JP2011066209A

JP2011066209A - Method of manufacturing three-dimensional circuit board

Info

Publication number: JP2011066209A
Application number: JP2009215655A
Authority: JP
Inventors: Hiroshi Okada; 浩岡田; Kan Yoshida; 堪吉田
Original assignee: Sumitomo Metal Mining Co Ltd
Current assignee: Sumitomo Metal Mining Co Ltd
Priority date: 2009-09-17
Filing date: 2009-09-17
Publication date: 2011-03-31
Anticipated expiration: 2029-09-17
Also published as: JP5251803B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional circuit board that can reduce the level difference of a gap between both end parts produced at both ends of a filmy circuit board when manufacturing the three-dimensional circuit board by sticking the filmy circuit board on a cylindrical body. <P>SOLUTION: The method of manufacturing the three-dimensional circuit board includes a first process of sticking a filmy adhesive 12 on the cylindrical body 11 while leaving a gap 12a between both end parts and a second process of sticking the filmy circuit board 13 on the filmy adhesive 12 so that a gap 13a between both the end parts does not overlap the gap 12a of the filmy adhesive 12, wherein the filmy adhesive 12 flows by application of pressing pressure during the sticking in the second process to backfill the gap 12a to form an adhesive layer having no gap, and at the same time, the adhesive is piled up at the gap 13a between both end parts of the filmy circuit board 13. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、円筒体の表面に接着剤を介してフィルム状回路基板を貼り付けた立体的回路基板に関し、特に、貼り付けの際にフィルム状回路基板の両端部に生じる間隙に接着剤を盛り上げて埋めるようにした立体的回路基板の製造方法、並びにその製造方法で得られる立体的回路基板に関する。 The present invention relates to a three-dimensional circuit board in which a film-like circuit board is attached to the surface of a cylindrical body via an adhesive, and in particular, the adhesive is raised in a gap generated at both ends of the film-like circuit board at the time of attachment. The present invention relates to a method of manufacturing a three-dimensional circuit board that is filled in, and a three-dimensional circuit board obtained by the manufacturing method.

近年の電子機器の小型化や多機能化及び低コスト化に伴い、回路基板として平面的なものだけではなく立体的なものが必要となり、円筒体などの筐体の内周面や外周面に回路基板をコンパクトに形成することが要求されている。例えば特開平０６−０５９５６８号公報（特許文献１）には、複写機の現像用ローラーなどの分野において、ローラー表面の一部又は全周に回路を形成することにより立体的回路基板とすることが提案されている。 With recent downsizing, multifunctionalization, and cost reduction of electronic devices, not only flat circuit boards but also three-dimensional boards are required, and the inner and outer peripheral surfaces of casings such as cylindrical bodies are required. There is a demand for compact circuit boards. For example, in Japanese Patent Laid-Open No. 06-059568 (Patent Document 1), in a field such as a developing roller of a copying machine, a three-dimensional circuit board is formed by forming a circuit on a part or the entire circumference of a roller surface. Proposed.

このような円筒体であるローラー表面の全周に回路を形成する方法として、ポリイミドなどの絶縁性フィルムの表面に銅などによる導体層を設けた基板を用い、その導体層をパターニングしてフィルム状回路基板とした後、これをローラーの表面全周に貼り付けする方法が考えられる。このようなフィルム状回路基板は多量に且つ安価に製造することができるため、これをローラー表面に高精度で貼り付けすることができれば、立体的回路基板の製造方法として極めて有利である。 As a method of forming a circuit on the entire circumference of the roller surface which is such a cylindrical body, using a substrate provided with a conductor layer made of copper or the like on the surface of an insulating film such as polyimide, the conductor layer is patterned to form a film After making it into a circuit board, the method of affixing this on the surface periphery of a roller can be considered. Since such a film-like circuit board can be manufactured in large quantities and at low cost, if it can be affixed to the roller surface with high accuracy, it is extremely advantageous as a method for manufacturing a three-dimensional circuit board.

ところで、フィルムを円筒体に貼り付ける方法としては、特開平１０−２３６４４６号公報（特許文献２）に、円筒形状の缶体にロータリーカッター方式で貼り付けする方法が記載されている。即ち、自立保持不能な柔軟性フィルムを高い精度で所定長さに切断し、切断したフィルムを缶体に供給してラミネートを行うことにより、フィルムの缶体への貼り付けが可能であるとしている。 By the way, as a method of attaching a film to a cylindrical body, JP-A-10-236446 (Patent Document 2) describes a method of attaching a film to a cylindrical can body by a rotary cutter method. In other words, a flexible film that cannot be held independently is cut into a predetermined length with high accuracy, and the cut film is supplied to the can body and laminated, whereby the film can be attached to the can body. .

より具体的には、巻取状態にある自立保持不能な柔軟性フィルムをカッティングロールに真空吸着させて巻き付け、フィルムにテンションを与えながら、カッティングロールの真空吸着部位を複数に分割して真空強度を調整することによりフィルムに滑りを付与し、切断後のフィルムに一定の間隔を作って缶体へのラミネートのタイミングを得、ラミネートロールのラミネート部位では加圧してフィルムの窪みを無くし、缶体とフィルムの間に空気を残存させずにラミネートを行っている。 More specifically, a flexible film that cannot be held in a wound state is wound on a cutting roll by vacuum suction, and while applying tension to the film, the vacuum suction portion of the cutting roll is divided into a plurality of parts to increase the vacuum strength. By adjusting, the film is slipped, the cut film is made at a certain interval to obtain the timing of laminating to the can body, the laminating part of the laminating roll is pressurized to eliminate the dent of the film, and the can body Lamination is performed without leaving any air between the films.

上記特許文献２に記載されたロータリーカッター方式による貼り付け方法は、缶体やボトルなどの飲料容器の表面にラベルを貼ることを目的として開発されたものである。そのため、飲料容器にラベルを貼る位置などの精度を厳密に管理する必要がなく、また、飲料容器の表面全周にラベルを貼り付けする場合は、フィルムに重なりや間隙が生じても問題となることはない。 The sticking method by the rotary cutter system described in the above-mentioned Patent Document 2 was developed for the purpose of sticking a label on the surface of a beverage container such as a can or a bottle. Therefore, it is not necessary to strictly control the accuracy of the position where the label is pasted on the beverage container, and when the label is pasted all around the surface of the beverage container, even if an overlap or a gap occurs in the film, there is a problem. There is nothing.

これに対して、複写機その他の電子機器に用いる立体的回路基板では、絶縁性フィルム表面に配線回路を形成したフィルム状回路基板をローラーの表面全周に貼り付けする場合、フィルム状回路基板の両端部に重なりや間隙、あるいは浮きが生じたりすると、回路を構成する配線に短絡や導通不良が発生し、回路の電気的特性に影響を及ぼすため大きな問題となる。 On the other hand, in a three-dimensional circuit board used for a copying machine or other electronic equipment, when a film-like circuit board having a wiring circuit formed on the surface of an insulating film is attached to the entire surface of the roller, If overlapping, gaps, or floating occur at both ends, a short circuit or poor conduction occurs in the wiring that constitutes the circuit, which affects the electrical characteristics of the circuit, which is a serious problem.

特開平０６−０５９５６８号公報Japanese Patent Laid-Open No. 06-059568 特開平１０−２３６４４６号公報Japanese Patent Laid-Open No. 10-236446

上記したように、特許文献２に記載されたロータリーカッター方式による貼り付け方法は、フィルムの切断や貼り付けの精度に問題があるうえ、カッティングロールやラミネートロール自体にも仕上がり径のバラツキが存在する。そのため、この方法を立体的回路基板の製造に適用した場合、円筒体に貼り付けたフィルム状回路基板の両端部間において重なりや間隙の発生を無くすことができていないのが現状である。 As described above, the sticking method by the rotary cutter method described in Patent Document 2 has a problem in the accuracy of cutting and sticking of the film, and there are variations in the finished diameter of the cutting roll and the laminate roll itself. . Therefore, when this method is applied to the manufacture of a three-dimensional circuit board, the present situation is that it is not possible to eliminate the occurrence of overlap or gap between both end portions of the film-like circuit board attached to the cylindrical body.

また、上記方法での貼り付けの際にフィルム状回路基板の両端部に発生した間隙については、短絡や導通不良を防止するためフィルム状回路基板の表面に塗布する保護用の樹脂で間隙を埋めることが考えられる。しかしながら、表面保護用の樹脂を機械的に塗布する方法では、間隙の段差を十分に埋めきれず、その間隙内にフィルム状回路基板の端部が露出してしまう場合があった。 In addition, with respect to the gap generated at both ends of the film-like circuit board at the time of pasting by the above method, the gap is filled with a protective resin applied to the surface of the film-like circuit board to prevent short circuit or conduction failure. It is possible. However, in the method of mechanically applying the resin for surface protection, the step of the gap cannot be sufficiently filled, and the end of the film-like circuit board may be exposed in the gap.

本発明は、このような従来の事情に鑑み、円筒体の外周面にフィルム状回路基板を貼り付けて立体的回路基板を製造する場合に、ロータリーカッター方式などの特殊な装置を用いることなく且つ簡単な方法によって、両端部間に生じた間隙の段差を低減することができる立体的回路基板の製造方法、並びに、その方法により得られる立体的回路基板を提供することを目的とする。 In view of such a conventional situation, the present invention uses a rotary cutter method or the like when a three-dimensional circuit board is manufactured by attaching a film-like circuit board to the outer peripheral surface of a cylindrical body, and It is an object of the present invention to provide a method for manufacturing a three-dimensional circuit board capable of reducing gap steps between both ends by a simple method, and a three-dimensional circuit board obtained by the method.

上記目的を達成するため、本発明が提供する立体的回路基板の製造方法は、円筒体の外周面上にフィルム状接着剤を両端部間に間隙を残して貼り付ける第１工程と、該フィルム状接着剤上に、絶縁性フィルム表面に配線回路が形成されたフィルム状回路基板を、両端部間に間隙を残し且つ該両端部間の間隙と前記フィルム状接着剤の両端部間の間隙とが重ならないように貼り付ける第２工程とを備え、該第２工程での貼り付け時に加える押付圧によって、前記フィルム状接着剤の両端部間の間隙をその接着剤で埋め戻して隙間のない接着剤層を形成すると同時に、前記フィルム状回路基板の両端部間の間隙に該接着剤層を盛り上げることを特徴とする。 In order to achieve the above object, a method of manufacturing a three-dimensional circuit board provided by the present invention includes a first step of attaching a film adhesive on the outer peripheral surface of a cylindrical body leaving a gap between both ends, and the film A film-like circuit board having a wiring circuit formed on the surface of the insulating film on the adhesive, leaving a gap between both ends, and a gap between both ends and a gap between both ends of the film-like adhesive; A second step of attaching the film-like adhesive so as not to overlap, and by pressing pressure applied at the time of attachment in the second step, the gap between both ends of the film adhesive is backfilled with the adhesive so that there is no gap. Simultaneously with the formation of the adhesive layer, the adhesive layer is raised in the gap between both end portions of the film-like circuit board.

また、本発明が提供する立体的回路基板は、絶縁性フィルムの表面に配線回路を形成したフィルム状回路基板を、円筒体の外周面上に接着剤層を介して貼り付けた立体的回路基板であって、フィルム状回路基板の絶縁性フィルムの厚さが１３μｍ以下であり、フィルム状回路基板と円筒体の間に接着剤層が隙間なく配置されると共に、フィルム状回路基板の対向する両端部間の間隙に接着剤層が盛り上がって該両端部間の段差を減じていることを特徴とするものである。 The three-dimensional circuit board provided by the present invention is a three-dimensional circuit board in which a film-like circuit board in which a wiring circuit is formed on the surface of an insulating film is attached to the outer peripheral surface of a cylindrical body via an adhesive layer. The thickness of the insulating film of the film-like circuit board is 13 μm or less, and the adhesive layer is disposed between the film-like circuit board and the cylindrical body without any gap, and both opposite ends of the film-like circuit board The adhesive layer is raised in the gap between the parts to reduce the step between the both ends.

本発明によれば、円筒体に貼り付けたフィルム状接着剤の両端部及びその上に貼り付けたフィルム状回路基板の両端部間にそれぞれ間隙を残したうえで、そのフィルム状回路基板の貼り付け時の押付圧により接着剤を流動させて、フィルム状回路基板の両端部の間隙内に接着剤層を盛り上げることができる。 According to the present invention, a gap is left between both ends of the film-like adhesive attached to the cylindrical body and both ends of the film-like circuit board attached thereon, and then the film-like circuit board is attached. The adhesive can be caused to flow by the pressing pressure at the time of application, and the adhesive layer can be raised in the gaps at both ends of the film-like circuit board.

また同時に、上記押付圧による接着剤の流動によって、フィルム状接着剤の両端部の間隙を埋め戻し、円筒体表面の凹みやフィルム状回路基板の切断バリの表面出現をなくすことができる。更に、フィルム状回路基板に使用する絶縁性フィルムの厚さを１３μｍ以下とすることにより、上記接着剤の流動と相まって、フィルム状回路基板の両端部間に残っている間隙の段差を一層小さくすることができる。 At the same time, the flow of the adhesive by the pressing pressure makes it possible to refill the gaps at both ends of the film adhesive, thereby eliminating the appearance of dents on the surface of the cylindrical body and cutting burrs on the film circuit board. Further, by setting the thickness of the insulating film used for the film-like circuit board to 13 μm or less, the gap step remaining between the both ends of the film-like circuit board is further reduced in combination with the flow of the adhesive. be able to.

本発明方法を説明するための図面であり、（ａ）は第１工程によりフィルム状接着剤を円筒体に貼り付けた状態を示す概略の断面図、（ｂ）は第２工程により更にフィルム状回路基板を貼り付けた状態を示す概略の断面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is drawing for demonstrating this invention method, (a) is general sectional drawing which shows the state which affixed the film adhesive to the cylindrical body at the 1st process, (b) is a film form further at the 2nd process. It is a schematic sectional drawing which shows the state which affixed the circuit board.

本発明の立体的回路基板の要部を示す概略の断面図である。It is a schematic sectional drawing which shows the principal part of the three-dimensional circuit board of this invention.

本発明によるフィルム状回路基板の貼り付け方法の具体例を示す概略の断面図である。It is general | schematic sectional drawing which shows the specific example of the bonding method of the film-form circuit board by this invention.

本発明によるフィルム状回路基板の貼り付け方法の別の具体例を示す概略の断面図である。It is a schematic sectional drawing which shows another specific example of the bonding method of the film-like circuit board by this invention.

本発明による立体的回路基板の製造方法は、図１に示すように、円筒体１１の外周面上に、フィルム状接着剤１２を両端部間に間隙１２ａを残して貼り付ける第１工程（図１（ａ）参照）と、そのフィルム状接着剤１２上に、絶縁性フィルム表面に配線回路を形成したフィルム状回路基板１３を両端部間に間隙１３ａを残し、且つその両端部間の間隙１３ａとフィルム状接着剤１２の両端部間の間隙１２ａとが重ならないように貼り付ける第２工程（図１（ｂ）参照）とを備えている。 As shown in FIG. 1, the manufacturing method of a three-dimensional circuit board according to the present invention includes a first step of attaching a film adhesive 12 on the outer peripheral surface of a cylindrical body 11 leaving a gap 12a between both ends (FIG. 1). 1 (a)) and a film-like circuit board 13 having a wiring circuit formed on the surface of the insulating film on the film-like adhesive 12, leaving a gap 13a between both ends, and a gap 13a between both ends. And a second step (see FIG. 1B) for pasting so that the gap 12a between both ends of the film adhesive 12 does not overlap.

上記第２工程では、フィルム状接着剤１２上にフィルム状回路基板１３を貼り付ける際に所定の押付圧を加えることにより、円筒体１１とフィルム状回路基板１３との間でフィルム状接着剤１２の接着剤が押されて流動する。その結果、図１（ｂ）に示すように、フィルム状接着剤１２の両端部間の間隙１２ａが接着剤で埋め戻され、その埋め戻し部１２ｂにより隙間のない接着剤層が形成される。同時に、フィルム状回路基板１３の両端部間にある間隙１３ａ内にはフィルム状接着剤１２から接着剤が盛り上がるので、その間隙１３ａを埋めてフィルム状回路基板１３の両端部間の段差が減少する。 In the second step, the film-like adhesive 12 is applied between the cylindrical body 11 and the film-like circuit board 13 by applying a predetermined pressing pressure when the film-like circuit board 13 is stuck on the film-like adhesive 12. The adhesive is pressed and flows. As a result, as shown in FIG. 1B, the gap 12a between both ends of the film adhesive 12 is backfilled with the adhesive, and an adhesive layer without a gap is formed by the backfill 12b. At the same time, since the adhesive swells from the film adhesive 12 in the gap 13a between both ends of the film-like circuit board 13, the gap between the both ends of the film-like circuit board 13 is reduced by filling the gap 13a. .

上記第１の工程で円筒体の外周面に貼り付けるフィルム状接着剤は、市販のものを使用することができ、その厚さは５０〜１５０μｍ程度が好ましい。また、円筒体の外周面に貼り付ける際にフィルム状接着剤の両端部間に生じる間隙の幅は、厚さが５０〜１５０μｍ程度のフィルム状接着剤の場合で、５０μｍ未満にすることは難しく、５００μｍを超えると接着剤の流動により埋め戻すことができなくなるため、５０〜５００μｍの範囲とすることが好ましい。 A commercially available adhesive can be used as the film adhesive to be attached to the outer peripheral surface of the cylindrical body in the first step, and the thickness is preferably about 50 to 150 μm. In addition, the width of the gap formed between both ends of the film adhesive when pasted on the outer peripheral surface of the cylindrical body is a film adhesive having a thickness of about 50 to 150 μm, and it is difficult to make it less than 50 μm. If it exceeds 500 μm, it cannot be refilled by the flow of the adhesive, and therefore it is preferably in the range of 50 to 500 μm.

上記第２の工程でフィルム状回路基板の両端部間に生じる間隙の幅は、１０μｍ未満にすることは難しく、３００μｍを超えると接着剤の盛り上がりが不十分となり、間隙の間に５μｍを超える段差が残り易くなるため、１０〜３００μｍの範囲とすることが好ましい。また、上記第２の工程で加える押付圧は、０.０１ＭＰａ未満では接着剤の流動が不十分となるため０.０１ＭＰａ以上が好ましい。押付圧の上限は、円筒体が変形しない程度とする。 The width of the gap generated between both ends of the film-like circuit board in the second step is difficult to be less than 10 μm, and if it exceeds 300 μm, the bulge of the adhesive becomes insufficient, and the step exceeding 5 μm between the gaps In the range of 10 to 300 μm. The pressing pressure applied in the second step is preferably 0.01 MPa or more because the flow of the adhesive is insufficient when it is less than 0.01 MPa. The upper limit of the pressing pressure is such that the cylindrical body is not deformed.

また、上記第１工程で円筒体１１にフィルム状接着剤１２を貼り付ける方法、及び第２工程でフィルム状回路基板１３を貼り付ける方法は、特に限定するものではいが、円筒体１１を回転させながら貼り付ける方法が好ましい。例えば、フィルム状接着剤１２又はフィルム状回路基板１３を基台上に配置して、円筒体１１を回転させながら押し付けて貼り付ける方法が特に好ましい。尚、基台上に配置するフィルム状回路基板１３及びフィルム状接着剤１２は、金型によって所定の大きさに予め切断しておく。 The method of attaching the film adhesive 12 to the cylindrical body 11 in the first step and the method of attaching the film circuit board 13 in the second step are not particularly limited, but the cylindrical body 11 is rotated. A method of pasting while making it preferable is preferable. For example, a method in which the film-like adhesive 12 or the film-like circuit board 13 is arranged on the base and pressed while being applied while rotating the cylindrical body 11 is particularly preferable. The film-like circuit board 13 and the film-like adhesive 12 arranged on the base are previously cut into a predetermined size by a mold.

上記第２工程においては、円筒体１１を回転させてフィルム状回路基板１３を貼り付けた後、そのフィルム状回路基板１３を貼り付けた円筒体１１を更に１回転以上回転させることにより、再び押付圧を加えて再貼り付けを行うことが好ましい。この再貼り付けにより、フィルム状回路基板１３の浮きを防ぐだけでなく、フィルム状接着剤１２を構成する接着剤の流動量を増やすことができるので、フィルム状接着剤１２の両端部間の間隙１２ａを接着剤で完全に埋め戻すと共に、フィルム状回路基板１３の両端部間にある間隙１３ａを接着剤で更に埋めて段差をより一層減少させることができる。 In the second step, after the cylindrical body 11 is rotated and the film-like circuit board 13 is pasted, the cylindrical body 11 to which the film-like circuit board 13 is pasted is further rotated one or more times to press again. It is preferable to re-paste by applying pressure. This re-sticking not only prevents the film-like circuit board 13 from floating, but also increases the flow amount of the adhesive constituting the film-like adhesive 12, so that the gap between both ends of the film-like adhesive 12 can be increased. 12a can be completely backfilled with an adhesive, and the gap 13a between both ends of the film-like circuit board 13 can be further filled with an adhesive to further reduce the level difference.

