JP2011222454A - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP2011222454A JP2011222454A JP2010093347A JP2010093347A JP2011222454A JP 2011222454 A JP2011222454 A JP 2011222454A JP 2010093347 A JP2010093347 A JP 2010093347A JP 2010093347 A JP2010093347 A JP 2010093347A JP 2011222454 A JP2011222454 A JP 2011222454A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pair
- housing
- arrow
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000013459 approach Methods 0.000 claims description 8
- 238000012856 packing Methods 0.000 description 32
- 238000006073 displacement reaction Methods 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 230000005489 elastic deformation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/04—Pins or blades for co-operation with sockets
- H01R13/05—Resilient pins or blades
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/26—Connectors or connections adapted for particular applications for vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Multi-Conductor Connections (AREA)
Abstract
【解決手段】電子部品1は、回路基板4と、前記回路基板4に接続される一対の接続端子7と、前記一対の接続端子7が取り付けられるハウジング5と、を有している。前記回路基板4には、前記接続端子7に接続される複数の端子部43が設けられ、前記一対の接続端子7各々には、弾性変形自在に形成された、互いの間に前記端子部43を挟むばね部材72が設けられ、前記ハウジング5には、前記一対の接続端子7それぞれが通される通し孔54間に設けられ、前記回路基板4が収容される基板収容部56の底部56aから前記回路基板4に向かって凸に形成され、複数の端子部43間に侵入するリブ57が設けられている。
【選択図】図9
Description
4 回路基板
5 メスハウジング(ハウジング)
7 メス端子(接続端子)
43 端子部
54 通し孔
55 当接部
56 基板収容部
56a 底部
57 リブ
57b 規制部
72 ばね部材
矢印X 互いに近づく方向と互いに離れる方向
Claims (3)
- 回路基板と、前記回路基板に接続される少なくとも一対の接続端子と、前記一対の接続端子が取り付けられるハウジングと、を有する電子部品であって、
前記回路基板には、前記ハウジングに向かって凸に形成され、互いに間隔をあけて設けられた、前記接続端子に接続される複数の端子部が設けられ、
前記一対の接続端子各々には、これら一対の接続端子が互いに近づく方向と互いに離れる方向との双方向に弾性変形自在に形成された、互いの間に前記端子部を挟むばね部材が設けられ、
前記ハウジングには、前記一対の接続端子それぞれが通される通し孔間に設けられ、前記回路基板が収容される基板収容部が設けられ、
前記基板収容部の底部から前記回路基板に向かって凸に形成され、前記複数の端子部間に侵入する少なくとも1つのリブが設けられていることを特徴とする電子部品。 - 前記ハウジングには、前記一対のばね部材が前記互いに離れる方向に設けられ、前記一対のばね部材を互いの間に挟む一対の当接部が設けられていることを特徴とする請求項1に記載の電子部品。
- 前記リブから前記回路基板に向かって凸に形成され、前記回路基板を互いの間に位置付ける一対の規制部が設けられていることを特徴とする請求項1または請求項2に記載の電子部品。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010093347A JP5513232B2 (ja) | 2010-04-14 | 2010-04-14 | 電子部品 |
KR1020127026799A KR101397761B1 (ko) | 2010-04-14 | 2011-04-12 | 전자 부품 |
PCT/JP2011/059099 WO2011129338A1 (ja) | 2010-04-14 | 2011-04-12 | 電子部品 |
EP11768859.8A EP2560242A4 (en) | 2010-04-14 | 2011-04-12 | ELECTRONIC COMPONENT |
CN201180019154.XA CN102859798B (zh) | 2010-04-14 | 2011-04-12 | 电子部件 |
US13/636,723 US9161463B2 (en) | 2010-04-14 | 2011-04-12 | Electronic component |
BR112012025555A BR112012025555A2 (pt) | 2010-04-14 | 2011-04-12 | componente eletrônico |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010093347A JP5513232B2 (ja) | 2010-04-14 | 2010-04-14 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011222454A true JP2011222454A (ja) | 2011-11-04 |
JP5513232B2 JP5513232B2 (ja) | 2014-06-04 |
Family
ID=44798709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010093347A Active JP5513232B2 (ja) | 2010-04-14 | 2010-04-14 | 電子部品 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9161463B2 (ja) |
EP (1) | EP2560242A4 (ja) |
JP (1) | JP5513232B2 (ja) |
KR (1) | KR101397761B1 (ja) |
CN (1) | CN102859798B (ja) |
BR (1) | BR112012025555A2 (ja) |
