EP1973177B8 - Ferroelectric film, process for producing the same, ferroelectric device, and liquid discharge device - Google Patents

Ferroelectric film, process for producing the same, ferroelectric device, and liquid discharge device Download PDF

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Publication number
EP1973177B8
EP1973177B8 EP08005206.1A EP08005206A EP1973177B8 EP 1973177 B8 EP1973177 B8 EP 1973177B8 EP 08005206 A EP08005206 A EP 08005206A EP 1973177 B8 EP1973177 B8 EP 1973177B8
Authority
EP
European Patent Office
Prior art keywords
ferroelectric
producing
same
liquid discharge
discharge device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP08005206.1A
Other languages
German (de)
French (fr)
Other versions
EP1973177A2 (en
EP1973177A3 (en
EP1973177B1 (en
Inventor
Takami Arakawa
Takamichi Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007229787A external-priority patent/JP2008266770A/en
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of EP1973177A2 publication Critical patent/EP1973177A2/en
Publication of EP1973177A3 publication Critical patent/EP1973177A3/en
Application granted granted Critical
Publication of EP1973177B1 publication Critical patent/EP1973177B1/en
Publication of EP1973177B8 publication Critical patent/EP1973177B8/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/49—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
    • C04B35/491—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT
    • C04B35/493—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT containing also other lead compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/088—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/21—Line printing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3251—Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/76—Crystal structural characteristics, e.g. symmetry
    • C04B2235/767—Hexagonal symmetry, e.g. beta-Si3N4, beta-Sialon, alpha-SiC or hexa-ferrites

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Inorganic Insulating Materials (AREA)
EP08005206.1A 2007-03-22 2008-03-19 Ferroelectric film, process for producing the same, ferroelectric device, and liquid discharge device Active EP1973177B8 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007074026 2007-03-22
JP2007229787A JP2008266770A (en) 2007-03-22 2007-09-05 Ferroelectric film, process for producing the same, ferroelectric device, and liquid discharge device
JP2007229788A JP2008266771A (en) 2007-03-22 2007-09-05 Ferroelectric film, process for producing the same, ferroelectric device, and liquid discharge device
JP2007229789A JP4808689B2 (en) 2007-03-22 2007-09-05 Ferroelectric film and manufacturing method thereof, ferroelectric element, and liquid ejection apparatus
JP2007229786A JP5367242B2 (en) 2007-03-22 2007-09-05 Ferroelectric film and manufacturing method thereof, ferroelectric element, and liquid ejection apparatus

Publications (4)

Publication Number Publication Date
EP1973177A2 EP1973177A2 (en) 2008-09-24
EP1973177A3 EP1973177A3 (en) 2012-07-04
EP1973177B1 EP1973177B1 (en) 2014-10-01
EP1973177B8 true EP1973177B8 (en) 2015-01-21

Family

ID=39774253

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08005206.1A Active EP1973177B8 (en) 2007-03-22 2008-03-19 Ferroelectric film, process for producing the same, ferroelectric device, and liquid discharge device

Country Status (2)

Country Link
US (1) US8100513B2 (en)
EP (1) EP1973177B8 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4993294B2 (en) * 2007-09-05 2012-08-08 富士フイルム株式会社 Perovskite oxide, ferroelectric film and manufacturing method thereof, ferroelectric element, and liquid ejection device
JP4505492B2 (en) * 2007-11-06 2010-07-21 富士フイルム株式会社 Perovskite oxide, ferroelectric film, ferroelectric element, and liquid ejection device
JP5290610B2 (en) * 2008-04-09 2013-09-18 富士フイルム株式会社 Method for forming piezoelectric film
JP4438892B1 (en) * 2009-02-03 2010-03-24 富士フイルム株式会社 Piezoelectric body and manufacturing method thereof, piezoelectric element, and liquid ejection device
JP4438893B1 (en) * 2009-02-04 2010-03-24 富士フイルム株式会社 Piezoelectric body and manufacturing method thereof, piezoelectric element, and liquid ejection device
JP5592104B2 (en) * 2009-02-17 2014-09-17 富士フイルム株式会社 Piezoelectric film, piezoelectric element including the same, and liquid ejection device
US8557088B2 (en) * 2009-02-19 2013-10-15 Fujifilm Corporation Physical vapor deposition with phase shift
US8540851B2 (en) * 2009-02-19 2013-09-24 Fujifilm Corporation Physical vapor deposition with impedance matching network
US8164234B2 (en) * 2009-02-26 2012-04-24 Fujifilm Corporation Sputtered piezoelectric material
JP5506031B2 (en) * 2009-12-28 2014-05-28 富士フイルム株式会社 Actuator element driving method and device inspection method
JP5555072B2 (en) 2010-06-25 2014-07-23 富士フイルム株式会社 Piezoelectric film, piezoelectric element, and liquid ejection device
JP5847803B2 (en) * 2011-03-30 2016-01-27 日本碍子株式会社 Method for manufacturing piezoelectric substrate
JP6036460B2 (en) * 2013-03-26 2016-11-30 三菱マテリアル株式会社 Method for forming PNbZT ferroelectric thin film
EP3306687B1 (en) * 2015-05-25 2021-03-17 Konica Minolta, Inc. Piezoelectric thin film, piezoelectric actuator, inkjet head, inkjet printer, and method for manufacturing piezoelectric actuator
DE112017003091B4 (en) 2016-07-28 2021-02-18 Fujifilm Corporation Piezoelectric film, piezoelectric element, and method of making a piezoelectric film
CN109983592B (en) 2016-12-12 2023-05-12 松下知识产权经营株式会社 Piezoelectric functional film, actuator, and inkjet head
JP6402369B1 (en) 2017-02-16 2018-10-10 パナソニックＩｐマネジメント株式会社 Piezoelectric element, actuator, and droplet discharge head
KR20210138997A (en) 2020-05-13 2021-11-22 삼성전자주식회사 Capacitor, method of controlling the same, and transistor including the same

