JP2013538134A - 波形加工製品を作製するための装置および方法 - Google Patents
波形加工製品を作製するための装置および方法 Download PDFInfo
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- JP2013538134A JP2013538134A JP2013518807A JP2013518807A JP2013538134A JP 2013538134 A JP2013538134 A JP 2013538134A JP 2013518807 A JP2013518807 A JP 2013518807A JP 2013518807 A JP2013518807 A JP 2013518807A JP 2013538134 A JP2013538134 A JP 2013538134A
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- corrugated
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- polyethylene
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Images
Classifications
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- A—HUMAN NECESSITIES
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- B32B2266/0214—Materials belonging to B32B27/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/02—Organic
- B32B2266/0214—Materials belonging to B32B27/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2266/00—Composition of foam
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B2305/022—Foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2607/00—Walls, panels
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/30—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure
- E04C2/34—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure composed of two or more spaced sheet-like parts
- E04C2/3405—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure composed of two or more spaced sheet-like parts spaced apart by profiled spacer sheets
- E04C2002/3444—Corrugated sheets
- E04C2002/3466—Corrugated sheets with sinusoidal corrugations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1007—Running or continuous length work
- Y10T156/1016—Transverse corrugating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1025—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina to form undulated to corrugated sheet and securing to base with parts of shaped areas out of contact
