JP2010287902A - 異なる保持エンドエフェクタを有する基板搬送装置 - Google Patents
異なる保持エンドエフェクタを有する基板搬送装置 Download PDFInfo
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- JP2010287902A JP2010287902A JP2010166098A JP2010166098A JP2010287902A JP 2010287902 A JP2010287902 A JP 2010287902A JP 2010166098 A JP2010166098 A JP 2010166098A JP 2010166098 A JP2010166098 A JP 2010166098A JP 2010287902 A JP2010287902 A JP 2010287902A
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- 239000000758 substrate Substances 0.000 title claims abstract description 194
- 239000012636 effector Substances 0.000 title claims abstract description 80
- 238000012546 transfer Methods 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 7
- 239000000872 buffer Substances 0.000 claims description 33
- 230000007723 transport mechanism Effects 0.000 claims description 17
- 230000032258 transport Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 29
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 239000002775 capsule Substances 0.000 description 17
- 238000012545 processing Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
【解決手段】半導体基板を第1位置から第2位置に移す装置。該第1及び第2位置は個別的な支持領域において複数の該半導体を保持するようになされている。その装置は、個別的に支える半導体の異なった最大数の支持領域をおのおのが有する2つの基板保持エンドエフェクタ46,48を有する搬送機構を含む。該半導体は該第1位置から該第2位置へと該第1エンドエフェクタ46によって搬送され、該第2位置又は該第1位置における空の個別的支持領域が該第1エンドエフェクタ46上の支持領域の該最大数よりも小さいときは、該第1位置から該第2位置へと該第2エンドエフェクタ48を用いて基板を搬送する。
【選択図】図3
Description
11 基板処理部
13 基板搭載部
20 フレーム
32 基板搬送ロボット
B1,B2,B3,B4 バッファカセット
34 カセット
56 制御部
Claims (10)
- 基板搬送機構であって、
第1のアーム部、前記第1のアーム部に枢動自在に接続された第2のアーム部、及び前記第2のアーム部に接続された枢動部を有するスカラアームと、
前記枢動部に設けられて第1の最大数の基板を個別的に支持可能な第1数の支持領域を有する第1のエンドエフェクタと、
前記枢動部に設けられて前記第1の最大数より少ない第2の最大数の基板を個別に支持可能な第2数の支持領域を有する第1のエンドエフェクタと、を有し、
前記第1のエンドエフェクタと前記第2のエンドエフェクタとが枢動部で互いに接続され、前記枢動部が、前記第1のアーム部及び前記第2のアーム部の互いに対する相対的な移動に基づいて前記第1のエンドエフェクタ及び前記第2のエンドエフェクタを回転させることを特徴とする基板搬送機構。 - 請求項1に記載の基板搬送機構であって、前記基板搬送機構は、基板を第1の位置と第2の位置との間で搬送可能であり、前記第1のエンドエフェクタ及び前記第2のエンドエフェクタは、前記第1の位置の基板の数が前記第1のエンドエフェクタ上にある前記第1数の支持領域よりも少ない場合において、前記第1の位置から前記第2の位置までの基板搬送が前記第2のエンドエフェクタを使用するように構成されていることを特徴とする基板搬送機構。
- 請求項1に記載の基板搬送機構であって、前記第2のエンドエフェクタの前記基板支持領域の第2数が1であることを特徴とする基板搬送機構。
- 請求項1に記載の基板搬送機構であって、前記第1のエンドエフェクタの前記基板支持領域の第1数が6であることを特徴とする基板搬送機構。
- 第1の最大数の基板を個別的に支持可能な第1数の基板支持領域を有する第1のエンドエフェクタを備えた第1のスカラアームと、
第1数より少ない第2の最大数の基板を個別に支持可能な第2数の基板支持領域を有する第2のエンドエフェクタを備えた第2のスカラアームと、を有し、前記エンドエフェクタの少なくとも1つを用いて第1の位置の第1の基板カセットから第2の位置まで基板を搬送する基板搬送機構であって、
前記第1のスカラアーム及び前記第2のスカラアームは、前記第1の基板カセット内の基板の数が前記第1のエンドエフェクタの支持領域の数よりも少ない場合及び前記第2の位置内の空の個別の支持領域が前記第1のエンドエフェクタの支持領域の第1数よりも少ない場合に、前記第2のエンドエフェクタが使用されるように構成されていることを特徴とする基板搬送機構。 - 請求項6に記載の基板搬送機構であって、前記第2の位置が基板バッファであることを特徴とする基板搬送機構。
- 請求項6に記載の基板搬送機構であって、前記第2の位置がロードロックであることを特徴とする基板搬送機構。
- 請求項6に記載の基板搬送機構であって、前記第2のエンドエフェクタの基板支持領域の第2数が1であることを特徴とする基板搬送機構。
- 請求項6に記載の基板搬送機構であって、前記第1のエンドエフェクタの基板支持領域の第1数が6であることを特徴とする基板搬送機構。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/044,820 | 1998-03-20 | ||
US09/044,820 US6481956B1 (en) | 1995-10-27 | 1998-03-20 | Method of transferring substrates with two different substrate holding end effectors |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000537681A Division JP2002507846A (ja) | 1998-03-20 | 1999-02-17 | 異なる保持エンドエフェクタによる基板搬送方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016065678A Division JP6179910B2 (ja) | 1998-03-20 | 2016-03-29 | 異なる保持エンドエフェクタを有する基板搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010287902A true JP2010287902A (ja) | 2010-12-24 |
JP6123104B2 JP6123104B2 (ja) | 2017-05-10 |
Family
ID=21934515
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000537681A Pending JP2002507846A (ja) | 1998-03-20 | 1999-02-17 | 異なる保持エンドエフェクタによる基板搬送方法 |
JP2010166098A Expired - Lifetime JP6123104B2 (ja) | 1998-03-20 | 2010-07-23 | 異なる保持エンドエフェクタを有する基板搬送装置 |
JP2016065678A Expired - Lifetime JP6179910B2 (ja) | 1998-03-20 | 2016-03-29 | 異なる保持エンドエフェクタを有する基板搬送装置 |
Family Applications Before (1)
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JP2000537681A Pending JP2002507846A (ja) | 1998-03-20 | 1999-02-17 | 異なる保持エンドエフェクタによる基板搬送方法 |
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JP2016065678A Expired - Lifetime JP6179910B2 (ja) | 1998-03-20 | 2016-03-29 | 異なる保持エンドエフェクタを有する基板搬送装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6481956B1 (ja) |
EP (1) | EP1094921B1 (ja) |
JP (3) | JP2002507846A (ja) |
KR (1) | KR20010042075A (ja) |
AU (1) | AU3295799A (ja) |
TW (1) | TW575677B (ja) |
WO (1) | WO1999048652A1 (ja) |
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- 1999-02-17 AU AU32957/99A patent/AU3295799A/en not_active Abandoned
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- 1999-02-17 KR KR1020007010427A patent/KR20010042075A/ko not_active Application Discontinuation
- 1999-02-17 EP EP99942580A patent/EP1094921B1/en not_active Expired - Lifetime
- 1999-02-24 TW TW88102703A patent/TW575677B/zh active
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Also Published As
Publication number | Publication date |
---|---|
EP1094921B1 (en) | 2012-04-11 |
WO1999048652A1 (en) | 1999-09-30 |
JP6123104B2 (ja) | 2017-05-10 |
JP2016154248A (ja) | 2016-08-25 |
EP1094921A1 (en) | 2001-05-02 |
TW575677B (en) | 2004-02-11 |
KR20010042075A (ko) | 2001-05-25 |
EP1094921A4 (en) | 2007-11-07 |
AU3295799A (en) | 1999-10-18 |
US6481956B1 (en) | 2002-11-19 |
JP2002507846A (ja) | 2002-03-12 |
JP6179910B2 (ja) | 2017-08-16 |
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