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JPH07330425A (en) 1994-06-01 1995-12-19 Ngk Spark Plug Co Ltd Porcelain composition for piezoelectric filter
DE69510284T2 (en) * 1994-08-25 1999-10-14 Seiko Epson Corp Liquid jet head
JP3970588B2 (en) 2000-12-28 2007-09-05 株式会社日本自動車部品総合研究所 Low-temperature fired dielectric ceramic, multilayer dielectric element, dielectric ceramic manufacturing method and auxiliary oxide
JP4752156B2 (en) 2001-08-23 2011-08-17 株式会社村田製作所 Piezoelectric ceramic composition for laminated piezoelectric element, laminated piezoelectric element, method for producing laminated piezoelectric element, and laminated piezoelectric device
JP2005101512A (en) 2002-10-24 2005-04-14 Seiko Epson Corp Ferroelectric film, ferroelectric memory, piezoelectric element, semiconductor element, liquid ejection head, printer and process for producing ferroelectric film
JP3791614B2 (en) 2002-10-24 2006-06-28 セイコーエプソン株式会社 Ferroelectric film, ferroelectric memory device, piezoelectric element, semiconductor element, piezoelectric actuator, liquid ejecting head, and printer
JP4572361B2 (en) 2003-03-28 2010-11-04 セイコーエプソン株式会社 Ferroelectric film manufacturing method, ferroelectric capacitor and manufacturing method thereof, ferroelectric memory and piezoelectric element
JP2005035843A (en) 2003-07-15 2005-02-10 Taiheiyo Cement Corp Piezoelectric ceramics, sintering aid, and laminated piezoelectric element
JP4479193B2 (en) 2003-08-27 2010-06-09 セイコーエプソン株式会社 Semiconductor device
JP2005150694A (en) 2003-10-23 2005-06-09 Seiko Epson Corp Piezoelectric film, piezoelectric element, piezoelectric actuator, piezoelectric pump, ink-jet recording head, ink-jet printer, surface acoustic wave element, thin film piezoelectric resonator, frequency filter, oscillator, electronic circuit, and electronic apparatus
JP4171908B2 (en) * 2004-01-20 2008-10-29 セイコーエプソン株式会社 Ferroelectric film, ferroelectric memory, and piezoelectric element
JP4811556B2 (en) 2004-04-23 2011-11-09 セイコーエプソン株式会社 Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus
JP4396857B2 (en) * 2005-08-30 2010-01-13 セイコーエプソン株式会社 Insulating target material manufacturing method
JP4142705B2 (en) * 2006-09-28 2008-09-03 富士フイルム株式会社 Film forming method, piezoelectric film, piezoelectric element, and liquid ejection apparatus
US20080081215A1 (en) * 2006-09-28 2008-04-03 Fujifilm Corporation Process for forming a film, piezoelectric film, and piezoelectric device

Also Published As

Publication number Publication date
EP1973177A2 (en) 2008-09-24
EP1973177A3 (en) 2012-07-04
EP1973177B1 (en) 2014-10-01
US20080231667A1 (en) 2008-09-25
US8100513B2 (en) 2012-01-24

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