기판 처리 장치 |
JP2022124070A (ja) * | 2021-02-15 | 2022-08-25 | 株式会社Screenホールディングス | 基板処理装置、および、筒状ガードの加工方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017204517A (ja) * | 2016-05-10 | 2017-11-16 | トヨタ自動車株式会社 | 基板洗浄装置 |
WO2018055843A1 (ja) * | 2016-09-26 | 2018-03-29 | 株式会社Screenホールディングス | 基板処理装置 |
JP2018056151A (ja) * | 2016-09-26 | 2018-04-05 | 株式会社Screenホールディングス | 基板処理装置 |
TWI644736B (zh) * | 2016-09-26 | 2018-12-21 | 斯庫林集團股份有限公司 | 基板處理裝置 |
KR20190039246A (ko) * | 2016-09-26 | 2019-04-10 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 |
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JP7425852B2 (ja) | 2017-09-26 | 2024-01-31 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
JP2019186529A (ja) * | 2018-03-30 | 2019-10-24 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
JP7242341B2 (ja) | 2018-03-30 | 2023-03-20 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
JP2021061294A (ja) * | 2019-10-04 | 2021-04-15 | 中興化成工業株式会社 | 洗浄装置 |
JP7399452B2 (ja) | 2019-10-04 | 2023-12-18 | 中興化成工業株式会社 | 洗浄装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20150026940A (ko) | 2015-03-11 |
CN104425235A (zh) | 2015-03-18 |
US20150059642A1 (en) | 2015-03-05 |
CN104425235B (zh) | 2018-09-11 |
US9679787B2 (en) | 2017-06-13 |
KR101634441B1 (ko) | 2016-06-28 |
TW201523160A (zh) | 2015-06-16 |
JP6234736B2 (ja) | 2017-11-22 |
TWI620989B (zh) | 2018-04-11 |
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