上記方法により得られる本発明の立体的回路基板は、図２に示すように、円筒体１１の外周面上に、絶縁性フィルム１の表面に配線回路２を形成したフィルム状回路基板１３が、フィルム状接着剤１２から形成された接着剤層を介して貼り付けられた構造を有している。フィルム状回路基板１３の両端部間の間隙１３ａ内にはフィルム状接着剤１２の接着剤が盛り上がり、その両端部間の段差を減少させている。 The three-dimensional circuit board of the present invention obtained by the above method has a film-like circuit board 13 in which the wiring circuit 2 is formed on the surface of the insulating film 1 on the outer peripheral surface of the cylindrical body 11 as shown in FIG. It has a structure attached via an adhesive layer formed from the film adhesive 12. In the gap 13a between the both ends of the film-like circuit board 13, the adhesive of the film-like adhesive 12 rises, and the step between the both ends is reduced.

フィルム状回路基板１３の両端部間の間隙１３ａにある段差は、上記のごとく両端部間の間隙１３ａ内にフィルム状接着剤１２の接着剤が盛り上がることで減少するが、フィルム状回路基板１３を構成する絶縁性フィルム１の厚さを１３μｍ以下とすることによって更に段差を減少させることができる。ただし、絶縁性フィルム１の厚さは、薄すぎると配線回路の形成や取り扱いが困難になるため、３〜１３μｍの範囲が好ましい。 The step in the gap 13a between both ends of the film-like circuit board 13 decreases as the adhesive of the film-like adhesive 12 rises in the gap 13a between both ends as described above. The step can be further reduced by setting the thickness of the insulating film 1 to be 13 μm or less. However, if the thickness of the insulating film 1 is too thin, it becomes difficult to form and handle a wiring circuit.

尚、上記円筒体は特に限定されず、複写機の各種ローラーなど電子機器部品であればよい。上記フィルム状接着剤やフィルム状回路基板についても、特に限定されず、電気機器などに通常使用されているものを用いることができる。また、上記絶縁性フィルムについては、フィルム状回路基板に通常使用されるものであればよく、例えばポリイミドフィルムなどを好適に用いることができる。 The cylindrical body is not particularly limited as long as it is an electronic device part such as various rollers of a copying machine. The film-like adhesive and the film-like circuit board are not particularly limited, and those usually used in electrical equipment can be used. Moreover, about the said insulating film, what is normally used for a film-like circuit board should just be used, for example, a polyimide film etc. can be used conveniently.

［実施例１］
ポリイミドフィルムに銅の配線回路が形成され、その配線回路上に保護フィルムを備えたフィルム状回路基板を準備し、金型を用いて幅５０.２ｍｍ×長さ２５０ｍｍの大きさに切断した。尚、上記フィルム状回路基板としては、ポリイミドフィルムの厚さが３８μｍ、２５μｍ、１２.５μｍ、７.５μｍの４種類を用いた。また、円筒体として、平均直径１６ｍｍ（外周５０.２４ｍｍ）、長さ３００ｍｍのアルミパイプを使用した。 [Example 1]
A copper wiring circuit was formed on the polyimide film, and a film-like circuit board provided with a protective film on the wiring circuit was prepared and cut into a size of width 50.2 mm × length 250 mm using a mold. As the film-like circuit board, four types of polyimide films having a thickness of 38 μm, 25 μm, 12.5 μm, and 7.5 μm were used. Further, an aluminum pipe having an average diameter of 16 mm (outer circumference: 50.24 mm) and a length of 300 mm was used as the cylindrical body.

フィルム状接着剤として、両面に剥離紙を備えた接着テープ（ソニーケミカル社製、Ｔ４９００：厚さ５０μｍ）を使用し、予め金型を用いて５０.２ｍｍ×２５０ｍｍの大きさに切断した。この切断したフィルム状接着剤の片方の剥離紙を取り除き、円筒体を０.１ＭＰａの押付圧で回転させることにより、外周面にフィルム状接着剤を貼り付けた（第１工程）。円筒体に貼り付けたフィルム状接着剤の両端部間に間隙が生じ、その平均幅を測定したところ下記表１に示すように約１００μｍであった。 As a film adhesive, an adhesive tape having a release paper on both sides (S4, manufactured by Sony Chemical Co., Ltd., T4900: thickness 50 μm) was used and cut in advance to a size of 50.2 mm × 250 mm using a mold. One release paper of the cut film adhesive was removed, and the cylindrical body was rotated with a pressing pressure of 0.1 MPa, so that the film adhesive was attached to the outer peripheral surface (first step). A gap was generated between both end portions of the film adhesive adhered to the cylindrical body, and the average width was measured to be about 100 μm as shown in Table 1 below.

次に、円筒体に貼り付けたフィルム状接着剤の表面に残っている剥離紙を除去し、０.２ＭＰａの押付圧で円筒体を回転させることにより、両端部間の間隙が上記フィルム状接着剤の間隙と重ならないように、フィルム状接着剤上にフィルム状回路基板を貼り付けた（第２工程）。尚、フィルム状回路基板の両端部間に生じる間隙の位置は、フィルム状接着剤の両端部間の間隙に対して約９０°の角度だけずれる位置とした。 Next, the release paper remaining on the surface of the film adhesive adhered to the cylindrical body is removed, and the cylindrical body is rotated with a pressing pressure of 0.2 MPa, so that the gap between both ends is the above-mentioned film adhesive. A film-like circuit board was affixed on the film-like adhesive so as not to overlap with the gap between the agents (second step). In addition, the position of the gap generated between both ends of the film-like circuit board was set to a position shifted by an angle of about 90 ° with respect to the gap between both ends of the film-like adhesive.

上記第２工程を具体的に説明する。図３に示すように、基台１４上の貼り付けエリア（イ）にフィルム状回路基板１３を配置し、剥離紙が除去されたフィルム状接着剤１２が貼り付けてある円筒体１１を上方から０.２ＭＰａの押付圧をかけながら、フィルム状回路基板１３の一端（図中のＡ）から矢印方向に他端（図中のＢ）まで移動させることにより、円筒体１１を回転させてフィルム状回路基板１３を貼り付けた。 The said 2nd process is demonstrated concretely. As shown in FIG. 3, the film-like circuit board 13 is arranged in the affixing area (a) on the base 14, and the cylindrical body 11 to which the film-like adhesive 12 from which the release paper has been removed is affixed is viewed from above. While applying a pressing pressure of 0.2 MPa, the cylindrical body 11 is rotated to move from one end (A in the figure) to the other end (B in the figure) in the direction of the arrow to rotate the cylindrical body 11 to form a film. The circuit board 13 was attached.

引き続き、上記のごとくフィルム状回路基板１３が貼り付けられた円筒体１０を、上方から０.２ＭＰａの押付圧をかけながら、更に矢印方向に、貼り付けエリア（イ）と同等以上の距離を有する再貼り付けエリア（ロ）の終点（図中のＣ）まで基台１４上を移動させることにより、円筒体１０を回転させて再貼り付けを行った。 Subsequently, the cylindrical body 10 with the film-like circuit board 13 attached as described above has a distance equal to or greater than the attachment area (A) in the direction of the arrow while applying a pressing pressure of 0.2 MPa from above. By moving on the base 14 to the end point (C in the figure) of the re-pasting area (b), the cylindrical body 10 was rotated and re-pasting was performed.

この再貼り付け終了後、得られた立体的回路基板では、円筒体上に貼り付けられたフィルム状接着剤１２が隙間なく配置されて接着剤層を形成しており、フィルム状回路基板１３の端部に浮きは存在せず、フィルム状回路基板１３の両端部間に生じた間隙を測定したところ、その平均幅は下記表２に示すように約１３０μｍであった。 After the re-pasting is completed, in the obtained three-dimensional circuit board, the film-like adhesive 12 stuck on the cylindrical body is arranged without a gap to form an adhesive layer. There was no float at the end, and when the gap formed between both ends of the film-like circuit board 13 was measured, the average width was about 130 μm as shown in Table 2 below.

得られた立体的回路基板について、上記４種類の厚さのポリイミドフィルムごとに、フィルム状回路基板１０本の両端部間に残っている間隙の深さ（段差）を３点（一端、中央、他端）で測定し、その平均値を求めて下記表１に示した。 About the obtained three-dimensional circuit board, the depth (step) of the gap | interval which remains between the both ends of ten film-like circuit boards for every said 4 types of polyimide film is set to three points (one end, center, The other end) was measured and the average value was obtained and shown in Table 1 below.

この結果から分るように、ポリイミドフィルムの厚さが１３μｍ以下のときに間隙の平均段差が５μｍ以下となり、接着剤がフィルム状回路基板の両端部の間隙内に盛り上がって間隙のほとんどを埋めた状態となっていた。 As can be seen from this result, when the thickness of the polyimide film is 13 μm or less, the average step of the gap becomes 5 μm or less, and the adhesive swells in the gaps at both ends of the film-like circuit board to fill most of the gaps. It was in a state.

尚、上記第１工程で円筒体にフィルム状接着剤を貼り付ける方法は、上記図３で示したフィルム状回路基板を貼り付ける方法とほぼ同様であるため、詳しい説明を省略した。 In addition, since the method of affixing a film adhesive on a cylindrical body at the said 1st process is substantially the same as the method of affixing the film-like circuit board shown in the said FIG. 3, detailed description was abbreviate | omitted.

［参考例］
上記実施例１と同じ４種類の厚さのポリイミドフィルムに銅の配線回路が形成され、その配線回路上に保護フィルムを備えたフィルム状回路基板と、両面に剥離紙を備えた接着テープからなるフィルム状接着剤と、アルミパイプの円筒体とを用い、以下のごとく立体的回路基板を作製した。尚、これらのフィルム状回路基板、フィルム状接着剤及び円筒体は、上記実施例１と同じものである。 [Reference example]
A copper wiring circuit is formed on a polyimide film having the same four types of thickness as in Example 1, and a film-like circuit board provided with a protective film on the wiring circuit, and an adhesive tape provided with release paper on both sides. A three-dimensional circuit board was produced as follows using a film adhesive and a cylindrical body of an aluminum pipe. In addition, these film-like circuit boards, film-like adhesives, and cylindrical bodies are the same as those in the first embodiment.

