JP2012229448A - 遮光性を有する光硬化性樹脂組成物及びその硬化物 - Google Patents
遮光性を有する光硬化性樹脂組成物及びその硬化物 Download PDFInfo
- Publication number
- JP2012229448A JP2012229448A JP2012186226A JP2012186226A JP2012229448A JP 2012229448 A JP2012229448 A JP 2012229448A JP 2012186226 A JP2012186226 A JP 2012186226A JP 2012186226 A JP2012186226 A JP 2012186226A JP 2012229448 A JP2012229448 A JP 2012229448A
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- Prior art keywords
- photocurable resin
- resin
- refractive index
- resin composition
- acrylate
- Prior art date
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- 239000011347 resin Substances 0.000 claims abstract description 100
- 150000001875 compounds Chemical class 0.000 claims abstract description 26
- 230000003287 optical effect Effects 0.000 claims description 23
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 abstract description 10
- -1 acrylate compound Chemical class 0.000 description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
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- 239000004925 Acrylic resin Substances 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 6
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- 238000001723 curing Methods 0.000 description 5
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
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- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
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- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
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- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
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- 239000000654 additive Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
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- GVPWHKZIJBODOX-UHFFFAOYSA-N dibenzyl disulfide Chemical compound C=1C=CC=CC=1CSSCC1=CC=CC=C1 GVPWHKZIJBODOX-UHFFFAOYSA-N 0.000 description 2
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- 229920000728 polyester Polymers 0.000 description 2
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- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
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- 238000003756 stirring Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- UHUKCWCIQZILRP-UHFFFAOYSA-N (1-hydroxy-3-methylpentyl) prop-2-enoate Chemical compound CCC(C)CC(O)OC(=O)C=C UHUKCWCIQZILRP-UHFFFAOYSA-N 0.000 description 1
- VMHYWKBKHMYRNF-UHFFFAOYSA-N (2-chlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC=C1C(=O)C1=CC=CC=C1 VMHYWKBKHMYRNF-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- ATIAIEWDRRJGSL-UHFFFAOYSA-N 1,3-bis(2-hydroxyethyl)-5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)N(CCO)C(=O)N(CCO)C1=O ATIAIEWDRRJGSL-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- UHLWGJNVYHBNBV-UHFFFAOYSA-N 1-(1-hydroxypropan-2-yloxy)-3-methoxypropan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.COCC(O)COC(C)CO UHLWGJNVYHBNBV-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- HUDYANRNMZDQGA-UHFFFAOYSA-N 1-[4-(dimethylamino)phenyl]ethanone Chemical compound CN(C)C1=CC=C(C(C)=O)C=C1 HUDYANRNMZDQGA-UHFFFAOYSA-N 0.000 description 1
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- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
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- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
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Images
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- Compositions Of Macromolecular Compounds (AREA)
- Polyethers (AREA)
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Abstract
【解決手段】光硬化性樹脂及び該光硬化性樹脂の硬化物の屈折率との屈折率の差が0.01以上となる屈折率を有し、該光硬化性樹脂に対して非相溶性で分散性を有する化合物を含む光硬化性樹脂組成物。
【選択図】なし
Description
(1)光硬化性樹脂及び該光硬化性樹脂の硬化物の屈折率との屈折率の差が0.01以上となる屈折率を有し、該光硬化性樹脂に対して非相溶性で分散性を有する化合物を含む光硬化性樹脂組成物;
(2)屈折率の差が0.1以上である、上記(1)記載の光硬化性樹脂組成物;
(3)光硬化性樹脂がアクリル変性樹脂又はエポキシ樹脂である、上記(1)又は(2)記載の光硬化性樹脂組成物;
(4)さらに、光重合開始剤を含む、上記(1)〜(3)のいずれか1項記載の光硬化性樹脂組成物;
(5)上記(1)〜(4)のいずれか1項記載の光重合性樹脂組成物の硬化物;
(6)上記(5)記載の硬化物を含む光学機器部材;
(7)上記(6)記載の光学機器部材を含む光学機器
である。
ZnO(屈折率1.90)、TiO2 (屈折率2.3〜2.7)、CeO2 (屈折率1.95)、Sb2 O5 (屈折率1.71)、SnO2 、ITO(屈折率1.95)、Y2 O3 (屈折率1.87)、La2 O3 (屈折率1.95)、ZrO2 (屈折率2.05)、Al2 O3 (屈折率1.63)、メラミン樹脂(1.6)、ナイロン(1.53)、ポリスチレン(1.6)、ポリエチレン(1.53)、ポリテトラフルオロエチレン(1.35)、メタクリル酸メチル樹脂(1.49)、塩化ビニル樹脂(1.54)、シリコーン油(1.4)
表1に示す割合で、ウレタンアクリレート樹脂(U-4HA、新中村化学社製)と光重合開始剤(I-184、CIBA CHWMICALS社製)を常法に従って混合しアクリル系ベース樹脂Aを、また、エポキシ樹脂(EP-830S、大日本インキ化学社製)と光重合開始剤(SP150、サンアプロ社製)を常法に従って混合しエポキシ系ベース樹脂Bを得た。さらに表2に示す割合で、作製したベース樹脂と各種材料を常法に従って混合し、光硬化性遮光樹脂組成物を得た。具体的には、室温のアクリル系ベース樹脂Aの100重量部を容器に装入した後、20重量部の球状アルミナを添加し500rpmの撹拌条件下、23℃で15分撹拌した。
表2に示すような割合で、実施例1と同様にして、混合し光硬化性樹脂組成物を得た。ベース樹脂A及びBのみからなる光硬化性樹脂組成物を参考例1及び2とした。
高屈折率化合物及び低屈折率化合物の代わりにカーボンブラックを加える以外は、実施例1と全く同様に操作し、表5に示すような割合で光硬化性樹脂組成物を得た。これらを実施例1と同様に評価し、その結果を表6に示す。
E:遮光スペーサ、F:遮光性固定(封止)樹脂
1:入射光、2:外部透過光、3:内部透過光(損失光)
Claims (7)
- 光硬化性樹脂及び該光硬化性樹脂の硬化物の屈折率との屈折率の差が0.01以上となる屈折率を有し、該光硬化性樹脂に対して非相溶性で分散性を有する化合物を含む光硬化性樹脂組成物。
- 屈折率の差が0.1以上である、請求項1記載の光硬化性樹脂組成物。
- 光硬化性樹脂がアクリル変性樹脂又はエポキシ樹脂である、請求項1又は2記載の光硬化性樹脂組成物。
- さらに、光重合開始剤を含む、請求項1〜3のいずれか1項記載の光硬化性樹脂組成物。
- 請求項1〜4のいずれか1項記載の光重合性樹脂組成物の硬化物。
- 請求項5記載の硬化物を含む光学機器部材。
- 請求項6記載の光学機器部材を含む光学機器。
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