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Architecture (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Mattresses And Other Support Structures For Chairs And Beds (AREA)
- Machines For Manufacturing Corrugated Board In Mechanical Paper-Making Processes (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
Description
本出願は、35 U.S.C.§119(e)に従い、2010年7月7日出願の米国仮特許出願第61/362,115号、2010年11月9日出願の米国仮特許出願第61/411,898号および2011年6月6日出願の米国仮特許出願第61/493,655号に対する利益を主張するものであり、それらの内容は、参照により全体が本明細書に組み込まれる。
供給ガイドを通して中央基板を駆動し、速度V3を有するように作動される駆動ローラの第1の対と、
駆動ローラの第1の対の後ろに位置付けられる形状ガイドであって、上部基板をガイドするための上部表面と、下部基板をガイドするための下部表面とを提供する、該形状ガイドと、
速度V1を有するように作動される駆動ローラの第2の対であって、V3は、V1よりも大きい、該第2の対と、
形状ガイドの上部表面および下部表面の付近に位置付けられる結合デバイスであって、中央基板を上部および下部基板に付着させる結合デバイスと、を備え、波形加工製品が製作される装置が提供される。
中央基板を速度V3で供給する駆動ローラの第1の対と、
駆動ローラの第1の対から中央基板を受容するように位置付けられる形状ガイドであって、距離S1だけ離間した上部および下部表面を備え、その上部表面上で上部基板を、およびその下部表面上で下部基板を受容する、該形状ガイドと、
形状ガイドの上部表面および下部表面の付近に位置付けられる結合デバイスであって、中央基板の襞を上部および下部基板に付着させ、波形加工製品を提供する結合デバイスと、
形状ガイドの後ろに位置付けられ、装置を通して波形加工製品を引き出す駆動ローラの第2の対と、を備え、波形加工物品が製造される装置の、さらに別の例示的実施形態を提供する。
(a)上部基板および下部基板を提供することであって、上部基板は、速度V1で移動し、下部基板は、速度V2で移動し、上部基板および下部基板は、互いに略平行であり、距離「S1」だけ離間する、該提供することと、
(b)中央基板を提供することであって、中央基板は、上部基板と下部基板との間に位置し、速度V3で移動し、V3は、V1またはV2よりも大きい、該提供することと、
(c)中央基板を、上部基板または下部基板に接触する軌道で推進することであって、上部基板または下部基板との接触後、中央基板は、反対方向に跳ね返って対置する基板に接触し、対置する基板との接触後、中央基板は跳ね返って他方の基板に接触する、該推進することと、
(d)中央基板が上部基板と下部基板との間に襞を形成するように、中央基板の接触点を、上部基板および下部基板に付着させることと、を含み、
波形加工製品が提供される方法を提供する。
上部基板と、
中央基板と、
下部基板と、
2つの側面周縁部分と、
2つの末端周縁部分と、
を含み、中央基板は、襞状であり、襞は、上部および下部基板に固定されて、単一壁の波形加工製品を形成し、
2つの側面部分は、波形加工製品の側面部分に固定され、2つの末端部分は、フォーム製品の末端に固定されて、マットレスの内部を封入する、波形加工フォームマットレスを提供する。
上部基板、中央基板および下部基板を有する、単一壁フォーム波形加工製品を製作することであって、
中央基板は、襞状であり、中央基板の襞は、上部および下部基板に付着される、製作することと、
単一壁波形加工製品の外側付近にフォーム周縁部分を付着させて、フォームマットレスを作製することと、を含む方法を提供する。
中央基板を速度V3で駆動するように作動される駆動ローラの第1の対と、駆動ローラの後ろに位置付けられる形状ガイドであって、上部基板をガイドするための上部表面と、下部基板をガイドするための下部表面とを提供する、形状ガイドと、速度V1を有するように作動される駆動ローラの第2の対であって、V3は、V1よりも大きい、第2の対と、形状ガイドの上部表面および下部表面の付近に位置付けられる結合デバイスであって、中央基板を上部および下部基板に付着させる結合デバイスと、を備え、波形加工製品が製作される、装置。
供給ガイドを通して中央基板を速度V3で供給する駆動ローラの第1の対と、
駆動ローラの第1の対の後ろに位置付けられ、距離S1だけ離間した上部および下部表面を備える形状ガイドであって、その上部表面上で上部基板を、およびその下部表面上で下部基板を受容する、形状ガイドと、
形状ガイドの上部表面および下部表面の付近に位置付けられる結合デバイスであって、中央基板の襞を上部および下部基板に付着させ、波形加工製品を提供する結合デバイスと、
形状ガイドの後ろに位置付けられ、装置を通して波形加工製品を引き出す駆動ローラの第2の対と、を備え、
波形加工物品が製造される、装置。
(a)上部基板および下部基板を提供することであって、上部基板は、速度V1で移動し、下部基板は、速度V2で移動し、上部基板および下部基板は、互いに略平行であり、距離「S1」だけ離間する、提供することと、
(b)中央基板を提供することであって、中央基板は、上部基板と下部基板との間に位置し、速度V3で移動し、V3は、V1またはV2よりも大きい、提供することと、
(c)中央基板を、上部基板または下部基板に接触する軌道で推進することであって、上部基板または下部基板との接触後、中央基板は、反対方向に跳ね返って対置する基板に接触し、対置する基板との接触後、中央基板は跳ね返って他方の基板に接触する、推進することと、
(d)中央基板が上部基板と下部基板との間に襞を形成するように、中央基板の接触点を、上部基板および下部基板に付着させることと、を含み、
波形加工製品が提供される、方法。
ポリエチレン誘導体、ポリ乳酸誘導体、セルロース誘導体、ケイ素およびケイ素系ポリマー、およびメタクリレートを含む、段落31〜33に記載の方法。
ポリ(ラクチド−コ−グリコリド)(PLGA)、ポリラクチド(PLA)、ポリグリコリド(PGA)、D−ラクチド、D,L−ラクチド、L−ラクチド、D,L−ラクチド−イプシロン−カプロラクトン、D,L−ラクチド−グリコリド−イプシロン−カプロラクトン、ポリイプシロン−カプロラクトン、グリコリド−カプロラクトンまたはそれらの組み合わせ、カルボキシメチルセルロース、酢酸セルロース、酢酸プロピオン酸セルロース、エチルセルロース、ヒドロキシプロピルメチルセルロース、ヒドロキシアルキルメチルセルロース、およびアルキルセルロース、ポリジメチルシロキサン、ポリエチレン−コ−(酢酸ビニル)、ポロキサマー、ポリビニルピロリドン、ポロキサミン、ポリプロピレン、ポリアミド、ポリアセタール、ポリエステル、ポリエチレン−クロロトリフルオロエチレン、ポリテトラフルオロエチレン(PTFEまたは「Teflon(商標)」)、スチレンブタジエンゴム、ポリエチレン、ポリプロピレン、ポリフェニレンオキシド−ポリスチレン、ポリ−アルファ−クロロ−p−キシレン、ポリメチルペンテン、ポリスルホン、非分解性エチレン−酢酸ビニル(例えば、エチレン酢酸ビニルディスクおよびポリ(エチレン−コ−酢酸ビニル))、ポリ(N−イソプロピルアクリルアミド)、デルリン、ポリウレタン、シリコーンおよびポリウレタンのコポリマー、ポリオレフィン(例えば、ポリイソブチレンおよびポリイソプレン)、アクリルアミド(例えば、ポリアクリル酸およびポリ(アクリロニトリル−アクリル酸))、ネオプレン、ニトリル、アクリレート(例えば、ポリアクリレート、ポリ(2−ヒドロキシエチルメタクリレート)、メタクリレート、メチルメタクリレート、2−ヒドロキシエチルメタクリレート、およびアクリレートとN−ビニルピロリドンのコポリマー)、N−ビニルラクタム、ポリアクリロニトリル、グルコマンナンゲル、加硫ゴム、ポリ(3−ヒドロキシブチレート)ならびにそれらの組み合わせを含む、段落31〜34に記載の方法。
上部基板と、
中央基板と、
下部基板と、
を含み、中央基板は、襞状であり、襞は、上部および下部基板に固定されて、単一壁の波形加工フォームマットレスを形成する、波形加工マットレス。
ポリエチレン誘導体、ポリ乳酸誘導体、セルロース誘導体、ケイ素およびケイ素系ポリマー、およびメタクリレートを含む、段落39〜42に記載の波形加工マットレス。
ポリ(ラクチド−コ−グリコリド)(PLGA)、ポリラクチド(PLA)、ポリグリコリド(PGA)、D−ラクチド、D,L−ラクチド、L−ラクチド、D,L−ラクチド−イプシロン−カプロラクトン、D,L−ラクチド−グリコリド−イプシロン−カプロラクトン、ポリイプシロン−カプロラクトン、グリコリド−カプロラクトンまたはそれらの組み合わせ、カルボキシメチルセルロース、酢酸セルロース、酢酸プロピオン酸セルロース、エチルセルロース、ヒドロキシプロピルメチルセルロース、ヒドロキシアルキルメチルセルロース、およびアルキルセルロース、ポリジメチルシロキサン、ポリエチレン−コ−(酢酸ビニル)、ポロキサマー、ポリビニルピロリドン、ポロキサミン、ポリプロピレン、ポリアミド、ポリアセタール、ポリエステル、ポリエチレン−クロロトリフルオロエチレン、ポリテトラフルオロエチレン(PTFEまたは「Teflon(商標)」)、スチレンブタジエンゴム、ポリエチレン、ポリプロピレン、ポリフェニレンオキシド−ポリスチレン、ポリ−アルファ−クロロ−p−キシレン、ポリメチルペンテン、ポリスルホン、非分解性エチレン−酢酸ビニル(例えば、エチレン酢酸ビニルディスクおよびポリ(エチレン−コ−酢酸ビニル))、ポリ(N−イソプロピルアクリルアミド)、デルリン、ポリウレタン、シリコーンおよびポリウレタンのコポリマー、ポリオレフィン(例えば、ポリイソブチレンおよびポリイソプレン)、アクリルアミド(例えば、ポリアクリル酸およびポリ(アクリロニトリル−アクリル酸))、ネオプレン、ニトリル、アクリレート(例えば、ポリアクリレート、ポリ(2−ヒドロキシエチルメタクリレート)、メタクリレート、メチルメタクリレート、2−ヒドロキシエチルメタクリレート、およびアクリレートとN−ビニルピロリドンのコポリマー)、N−ビニルラクタム、ポリアクリロニトリル、グルコマンナンゲル、加硫ゴム、ポリ(3−ヒドロキシブチレート)ならびにそれらの組み合わせを含む、段落39〜43に記載の波形加工マットレス。
ポリエチレン誘導体、ポリ乳酸誘導体、セルロース誘導体、ケイ素およびケイ素系ポリマー、およびメタクリレートを含む、段落39および43〜49に記載のマットレス。
上部基板、中央基板および下部基板を有する、単一壁フォーム波形加工製品を製作することを含み、中央基板は、襞状であり、中央基板の襞は、上部および下部基板に付着されて、フォームマットレスを形成する、方法。
ポリエチレン誘導体、ポリ乳酸誘導体、セルロース誘導体、ケイ素およびケイ素系ポリマー、およびメタクリレートを含む、段落55〜59に記載の方法。
ポリ(ラクチド−コ−グリコリド)(PLGA)、ポリラクチド(PLA)、ポリグリコリド(PGA)、D−ラクチド、D,L−ラクチド、L−ラクチド、D,L−ラクチド−イプシロン−カプロラクトン、D,L−ラクチド−グリコリド−イプシロン−カプロラクトン、ポリイプシロン−カプロラクトン、グリコリド−カプロラクトンまたはそれらの組み合わせ、カルボキシメチルセルロース、酢酸セルロース、酢酸プロピオン酸セルロース、エチルセルロース、ヒドロキシプロピルメチルセルロース、ヒドロキシアルキルメチルセルロース、およびアルキルセルロース、ポリジメチルシロキサン、ポリエチレン−コ−(酢酸ビニル)、ポロキサマー、ポリビニルピロリドン、ポロキサミン、ポリプロピレン、ポリアミド、ポリアセタール、ポリエステル、ポリエチレン−クロロトリフルオロエチレン、ポリテトラフルオロエチレン(PTFEまたは「Teflon(商標)」)、スチレンブタジエンゴム、ポリエチレン、ポリプロピレン、ポリフェニレンオキシド−ポリスチレン、ポリ−アルファ−クロロ−p−キシレン、ポリメチルペンテン、ポリスルホン、非分解性エチレン−酢酸ビニル(例えば、エチレン酢酸ビニルディスクおよびポリ(エチレン−コ−酢酸ビニル))、ポリ(N−イソプロピルアクリルアミド)、デルリン、ポリウレタン、シリコーンおよびポリウレタンのコポリマー、ポリオレフィン(例えば、ポリイソブチレンおよびポリイソプレン)、アクリルアミド(例えば、ポリアクリル酸およびポリ(アクリロニトリル−アクリル酸))、ネオプレン、ニトリル、アクリレート(例えば、ポリアクリレート、ポリ(2−ヒドロキシエチルメタクリレート)、メタクリレート、メチルメタクリレート、2−ヒドロキシエチルメタクリレート、およびアクリレートとN−ビニルピロリドンのコポリマー)、N−ビニルラクタム、ポリアクリロニトリル、グルコマンナンゲル、加硫ゴム、ポリ(3−ヒドロキシブチレート)ならびにそれらの組み合わせを含む、段落55〜60に記載の方法。