フィルム状接着剤の片方の剥離紙を取り除き、ラミネーターを使用して０.１ＭＰａの圧力でフィルム状回路基板のポリイミドフィルム側に貼り付けた後、金型を用いて５０.２ｍｍ×２５０ｍｍの大きさに打ち抜いた。 Remove the release paper on one side of the film adhesive, attach it to the polyimide film side of the film circuit board at a pressure of 0.1 MPa using a laminator, and then use a mold to measure 50.2 mm x 250 mm Punched out.

次に、打ち抜いたフィルム状回路基板のフィルム状接着剤から剥離紙を取り除き、フィルム状接着剤を上にして基台に配置し、上方から０.２ＭＰａの押付圧をかけながら円筒体を横方向に移動させることにより、円筒体を回転させてフィルム状回路基板を貼り付けた。このときフィルム状回路基板１の両端部間に生じた間隙の幅は、約０.１５ｍｍであった。 Next, remove the release paper from the film adhesive of the punched film circuit board, place it on the base with the film adhesive facing up, and place the cylinder in the horizontal direction while applying a pressing pressure of 0.2 MPa from above. By moving the cylindrical body, the cylindrical body was rotated to attach the film-like circuit board. At this time, the width of the gap formed between both ends of the film-like circuit board 1 was about 0.15 mm.

しかし、上記のごとく予めフィルム状接着剤を貼り付けたフィルム状回路基板を打ち抜いてから円筒体に貼り付けた場合、フィルム状接着剤の両端部間に生じる間隙とフィルム状回路基板の両端部間に生じる間隙とが同じ位置になる。そのため、円筒体への貼り付け時に接着剤が流動しても、フィルム状回路基板の間隙内に盛り上がることができず、間隙内に円筒体表面が現れているものが複数発生した。 However, when the film-like circuit board on which the film-like adhesive has been previously applied is punched out and attached to the cylindrical body as described above, the gap generated between the both ends of the film-like adhesive and the both ends of the film-like circuit board The gap generated at the same position is the same. For this reason, even if the adhesive flowed when being attached to the cylindrical body, the adhesive could not rise in the gap of the film-like circuit board, and a plurality of cylindrical surfaces appeared in the gap.

［実施例２］
上記実施例１で準備したフィルム状回路基板と同一で、ポリイミドフィルムの厚さが２５μｍと１２.５μｍの２種類のものを用意し、金型で５０.２ｍｍ×２５０ｍｍの大きさに打ち抜いた。これらのフィルム状回路基板を、フィルム状接着剤を貼り付けたアルミパイプの円筒体に、図４に示す方法で貼り付けた。尚、円筒体へのフィルム状接着剤の貼り付けは上記実施例１の第１工程と同様に実施し、フィルム状接着剤の両端部間に生じた間隙の平均幅を測定したところ、下記表２に示すように約１００μｍであった。 [Example 2]
Two types of polyimide film having a thickness of 25 μm and 12.5 μm, which were the same as the film-like circuit board prepared in Example 1 above, were prepared and punched into a size of 50.2 mm × 250 mm with a mold. These film-like circuit boards were attached to a cylindrical body of an aluminum pipe to which a film-like adhesive was attached by the method shown in FIG. The film adhesive was attached to the cylindrical body in the same manner as in the first step of Example 1, and the average width of the gap formed between both ends of the film adhesive was measured. As shown in FIG.

第２工程では、図４に示すように、１対のローラー１５上に上記第１工程でフィルム状接着剤１２を貼り付けた円筒体１１を乗せ、基台１４の貼り付けエリア（イ）にはバキューム方式によって上記フィルム状回路基板１３を保持した。この状態で、フィルム状接着剤の表面に残っている剥離紙を除去し、下方から基台１４に０.２ＭＰａの押付圧で円筒体１１を押し付けながら矢印方向に１対のローラー１５を移動させた。 In the second step, as shown in FIG. 4, the cylindrical body 11 on which the film-like adhesive 12 is pasted in the first step is placed on a pair of rollers 15, and the pasting area (A) of the base 14 is placed. Held the film-like circuit board 13 by a vacuum method. In this state, the release paper remaining on the surface of the film adhesive is removed, and the pair of rollers 15 is moved in the direction of the arrow while pressing the cylindrical body 11 against the base 14 from below with a pressing pressure of 0.2 MPa. It was.

このとき、フィルム状接着剤１２を貼り付けた円筒体１１が回転して貼り付けエリア（イ）を移動することにより、両端部間の間隙が上記フィルム状接着剤１２の間隙と重ならないように、フィルム状接着剤１２上にフィルム状回路基板１３を貼り付けた（第２工程）。尚、フィルム状回路基板の両端部間に生じる間隙の位置は、フィルム状接着剤の両端部間の間隙に対して約９０°の角度だけずれる位置とした。 At this time, the cylindrical body 11 to which the film adhesive 12 is attached rotates and moves in the attachment area (a) so that the gap between both ends does not overlap the gap of the film adhesive 12. The film-like circuit board 13 was stuck on the film-like adhesive 12 (second step). In addition, the position of the gap generated between both ends of the film-like circuit board was set to a position shifted by an angle of about 90 ° with respect to the gap between both ends of the film-like adhesive.

