BR112012025555A2 - componente eletrônico - Google Patents

componente eletrônico

Info

Publication number
BR112012025555A2
BR112012025555A2 BR112012025555A BR112012025555A BR112012025555A2 BR 112012025555 A2 BR112012025555 A2 BR 112012025555A2 BR 112012025555 A BR112012025555 A BR 112012025555A BR 112012025555 A BR112012025555 A BR 112012025555A BR 112012025555 A2 BR112012025555 A2 BR 112012025555A2
Authority
BR
Brazil
Prior art keywords
circuit board
connection terminals
electronic component
rib
pair
Prior art date
Application number
BR112012025555A
Other languages
English (en)
Inventor
Naoki Takamura
Tohru Kurosawa
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of BR112012025555A2 publication Critical patent/BR112012025555A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H01R13/05—Resilient pins or blades
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

componente eletrônico. tem-se a descrição de um componente eletrônico com a preservação de boa conexão entre o painel de circuito e os terminais de conexão conectadas ao painel de circuito com provisão de redução de tamanho. o componente eletrônico (1) compreende de um painel de circuito (4), um par de terminais de conexão (7) conectado ao painel de circuito (4), e um compartimento (5) apresentando o par de terminais de conexão (7) instalado no mesmo. o painel de circuito (4) vem a ser provido com uma pluralidade de seções de terminais (43) contendo os terminais de conexão (7). cada terminal de conexão presente no par de terminais de conexão (7) vem a ser provido com um componente de mola (72) formado para ser elasticamente deformável e comprimindo as seções de terminais (43) entre estes. uma nervura (57) vem a ser provida no compartimento (5), sendo que a nervuro é fornecida entre os orifícios de passagem (54) através de onde cada par de terminais de conexão (7) vem a passar, sendo que a nervura (57) vem a ser constituída em uma configuração convexa, direcionada ao painel de circuito (4) e afastada da seção de base (56a) de uma seção de compartimento de substrato (56) aonde se dá o alojamento do painel de circuito (4), com a nervura (57) penetrando uma pluralidade de seções de terminais (43).
BR112012025555A 2010-04-14 2011-04-12 componente eletrônico BR112012025555A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010093347A JP5513232B2 (ja) 2010-04-14 2010-04-14 電子部品
PCT/JP2011/059099 WO2011129338A1 (ja) 2010-04-14 2011-04-12 電子部品

Publications (1)

Publication Number Publication Date
BR112012025555A2 true BR112012025555A2 (pt) 2016-06-28

Family

ID=44798709

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012025555A BR112012025555A2 (pt) 2010-04-14 2011-04-12 componente eletrônico

Country Status (7)

Country Link
US (1) US9161463B2 (pt)
EP (1) EP2560242A4 (pt)
JP (1) JP5513232B2 (pt)
KR (1) KR101397761B1 (pt)
CN (1) CN102859798B (pt)
BR (1) BR112012025555A2 (pt)
WO (1) WO2011129338A1 (pt)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9011177B2 (en) 2009-01-30 2015-04-21 Molex Incorporated High speed bypass cable assembly
US9142921B2 (en) 2013-02-27 2015-09-22 Molex Incorporated High speed bypass cable for use with backplanes
US9284198B2 (en) 2013-06-28 2016-03-15 Air Products And Chemicals, Inc. Process for making trisilylamine
US20150042874A1 (en) * 2013-08-08 2015-02-12 Nidec Elesys Corporation In-vehicle camera
CN105580210B (zh) * 2013-09-04 2017-07-07 莫列斯有限公司 设有旁路线缆的连接器***
JP2016072456A (ja) * 2014-09-30 2016-05-09 パナソニックＩｐマネジメント株式会社 電気機器の外郭構造及び負荷制御システムの端末器
USD780703S1 (en) 2014-10-20 2017-03-07 S.J. Electro Systems, Inc. Control panel cover
KR20170102011A (ko) 2015-01-11 2017-09-06 몰렉스 엘엘씨 바이패스 루트설정 조립체에 사용하기 적합한 와이어-대-기판 커넥터
CN110662388A (zh) 2015-01-11 2020-01-07 莫列斯有限公司 模块壳体及连接器端口
US10739828B2 (en) 2015-05-04 2020-08-11 Molex, Llc Computing device using bypass assembly
JP2017083756A (ja) * 2015-10-30 2017-05-18 日本圧着端子製造株式会社 撮像装置
KR102450557B1 (ko) * 2015-11-12 2022-10-05 엘지이노텍 주식회사 카메라 모듈
WO2017123614A1 (en) 2016-01-11 2017-07-20 Molex, Llc Cable connector assembly
US10424856B2 (en) 2016-01-11 2019-09-24 Molex, Llc Routing assembly and system using same
CN108475870B (zh) 2016-01-19 2019-10-18 莫列斯有限公司 集成路由组件以及采用集成路由组件的***
US9985399B2 (en) * 2016-02-03 2018-05-29 Canon Kabushiki Kaisha Accessory shoe device to which accessory is attached, image pickup apparatus, and accessory
WO2020026398A1 (ja) * 2018-08-02 2020-02-06 三菱電機株式会社 電子制御装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629787A (en) * 1970-06-19 1971-12-21 Bell Telephone Labor Inc Connector for flexible circuitry
JPS62123081U (pt) * 1986-01-28 1987-08-05
JP2002367696A (ja) * 2001-06-08 2002-12-20 Sumitomo Wiring Syst Ltd カードエッジコネクタ
JP5024945B2 (ja) 2007-10-17 2012-09-12 矢崎総業株式会社 接点接続構造
JP5239714B2 (ja) 2008-10-03 2013-07-17 トヨタ自動車株式会社 車両用無線通信装置、通信方法
KR100913922B1 (ko) 2009-02-02 2009-08-26 최상무 탈부착형 엘이디 조명장치구조

Also Published As

Publication number Publication date
WO2011129338A1 (ja) 2011-10-20
US20130010443A1 (en) 2013-01-10
CN102859798B (zh) 2016-03-09
JP5513232B2 (ja) 2014-06-04
CN102859798A (zh) 2013-01-02
KR20120130338A (ko) 2012-11-30
US9161463B2 (en) 2015-10-13
KR101397761B1 (ko) 2014-05-20
EP2560242A1 (en) 2013-02-20
JP2011222454A (ja) 2011-11-04
EP2560242A4 (en) 2014-03-05

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO ARQUIVAMENTO PUBLICADO NA RPI 2509 DE 05/02/2019.