JP2009147081A - Apparatus and method for forming three-dimensional circuit board - Google Patents

Apparatus and method for forming three-dimensional circuit board Download PDF

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JP2009147081A
JP2009147081A JP2007322342A JP2007322342A JP2009147081A JP 2009147081 A JP2009147081 A JP 2009147081A JP 2007322342 A JP2007322342 A JP 2007322342A JP 2007322342 A JP2007322342 A JP 2007322342A JP 2009147081 A JP2009147081 A JP 2009147081A
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circuit board
adhesive layer
dimensional
forming
roller
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JP4400673B2 (en
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Hiroshi Okada
浩 岡田
Fumiaki Ishida
史明 石田
Kan Yoshida
堪 吉田
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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Priority to JP2007322342A priority Critical patent/JP4400673B2/en
Priority to KR1020080119519A priority patent/KR100982590B1/en
Priority to TW097146559A priority patent/TWI363587B/en
Priority to CN2008101817921A priority patent/CN101460012B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To accurately attach a circuit board to the front surface of a roller for an electronic device which is superior in position accuracy, without generating overlapping area, by minimizing gaps between circuit boards. <P>SOLUTION: An apparatus includes a rotational mechanism (10) for holding a column-shaped or cylinder-shaped object (1), under the condition that the center axis be maintained in the horizontal state and making the object rotate about the center axis as the rotating axis; a holding mechanism (20) for holding a circuit board (2) under the condition that a bonding agent layer is directed downward and for transferring the circuit board (2) horizontally, and a controlling mechanism (30) for adjusting relative positional relation so that the bonding agent layer of the circuit board (2) transferred is placed, in contact with the front surface of the rotating object (1) and for controlling the pressure of the circuit board, pressing against the front surface of the object (1) to a constant value. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、立体的回路基板の形成装置および形成方法に関し、特に、ローラーの表面に回路基板を貼着することにより立体的回路基板を形成するための装置および方法に関する。   The present invention relates to an apparatus and a method for forming a three-dimensional circuit board, and more particularly to an apparatus and a method for forming a three-dimensional circuit board by sticking a circuit board to a surface of a roller.

携帯電話などの電子機器の小型化、多機能化、および低コスト化に伴い、その筐体の内面や外面に、回路基板をコンパクトに貼着することが要求されており、回路基板として平面的ではなく立体的なものが必要となる場合がある。また、複写機の分野でも、現像用ローラー、帯電ローラー、または転写ローラーなどのローラーの表面の一部に、または全周にわたって、回路基板を貼着することにより、立体的回路基板を形成することが提案されている。   As electronic devices such as mobile phones become smaller, more multifunctional, and lower in cost, it is required that the circuit board be compactly attached to the inner and outer surfaces of the housing. Instead, a three-dimensional thing may be required. Also in the field of copying machines, a three-dimensional circuit board is formed by adhering a circuit board to a part of the surface of a roller such as a developing roller, a charging roller, or a transfer roller or over the entire circumference. Has been proposed.

このような立体的回路基板を形成する一般的な方法としては、従来、１ショットモールド法、または２ショットモールド法と称される射出成形法がある。   As a general method for forming such a three-dimensional circuit board, there is conventionally an injection molding method called a one-shot mold method or a two-shot mold method.

１ショットモールド法では、まず、無電解めっきが可能で導電性を有する樹脂を所望の立体形状に形成し、次に、その表面に感光性レジストを塗布し、回路パターンを露光し、現像し、露光されなかった部分の感光性レジストを除去し、露出した樹脂の表面に無電解めっきを施して、立体的回路基板を得ている。   In the one-shot mold method, first, a resin having electroconductivity that can be electrolessly formed and having a desired three-dimensional shape is formed, then a photosensitive resist is applied to the surface, a circuit pattern is exposed, developed, The portion of the photosensitive resist that was not exposed was removed, and the surface of the exposed resin was subjected to electroless plating to obtain a three-dimensional circuit board.

これに対して、２ショットモールド法では、めっき用の触媒を配合した樹脂を用い、最初の射出成形によって、無電解めっきが可能な立体形状を形成し、２回目の射出成形によって、表面の所定部分に無電解めっきを行わない表面層を形成し、次いで、めっき用の触媒を配合した樹脂が表れている表面の部分に無電解めっきを施して、立体的回路基板を得ている。   In contrast, in the two-shot mold method, a resin blended with a catalyst for plating is used, a three-dimensional shape capable of electroless plating is formed by the first injection molding, and a predetermined surface is formed by the second injection molding. A surface layer that is not subjected to electroless plating is formed on the portion, and then electroless plating is performed on the portion of the surface where the resin mixed with the catalyst for plating appears to obtain a three-dimensional circuit board.

しかしながら、１ショットモールド法および２ショットモールド法のいずれにも、以下のような問題がある。例えば、１ショットモールド法では、製造工程が非常に長く、コストが高くつく。また、３次元の曲面形状を有する立体形状の製造には不向きである。さらに、樹脂の材料が限定され、回路のパターニングが困難である。   However, both the one-shot mold method and the two-shot mold method have the following problems. For example, in the one-shot mold method, the manufacturing process is very long and the cost is high. Further, it is not suitable for manufacturing a three-dimensional shape having a three-dimensional curved surface shape. Furthermore, the resin material is limited, and circuit patterning is difficult.

一方、２ショットモールド法では、３次元の曲面形状を有する立体形状の製造には適しているものの、精度の高い成形用金型が要求されること、２回の射出成形を行うことなどから、コストが高くなる。   On the other hand, although the two-shot mold method is suitable for manufacturing a three-dimensional shape having a three-dimensional curved surface shape, a highly accurate molding die is required, and two injection moldings are performed. Cost increases.

従って、これらの射出成形法はいずれも、ローラの表面全周に回路基板を形成するための方法としては適していない。   Accordingly, none of these injection molding methods is suitable as a method for forming a circuit board around the entire surface of the roller.

このようなローラの表面全周に回路基板を形成する方法として、ポリイミドなどの絶縁性フィルムの表面に、銅などの導体層を設けた基材を用いて、導体層をパターニングして回路基板を形成し、得られた回路基板をローラーの表面全周に貼着する方法が考えられる。このような回路基板は、多量に、かつ、安価に製造することができるため、ローラに添着することができれば、有利といえる。   As a method of forming a circuit board on the entire surface of such a roller, a circuit board is formed by patterning a conductor layer using a base material provided with a conductor layer such as copper on the surface of an insulating film such as polyimide. A method of forming and sticking the obtained circuit board around the entire surface of the roller is conceivable. Since such a circuit board can be manufactured in large quantities and at low cost, it can be advantageous if it can be attached to a roller.

ところで、特許文献１には、フィルムを円柱形状または円筒形状である缶体にロータリーカッター方式で貼着する方法が記載されている。この方法では、自立保持不能な柔軟性フィルムを、高い精度で希望長さに切断し、切断して得たフィルムを缶体に供給して、良好にラミネートを行うことにより、フィルムの缶体への添着を可能としている。より具体的には、巻き取り状態にある自立保持不能な柔軟性フィルムを、フィードロールおよびカッティングロールに真空吸着させて巻き付け、フィードロールの周速をカッティングロールの周速より遅くし、フィルムにテンションを与え、カッティングロールの真空吸着部位を複数に分割して真空強度を調整することによりフィルムに滑りを付与し、切断後のフィルムに一定の間隔を作り、缶体へのラミネートのタイミングを得て、ラミネートロールのラミネート部位では一転して加圧しフィルムの窪みを無くし、缶体とフィルムの間に空気を残存さないで、缶体へ良好にラミネートを行っている。   By the way, Patent Document 1 describes a method of sticking a film to a cylindrical or cylindrical can body by a rotary cutter method. In this method, a flexible film that cannot be held on its own is cut to a desired length with high accuracy, and the film obtained by cutting is supplied to the can body, and then laminated to a film can body. Can be attached. More specifically, a flexible film that cannot be held on its own in a wound state is wound on a feed roll and a cutting roll by vacuum suction, and the peripheral speed of the feed roll is made slower than the peripheral speed of the cutting roll, and tension is applied to the film. By dividing the vacuum suction part of the cutting roll into multiple parts and adjusting the vacuum strength, the film is made slippery, a certain interval is created in the cut film, and the timing of lamination to the can body is obtained. The laminate part of the laminating roll turns and pressurizes to eliminate the dent of the film, and air is not left between the can body and the film, and the can body is satisfactorily laminated.

特許文献１に記載されたロータリーカッター方式による貼着方法は、缶体やボトルなどの飲料容器のボトル表面にラベルを貼ることを目的として開発されたものである。そのため、ラベルを貼る位置精度などを厳密に管理する必要がなく、また、飲料容器の表面全周にラベルを貼着する場合は、フィルムに重なりや隙間が生じても問題となることはない。   The sticking method by the rotary cutter system described in Patent Document 1 was developed for the purpose of sticking a label on the bottle surface of a beverage container such as a can or a bottle. Therefore, it is not necessary to strictly manage the positional accuracy and the like where the label is applied, and when the label is attached to the entire surface of the beverage container, there is no problem even if an overlap or a gap occurs in the film.

しかしながら、電子機器用途の回路基板をローラーの表面全周に貼着する場合、回路基板に重なりや大きい隙間があると、回路を構成する配線に短絡や導通不良が発生し、回路の電気的特性に影響を及ぼすため、大きな問題となる。また、立体的回路基板を形成した後の工程では、回路基板に外部から通電処理などを行う組立工程が続くため、正確な位置に回路基板を貼着していなければ、その後の組立工程で支障を来すなどの問題が生じる。このため、貼り合わせる位置精度については、非常に厳密な管理が求められる。   However, when a circuit board for electronic equipment is attached to the entire circumference of the roller surface, if there are overlaps or large gaps on the circuit board, a short circuit or poor conduction will occur in the wiring that constitutes the circuit, and the electrical characteristics of the circuit This is a big problem. In addition, in the process after forming the three-dimensional circuit board, an assembly process in which an energization process is performed on the circuit board from the outside continues. Therefore, if the circuit board is not attached to an accurate position, the subsequent assembly process is hindered. Problems occur. For this reason, very precise management is required for the accuracy of the bonding position.

また、回路基板を貼着したローラーを回転体として使用する場合、貼着時に重なりや大きい隙間が生ずると、回路基板に凹凸が形成され、回転時に部分的な接触が発生するなどの問題が生じる。そのため、重なりがなく、隙間が許容される程度に小さいことが要求される。   In addition, when a roller with a circuit board attached is used as a rotator, if there are overlaps or large gaps at the time of application, irregularities are formed on the circuit board, causing problems such as partial contact during rotation. . Therefore, it is required that there is no overlap and the gap is small enough to be allowed.

さらに、特許文献１に記載された方法で、回路基板をローラーの表面全周に貼着しようとすると、ローラーを直立した状態に保持して搬送する必要がある。しかしながら、細長い形状の場合や、両端ないしは一端が複雑な形状に加工されている場合は、常に垂直に保持、搬送して、これに回路基板を貼着することは困難である。   Furthermore, when it is going to stick a circuit board to the surface periphery of a roller with the method described in patent document 1, it is necessary to hold | maintain and convey a roller in the upright state. However, in the case of an elongated shape, or when both ends or one end is processed into a complicated shape, it is difficult to always hold and convey the substrate vertically and attach the circuit board thereto.

このように、ローラの表面全周に回路基板を形成する立体的回路基板の形成において、上述のロータリーカッター方式の貼着方法を採用することはできない。
特開平１０−２３６４４６号公報 As described above, in the formation of the three-dimensional circuit board in which the circuit board is formed on the entire surface of the roller, the above-described rotary cutter method cannot be adopted.
Japanese Patent Laid-Open No. 10-236446

本発明は、円柱形状または円筒形状のローラーの表面に、特に全周にわたって、正確な位置精度をもって回路基板を貼着することを可能とする、立体的回路基板の形成装置および形成方法を提供することを目的とする。   The present invention provides a three-dimensional circuit board forming apparatus and a forming method capable of sticking a circuit board to a surface of a columnar or cylindrical roller with an accurate positional accuracy, particularly over the entire circumference. For the purpose.

本発明に係る立体的回路基板の形成装置は、円柱形状または円筒形状である対象物を、中心軸が水平となる状態で保持し、かつ、該中心軸を回転軸にして回転させる回転機構と、回路基板を接着剤層が下向きとなるように保持し、かつ、水平に搬送する保持機構と、回転する前記対象物の表面に対して搬送される前記回路基板の接着剤層が接するように相対的位置関係を調節可能であり、かつ、前記対象物の表面に対して押圧する前記回路基板の圧力を一定に制御可能である制御機構とを備える。   An apparatus for forming a three-dimensional circuit board according to the present invention includes a rotating mechanism that holds an object having a columnar shape or a cylindrical shape in a state where the central axis is horizontal, and rotates the central axis as a rotational axis. The holding mechanism for holding the circuit board with the adhesive layer facing downward and transporting the circuit board horizontally is in contact with the adhesive layer of the circuit board transported to the surface of the rotating object. And a control mechanism capable of adjusting the relative positional relationship and controlling the pressure of the circuit board pressing against the surface of the object to be constant.

前記回路基板の接着剤層が、常温で粘着性を有する常温硬化型の接着剤からなり、前記回路基板の接着剤層が保護フィルムにより被覆されている場合には、該保護フィルムを除去する除去機構をさらに有することが好ましい。   When the adhesive layer of the circuit board is made of a normal temperature curable adhesive having tackiness at normal temperature, and the adhesive layer of the circuit board is covered with a protective film, the protective film is removed to remove the protective film It is preferable to further have a mechanism.

また、前記回路基板の接着剤層が、加熱により粘着性を発現する加熱硬化型の接着剤からなる場合には、前記接着剤層または前記対象物を加熱する加熱機構をさらに有することが好ましい。   Moreover, when the adhesive layer of the circuit board is made of a thermosetting adhesive that develops tackiness by heating, it is preferable to further have a heating mechanism for heating the adhesive layer or the object.

前記回転機構は、具体的には、前記対象物が間に載せられて回転するように配置された２つの回転ローラーから構成される。   Specifically, the rotation mechanism is configured by two rotation rollers arranged so that the object is placed between them and rotates.

また、前記回転機構に載置された前記対象物の軸方向に合わせて、前記回路基板を収容することが可能な基準出し機構をさらに備えることより、前記対象物の中心軸に垂直な方向にのみ移動させることで、回路基板の貼着が可能となる。   In addition, it further includes a reference mechanism that can accommodate the circuit board in accordance with the axial direction of the object placed on the rotating mechanism, so that it is perpendicular to the central axis of the object. By moving only the circuit board, it is possible to attach the circuit board.

なお、本発明に係る立体的回路基板の形成方法は、円柱形状または円筒形状である対象物を、中心軸が水平となる状態で回転可能に保持し、片面に回路を有し、他面に接着剤層が設けられた回路基板を所定の大きさに切断し、該回路基板を、基準位置に載置し、該回路基板を移動手段に吸着させ、該移動手段を移動させ、前記回路基板の接着剤層の端部を前記対象物の表面に接合し、前記回路基板を前記対象物の表面に対して押圧する圧力を制御しながら、前記回路基板を水平移動させるとともに、前記対象物を回転させることにより、前記回路基板を前記対象物の表面に貼着する工程からなることを特徴とする。   In the method for forming a three-dimensional circuit board according to the present invention, an object having a columnar shape or a cylindrical shape is rotatably held in a state where the central axis is horizontal, the circuit is provided on one side, and the other side is provided with a circuit. A circuit board provided with an adhesive layer is cut into a predetermined size, the circuit board is placed at a reference position, the circuit board is adsorbed to a moving means, the moving means is moved, and the circuit board is placed. The edge of the adhesive layer is joined to the surface of the object, and the circuit board is horizontally moved while controlling the pressure for pressing the circuit board against the surface of the object. The method comprises a step of sticking the circuit board to the surface of the object by rotating.

具体的には、上述の立体的回路基板の形成装置を使用し、前記圧力を調節することにより、前記回路基板を、前記対象物の表面全周に、隙間を制御して貼着する。   Specifically, by using the above-described three-dimensional circuit board forming apparatus and adjusting the pressure, the circuit board is attached to the entire surface of the object while controlling the gap.

本発明により、垂直に保持して搬送することが困難な電子機器用途のローラーの表面に、位置精度よく、重なりを生じず、かつ、隙間を最小限に制御して、正確に回路基板を貼り付けることが可能となる。   According to the present invention, a circuit board is accurately pasted on a roller surface for electronic equipment, which is difficult to hold and transport vertically, with high positional accuracy, without overlapping, and with a minimal gap. It becomes possible to attach.

本発明の一実施形態を、図面に基づいて詳述する。図１に、本発明の立体的回路基板の形成装置の一実施形態を概略図で示す。図２に、図１の基準出し機構を概略図で示す。   An embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 schematically shows an embodiment of a three-dimensional circuit board forming apparatus according to the present invention. FIG. 2 is a schematic view showing the reference setting mechanism shown in FIG.

本発明の立体的回路基板の形成装置は、円柱形状または円筒形状である対象物（１）を、中心軸が水平となる状態で保持し、かつ、中心軸を回転軸にして回転させる回転機構（１０）と、回路基板（２）を接着剤層が下向きとなるように保持し、かつ、水平に搬送する保持機構（２０）と、回転する対象物（１）の表面に対して搬送される回路基板（２）の接着剤層が接するように相対的位置関係を調節可能であり、かつ、対象物（１）の表面に対して押圧する回路基板（２）の圧力を一定に制御可能である制御機構（３０）とを備える。   The apparatus for forming a three-dimensional circuit board according to the present invention holds a target object (1) having a columnar shape or a cylindrical shape in a state where the central axis is horizontal and rotates the central axis as a rotational axis. (10) and the circuit board (2) are held with the adhesive layer facing downward, and are transported horizontally with respect to the holding mechanism (20) and the surface of the rotating object (1). The relative positional relationship can be adjusted so that the adhesive layer of the circuit board (2) contacts, and the pressure of the circuit board (2) pressed against the surface of the object (1) can be controlled to be constant. And a control mechanism (30).

回路基板（２）は、基準出し機構（４０）に収められる。なお回路基板（２）は、貼着される対象物の大きさに合わせて所定のサイズに予め切断される。例えば、対象物（１）であるローラーの全面に回路基板を形成する場合、回路基板（２）の対象物（１）の回転軸方向の側辺の長さを、対象物（１）の回転軸方向の長さと同じとする。また、対象物（１）の円周方向に対応する側辺の長さを、対象物（１）の円周とほぼ同じとする。ただし、後述の通り、切断精度には誤差があり、また対象物の形状にも公差があり、これらは補正されるため、これらの値を厳密に一致させる必要はない。   The circuit board (2) is housed in the reference out mechanism (40). The circuit board (2) is cut in advance to a predetermined size in accordance with the size of the object to be attached. For example, when the circuit board is formed on the entire surface of the roller that is the object (1), the length of the side of the circuit board (2) in the direction of the rotation axis of the object (1) is the rotation of the object (1). It is the same as the axial length. Further, the length of the side corresponding to the circumferential direction of the object (1) is made substantially the same as the circumference of the object (1). However, as will be described later, there is an error in the cutting accuracy, and there is a tolerance in the shape of the object, and these are corrected. Therefore, it is not necessary to match these values strictly.

基準出し機構（４０）は、所定のサイズに切断されたフィルム状の回路基板（２）のホルダーとして機能する。基準出し機構（４０）は、例えば、樹脂製の固定プレート（４１）と可動プレート（４２）とからなる。所定のサイズに切断されたフィルム状の回路基板（２）を、回路面を上にした状態で、基準出し機構（４０）にセットする。基準出し機構（４０）での位置合わせは、ＸＹ方向の固定式の基準プレートとなる固定プレート（４１）へ、可動プレート（４２）がフィルム状の回路基板（２）を押すことにより、正確な位置にセットする。   The reference out mechanism (40) functions as a holder for the film-like circuit board (2) cut to a predetermined size. The reference out mechanism (40) includes, for example, a resin fixed plate (41) and a movable plate (42). The film-like circuit board (2) cut to a predetermined size is set in the reference out mechanism (40) with the circuit surface facing up. Positioning by the reference out mechanism (40) is performed accurately when the movable plate (42) pushes the film-like circuit board (2) onto the fixed plate (41) which is a fixed reference plate in the XY directions. Set to position.

切断したフィルム状の回路基板（２）は、１枚毎にセットしても良いし、複数枚をまとめてセットしても良い。複数枚をまとめてセットする場合には、複数枚を重ねて収納できるようなマガジンを、基準出し機構（４０）に取り付ける。   The cut film-like circuit board (2) may be set for each sheet, or a plurality of sheets may be set together. When a plurality of sheets are set together, a magazine capable of storing a plurality of sheets in a stacked manner is attached to the reference output mechanism (40).

正確な位置にセットされたフィルム状の回路基板（２）は、小さな孔があいている保持機構（２０）に、１枚毎、真空吸引によって吸着され、搬送される。具体的には、保持機構（２０）は、真空吸引を可能とする小さな孔を有する樹脂板または機構金属板の吸着板と、該孔と連通する真空吸引システム、および該吸着板と真空吸引システムを上昇下降および水平方向に移動させる機構からなる。   The film-like circuit board (2) set at an accurate position is adsorbed by vacuum suction to the holding mechanism (20) having a small hole and conveyed. Specifically, the holding mechanism (20) includes a suction plate made of a resin plate or a mechanism metal plate having a small hole that enables vacuum suction, a vacuum suction system communicating with the hole, and the suction plate and the vacuum suction system. It is composed of a mechanism for moving up and down and moving in the horizontal direction.

保持機構（２０）は、フィルム状の回路基板（２）を吸着した後、上昇する。   The holding mechanism (20) moves up after adsorbing the film-like circuit board (2).

接着剤層が、加熱されて粘着性を発現する接着剤からなる場合、回路基板（２）を加熱する加熱機構（５０）を通過させる。加熱機構（５０）としては、公知の加熱ヒーターなどを採用できる。接着剤の種類によって活性の条件が異なるため、加熱ヒーターによる加熱温度および加熱時間を、用いる接着剤に応じて最適化して、加熱を行う。加熱温度は、各接着剤の活性温度範囲とする。   When the adhesive layer is made of an adhesive that is heated to develop tackiness, the adhesive layer is passed through a heating mechanism (50) for heating the circuit board (2). As the heating mechanism (50), a known heater can be employed. Since the active conditions vary depending on the type of adhesive, heating is performed by optimizing the heating temperature and heating time of the heater according to the adhesive used. The heating temperature is within the activation temperature range of each adhesive.

なお、加熱機構（５０）は、回路基板（２）の接着剤層を加熱するもののほか、対象物（１）を加熱することにより、接合時に接着剤層を加熱する機構のものも採用できる。   In addition to the heating mechanism (50) for heating the adhesive layer of the circuit board (2), the heating mechanism (50) for heating the object (1) to heat the adhesive layer at the time of bonding can also be employed.

また、図示した態様においては、接着剤層が、加熱されて粘着性を発現する加熱硬化型の接着剤からなる場合を示したが、接着剤層が、常温で粘着性を有する接着剤からなり、接着剤層に、保護フィルムが貼着されている場合には、保護フィルムを除去する除去機構を備えるようにする。該除去機構についても、保護フィルムを剥離させ除去させるための公知の装置を用いることができる。   Further, in the illustrated embodiment, the case where the adhesive layer is made of a thermosetting adhesive that exhibits adhesiveness when heated is shown. However, the adhesive layer is made of an adhesive having adhesiveness at room temperature. In the case where a protective film is attached to the adhesive layer, a removal mechanism for removing the protective film is provided. Also for the removal mechanism, a known device for peeling off and removing the protective film can be used.

これらの加熱機構（５０）および除去機構を同時に備えてもよい。   You may provide these heating mechanisms (50) and removal mechanisms simultaneously.

その後、保持機構（２０）を移動させ、回路基板（２）を、金属製または樹脂製のローラーからなる対象物（１）がセットされた回転機構（１０）の上方に移動させる。必要に応じて、当該位置に置いて、保持機構（２０）を下降させ、回路基板（２）を対象物（１）の表面に押圧することにより、回路基板（２）の接着剤層の端部（回転軸方向の側辺で進行方向前側の端部）をその表面に接合させる。ただし、水平移動のみによって、この接合を達成してもよい。   Thereafter, the holding mechanism (20) is moved, and the circuit board (2) is moved above the rotating mechanism (10) on which the object (1) made of a metal or resin roller is set. If necessary, the holding mechanism (20) is lowered at the position, and the circuit board (2) is pressed against the surface of the object (1) to thereby end the adhesive layer of the circuit board (2). The portion (the end on the side in the rotation axis direction and the front end in the traveling direction) is joined to the surface. However, this joining may be achieved only by horizontal movement.

回転機構（１０）は、自由に回転可能な２本の回転ローラーを隣接させる構造で構成される。回転ローラーとしては、金属製のローラーを採用できる。必要に応じて、ゴムなどの弾性材が全周に添着されているものも採用できる。かかるローラーの両端を軸受などにより回転可能に支承し、対象物の回転に追従可能とする。対象物（１）が２本の回転ローラーの間に載せられ、フィルム状の回路基板（２）の側辺と、対象物（１）の回転軸とが平行になるように保持機構（２０）が移動する。その他、例えば、対象物（１）の両端に回路基板（２）を形成する必要がない場合等には、該両端部を軸受などにより支承して、回転可能に支持してもよい。   The rotation mechanism (10) has a structure in which two freely rotatable rollers are adjacent to each other. A metal roller can be adopted as the rotating roller. If necessary, an elastic material such as rubber attached to the entire circumference can be used. Both ends of the roller are rotatably supported by a bearing or the like so that the rotation of the object can be followed. The object (1) is placed between two rotating rollers, and the holding mechanism (20) so that the side of the film-like circuit board (2) and the rotation axis of the object (1) are parallel to each other. Move. In addition, for example, when it is not necessary to form the circuit board (2) at both ends of the object (1), the both end portions may be supported by bearings and supported rotatably.

その後、フィルム状の回路基板（２）を吸着した保持機構（２０）が、水平に移動すると同時に、フィルム状の回路基板（２）の側辺から、対象物（１）の回転にともなって、対象物（１）の表面全周に接着される。従って、接着剤層と対象物（１）との間に、空気を巻き込むことがない。また、長さや直径など、対象物（１）の形状が変化しても、保持機構（２０）は、冶具や構造を変更することなく、貼り付けることが可能である。なお、接着する時の圧力が一定になるように、エアーまたは油圧を用いた機構により行ってもよい。   Thereafter, the holding mechanism (20) that sucks the film-like circuit board (2) moves horizontally, and simultaneously with the rotation of the object (1) from the side of the film-like circuit board (2), It adheres to the entire surface of the object (1). Therefore, air is not involved between the adhesive layer and the object (1). Further, even if the shape of the object (1) such as the length or diameter changes, the holding mechanism (20) can be attached without changing the jig or structure. Note that a mechanism using air or hydraulic pressure may be used so that the pressure at the time of bonding is constant.

フィルム状の回路基板（２）は、樹脂フィルムの上に銅などの薄い導体を形成した構造であるため、ある程度の伸びが発生する。本発明では、対象物（１）に対して、保持機構（２０）に吸着したフィルム状の回路基板（２）が巻きつけるようにして、貼り付けられる構造であるため、制御機構（３０）により、対象物（１）に対して回路基板（２）を押圧する圧力を変化させることで、フィルム状の回路基板（２）の伸びが異なり、その結果、対象物（１）の表面全周に貼り付けたフィルム状の回路基板（２）の隙間（貼着後の回転軸方向の側辺間の距離）を、前述の圧力で制御することが可能となる。具体的には、抜いた回路基板の寸法のバラツキやアルミパイプ径のバラツキを求め、要求する隙間に収まるように圧力を制御しながら巻きつけることで伸びを調整する。   Since the film-like circuit board (2) has a structure in which a thin conductor such as copper is formed on a resin film, a certain amount of elongation occurs. In the present invention, since the film-like circuit board (2) adsorbed to the holding mechanism (20) is wound around the object (1) and attached, the control mechanism (30) By changing the pressure for pressing the circuit board (2) against the object (1), the elongation of the film-like circuit board (2) is different, and as a result, the entire surface of the object (1) is It becomes possible to control the gap (distance between the sides in the direction of the rotation axis after sticking) of the stuck film-like circuit board (2) with the pressure described above. Specifically, the elongation is adjusted by obtaining the variation in the size of the circuit board that has been removed and the variation in the diameter of the aluminum pipe, and winding while controlling the pressure so as to be within the required gap.

特に、フィルム状の回路基板（２）の切断精度のバラツキ、対象物（１）が金属製または樹脂製のローラーである場合の公差、および、ロット間で生じる製作上のバラツキにより、計算上の隙間が異なる場合がある。しかし、本発明では、前述したように、制御機構（３０）において貼り付ける時の圧力を操作することで、回路基板（２）の伸びを変化させて、隙間を許容値以下の一定値に制御することが可能である。   In particular, due to variations in the cutting accuracy of the film-like circuit board (2), tolerances when the object (1) is a metal or resin roller, and manufacturing variations that occur between lots, the calculation The gap may be different. However, in the present invention, as described above, the gap is controlled to a constant value not more than the allowable value by changing the elongation of the circuit board (2) by manipulating the pressure applied at the control mechanism (30). Is possible.

（実施例１）
まず、回路基板を以下のように作製した。 Example 1
First, a circuit board was produced as follows.