引き続き、１対のローラー１５に乗せた円筒体１１を再貼り付けエリア（ロ）で移動させた。この再貼り付け終了後、得られた立体的回路基板では、円筒体１１上に貼り付けられたフィルム状接着剤１２が隙間なく配置されて接着剤層を形成しており、フィルム状回路基板１３の端部に浮きは存在せず、フィルム状回路基板１３の両端部間に生じた間隙の平均幅を測定したところ、下記表２に示すように約１３０μｍであった。 Subsequently, the cylindrical body 11 placed on the pair of rollers 15 was moved in the re-pasting area (b). After the re-pasting is completed, in the obtained three-dimensional circuit board, the film-like adhesive 12 stuck on the cylindrical body 11 is arranged without a gap to form an adhesive layer, and the film-like circuit board 13 As shown in Table 2 below, the average width of the gap formed between both ends of the film-like circuit board 13 was about 130 μm.

得られた立体的回路基板について、上記２種類の厚さのポリイミドフィルムごとに、フィルム状回路基板１０本の両端部間に残っている間隙の深さ（段差）を３点（一端、中央、他端）で測定し、その平均値を求めて下記表２に示した。 About the obtained three-dimensional circuit board, for each of the two types of polyimide films, the depth (step) of the gap remaining between the two end portions of the ten film-like circuit boards is 3 points (one end, the center, The other value was measured and the average value was obtained and shown in Table 2 below.

上記実施例１と異なる貼り付け方法であっても、ポリイミドフィルムの厚さが１３μｍ以下の場合には、接着剤がフィルム状回路基板の両端部の間隙内に盛り上がって間隙のほとんどを埋めることができ、間隙の深さ（段差）を５μｍ以下とすることができた。 Even if the bonding method is different from that in Example 1, when the thickness of the polyimide film is 13 μm or less, the adhesive may swell in the gaps at both ends of the film-like circuit board to fill most of the gaps. The depth (step) of the gap could be 5 μm or less.

１絶縁性フィルム
２配線回路
１１円筒体
１２フィルム状接着剤
１２ａフィルム状接着剤の間隙
１２ｂ埋め戻し部
１３フィルム状回路基板
１３ａフィルム状回路基板の間隙
１４基台
１５ローラー DESCRIPTION OF SYMBOLS 1 Insulating film 2 Wiring circuit 11 Cylindrical body 12 Film adhesive 12a Gap of film adhesive 12b Backfill part 13 Film circuit board 13a Gap of film circuit board 14 Base 15 Roller

Claims

円筒体の外周面上にフィルム状接着剤を両端部間に間隙を残して貼り付ける第１工程と、該フィルム状接着剤上に、絶縁性フィルム表面に配線回路が形成されたフィルム状回路基板を、両端部間に間隙を残し且つ該両端部間の間隙と前記フィルム状接着剤の両端部間の間隙とが重ならないように貼り付ける第２工程とを備え、該第２工程での貼り付け時に加える押付圧によって、前記フィルム状接着剤の両端部間の間隙をその接着剤で埋め戻して隙間のない接着剤を形成すると同時に、前記フィルム状回路基板の両端部間の間隙に該接着剤を盛り上げることを特徴とする立体的回路基板の製造方法。 A first step of attaching a film adhesive on the outer peripheral surface of the cylindrical body leaving a gap between both ends, and a film circuit board having a wiring circuit formed on the surface of the insulating film on the film adhesive And a second step of attaching the gap between both ends so that the gap between the two ends and the gap between both ends of the film adhesive do not overlap with each other. With the pressing pressure applied at the time of application, the gap between both ends of the film adhesive is backfilled with the adhesive to form an adhesive having no gap, and at the same time, the adhesion is applied to the gap between both ends of the film circuit board. A method for producing a three-dimensional circuit board, wherein the agent is raised.

前記第２工程において、前記円筒体を回転させることでフィルム状回路基板を貼り付けた後、そのフィルム状回路基板を貼り付けた円筒体を更に押付圧を加えながら１回転以上回転させることを特徴とする、請求項１に記載の立体的回路基板の製造方法。 In the second step, the film-like circuit board is attached by rotating the cylinder, and then the cylinder to which the film-like circuit board is attached is rotated one or more times while further pressing pressure is applied. The manufacturing method of the three-dimensional circuit board of Claim 1.

絶縁性フィルムの表面に配線回路を形成したフィルム状回路基板を、円筒体の外周面上に接着剤を介して貼り付けた立体的回路基板であって、フィルム状回路基板の絶縁性フィルムの厚さが１３μｍ以下であり、フィルム状回路基板と円筒体の間に接着剤が隙間なく配置されると共に、フィルム状回路基板の対向する両端部間の間隙に接着剤が盛り上がって該両端部間の段差を減じていることを特徴とする立体的回路基板。 A three-dimensional circuit board in which a film-like circuit board in which a wiring circuit is formed on the surface of an insulating film is attached to an outer peripheral surface of a cylindrical body via an adhesive, and the thickness of the insulating film of the film-like circuit board Is 13 μm or less, and the adhesive is disposed between the film-like circuit board and the cylindrical body without any gap, and the adhesive rises in the gap between the opposite ends of the film-like circuit board so that the gap between the both ends A three-dimensional circuit board characterized in that the steps are reduced.