ポリエチレン誘導体、ポリ乳酸誘導体、セルロース誘導体、ケイ素およびケイ素系ポリマー、およびメタクリレートを含む、段落55および58〜67に記載のマットレス。
ポリ(ラクチド−コ−グリコリド)(PLGA)、ポリラクチド(PLA)、ポリグリコリド(PGA)、D−ラクチド、D,L−ラクチド、L−ラクチド、D,L−ラクチド−イプシロン−カプロラクトン、D,L−ラクチド−グリコリド−イプシロン−カプロラクトン、ポリイプシロン−カプロラクトン、グリコリド−カプロラクトンまたはそれらの組み合わせ、カルボキシメチルセルロース、酢酸セルロース、酢酸プロピオン酸セルロース、エチルセルロース、ヒドロキシプロピルメチルセルロース、ヒドロキシアルキルメチルセルロース、およびアルキルセルロース、ポリジメチルシロキサン、ポリエチレン−コ−(酢酸ビニル)、ポロキサマー、ポリビニルピロリドン、ポロキサミン、ポリプロピレン、ポリアミド、ポリアセタール、ポリエステル、ポリエチレン−クロロトリフルオロエチレン、ポリテトラフルオロエチレン(PTFEまたは「Teflon(商標)」)、スチレンブタジエンゴム、ポリエチレン、ポリプロピレン、ポリフェニレンオキシド−ポリスチレン、ポリ−アルファ−クロロ−p−キシレン、ポリメチルペンテン、ポリスルホン、非分解性エチレン−酢酸ビニル(例えば、エチレン酢酸ビニルディスクおよびポリ(エチレン−コ−酢酸ビニル))、ポリ(N−イソプロピルアクリルアミド)、デルリン、ポリウレタン、シリコーンおよびポリウレタンのコポリマー、ポリオレフィン(例えば、ポリイソブチレンおよびポリイソプレン)、アクリルアミド(例えば、ポリアクリル酸およびポリ(アクリロニトリル−アクリル酸))、ネオプレン、ニトリル、アクリレート(例えば、ポリアクリレート、ポリ(2−ヒドロキシエチルメタクリレート)、メタクリレート、メチルメタクリレート、2−ヒドロキシエチルメタクリレート、およびアクリレートとN−ビニルピロリドンのコポリマー)、N−ビニルラクタム、ポリアクリロニトリル、グルコマンナンゲル、加硫ゴム、ポリ(3−ヒドロキシブチレート)ならびにそれらの組み合わせを含む、段落55および58〜68に記載のマットレス。
Claims (38)
- 波形加工製品を製作するための方法であって、
(a)上部および下部基板をV1およびV2の速度で提供するステップであって、前記上部および下部基板は、互いに距離S1だけ離して維持される、該提供するステップと、
(b)前記上部基板と前記下部基板との間に介在する中央基板を、V3の速度で、前記上部または下部基板に衝突する軌道で提供するステップであって、前記中央基板が、前記上部および下部基板に交互に接触する襞を形成するように、速度V3は、V1およびV2の速度より大きい、該提供するステップと、を含み、波形加工製品が形成される方法。 - 前記距離S1は、形状ガイドにより区切られる、請求項1に記載の方法。
- 前記形状ガイドは、上部および下部表面を備える、請求項2に記載の方法。
- 前記上部および下部表面は、プレートまたはローラを備える、請求項3に記載の方法。
- 前記中央基板は、供給ガイドにより前記形状ガイド内に誘導される、請求項1〜4に記載の方法。
- 前記中央基板を駆動するように前記供給ガイドの前に位置付けられる駆動ローラをさらに備える、請求項1〜5のいずれか一項に記載の方法。
- 装置を通して前記波形加工製品を引き出すように、前記形状ガイドの後ろに駆動ローラの第2の組をさらに備える、請求項1〜6のいずれか一項に記載の方法。
- 前記中央基板の前記襞を、前記上部および下部基板に付着させることをさらに含む、請求項1〜7のいずれか一項に記載の方法。
- 前記中央基板の前記襞は、接着剤、前記基板を部分的に溶解するのに好適な溶剤、赤外線加熱、加熱、レーザ溶接、または超音波溶接により付着される、請求項8に記載の方法。
- V1およびV2は等しい、請求項1〜9のいずれか一項に記載の方法。
- 前記上部、中央および下部基板は、独立して、ポリ(ラクチド−コ−グリコリド)(PLGA)、ポリラクチド(PLA)、ポリグリコリド(PGA)、D−ラクチド、D,L−ラクチド、L−ラクチド、D,L−ラクチド−イプシロン−カプロラクトン、D,L−ラクチド−グリコリド−イプシロン−カプロラクトン、ポリイプシロン−カプロラクトン、グリコリド−カプロラクトンまたはそれらの組み合わせ、カルボキシメチルセルロース、酢酸セルロース、酢酸プロピオン酸セルロース、エチルセルロース、ヒドロキシプロピルメチルセルロース、ヒドロキシアルキルメチルセルロース、およびアルキルセルロース、ポリジメチルシロキサン、ポリエチレン−コ−(酢酸ビニル)、ポロキサマー、ポリビニルピロリドン、ポロキサミン、ポリプロピレン、ポリアミド、ポリアセタール、ポリエステル、ポリエチレン−クロロトリフルオロエチレン、ポリテトラフルオロエチレン(PTFEまたは「Teflon(商標)」)、スチレンブタジエンゴム、ポリエチレン、ポリプロピレン、ポリフェニレンオキシド−ポリスチレン、ポリ−アルファ−クロロ−p−キシレン、ポリメチルペンテン、ポリスルホン、非分解性エチレン−酢酸ビニル(例えば、エチレン酢酸ビニルディスクおよびポリ(エチレン−コ−酢酸ビニル))、ポリ(N−イソプロピルアクリルアミド)、デルリン、ポリウレタン、シリコーンおよびポリウレタンのコポリマー、ポリオレフィン(例えば、ポリイソブチレンおよびポリイソプレン)、アクリルアミド(例えば、ポリアクリル酸およびポリ(アクリロニトリル−アクリル酸))、ネオプレン、ニトリル、アクリレート(例えば、ポリアクリレート、ポリ(2−ヒドロキシエチルメタクリレート)、メタクリレート、メチルメタクリレート、2−ヒドロキシエチルメタクリレート、およびアクリレートとN−ビニルピロリドンのコポリマー)、N−ビニルラクタム、ポリアクリロニトリル、グルコマンナンゲル、加硫ゴム、ポリ(3−ヒドロキシブチレート)ならびにそれらの組み合わせから選択される、請求項1〜10に記載の方法。
- 前記上部、下部および中央基板は、ポリエチレンを含む、請求項1〜11のいずれか一項に記載の方法。
- 前記ポリエチレンは、独立気泡低密度ポリエチレンフォームである、請求項1〜12に記載の方法。
- 前記ポリエチレンは、食品用ポリエチレンである、請求項1〜13に記載の方法。
- 波形加工製品を製作するための装置であって、
(a)形状ガイドを通して中央基板を駆動し、速度V3を有するように作動される駆動ローラの第1の対と、
(b)形状ガイドであって、上部基板をガイドするための上部表面と、下部基板をガイドするための下部表面とを提供する、該形状ガイドと、
(c)速度V1を有するように作動される駆動ローラの第2の対と、を備え、
(d)V3は、V1より大きく、
(e)前記形状ガイドの前記上部表面および前記下部表面の付近に位置付けられる結合デバイスであって、前記中央基板を前記上部および下部基板に付着させる結合デバイスと、をさらに備え、
波形加工製品が製作される、装置。 - 前記形状ガイドは、略平行なプレート、平行なローラ、またはそれらの組み合わせの組である、請求項15に記載の装置。
- 供給ガイドをさらに備え、前記供給ガイドは、前記中央基板を受容するように変化することができる距離だけ離間した2つのプレートを備える、請求項15または16に記載の装置。
- 前記結合デバイスは、前記中央基板の前記襞を前記上部および下部基板に結合する、加熱器、溶剤、超音波溶接機、レーザ溶接機または接着剤である、請求項15〜17のいずれか一項に記載の装置。
- 切断装置をさらに備える、請求項15〜18のいずれか一項に記載の装置。
- 前記上部基板を前記形状ガイド内に、および前記下部基板を前記形状ガイド内にガイドするための1つ以上のガイドローラをさらに備える、請求項15〜19に記載の装置。
- 前記駆動ローラの第2の対は、装置内で前記波形加工製品が前記供給ガイドから出た後に位置する、請求項15〜20に記載の装置。
- 前記駆動ローラの第2の対は、前記形状ガイドの前に位置付けられ、前記上部基板のみを駆動する、請求項15〜20に記載の装置。
- 駆動ローラの第3の組が、前記形状ガイドの前に位置付けられ、前記下部基板のみを速度V2で駆動する、請求項15〜20および22に記載の装置。
- 前記駆動ローラは、一緒に作動される、請求項15〜23に記載の装置。
- 前記駆動ローラは、独立して作動される、請求項15〜23に記載の装置。
- 波形加工物品を製作するための装置であって、
(a)供給ガイドを通して中央基板を速度V3で移動させる駆動ローラの第1の対と、
(b)距離S1だけ離間した上部および下部表面を備える形状ガイドであって、その上部表面上で上部基板を、およびその下部表面上で下部基板を、および前記駆動ローラから前記中央基板を受容する、該形状ガイドと、
(c)前記形状ガイドの前記上部表面および前記下部表面の付近に位置付けられる結合デバイスであって、前記中央基板の襞を前記上部および下部基板に付着させ、波形加工製品を提供する結合デバイスと、
(d)前記形状ガイドの後ろに位置付けられ、前記装置を通して前記波形加工製品を引き出す駆動ローラの第2の対と、を備え、
波形加工物品が製造される、装置。 - 前記形状ガイドは、略平行なプレート、平行なローラ、またはそれらの組み合わせの組である、請求項26に記載の装置。
- 供給ガイドをさらに含み、前記供給ガイドは、前記駆動ローラから前記中央基板を受容するように変化することができる距離だけ離間した2つのプレートである、請求項26〜27に記載の装置。
- 前記結合デバイスは、前記中央基板の前記襞を前記上部および下部基板に結合する、加熱器、超音波溶接機、レーザ溶接機または接着剤である、請求項26〜28のいずれか一項に記載の装置。
- 切断装置をさらに備える、請求項26〜29のいずれか一項に記載の装置。
- 波形加工製品の作製方法であって、
(a)上部基板および下部基板を提供することであって、前記上部基板は、速度V1で移動し、前記下部基板は、速度V2で移動し、前記上部基板および前記下部基板は、互いに略平行であり、距離「S1」だけ離間する、該提供することと、
(b)中央基板を提供することであって、前記中央基板は、前記上部基板と前記下部基板との間に位置し、速度V3で移動し、V3は、V1またはV2よりも大きい、該提供することと、
(c)前記中央基板を、前記上部基板または前記下部基板に接触する軌道で推進することであって、前記上部基板または前記下部基板との接触後、前記中央基板は、反対方向に跳ね返って対置する基板に接触し、前記対置する基板との接触後、前記中央基板は跳ね返って他方の基板に接触する、該推進することと、
(d)前記中央基板が前記上部基板と前記下部基板との間に襞を形成するように、前記中央基板の接触点を、前記上部基板および前記下部基板に付着させることと、を含み、
波形加工製品が提供される、方法。 - V1およびV2は等しい、請求項26に記載の方法。
- V1およびV2は等しくない、請求項27に記載の方法。
- 前記上部、下部および中央基板は、独立して、
ポリエチレン誘導体、ポリ乳酸誘導体、セルロース誘導体、ケイ素およびケイ素系ポリマー、メタクリレート、プラスチックまたは金属を含む、請求項26〜28に記載の方法。 - 前記第1、第2および第3の基板は、独立して、
ポリ(ラクチド−コ−グリコリド)(PLGA)、ポリラクチド(PLA)、ポリグリコリド(PGA)、D−ラクチド、D,L−ラクチド、L−ラクチド、D,L−ラクチド−イプシロン−カプロラクトン、D,L−ラクチド−グリコリド−イプシロン−カプロラクトン、ポリイプシロン−カプロラクトン、グリコリド−カプロラクトンまたはそれらの組み合わせ、カルボキシメチルセルロース、酢酸セルロース、酢酸プロピオン酸セルロース、エチルセルロース、ヒドロキシプロピルメチルセルロース、ヒドロキシアルキルメチルセルロース、およびアルキルセルロース、ポリジメチルシロキサン、ポリエチレン−コ−(酢酸ビニル)、ポロキサマー、ポリビニルピロリドン、ポロキサミン、ポリプロピレン、ポリアミド、ポリアセタール、ポリエステル、ポリエチレン−クロロトリフルオロエチレン、ポリテトラフルオロエチレン(PTFEまたは「Teflon(商標)」)、スチレンブタジエンゴム、ポリエチレン、ポリプロピレン、ポリフェニレンオキシド−ポリスチレン、ポリ−アルファ−クロロ−p−キシレン、ポリメチルペンテン、ポリスルホン、非分解性エチレン−酢酸ビニル(例えば、エチレン酢酸ビニルディスクおよびポリ(エチレン−コ−酢酸ビニル))、ポリ(N−イソプロピルアクリルアミド)、デルリン、ポリウレタン、シリコーンおよびポリウレタンのコポリマー、ポリオレフィン(例えば、ポリイソブチレンおよびポリイソプレン)、アクリルアミド(例えば、ポリアクリル酸およびポリ(アクリロニトリル−アクリル酸))、ネオプレン、ニトリル、アクリレート(例えば、ポリアクリレート、ポリ(2−ヒドロキシエチルメタクリレート)、メタクリレート、メチルメタクリレート、2−ヒドロキシエチルメタクリレート、およびアクリレートとN−ビニルピロリドンのコポリマー)、N−ビニルラクタム、ポリアクリロニトリル、グルコマンナンゲル、加硫ゴム、ポリ(3−ヒドロキシブチレート)ならびにそれらの組み合わせを含む、請求項29に記載の方法。 - 前記ポリエチレンは、独立気泡低密度ポリエチレンフォームである、請求項26〜30に記載の方法。
- 前記上部、下部および中央基板は、FDAガイドラインに従う食品用ポリマー、食品用ポリ乳酸、または食品用低密度ポリエチレン(LDPE)から独立して選択される、請求項26〜31に記載の方法。
- 前記付着させることは、接着剤、前記基板を部分的に溶解するのに好適な溶剤、赤外線加熱、加熱、レーザまたは超音波溶接を使用して達成される、請求項26〜32に記載の方法。
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JP2016077443A Expired - Fee Related JP6251313B2 (ja) | 2010-07-07 | 2016-04-07 | 波形加工製品を作製するための装置および方法 |
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EP (1) | EP2590800B1 (ja) |
JP (2) | JP5918231B2 (ja) |
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CN (2) | CN103097112B (ja) |
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CA (1) | CA2804588C (ja) |
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JP2016164001A (ja) | 2016-09-08 |
AU2011276287B2 (en) | 2017-03-02 |
CN103097112B (zh) | 2015-03-11 |
US8580061B2 (en) | 2013-11-12 |
KR101901562B1 (ko) | 2018-09-27 |
CN104739089B (zh) | 2020-08-04 |
US20120006471A1 (en) | 2012-01-12 |
CA2804588A1 (en) | 2012-01-12 |
EP2590800B1 (en) | 2021-01-13 |
AU2017200726A1 (en) | 2017-02-23 |
KR20130141435A (ko) | 2013-12-26 |
CN103097112A (zh) | 2013-05-08 |
AU2011276287A9 (en) | 2017-03-02 |
US20150216319A1 (en) | 2015-08-06 |
CA2804588C (en) | 2018-11-27 |
JP6251313B2 (ja) | 2017-12-20 |
JP5918231B2 (ja) | 2016-05-18 |
US9004133B2 (en) | 2015-04-14 |
US10035299B2 (en) | 2018-07-31 |
US20160207251A1 (en) | 2016-07-21 |
MX337726B (es) | 2016-03-16 |
MX348607B (es) | 2017-06-21 |
CN104739089A (zh) | 2015-07-01 |
WO2012006349A1 (en) | 2012-01-12 |
US20140027062A1 (en) | 2014-01-30 |
EP2590800A1 (en) | 2013-05-15 |
US8726438B2 (en) | 2014-05-20 |
WO2012006343A1 (en) | 2012-01-12 |
MX2013000303A (es) | 2013-12-16 |
US20120005836A1 (en) | 2012-01-12 |
EP2590800A4 (en) | 2016-08-24 |
AU2011276287A1 (en) | 2013-01-24 |
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