KR100382245B1 - Asher equipment for semiconductor device manufacturing including cluster method - Google Patents

Asher equipment for semiconductor device manufacturing including cluster method Download PDF

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Publication number
KR100382245B1
KR100382245B1 KR1020020078996A KR20020078996A KR100382245B1 KR 100382245 B1 KR100382245 B1 KR 100382245B1 KR 1020020078996 A KR1020020078996 A KR 1020020078996A KR 20020078996 A KR20020078996 A KR 20020078996A KR 100382245 B1 KR100382245 B1 KR 100382245B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
device manufacturing
wafer
transfer module
cluster method
Prior art date
Application number
KR1020020078996A
Other languages
Korean (ko)
Inventor
Kyoung Soo Park
Original Assignee
Psk Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk Inc filed Critical Psk Inc
Priority to KR1020020078996A priority Critical patent/KR100382245B1/en
Priority to CNB038186101A priority patent/CN100350568C/en
Priority to AU2003206246A priority patent/AU2003206246A1/en
Priority to PCT/KR2003/000283 priority patent/WO2004053969A1/en
Priority to JP2004558499A priority patent/JP2006502591A/en
Priority to TW92103457A priority patent/TWI240349B/en
Priority to SG200301143A priority patent/SG127690A1/en
Application granted granted Critical
Publication of KR100382245B1 publication Critical patent/KR100382245B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: Asher equipment for semiconductor device manufacturing including a cluster method is provided to be capable of improving the maintenance of each wafer by installing an alignment and OCR(Optical Character Recognition) unit at a buffer stage for carrying out an OCR process when the wafer is located at the buffer stage. CONSTITUTION: A semiconductor device manufacturing asher equipment is provided with a transfer module and a process chamber. At this time, the transfer module includes a wafer transfer robot capable of simultaneously transferring a pair of wafers. The semiconductor device manufacturing asher equipment further includes a buffer stage(210) installed between the transfer module and the process chamber for carrying out an alignment and OCR process at the wafer transferred from the transfer module in a waiting state.
KR1020020078996A 2002-12-12 2002-12-12 Asher equipment for semiconductor device manufacturing including cluster method KR100382245B1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020020078996A KR100382245B1 (en) 2002-12-12 2002-12-12 Asher equipment for semiconductor device manufacturing including cluster method
CNB038186101A CN100350568C (en) 2002-12-12 2003-02-10 Cluster type asher equipment used for manufacture of semiconductor device
AU2003206246A AU2003206246A1 (en) 2002-12-12 2003-02-10 Cluster type asher equipment used for manufacture of semiconductor device
PCT/KR2003/000283 WO2004053969A1 (en) 2002-12-12 2003-02-10 Cluster type asher equipment used for manufacture of semiconductor device
JP2004558499A JP2006502591A (en) 2002-12-12 2003-02-10 Asher equipment for semiconductor device manufacturing including cluster system
TW92103457A TWI240349B (en) 2002-12-12 2003-02-19 Cluster type asher equipment used for manufacture of semiconductor device
SG200301143A SG127690A1 (en) 2002-12-12 2003-03-05 Cluster type asher equipment used for manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020020078996A KR100382245B1 (en) 2002-12-12 2002-12-12 Asher equipment for semiconductor device manufacturing including cluster method

Publications (1)

Publication Number Publication Date
KR100382245B1 true KR100382245B1 (en) 2003-05-01

Family

ID=32501370

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020078996A KR100382245B1 (en) 2002-12-12 2002-12-12 Asher equipment for semiconductor device manufacturing including cluster method

Country Status (7)

Country Link
JP (1) JP2006502591A (en)
KR (1) KR100382245B1 (en)
CN (1) CN100350568C (en)
AU (1) AU2003206246A1 (en)
SG (1) SG127690A1 (en)
TW (1) TWI240349B (en)
WO (1) WO2004053969A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100896472B1 (en) * 2007-02-28 2009-05-14 세메스 주식회사 Multi-chamber system for manufacturing semiconductor device and method for treating substrate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004036803A1 (en) 2004-07-29 2006-03-23 Robert Bosch Gmbh Method for etching a layer on a substrate
KR101330225B1 (en) * 2012-05-25 2013-11-18 피에스케이 주식회사 Method for bonding of substrate and substrate reflow treatment apparatus
CN113097047B (en) * 2021-03-10 2022-04-22 长江存储科技有限责任公司 Ashing apparatus and ashing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3136615B2 (en) * 1991-01-10 2001-02-19 ソニー株式会社 Multi-chamber process apparatus and semiconductor device manufacturing method
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
US6481956B1 (en) * 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
JP3454034B2 (en) * 1996-09-13 2003-10-06 株式会社日立製作所 Vacuum processing equipment
US6478532B1 (en) * 1999-11-30 2002-11-12 Asyst Technologies, Inc. Wafer orienting and reading mechanism
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100896472B1 (en) * 2007-02-28 2009-05-14 세메스 주식회사 Multi-chamber system for manufacturing semiconductor device and method for treating substrate

Also Published As

Publication number Publication date
TWI240349B (en) 2005-09-21
CN100350568C (en) 2007-11-21
WO2004053969A1 (en) 2004-06-24
TW200410354A (en) 2004-06-16
JP2006502591A (en) 2006-01-19
SG127690A1 (en) 2006-12-29
AU2003206246A1 (en) 2004-06-30
CN1675748A (en) 2005-09-28

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