JP2013239564A - 粘着テープの貼着方法 - Google Patents
粘着テープの貼着方法 Download PDFInfo
- Publication number
- JP2013239564A JP2013239564A JP2012111411A JP2012111411A JP2013239564A JP 2013239564 A JP2013239564 A JP 2013239564A JP 2012111411 A JP2012111411 A JP 2012111411A JP 2012111411 A JP2012111411 A JP 2012111411A JP 2013239564 A JP2013239564 A JP 2013239564A
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- JP
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- Prior art keywords
- wafer
- adhesive tape
- sticking
- outer peripheral
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 37
- 239000012790 adhesive layer Substances 0.000 claims abstract description 35
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 86
- 239000000463 material Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5064—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like of particular form, e.g. being C-shaped, T-shaped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】粘着テープの中央部の直下にウェーハの中央部を位置付ける位置合わせステップと、粘着テープの中央部を通って粘着テープの直径を覆うように位置付けた貼着用ローラーで、粘着テープをウェーハの表面に押圧し、粘着テープの中央部とウェーハの中央部とが重なる位置で粘着テープの一部をウェーハへ貼着して固定する一部貼着ステップと、一部貼着ステップの後、貼着用ローラーをウェーハの中央部から外周部に向かって回転移動させ粘着テープをウェーハに貼着する貼着ステップと、を備える粘着テープの貼着方法とする。
【選択図】図6
Description
11C 中央部
11L 外周部
11R 外周部
14 バンプ
15 デバイス
17 デバイス領域
19 外周余剰領域
20 粘着テープ
20C 中央部
22 粘着層
24 基材
30 チャックテーブル
40 テープ供給装置
41 離型紙
46 貼着用ローラー
46a 回転軸心
Claims (1)
- 複数のデバイスが形成されたデバイス領域と該デバイス領域を囲繞する外周余剰領域を表面に有するウェーハの表面に、該外周余剰領域と対応する環状の粘着層を有する粘着テープを貼着する粘着テープの貼着方法であって、
表面を露出させて該ウェーハをチャックテーブルに載置するウェーハ載置ステップと、
該ウェーハと同等の直径の基材の片面の周縁に該外周余剰領域と対応する環状の粘着層が配設された粘着テープを、該チャックテーブルに載置された該ウェーハの表面に向かって対面させ、該粘着テープの中央部の直下に該ウェーハの中央部を位置付ける位置合わせステップと、
該粘着テープの中央部を通って該粘着テープの直径を覆うように位置付けた貼着用ローラーで、該粘着テープを該ウェーハの表面に押圧し、該粘着テープの中央部と該ウェーハの中央部とが重なる位置で該粘着テープの一部を該ウェーハへ貼着して固定する一部貼着ステップと、
一部貼着ステップの後、該貼着用ローラーを該ウェーハの中央部から外周部に向かって回転移動させ該粘着テープを該ウェーハに貼着する貼着ステップと、
を備える粘着テープの貼着方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012111411A JP6037655B2 (ja) | 2012-05-15 | 2012-05-15 | 粘着テープの貼着方法 |
US13/887,518 US20130306215A1 (en) | 2012-05-15 | 2013-05-06 | Adhesive tape ataching method |
CN201310174284.1A CN103426806B (zh) | 2012-05-15 | 2013-05-13 | 黏着带的粘贴方法 |
DE102013208835A DE102013208835A1 (de) | 2012-05-15 | 2013-05-14 | Haftbandbefestigungsverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012111411A JP6037655B2 (ja) | 2012-05-15 | 2012-05-15 | 粘着テープの貼着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013239564A true JP2013239564A (ja) | 2013-11-28 |
JP6037655B2 JP6037655B2 (ja) | 2016-12-07 |
Family
ID=49511141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012111411A Active JP6037655B2 (ja) | 2012-05-15 | 2012-05-15 | 粘着テープの貼着方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130306215A1 (ja) |
JP (1) | JP6037655B2 (ja) |
CN (1) | CN103426806B (ja) |
DE (1) | DE102013208835A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015185677A (ja) * | 2014-03-24 | 2015-10-22 | リンテック株式会社 | シート貼付装置および貼付方法 |
WO2020196794A1 (ja) * | 2019-03-27 | 2020-10-01 | 三井化学東セロ株式会社 | 保護フィルム及びその貼着方法並びに半導体部品の製造方法 |
KR20210084246A (ko) | 2019-12-27 | 2021-07-07 | 가부시기가이샤 디스코 | 보호 시트 배치 형성 장치, 및 보호 시트의 배치 형성 방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170016547A (ko) | 2015-08-03 | 2017-02-14 | 삼성전자주식회사 | 척 테이블 및 그를 포함하는 기판 제조 장치 |
KR102345923B1 (ko) * | 2017-05-18 | 2022-01-03 | 가부시기가이샤 디스코 | 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체 |
USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005109433A (ja) * | 2004-03-31 | 2005-04-21 | Disco Abrasive Syst Ltd | 半導体ウエーハの切削方法および研削用のバンプ保護部材 |
JP2007288031A (ja) * | 2006-04-19 | 2007-11-01 | Disco Abrasive Syst Ltd | 保護テープ貼着方法 |
JP2012059929A (ja) * | 2010-09-09 | 2012-03-22 | Lintec Corp | シート貼付装置及び貼付方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008270543A (ja) * | 2007-04-20 | 2008-11-06 | Disco Abrasive Syst Ltd | 接着フィルムの貼着方法 |
JP5324319B2 (ja) * | 2009-05-26 | 2013-10-23 | 日東電工株式会社 | ウエハマウント方法とウエハマウント装置 |
-
2012
- 2012-05-15 JP JP2012111411A patent/JP6037655B2/ja active Active
-
2013
- 2013-05-06 US US13/887,518 patent/US20130306215A1/en not_active Abandoned
- 2013-05-13 CN CN201310174284.1A patent/CN103426806B/zh active Active
- 2013-05-14 DE DE102013208835A patent/DE102013208835A1/de active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005109433A (ja) * | 2004-03-31 | 2005-04-21 | Disco Abrasive Syst Ltd | 半導体ウエーハの切削方法および研削用のバンプ保護部材 |
JP2007288031A (ja) * | 2006-04-19 | 2007-11-01 | Disco Abrasive Syst Ltd | 保護テープ貼着方法 |
JP2012059929A (ja) * | 2010-09-09 | 2012-03-22 | Lintec Corp | シート貼付装置及び貼付方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015185677A (ja) * | 2014-03-24 | 2015-10-22 | リンテック株式会社 | シート貼付装置および貼付方法 |
WO2020196794A1 (ja) * | 2019-03-27 | 2020-10-01 | 三井化学東セロ株式会社 | 保護フィルム及びその貼着方法並びに半導体部品の製造方法 |
KR20210084246A (ko) | 2019-12-27 | 2021-07-07 | 가부시기가이샤 디스코 | 보호 시트 배치 형성 장치, 및 보호 시트의 배치 형성 방법 |
US11651978B2 (en) | 2019-12-27 | 2023-05-16 | Disco Corporation | Protective sheet application apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
JP6037655B2 (ja) | 2016-12-07 |
CN103426806A (zh) | 2013-12-04 |
US20130306215A1 (en) | 2013-11-21 |
DE102013208835A1 (de) | 2013-11-21 |
CN103426806B (zh) | 2018-02-16 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |