JP2013508943A - ダイアタッチフィルム - Google Patents
ダイアタッチフィルム Download PDFInfo
- Publication number
- JP2013508943A JP2013508943A JP2012534084A JP2012534084A JP2013508943A JP 2013508943 A JP2013508943 A JP 2013508943A JP 2012534084 A JP2012534084 A JP 2012534084A JP 2012534084 A JP2012534084 A JP 2012534084A JP 2013508943 A JP2013508943 A JP 2013508943A
- Authority
- JP
- Japan
- Prior art keywords
- die attach
- epoxy resin
- attach film
- weight
- film according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims abstract description 50
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- 239000000853 adhesive Substances 0.000 claims description 82
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- 239000011347 resin Substances 0.000 claims description 57
- 239000003822 epoxy resin Substances 0.000 claims description 51
- 229920000647 polyepoxide Polymers 0.000 claims description 51
- -1 imidazole compound Chemical class 0.000 claims description 19
- 239000004925 Acrylic resin Substances 0.000 claims description 10
- 229920000178 Acrylic resin Polymers 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004843 novolac epoxy resin Substances 0.000 claims description 5
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 4
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
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- 230000007423 decrease Effects 0.000 description 5
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- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 4
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
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- 238000010438 heat treatment Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
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- 239000003208 petroleum Substances 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
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- 239000006087 Silane Coupling Agent Substances 0.000 description 2
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明のダイアタッチフィルムは、含まれる基材フィルム(厚さ:A)及び粘着部(厚さ:B)の厚さの比率(B/A)が0.15〜0.5、好ましくは、0.2〜0.4の範囲である。本発明のフィルムにおいて、上記比率が0.15未満なら、基材フィルムの厚さに対して粘着部の厚さが小さすぎるので、ダイシング工程で多量のバーが発生するおそれがあり、エキスパンディングが難しくなり、ピックアップ不良が発生するおそれがある。また、上記比率が0.5を超過すれば、ダイシング工程時にチッピング現象が過度に発生するか、またはフィルムの取り扱い性が悪くなるおそれがある。
ブチルアクリレート100重量部、エチルアクリレート100重量部、アクリロニトリル70重量部、グリシジルメタクリルレート8重量部、アクリル酸4重量部及び脱イオン化された蒸留水750重量部を、撹拌器、窒素置換器及び温度計が備えられた4口の3L反応器に入れた。次に、懸濁化剤として水に4%に希釈したポリビニルアルコール(商品名:NH−17、Nippon ghosei社(製))2重量部及び分子量調節剤としてドデシルメルカプタン(dodecyl mercaptan)0.3重量部を投入し、混合物を製造した。製造された混合物に約1時間窒素置換を行った後、55℃に昇温し、設定温度に到達したとき、開始剤としてエチルアセテートに2%に希釈したジエチルヘキシルペルオキシジカルボネート(商品名:Trigonox EHP、Akzo Nobel社(製))2重量部を入れ、重合反応を開始した。反応開始後、4時間が経過した時点で反応を終決させ、脱イオン化された蒸留水で数回洗浄した後、遠心分離器と真空オーブンを使用して乾燥させ、重合体ビーズ(polymer bead)を収得した。収率は、90%であり、ゲル透過クロマトグラフィーで測定した重量平均分子量は、75万であり、分子量分布は、4.0であり、ガラス転移温度(Tg)は、10℃であった。製造された重合体ビーズは、メチルエチルケトンに1日間充分に溶かして使用した。
