JP2012227293A - ソルダーレジスト、ソルダーレジスト原料、led基板、発光モジュール、発光モジュールを有する機器、led基板の製造方法、発光モジュールの製造方法、及び発光モジュールを有する機器の製造方法 - Google Patents
ソルダーレジスト、ソルダーレジスト原料、led基板、発光モジュール、発光モジュールを有する機器、led基板の製造方法、発光モジュールの製造方法、及び発光モジュールを有する機器の製造方法 Download PDFInfo
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- JP2012227293A JP2012227293A JP2011092524A JP2011092524A JP2012227293A JP 2012227293 A JP2012227293 A JP 2012227293A JP 2011092524 A JP2011092524 A JP 2011092524A JP 2011092524 A JP2011092524 A JP 2011092524A JP 2012227293 A JP2012227293 A JP 2012227293A
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- solder resist
- light emitting
- substrate
- emitting module
- manufacturing
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Images
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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Abstract
【解決手段】平均粒子直径が0.1〜10μmの範囲にある酸化チタン粒子、及び、シリコーン樹脂から構成されるソルダーレジスト。
【選択図】図2
Description
さらに樹脂からなる基板は、柔軟性がありかつ復元力があるため、薄い基板であっても、銅、アルミニウム、ステンレス等からなるメタル基板のように塑性変形することなく、変形後にもとの形状に復元することができる。このため、落下による強い衝撃あるいは取り扱いによる変形が発生してももとの形状に戻ることができる。このため、LED基板に発光素子を実装する際あるいは発光モジュールを機器に実装する際に容易に取り扱うことができる。
本実施形態において、フィルド導体10bの形状は、LED実装面側(第1面:Z1側)に向かって縮径されるようにテーパしたテーパ円柱(円錐台)である。しかしこれに限定されず、フィルド導体10bの形状は、LED実装裏側(第2面:Z2側)に向かって縮径されるようにテーパしたテーパ円柱(円錐台)、あるいは第1面、第2面からそれぞれ中央に向かって縮径されるようにテーパした中央のくびれた形状などであってもよい。
本実施形態のLED基板に発光素子200が実装されることで、発光モジュール1000となる。本実施形態では、発光素子200が、樹脂基板10の第1面F1側に実装される(図2参照)。
本実施形態の発光モジュールを有する機器は、LED基板のソルダーレジスト層の電気絶縁性が低下しにくいので、LED素子に効率良く電力を供給することができ、高い効率でLED素子を発光させることができる。本実施形態の発光素子のソルダーレジスト層は、黄色あるいは褐色に変色しにくいので、高い反射率を維持することができる。本実施形態の発光素子のソルダーレジスト層は、黄色あるいは褐色に変色しにくいので、発光モジュールから発せられる光の色を維持しやすくすることができる。
光の異なる材料からなるソルダーレジストの光の反射率は、所定の波長範囲における分光反射率を以下の方法により測定した。
各ソルダーレジスト層について耐久試験(エージング試験)を行った結果を示す。この耐久試験では、温度150℃でソルダーレジスト層を処理し、発光素子200を長時間動作させ、所定のタイミング(0時間、100時間、200時間)で、発光素子200から発せられる光を想定した波長450nmの光に対する各ソルダーレジスト層の反射率を測定した。具体的には、異なる材料からなる各ソルダーレジスト層について、透明な1mmのガラス板に各ソルダーレジスト層の材料を塗布し硬化させて厚さ20μmの各ソルダーレジスト層を備えた測定サンプルを作成した。そして、各測定サンプルについて、150℃で、0時間、100時間、200時間処理した後における450nmにおける反射率を分光光度計UV−3150(株式会社島津製作所)を用いて測定し、反射率とした。
10a 孔
10b フィルド導体
10c 非貫通孔
11 ソルダーレジスト層(反射膜)
11a、11b 素子部
21、22 導体層
21a、22a 導体パターン
21b、22b 耐食膜
21c、21d 配線パターン
100 LED基板
101 金属基板
102 絶縁層
200 発光素子
200a 半田
200b ワイヤ
1000 発光モジュール
1001、1002 銅箔
1003 めっき膜
1004、1005 エッチングレジスト
1004a、1005a 開口部
2000 両面銅張積層板
2001 無電解めっき膜
2002、2003 めっきレジスト
2002a、2003a 開口部
3001 酸化チタン粒子
3002 シリコーン樹脂
3003 気孔
Claims (26)
- 平均粒子直径が0.1〜10μmの範囲にある酸化チタン粒子、及び、シリコーン樹脂から構成される、
ことを特徴とするソルダーレジスト。 - 前記酸化チタン粒子の含有量は、50〜80重量%の範囲にある、
ことを特徴とする請求項1に記載のソルダーレジスト。 - 前記酸化チタン粒子は、アナターゼ型の酸化チタン粒子である、
ことを特徴とする請求項1又は2に記載のソルダーレジスト。 - 前記ソルダーレジストは、波長500nm以下の単色光もしくは500nm以下の単色光を含む光を反射する、
ことを特徴とする請求項1乃至3のいずれか一項に記載のソルダーレジスト。 - 気孔を有する、
ことを特徴とする請求項1乃至4のいずれか一項に記載のソルダーレジスト。 - 平均粒子直径が0.1〜10μmの範囲にある酸化チタン粒子、及び、シリコーン樹脂前駆体組成物から構成される、
ことを特徴とするソルダーレジスト原料。 - 前記酸化チタン粒子の含有量は、50〜80重量%の範囲にある、
ことを特徴とする請求項6に記載のソルダーレジスト原料。 - 前記酸化チタン粒子は、アナターゼ型の酸化チタン粒子である、
ことを特徴とする請求項6又は7に記載のソルダーレジスト原料。 - 基板上に発光素子を実装するための導体層が形成されてなり、当該基板上にソルダーレジスト層が設けられてなり、
前記ソルダーレジスト層は、請求項1乃至5のいずれか一項に記載のソルダーレジストであり、
前記ソルダーレジスト層には、前記導体層を露出させるための開口が形成されてなる、
ことを特徴とするLED基板。 - 前記基板は、無機材料からなる補強材を含有する樹脂基板である、
ことを特徴とする請求項9に記載のLED基板。 - 前記無機材料は、ガラス繊維である、
ことを特徴とする請求項10に記載のLED基板。 - 前記樹脂基板は、エポキシ樹脂からなる、
ことを特徴とする請求項10又は11に記載のLED基板。 - 前記樹脂基板は、前記樹脂基板を貫通する孔を有し、前記樹脂基板を貫通する孔に導体が充填されてなるフィルド導体を有する、
ことを特徴とする請求項10乃至12のいずれか一項に記載のLED基板。 - 前記フィルド導体は、銅からなる、
ことを特徴とする請求項13に記載のLED基板。 - LED基板上に発光素子が実装された発光モジュールであって、
前記LED基板は、請求項9乃至14のいずれか一項に記載のLED基板である、
ことを特徴とする発光モジュール。 - 発光モジュールを有する機器であって、
前記発光モジュールは請求項15に記載の発光モジュールである、
ことを特徴とする発光モジュールを有する機器。 - 基板上に発光素子を実装するための導体層を形成する工程と、
当該基板上に、平均粒子直径が0.1〜10μmの範囲にある酸化チタン粒子、及び、シリコーン樹脂から構成されるソルダーレジスト層を設ける工程と、
を含む、
ことを特徴とするLED基板の製造方法。 - さらに、前記ソルダーレジスト層に前記導体層を露出させるための開口を形成する工程を含み、
前記導体層を形成する工程、前記ソルダーレジスト層を設ける工程、前記開口を形成する工程の順で行われる、
ことを特徴とする請求項17に記載のLED基板の製造方法。 - さらに、前記ソルダーレジスト層に前記導体層を露出させるための開口を形成する工程を含み、
前記導体層を形成する工程、前記開口を形成する工程、前記ソルダーレジスト層を設ける工程の順で行われる、
ことを特徴とする請求項17に記載のLED基板の製造方法。 - 前記基板は、無機材料からなる補強材を含有する樹脂基板である、
ことを特徴とする請求項17乃至19のいずれか一項に記載のLED基板の製造方法。 - 前記無機材料は、ガラス繊維である、
ことを特徴とする請求項20に記載のLED基板の製造方法。 - 前記樹脂基板は、エポキシ樹脂からなる、
ことを特徴とする請求項20又は21に記載のLED基板の製造方法。 - 前記樹脂基板を貫通する孔を形成する工程と、
前記樹脂基板を貫通する孔に導体が充填されてなるフィルド導体を形成する工程と、
をさらに含む、
ことを特徴とする請求項20乃至22のいずれか一項に記載のLED基板の製造方法。 - 前記フィルド導体は、銅からなる、
ことを特徴とする請求項23に記載のLED基板の製造方法。 - LED基板に発光素子を実装する発光モジュールの製造方法であって、
前記LED基板は、請求項17乃至24のいずれか一項に記載のLED基板の製造方法により製造されたLED基板である、
ことを特徴とする発光モジュールの製造方法。 - 発光モジュールを有する機器の製造方法であって、
前記発光モジュールは、請求項25に記載の発光モジュールの製造方法により製造された発光モジュールである、
ことを特徴とする発光モジュールを有する機器の製造方法。
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PCT/JP2012/060356 WO2012144493A1 (ja) | 2011-04-18 | 2012-04-17 | ソルダーレジスト、ソルダーレジスト原料、led基板、発光モジュール、発光モジュールを有する機器、led基板の製造方法、発光モジュールの製造方法、及び発光モジュールを有する機器の製造方法 |
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