JP2011166080A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2011166080A JP2011166080A JP2010030437A JP2010030437A JP2011166080A JP 2011166080 A JP2011166080 A JP 2011166080A JP 2010030437 A JP2010030437 A JP 2010030437A JP 2010030437 A JP2010030437 A JP 2010030437A JP 2011166080 A JP2011166080 A JP 2011166080A
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Abstract
【解決手段】第1の主面11に形成された固体撮像素子13と第2の主面12に形成された固体撮像素子13の外部端子17とを有するデバイスチップ10と、接続パッド36を有する先端部31と、90度以上の角度に折り曲げられた屈曲部32と、延設部33と、からなり、先端部31から屈曲部32を介して延設部33まで延設された配線層35を有する配線板30と、第2の主面12に先端部31を接着する接着層16と、外部端子17と接続パッド36とを電気的に接続するワイヤボンディング配線40と、を具備し、配線板30がデバイスチップ10の第2の主面の直上空間10S内にある。
【選択図】図1
Description
本実施の形態の半導体装置は、例えば内視鏡の先端部に配設される撮像装置1である。図1および図2に示すように、撮像装置1は、半導体チップであるデバイスチップ10と、デバイスチップ10の第1の主面11に接合された透明基板であるガラス基板20と、デバイスチップ10の第2の主面12の中央部に接着層16を介して接合された配線板30と、を有する。
最初に、シリコン基板の表面(第1の主面11)に公知の半導体プロセスを用いて多数の固体撮像素子13が形成される。そしてシリコン基板と略同サイズのガラスウエハを保護材として固体撮像素子13形成面に接合後、シリコン基板の裏面(第2の主面12)側から研削加工が行われる。研削加工によりシリコン基板の厚さを薄くした後、裏面側からエッチング等により貫通孔を形成し、内部を導電性ペーストやめっき法やスパッタ法等により導電化することで貫通配線14が形成される。その後、ガラスウエハが接合されたシリコン基板を切断により個片化することによりガラス基板20が接合された撮像素子チップであるデバイスチップ10が作製される。配線板30は銅箔と基材であるポリイミド等を貼り合わせエッチングしたり、めっき法等を用いたりして作製され、必要に応じて電子部品56が実装される。
さらに、ワイヤボンディング配線40を保護するとともに、屈曲部32の形状を維持するために、樹脂等からなる封止部である封止材41が第2の主面12に配設される。さらに、配線板30の延設部33の接続パッド36に、ケーブルがはんだ付けにより接続される。
次に第2の実施の形態の撮像装置1Aについて説明する。本実施の形態の撮像装置1Aは第1の実施の形態の撮像装置1と類似しているので同じ構成要素には同じ符号を付し説明は省略する。
Claims (6)
- 第1の主面に形成された半導体素子と、第2の主面に形成された前記半導体素子の外部端子とを、有する半導体チップと、
接続パッドを有する先端部と、90度以上の角度に折り曲げられた屈曲部と、延設部と、からなり、前記先端部から前記屈曲部を介して前記延設部まで延設された配線層を有する配線板と、
前記半導体チップの前記第2の主面と前記配線板の前記先端部とを接合する接着層と、
前記外部端子と前記接続パッドとを電気的に接続するワイヤボンディング配線と、を具備し、
前記配線板が、前記半導体チップの前記第2の主面の直上空間内にあることを特徴とする半導体装置。 - 前記配線板が少なくとも両面に配線層を有する多層配線板であり、前記先端部、前記屈曲部および前記延設部の屈曲部側が長手方向のスリットにより幅方向に分割されており、
分割された複数の前記屈曲部が、交互に反対方向に折り曲げられていることを特徴とする請求項1に記載の半導体装置。 - 前記複数の屈曲部が、交互に直角に反対方向に折り曲げられていることを特徴とする請求項2に記載の半導体装置。
- 前記先端部が前記半導体チップの前記第2の主面の中央部に接着されていることを特徴とする請求項1または請求項3に記載の半導体装置。
- 前記ワイヤボンディング配線および前記屈曲部を覆う封止部を具備することを特徴とする請求項4に記載の半導体装置。
- 前記半導体素子が撮像素子であり、
前記第1の主面に透明基板が接合されている撮像装置であることを特徴とする請求項1から請求項5のいずれか1項に記載の半導体装置。
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