ダイシングフィルム(粘着フィルム)の製造
2−エチルヘキシルアクリレート、メチルアクリレート及びメチルメタクリルレートを共重合して製造された重量平均分子量が80万であり、ガラス転移温度が10℃であるアクリル系共重合体100重量部、イソシアネート硬化剤5重量部及び重量平均分子量が2万である多管能性オリゴマー10重量部を含む混合物に、光開始剤としてダロクレTPO(Darocur TPO)を上記多管能性オリゴマー100重量部に対して7重量部の量で混合し、紫外線硬化型粘着剤組成物を製造した。次に、製造された紫外線硬化性粘着剤を離型処理された厚さ38μmのポリエステルフィルムの上に乾燥後の厚さが20μmとなるように塗布し、110℃で3分間乾燥した。次に、乾燥した粘着層を基材フィルムとして厚さが90μmのポリオレフインフィルムにラミネートし、ダイシング用粘着フィルムを製造した。
エポキシ樹脂としてYDCN−500−1P(KUKDO化学社(製)、クレゾールノボラックエポキシ樹脂:エポキシ当量=200、軟化点=52℃)75重量部、YD−128(KUKDO化学社(製)、ビスフェノールAエポキシ樹脂:エポキシ当量=187)25重量部、フェノール樹脂(KPHF2001、KOLON乳化社(製)、フェノールノボラック樹脂:水酸基当量=106、軟化点=88℃)60重量部、製造例1で製造された低弾性高分子量樹脂200重量部、2−フェニルイミダゾール(2PZ、四国化成社(製))0.5重量部、シランカップリング剤(KBM−403、新越化学社(製)、γ−グリシドキシプロピルトリメトキシシラン)2重量部及び球状シリカ充填剤(UFP−30、デンカ社(製)、平均粒径=150nm)30重量部をメチルエチルケトン(MEK)に撹拌混合し、樹脂ワニスを製造した。製造されたワニスを厚さ38μmの基材フィルム(SKC、RS−21G、シリコン離型PETフィルム)に塗布し、110℃で5分間乾燥し、塗膜の厚さが20μmのダイボンディング用接着層を製造した。製造された接着層をホットロールラミネータを利用して、上記製造された紫外線硬化型粘着層を含むダイシング用粘着フィルムと40℃、5kgf/cm2で5秒間ラミネートし、ダイアタッチフィルムを製造した。
ダイシング用粘着フィルムの製造時に粘着層の厚さを30μm、ポリオレフインフィルムの厚さを80μmにしたことを除いて実施例1と同一の方法でダイアタッチフィルムを製造した。
ダイボンディング用接着層の厚さを60μmにしたことを除いて実施例2と同一の方法でダイアタッチフィルムを製造した。
ダイボンディング用接着層の厚さを10μmにしたことを除いて実施例2と同一の方法でダイアタッチフィルムを製造した。
ダイシング用粘着フィルムの製造時に粘着層の厚さを10μm、ポリオレフインフィルムの厚さを100μmにしたことを除いて実施例1と同一の方法でダイアタッチフィルムを製造した。
ダイシング用粘着フィルムの製造時に粘着層の厚さを40μm、ポリオレフインフィルムの厚さを70μmにしたことを除いて実施例1と同一の方法でダイアタッチフィルムを製造した。
ダイボンディング用接着層の厚さを5μmにしたことを除いて比較例2と同一の方法でダイアタッチフィルムを製造した。
100μmのウェーハ及びウェーハリングにマウンターを利用して50℃でダイアタッチフィルムをラミネートした後、ダイシング装備(DAD−640、Disco社製)を利用してダイシング(条件:Rpm=40K、speed=50mm/sec、チップ大きさ=5mm×5mm、総個数100個)した後、チップ上でバーが発生した個数を測定した。
ダイシング工程後にエキスパンダ(HS−1810、Huggle社製)を使用して、5mmの範囲でエキスパンディングを行いながら、エキスパンディング性を評価した。
ダイシング工程後に5mm×5mmサイズのチップを剥離(総個数100個)し、チップ側面でチッピングを観察し、チップのサイズが20μm以上のものを測定した。
ダイシング工程後に光量が100mJ/cm2の高圧水銀灯を照射し、ダイシングされたチップ(総個数100個)をピックアップした。接着部が付着したチップがピックアップされた場合を○で示し、クラックが発生するか、またはチップがピックアップされない場合を×で示して評価した。
Claims (22)
- 基材フィルムと;上記基材フィルム上に形成された粘着部と;上記粘着部上に形成された接着部と;を含み、
上記基材フィルムの厚さをA、粘着部の厚さをB、そして接着部の厚さをCとするとき、B/Aの値が0.15〜0.5であり、B/Cの値が0.2〜4であるダイアタッチフィルム。 - B/Aの値が0.2〜0.4であることを特徴とする請求項1に記載のダイアタッチフィルム。
- B/Cの値が0.5〜3であることを特徴とする請求項1に記載のダイアタッチフィルム。
- 基材フィルムは、垂直方向及び水平方向の延伸率の差異が垂直方向延伸率の10%以内であることを特徴とする請求項1に記載のダイアタッチフィルム。
- 基材フィルムの厚さが10μm〜200μmであることを特徴とする請求項1に記載のダイアタッチフィルム。
- 粘着部は、厚さが10μm〜40μmであることを特徴とする請求項1に記載のダイアタッチフィルム。
- 接着部は、エポキシ樹脂、低弾性高分子量樹脂及び硬化剤を含むことを特徴とする請求項1に記載のダイアタッチフィルム。
- エポキシ樹脂は、ビスフェノールAエポキシ樹脂、ビスフェノールFエポキシ樹脂、クレゾールノボラックエポキシ樹脂、フェノールノボラックエポキシ樹脂、4官能性エポキシ樹脂、ビフェニル型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、アルキル変性トリフェノールメタン型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂及びジシクロペンタジエン変性フェノール型エポキシ樹脂よりなる群から選択された1つ以上であることを特徴とする請求項7に記載のダイアタッチフィルム。
- エポキシ樹脂は、二管能性エポキシ樹脂及び多管能性エポキシ樹脂の混合樹脂であることを特徴とする請求項7に記載のダイアタッチフィルム。
- 混合樹脂は、多管能性エポキシ樹脂100重量部に対して10重量部〜50重量部の二管能性エポキシ樹脂を含むことを特徴とする請求項9に記載のダイアタッチフィルム。
- エポキシ樹脂は、低弾性高分子量樹脂100重量部に対して10重量部〜200重量部の量で含まれることを特徴とする請求項7に記載のダイアタッチフィルム。
- 低弾性高分子量樹脂は、ガラス転移温度が−20℃〜40℃であり、重量平均分子量が10万〜100万であることを特徴とする請求項7に記載のダイアタッチフィルム。
- 低弾性高分子量樹脂は、ポリイミド、ポリエーテルイミド、ポリエステルイミド、ポリアミド、ポリエーテルスルホン、ポリエーテルケトン、ポリオレフイン、ポリ塩化ビニル、フェノキシ、反応性アクリロニトリルブタジエンゴム及びアクリル系樹脂よりなる群から選択された1つ以上を含むことを特徴とする請求項7に記載のダイアタッチフィルム。
- 硬化剤は、水酸基当量が100〜1,000であるフェノール樹脂であることを特徴とする請求項7に記載のダイアタッチフィルム。
- 硬化剤は、エポキシ樹脂100重量部に対して30重量部〜100重量部の量で含まれることを特徴とする請求項7に記載のダイアタッチフィルム。
- 接着部は、エポキシ樹脂100重量部に対して、0.1重量部〜10重量部の硬化促進剤をさらに含むことを特徴とする請求項7に記載のダイアタッチフィルム。
- 硬化促進剤は、イミダゾール化合物、トリフェニルホスフィンまたは3級アミン類であることを特徴とする請求項16に記載のダイアタッチフィルム。
- 接着部は、130℃で測定されたタック強度が50gf〜150gfであることを特徴とする請求項1に記載のダイアタッチフィルム。
- 接着部は、150℃で測定されたせん断強度が4.0MPa以上であることを特徴とする請求項1に記載のダイアタッチフィルム。
- 接着部は、厚さが1μm〜200μmであることを特徴とする請求項1に記載のダイアタッチフィルム。
- 請求項1に記載のダイアタッチフィルムの接着部がウェーハの一面に付着していて、
上記ダイアタッチフィルムの基材フィルムまたは粘着部がウェーハリングフレームに固定されている半導体ウェーハ。 - 請求項21に記載の半導体ウェーハをダイシングする第1段階と;
第1段階を経て製造された半導体チップをピックアップする第2段階と;を含む半導体パッケージング方法。
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2009
- 2009-10-16 WO PCT/KR2009/005974 patent/WO2011046238A1/ko active Application Filing
- 2009-10-16 CN CN200980163029.9A patent/CN102656675B/zh active Active
- 2009-10-16 US US13/502,018 patent/US20120270381A1/en not_active Abandoned
- 2009-10-16 JP JP2012534084A patent/JP6136268B2/ja active Active
- 2009-10-16 EP EP09850414.5A patent/EP2490251B1/en active Active
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WO2014084357A1 (ja) * | 2012-11-30 | 2014-06-05 | リンテック株式会社 | 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法 |
JPWO2014084357A1 (ja) * | 2012-11-30 | 2017-01-05 | リンテック株式会社 | 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法 |
KR101622023B1 (ko) | 2013-06-19 | 2016-05-17 | 주식회사 엘지화학 | 봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치 |
JP2017508304A (ja) * | 2014-01-03 | 2017-03-23 | エルジー・ケム・リミテッド | ダイシングフィルムおよびダイシングダイボンディングフィルム |
JP2018526830A (ja) * | 2015-11-06 | 2018-09-13 | エルジー・ケム・リミテッド | 半導体装置および半導体装置の製造方法 |
US10707187B2 (en) | 2015-11-06 | 2020-07-07 | Lg Chem, Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US10991678B2 (en) | 2015-11-06 | 2021-04-27 | Lg Chem, Ltd. | Semiconductor device and method for manufacturing semiconductor device |
JP2021019150A (ja) * | 2019-07-23 | 2021-02-15 | ロンシール工業株式会社 | 粘着テープ基材用フィルム |
Also Published As
Publication number | Publication date |
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JP6136268B2 (ja) | 2017-05-31 |
EP2490251B1 (en) | 2017-08-23 |
EP2490251A1 (en) | 2012-08-22 |
US20120270381A1 (en) | 2012-10-25 |
EP2490251A4 (en) | 2016-10-05 |
CN102656675B (zh) | 2016-04-13 |
WO2011046238A1 (ko) | 2011-04-21 |
CN102656675A (zh) | 2012-09-05 |
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