WO (1) | WO2011129338A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112470555A (zh) * | 2018-08-02 | 2021-03-09 | 三菱电机株式会社 | 电子控制装置 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9011177B2 (en) | 2009-01-30 | 2015-04-21 | Molex Incorporated | High speed bypass cable assembly |
US9142921B2 (en) | 2013-02-27 | 2015-09-22 | Molex Incorporated | High speed bypass cable for use with backplanes |
US9284198B2 (en) | 2013-06-28 | 2016-03-15 | Air Products And Chemicals, Inc. | Process for making trisilylamine |
US20150042874A1 (en) * | 2013-08-08 | 2015-02-12 | Nidec Elesys Corporation | In-vehicle camera |
CN105580210B (zh) * | 2013-09-04 | 2017-07-07 | 莫列斯有限公司 | 设有旁路线缆的连接器*** |
JP2016072456A (ja) * | 2014-09-30 | 2016-05-09 | パナソニックIpマネジメント株式会社 | 電気機器の外郭構造及び負荷制御システムの端末器 |
USD780703S1 (en) | 2014-10-20 | 2017-03-07 | S.J. Electro Systems, Inc. | Control panel cover |
KR20170102011A (ko) | 2015-01-11 | 2017-09-06 | 몰렉스 엘엘씨 | 바이패스 루트설정 조립체에 사용하기 적합한 와이어-대-기판 커넥터 |
CN110662388A (zh) | 2015-01-11 | 2020-01-07 | 莫列斯有限公司 | 模块壳体及连接器端口 |
US10739828B2 (en) | 2015-05-04 | 2020-08-11 | Molex, Llc | Computing device using bypass assembly |
JP2017083756A (ja) * | 2015-10-30 | 2017-05-18 | 日本圧着端子製造株式会社 | 撮像装置 |
KR102450557B1 (ko) * | 2015-11-12 | 2022-10-05 | 엘지이노텍 주식회사 | 카메라 모듈 |
WO2017123614A1 (en) | 2016-01-11 | 2017-07-20 | Molex, Llc | Cable connector assembly |
US10424856B2 (en) | 2016-01-11 | 2019-09-24 | Molex, Llc | Routing assembly and system using same |
CN108475870B (zh) | 2016-01-19 | 2019-10-18 | 莫列斯有限公司 | 集成路由组件以及采用集成路由组件的*** |
US9985399B2 (en) * | 2016-02-03 | 2018-05-29 | Canon Kabushiki Kaisha | Accessory shoe device to which accessory is attached, image pickup apparatus, and accessory |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3629787A (en) * | 1970-06-19 | 1971-12-21 | Bell Telephone Labor Inc | Connector for flexible circuitry |
JPS62123081U (ja) * | 1986-01-28 | 1987-08-05 | ||
JP2002367696A (ja) * | 2001-06-08 | 2002-12-20 | Sumitomo Wiring Syst Ltd | カードエッジコネクタ |
JP5024945B2 (ja) | 2007-10-17 | 2012-09-12 | 矢崎総業株式会社 | 接点接続構造 |
JP5239714B2 (ja) | 2008-10-03 | 2013-07-17 | トヨタ自動車株式会社 | 車両用無線通信装置、通信方法 |
KR100913922B1 (ko) | 2009-02-02 | 2009-08-26 | 최상무 | 탈부착형 엘이디 조명장치구조 |
-
2010
- 2010-04-14 JP JP2010093347A patent/JP5513232B2/ja active Active
-
2011
- 2011-04-12 WO PCT/JP2011/059099 patent/WO2011129338A1/ja active Application Filing
- 2011-04-12 EP EP11768859.8A patent/EP2560242A4/en not_active Withdrawn
- 2011-04-12 KR KR1020127026799A patent/KR101397761B1/ko active IP Right Grant
- 2011-04-12 CN CN201180019154.XA patent/CN102859798B/zh not_active Expired - Fee Related
- 2011-04-12 BR BR112012025555A patent/BR112012025555A2/pt not_active IP Right Cessation
- 2011-04-12 US US13/636,723 patent/US9161463B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112470555A (zh) * | 2018-08-02 | 2021-03-09 | 三菱电机株式会社 | 电子控制装置 |
CN112470555B (zh) * | 2018-08-02 | 2022-03-22 | 三菱电机株式会社 | 电子控制装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2011129338A1 (ja) | 2011-10-20 |
US20130010443A1 (en) | 2013-01-10 |
CN102859798B (zh) | 2016-03-09 |
JP5513232B2 (ja) | 2014-06-04 |
CN102859798A (zh) | 2013-01-02 |
KR20120130338A (ko) | 2012-11-30 |
US9161463B2 (en) | 2015-10-13 |
KR101397761B1 (ko) | 2014-05-20 |
EP2560242A1 (en) | 2013-02-20 |
BR112012025555A2 (pt) | 2016-06-28 |
EP2560242A4 (en) | 2014-03-05 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |