JP2012519378A - スパッタされた圧電材料 - Google Patents
スパッタされた圧電材料 Download PDFInfo
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- JP2012519378A JP2012519378A JP2011552079A JP2011552079A JP2012519378A JP 2012519378 A JP2012519378 A JP 2012519378A JP 2011552079 A JP2011552079 A JP 2011552079A JP 2011552079 A JP2011552079 A JP 2011552079A JP 2012519378 A JP2012519378 A JP 2012519378A
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- Prior art keywords
- piezoelectric
- piezoelectric material
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- seed layer
- electrode
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- 239000000463 material Substances 0.000 title claims abstract description 62
- 238000000151 deposition Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 230000008021 deposition Effects 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 12
- 229910052741 iridium Inorganic materials 0.000 claims description 12
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 4
- 229910000457 iridium oxide Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract description 2
- 238000005240 physical vapour deposition Methods 0.000 description 12
- 239000010955 niobium Substances 0.000 description 10
- 239000010936 titanium Substances 0.000 description 9
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 229910052758 niobium Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101001095089 Homo sapiens PML-RARA-regulated adapter molecule 1 Proteins 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 102100037019 PML-RARA-regulated adapter molecule 1 Human genes 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- QNZFKUWECYSYPS-UHFFFAOYSA-N lead zirconium Chemical compound [Zr].[Pb] QNZFKUWECYSYPS-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Memories (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
Claims (20)
- Pb1.00+x(Zr0.52Ti0.48)1.00−yO3Nby(式中、x>−0.02且つy>0)の物体を含む圧電材料。
- −0.01≦x≦0.15且つ0<y≦0.15である、請求項1に記載の圧電材料。
- 0≦x≦0.05且つ0.08<y≦0.13である、請求項1に記載の圧電材料。
- 前記材料がペロブスカイト型結晶構造を有する、請求項1に記載の圧電材料。
- yが約0.1である、請求項1に記載の圧電材料。
- 請求項1に記載の圧電材料と、
前記圧電材料の第1面上の第1電極と、
前記圧電材料の第2面上の第2電極と、を備える圧電積層体。 - 前記第1電極が、前記圧電材料に直接隣接する導電性酸化物を含む、請求項6に記載の圧電積層体。
- 前記第2電極が、前記圧電材料に隣接するシード層を含む、請求項6に記載の圧電積層体。
- 前記シード層が、イリジウムを含む、請求項8に記載の圧電積層体。
- 前記シード層が、(111)結晶配向した膜面を有する、請求項8に記載の圧電積層体。
- 前記シード層が、酸化イリジウムを含む、請求項8に記載の圧電積層体。
- 前記第1電極が、白金を含む、請求項8に記載の圧電積層体。
- 圧縮可能なチャンバを内部に有する本体と、
前記チャンバに隣接するアクチュエータであって、請求項6に記載の圧電積層体を含むアクチュエータと、を備えるMEMS。 - Pb1.00+x(Zr0.52Ti0.48)1.00−yO3Nby(式中、−0.1≦x≦0.30且つ0<y≦0.2)の組成を有するセラミック体を含むセラミックターゲット。
- 0.08≦yである、請求項14に記載のセラミックターゲット。
- 圧電材料の形成方法であって、
チャンバ内の請求項14に記載のセラミックターゲットにバイアスをかける工程と、
前記チャンバ内の支持体を450℃よりも高い温度に加熱する工程と、
前記支持体上に被堆積面を支持する工程と、
不活性及び反応性ガスを前記チャンバに導入して前記セラミックターゲットからのセラミック材料を前記被堆積面上に堆積させることにより前記圧電材料を形成する工程と、を含む圧電材料の形成方法。 - 前記被堆積面に前記セラミック材料を堆積させる前に前記被堆積面にシード層を適用することをさらに含む、請求項16に記載の方法。
- 前記シード層が(111)結晶配向を有する、請求項17に記載の方法。
- 前記シード層を適用する前に密着層を前記被堆積面に適用することをさらに含む、請求項17に記載の方法。
- 前記圧電材料を形成した後に、前記圧電材料上に電極を適用することをさらに含む、請求項16に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/393,644 US8164234B2 (en) | 2009-02-26 | 2009-02-26 | Sputtered piezoelectric material |
US12/393,644 | 2009-02-26 | ||
PCT/US2010/025012 WO2010099091A1 (en) | 2009-02-26 | 2010-02-23 | Sputtered piezoelectric material |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012519378A true JP2012519378A (ja) | 2012-08-23 |
JP2012519378A5 JP2012519378A5 (ja) | 2013-04-04 |
Family
ID=42630346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011552079A Abandoned JP2012519378A (ja) | 2009-02-26 | 2010-02-23 | スパッタされた圧電材料 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8164234B2 (ja) |
EP (1) | EP2401414B1 (ja) |
JP (1) | JP2012519378A (ja) |
KR (1) | KR101312485B1 (ja) |
CN (1) | CN102333904B (ja) |
WO (1) | WO2010099091A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015030064A1 (ja) * | 2013-08-27 | 2015-03-05 | 三菱マテリアル株式会社 | PNbZT薄膜の製造方法 |
JP2015195373A (ja) * | 2014-03-24 | 2015-11-05 | セイコーエプソン株式会社 | 圧電素子及び圧電素子応用デバイス |
JP2020097186A (ja) * | 2018-12-19 | 2020-06-25 | エスアイアイ・プリンテック株式会社 | ヘッドチップ、液体噴射ヘッド、液体噴射記録装置およびヘッドチップの製造方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2010129756A1 (en) | 2009-05-08 | 2010-11-11 | Swagelok Company | Conduit fitting with attached torque collar |
JP5399970B2 (ja) * | 2010-03-31 | 2014-01-29 | パナソニック株式会社 | 強誘電体デバイスの製造方法 |
FR2976126B1 (fr) * | 2011-06-01 | 2014-05-09 | Commissariat Energie Atomique | Composant electrique comprenant un materiau de structure perovskite et des electrodes optimisees et procede de fabrication |
US10266936B2 (en) | 2011-10-17 | 2019-04-23 | The United States Of America As Represented By The Secretary Of The Army | Process for making lead zirconate titanate (PZT) layers and/or platinum electrodes and products thereof |
CN104245324B (zh) * | 2012-07-25 | 2016-10-12 | 惠普发展公司,有限责任合伙企业 | 压电致动器和制造压电致动器的方法 |
WO2014021850A1 (en) * | 2012-07-31 | 2014-02-06 | Hewlett-Packard Development Company, L.P. | Thin film stack |
KR101865347B1 (ko) * | 2016-06-10 | 2018-06-07 | 주식회사 모다이노칩 | 음향 출력 장치 |
WO2017213415A1 (ko) * | 2016-06-10 | 2017-12-14 | 주식회사 모다이노칩 | 음향 출력 장치 |
CN112853286A (zh) | 2019-11-12 | 2021-05-28 | 应用材料公司 | 压电膜的物理气相沉积 |
US20240065105A1 (en) * | 2022-08-17 | 2024-02-22 | Fujifilm Dimatix, Inc. | Process of epitaxial grown pzt film and method of making a pzt device |
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JP2015065430A (ja) * | 2013-08-27 | 2015-04-09 | 三菱マテリアル株式会社 | PNbZT薄膜の製造方法 |
JP2015195373A (ja) * | 2014-03-24 | 2015-11-05 | セイコーエプソン株式会社 | 圧電素子及び圧電素子応用デバイス |
JP2020097186A (ja) * | 2018-12-19 | 2020-06-25 | エスアイアイ・プリンテック株式会社 | ヘッドチップ、液体噴射ヘッド、液体噴射記録装置およびヘッドチップの製造方法 |
JP7193334B2 (ja) | 2018-12-19 | 2022-12-20 | エスアイアイ・プリンテック株式会社 | ヘッドチップ、液体噴射ヘッド、液体噴射記録装置およびヘッドチップの製造方法 |
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CN102333904A (zh) | 2012-01-25 |
CN102333904B (zh) | 2013-08-07 |
EP2401414A4 (en) | 2013-10-09 |
WO2010099091A1 (en) | 2010-09-02 |
KR101312485B1 (ko) | 2013-10-01 |
KR20110120342A (ko) | 2011-11-03 |
US20120177815A1 (en) | 2012-07-12 |
US8164234B2 (en) | 2012-04-24 |
EP2401414B1 (en) | 2020-06-03 |
US20100213795A1 (en) | 2010-08-26 |
EP2401414A1 (en) | 2012-01-04 |
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