厚さ３５μｍのＰＥＴフィルム（東洋紡績株式会社製、Ａ４１００）を用い、表面に銅薄膜をスパッタリングにより成膜し、その後、電気銅めっき法で銅層を形成した。電気銅めっきは、硫酸銅濃度９０ｇ／リットル、硫酸濃度１８０ｇ／リットルのめっき浴を室温で用い、陰極電流密度２Ａ／ｄｍ2によって、厚さ８μｍの銅被覆を形成した。 Using a 35 μm thick PET film (A4100, manufactured by Toyobo Co., Ltd.), a copper thin film was formed on the surface by sputtering, and then a copper layer was formed by an electrolytic copper plating method. For the electrolytic copper plating, a copper bath having a thickness of 8 μm was formed by using a plating bath having a copper sulfate concentration of 90 g / liter and a sulfuric acid concentration of 180 g / liter at room temperature and a cathode current density of 2 A / dm 2 .

さらに、フォトレジスト方式により、銅層の表面にドライフィルムレジスト（旭化成株式会社製、ＡＱ−１１５８）を貼り、配線形状のマスクを作製した後、ドライフィルムレジスト上に露光を行い、現像、エッチング、およびドライフィルム剥離を行った。また、回路基板の裏側には、常温で粘着性を有する接着剤（大日本インキ化学工業株式会社製、両面接着テープ＃８６１６）をラミネートして用いた。従って、接着剤層に保護フィルムが貼られている。   Furthermore, after applying a dry film resist (AQ-1158, manufactured by Asahi Kasei Co., Ltd.) on the surface of the copper layer by a photoresist method, and producing a wiring-shaped mask, exposure is performed on the dry film resist, development, etching, And dry film peeling was performed. Further, an adhesive having adhesiveness at room temperature (Dainippon Ink Chemical Co., Ltd., double-sided adhesive tape # 8616) was laminated on the back side of the circuit board. Therefore, the protective film is stuck on the adhesive layer.

以上のようにして得られた回路基板（２）を、金型により切断し、回転軸方向の側辺が５０．３ｍｍ、これに垂直方向の側辺が３５０ｍｍとなるようにした。切断後、図２に示すカセット（４０）にセットした。   The circuit board (2) obtained as described above was cut with a mold so that the side in the rotation axis direction was 50.3 mm, and the side in the vertical direction was 350 mm. After cutting, it was set in the cassette (40) shown in FIG.

次に、図１に概略図を示した立体的回路基板の形成装置を使用して、貼着工程を行った。該装置は、真空吸着（バキューム）リフト（３０、エアシリンダによる昇降機構）、該リフトに接続された吸着板（２０）、加熱ヒータ（５０）、保護フィルム除去装置（回路基板に貼り付けた保護フィルムは、フィルム端部にリーダーテープが貼り付けてあり、リーダーテープを掴み剥離することで保護フィルムを剥がす機構）、回転装置（１０）、および回転装置用加熱ヒータ（図示せず）を備えている。バキュームリフト（３０）は、吸着板（２０）を上昇下降移動およびカセット（４０）から回転装置（１０）の方向への水平移動が可能である。保護フィルム除去装置は、加熱ヒータ（５０）に隣接して、カセット（４０）から回転装置（１０）へのライン上に設置されている。なお、加熱ヒータ（５０）は使用しなかった。回転装置（１０）の回転ローラーとして、それぞれ金属製ローラー表面にシリコンゴム添付した直径が４０ｍｍ、長さが４００ｍｍのローラーを使用した。   Next, the sticking process was performed using the formation apparatus of the three-dimensional circuit board which showed the schematic in FIG. The apparatus includes a vacuum suction (vacuum) lift (30, a lifting mechanism using an air cylinder), a suction plate (20) connected to the lift, a heater (50), a protective film removal device (protection attached to a circuit board) The film has a leader tape affixed to the end of the film, and a mechanism for peeling off the protective film by grasping and peeling the leader tape), a rotating device (10), and a heater for the rotating device (not shown). Yes. The vacuum lift (30) can move the suction plate (20) up and down and move horizontally from the cassette (40) to the rotating device (10). The protective film removing device is installed on the line from the cassette (40) to the rotating device (10) adjacent to the heater (50). The heater (50) was not used. As the rotating roller of the rotating device (10), rollers each having a diameter of 40 mm and a length of 400 mm attached to the surface of a metal roller with silicon rubber were used.

直径が１６ｍｍ、長さが３５０ｍｍであるアルミパイプからなるローラー（１）を該回転装置のローラー間に載置した。   A roller (1) made of an aluminum pipe having a diameter of 16 mm and a length of 350 mm was placed between the rollers of the rotating device.

なお、それぞれの回路基板（２）およびローラー（１）について、後述の測定のために、正確に寸法を測定しておいた。   In addition, about each circuit board (2) and roller (1), the dimension was measured correctly for the below-mentioned measurement.

吸着板（２０）をカセット（４０）に収容されている回路基板（２）上まで降下させ、回路基板（２）を吸着させた。吸着板（２０）を上昇させ、水平移動させた。水平移動の途中で、保護フィルム除去機構により、回路基板（２）の下側の接着剤層を被覆する保護シートを剥離除去させた。吸着板（２０）の進行方向端部が回転装置上のローラー（１）上まで達すると、吸着板（２０）は、予め設定された圧力によりローラー（１）を押圧するまで、降下した。接着剤層の進行方向端部がローラー（１）の表面に接触後、吸着板（２０）を水平移動させると、それに伴いローラー（１）も回転し、その全周にわたって回路基板（２）が貼着された。   The suction plate (20) was lowered onto the circuit board (2) accommodated in the cassette (40) to suck the circuit board (2). The suction plate (20) was raised and moved horizontally. During the horizontal movement, the protective sheet covering the lower adhesive layer of the circuit board (2) was peeled and removed by the protective film removing mechanism. When the advancing direction end of the suction plate (20) reached the roller (1) on the rotating device, the suction plate (20) was lowered until the roller (1) was pressed by a preset pressure. When the advancing direction end of the adhesive layer contacts the surface of the roller (1), when the suction plate (20) is moved horizontally, the roller (1) also rotates accordingly, and the circuit board (2) is rotated over the entire circumference. Stuck.

回路基板（２）の寸法と、ローラーの直径とから、回路基板の側辺間の隙間を計算したところ、理論値としては０．２０ｍｍであった。   When the gap between the sides of the circuit board was calculated from the dimensions of the circuit board (2) and the diameter of the roller, the theoretical value was 0.20 mm.

その後、回路基板（２）が貼着したローラー（１）を排出し、新たなローラ（１）を回転装置（１０）の上に載置し、貼着時の圧力を表１に示したように変化させて、複数のローラーに対して回路基板を貼着した。   Then, the roller (1) to which the circuit board (2) was adhered was discharged, and a new roller (1) was placed on the rotating device (10), and the pressure at the time of adhesion was as shown in Table 1. The circuit board was attached to a plurality of rollers.

得られた立体回路基板から、貼着後の回路基板の側辺間の隙間をそれぞれの試料について測定した。その測定結果を表１に示す。   From the obtained three-dimensional circuit board, the gap between the side edges of the circuit board after pasting was measured for each sample. The measurement results are shown in Table 1.

Figure 2009147081
Figure 2009147081

（実施例２）
まず、回路基板を以下のように作製した。 (Example 2)
First, a circuit board was produced as follows.

厚さが３８μｍであるポリイミドフィルムに、厚さが８μｍであるＣｕ箔を積層した２層基板（住友金属鉱山株式会社製、Ｓ‘ｐｅｒＦｌｅｘ）を用いて、フォトレジスト方式により、銅層の表面にドライフィルムレジスト（旭化成株式会社製、ＡＱ−１１５８）を貼り、配線形状のマスクを作製した後、ドライフィルムレジスト上に露光を行い、現像、エッチング、およびドライフィルム剥離を行った。また、回路基板の裏側には、熱圧着タイプの接着剤（ニッカン工業株式会社製、ＳＡＦＷ）をラミネートして、仮接着した。   By using a two-layer substrate (S'perFlex, manufactured by Sumitomo Metal Mining Co., Ltd.) in which a Cu film having a thickness of 8 μm is laminated on a polyimide film having a thickness of 38 μm, the surface of the copper layer is formed by a photoresist method. A dry film resist (AQ-1158, manufactured by Asahi Kasei Co., Ltd.) was pasted to prepare a wiring-shaped mask, and then the dry film resist was exposed to light, and development, etching, and dry film peeling were performed. In addition, a thermocompression bonding adhesive (manufactured by Nikkan Kogyo Co., Ltd., SAFW) was laminated on the back side of the circuit board and temporarily bonded.

以上のようにして得られた回路基板を、金型により切断し、図２に示すカセット（４０）にセットした。   The circuit board obtained as described above was cut with a mold and set in a cassette (40) shown in FIG.

次に、実施例１と同様に、図１に概略図を示した立体的回路基板の形成装置を使用して貼着工程を実施した。   Next, as in Example 1, the pasting process was performed using the three-dimensional circuit board forming apparatus schematically shown in FIG.

保護フィルム除去装置の代わりに、加熱ヒータ（５０）または回転装置用加熱ヒータ（図示せず）を使用した。試料Ｎｏ．１および２では、回路基板（２）が１２０℃となるように、ヒーター温度を設定し、１０秒間、加熱ヒータ（５０）で吸着板（２０）を停止して加熱を行った。また、試料Ｎｏ．３および４では、回転装置の回転ローラを加熱し、その表面の温度を１２０℃として、当該回転ローラ上にアルミパイプ製のローラー（１）を載置して、貼着を行った。なお、対象物であるローラー（１）は実施例１と同じものを用いた。   Instead of the protective film removing device, a heater (50) or a heater for a rotating device (not shown) was used. Sample No. In 1 and 2, the heater temperature was set so that the circuit board (2) was 120 ° C., and the adsorption plate (20) was stopped with the heater (50) for 10 seconds to perform heating. Sample No. In 3 and 4, the rotating roller of the rotating device was heated, the temperature of the surface was set to 120 ° C., and the roller (1) made of aluminum pipe was placed on the rotating roller to perform the sticking. In addition, the roller (1) which is an object used the same thing as Example 1. FIG.

回路基板（２）の寸法と、ローラーの直径とから、回路基板の側辺間の隙間を計算したところ、理論値としては０．２０ｍｍであった。   When the gap between the sides of the circuit board was calculated from the dimensions of the circuit board (2) and the diameter of the roller, the theoretical value was 0.20 mm.

得られた立体回路基板から、貼着後の回路基板の側辺間の隙間をそれぞれの試料について測定した。その測定結果を表２に示す。   From the obtained three-dimensional circuit board, the gap between the side edges of the circuit board after pasting was measured for each sample. The measurement results are shown in Table 2.

Figure 2009147081
Figure 2009147081

本発明の立体的回路基板の形成装置の一実施例を示す概略図である。It is the schematic which shows one Example of the formation apparatus of the three-dimensional circuit board of this invention. 図１の基準出し機構を示す概略図である。It is the schematic which shows the reference | standard taking-out mechanism of FIG.

符号の説明Explanation of symbols

１ 対象物（ローラー）
２ 回路基板
１０ 回転機構
２０ 保持機構
３０ 制御機構
４０ 基準出し機構
４１ 固定プレート
４２ 可動プレート
５０ 加熱機構 1 Object (roller)
2 Circuit board 10 Rotating mechanism 20 Holding mechanism 30 Control mechanism 40 Reference mechanism 41 Fixed plate 42 Movable plate 50 Heating mechanism

Claims (7)

円柱形状または円筒形状である対象物を、中心軸が水平となる状態で保持し、かつ、該中心軸を回転軸にして回転させる回転機構と、回路基板を接着剤層が下向きとなるように保持し、かつ、水平に搬送する保持機構と、回転する前記対象物の表面に対して搬送される前記回路基板の接着剤層が接するように相対的位置関係を調節可能であり、かつ、前記対象物の表面に対して押圧する前記回路基板の圧力を一定に制御可能である制御機構とを有する立体的回路基板の形成装置。   A rotating mechanism that holds a cylindrical or cylindrical target object in a state where the central axis is horizontal, and rotates the central axis as a rotational axis, and a circuit board with an adhesive layer facing downward The relative positional relationship can be adjusted so that the holding mechanism that holds and horizontally conveys the adhesive layer of the circuit board that is conveyed against the surface of the rotating object, and the An apparatus for forming a three-dimensional circuit board, comprising: a control mechanism capable of controlling the pressure of the circuit board pressed against the surface of an object to be constant. 前記回路基板の接着剤層を被覆する保護フィルムを除去する除去機構をさらに有する請求項１に記載の立体的回路基板の形成装置。   The three-dimensional circuit board forming apparatus according to claim 1, further comprising a removal mechanism for removing a protective film covering the adhesive layer of the circuit board. 前記回路基板の接着剤層または前記対象物を加熱する加熱機構をさらに有する請求項１に記載の立体的回路基板の形成装置。   The three-dimensional circuit board forming apparatus according to claim 1, further comprising a heating mechanism for heating the adhesive layer of the circuit board or the object. 前記回転機構が、前記対象物が間に載せられて回転するように配置された２つの回転ローラーからなる請求項１に記載の立体的回路基板の形成装置。   The three-dimensional circuit board forming apparatus according to claim 1, wherein the rotating mechanism includes two rotating rollers arranged to rotate with the object placed therebetween. 前記回転機構に載置された前記対象物の軸方向に合わせて、前記回路基板を収容することが可能な基準出し機構をさらに有する請求項１に記載の立体的回路基板の形成装置。   The three-dimensional circuit board forming apparatus according to claim 1, further comprising a reference setting mechanism capable of accommodating the circuit board in accordance with an axial direction of the object placed on the rotating mechanism. 請求項１から５のいずれかに記載の立体的回路基板の形成装置を使用し、前記圧力を調節することにより、前記回路基板を、前記対象物の表面全周に、隙間を制御して貼着する立体的回路基板の形成方法。   The apparatus for forming a three-dimensional circuit board according to any one of claims 1 to 5 is used to adjust the pressure so that the circuit board is pasted around the entire surface of the object while controlling a gap. A method for forming a three-dimensional circuit board to be worn. 円柱形状または円筒形状である対象物を、中心軸が水平となる状態で回転可能に保持し、片面に回路を有し、他面に接着剤層が設けられた回路基板を所定の大きさに切断し、該回路基板を、基準位置に載置し、該回路基板を移動手段に吸着させ、該移動手段を移動させ、前記回路基板の接着剤層の端部を前記対象物の表面に接合し、前記回路基板を前記対象物の表面に対して押圧する圧力を制御しながら、前記回路基板を水平移動させるとともに、前記対象物を回転させることにより、前記回路基板を前記対象物の表面に貼着する立体的回路基板の形成方法。   A circuit board having a cylindrical shape or a cylindrical shape is rotatably held with the central axis being horizontal, a circuit board having a circuit on one side and an adhesive layer on the other side is sized to a predetermined size. Cut, place the circuit board at the reference position, adsorb the circuit board to the moving means, move the moving means, and bond the edge of the adhesive layer of the circuit board to the surface of the object Then, while controlling the pressure that presses the circuit board against the surface of the object, the circuit board is moved horizontally, and the object is rotated to bring the circuit board onto the surface of the object. A method for forming a three-dimensional circuit board to be attached.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009262387A (en) * 2008-04-24 2009-11-12 Sumitomo Metal Mining Co Ltd Method and apparatus for forming three-dimensional circuit board
JP2011009451A (en) * 2009-06-25 2011-01-13 Sumitomo Metal Mining Co Ltd Method of manufacturing steric circuit board
JP2011066209A (en) * 2009-09-17 2011-03-31 Sumitomo Metal Mining Co Ltd Method of manufacturing three-dimensional circuit board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109548270A (en) * 2018-11-09 2019-03-29 广东洲明节能科技有限公司 Wiring board and preparation method thereof
TW202045373A (en) * 2019-04-30 2020-12-16 日商迪睿合股份有限公司 Sliding device
CN111712067A (en) * 2020-05-21 2020-09-25 深圳崇达多层线路板有限公司 Manufacturing method and conveying device for PCB pre-positioning continuous melt riveting

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990015478A2 (en) * 1989-05-19 1990-12-13 Trove Technology, Inc. Improved three-dimensional circuit component assembly and method corresponding thereto
JP3595695B2 (en) 1998-08-31 2004-12-02 キヤノン株式会社 Method for transferring surface pattern of transfer member to fluororesin surface on cylindrical substrate
JP2002353575A (en) 2001-05-23 2002-12-06 Nitto Denko Corp Composite tubular body and manufacturing method therefor
JP4092113B2 (en) * 2002-02-28 2008-05-28 大和製罐株式会社 Method and apparatus for attaching film to can
US7262489B2 (en) * 2003-11-12 2007-08-28 Polymatech Co., Ltd. Three-dimensionally formed circuit sheet, component and method for manufacturing the same
JP2005235803A (en) * 2004-02-17 2005-09-02 Kunio Oe Component supply device and component supply method
JP4371860B2 (en) * 2004-03-09 2009-11-25 新日鐵化学株式会社 Manufacturing method of substrate for flexible printed wiring board
JP4428449B2 (en) * 2008-01-15 2010-03-10 住友金属鉱山株式会社 Three-dimensional circuit board forming apparatus and forming method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009262387A (en) * 2008-04-24 2009-11-12 Sumitomo Metal Mining Co Ltd Method and apparatus for forming three-dimensional circuit board
JP2011009451A (en) * 2009-06-25 2011-01-13 Sumitomo Metal Mining Co Ltd Method of manufacturing steric circuit board
JP2011066209A (en) * 2009-09-17 2011-03-31 Sumitomo Metal Mining Co Ltd Method of manufacturing three-dimensional circuit board

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