JP2010232415A - 基板熱処理装置 - Google Patents
基板熱処理装置 Download PDFInfo
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- JP2010232415A JP2010232415A JP2009078160A JP2009078160A JP2010232415A JP 2010232415 A JP2010232415 A JP 2010232415A JP 2009078160 A JP2009078160 A JP 2009078160A JP 2009078160 A JP2009078160 A JP 2009078160A JP 2010232415 A JP2010232415 A JP 2010232415A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】半導体ウエハWを載置して熱処理する熱板70と、この熱板70のウエハ載置面に形成され、ウエハを吸引するための複数の吸引口76と、この各吸引口76と吸引手段とを接続する吸引管78と、を具備する基板熱処理装置において、吸引管78の一端に、断熱性及び可撓性を有する合成ゴム製の接続部材77を装着し、この接続部材77を、熱板70の下面の吸引部に密接して、吸引口76と吸引管78を気密状態に連通する。
【選択図】 図6
Description
70 熱板(熱処理板)
73 ヒータ
76 吸引口
77,77A 接続部材
77a 蛇腹部
77b 先端開口部
77c 密接片
77d 屈曲波形部
77d1 先端屈曲波形部
77d2 先端屈曲波形部以外の屈曲波形部
78 吸引管
78b 吸引ベース部材
78c 流路
78d 連通口
79 真空ポンプ(吸引手段)
Claims (6)
- 基板を載置して熱処理する熱処理板と、この熱処理板の基板載置面に形成され、基板を吸引するための複数の吸引口と、この各吸引口と吸引手段とを接続する吸引管と、を具備する基板熱処理装置において、
上記吸引管の一端に、断熱性及び可撓性を有する合成ゴム製の接続部材を装着し、この接続部材を、上記熱処理板の下面の吸引部に密接して、上記吸引口と吸引管を連通してなる、
ことを特徴とする基板熱処理装置。 - 請求項1記載の基板熱処理装置において、
上記接続部材の少なくとも先端部が蛇腹状に形成されている、ことを特徴とする基板熱処理装置。 - 請求項1又は2記載の基板熱処理装置において、
上記接続部材の先端に、外方に向かって拡開テーパ状の密接片が形成され、この密接片の裏面中間部に屈曲波形部が連結されると共に、この屈曲波形部の上記密接片に連結する先端波形部の肉厚を先端波形部以外の波形部の肉厚より薄く形成してなる、ことを特徴とする基板熱処理装置。 - 請求項1ないし3のいずれかに記載の基板熱処理装置において、
上記吸引管内における上記吸引口側に、下方に向かって狭小テーパ状に形成される復元可能な可撓性を有する逆流抑制部材を配設し、上記吸引手段の吸引時の負圧により上記逆流抑制部材の開口部が拡径し、上記吸引手段の吸引停止時には開口部が復元して縮径可能に形成してなる、ことを特徴とする基板熱処理装置。 - 請求項1ないし4のいずれかに記載の基板熱処理装置において、
上記吸引管内の先端側に、吸引管内を流れる気体中に含まれるパーティクルを捕集する網目状のフィルタを嵌挿してなる、ことを特徴とする基板熱処理装置。 - 請求項1ないし5のいずれかに記載の基板熱処理装置において、
上記吸引管を直状の管部材にて形成し、かつ、各吸引管の下端を吸引ベース部材に連結すると共に、各吸引管を上記吸引ベース部材に設けられた流路に連通し、上記吸引ベース部材に設けられる上記流路に連通する連通口を上記吸引手段に接続してなる、ことを特徴とする基板熱処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009078160A JP4811882B2 (ja) | 2009-03-27 | 2009-03-27 | 基板熱処理装置 |
KR20090125380A KR101486598B1 (ko) | 2009-03-27 | 2009-12-16 | 기판 열처리 장치 |
Applications Claiming Priority (1)
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JP2009078160A JP4811882B2 (ja) | 2009-03-27 | 2009-03-27 | 基板熱処理装置 |
Publications (2)
Publication Number | Publication Date |
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JP2010232415A true JP2010232415A (ja) | 2010-10-14 |
JP4811882B2 JP4811882B2 (ja) | 2011-11-09 |
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JP2009078160A Active JP4811882B2 (ja) | 2009-03-27 | 2009-03-27 | 基板熱処理装置 |
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JP (1) | JP4811882B2 (ja) |
KR (1) | KR101486598B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013048144A (ja) * | 2011-08-29 | 2013-03-07 | Tokyo Electron Ltd | 基板熱処理装置 |
JP2021009923A (ja) * | 2019-07-01 | 2021-01-28 | 東京エレクトロン株式会社 | 加熱処理装置及び加熱処理方法 |
JP7441665B2 (ja) | 2020-02-10 | 2024-03-01 | 株式会社Screenホールディングス | 基板処理装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485918A (ja) * | 1990-07-30 | 1992-03-18 | Canon Inc | X線露光装置用ウエハ冷却装置 |
JPH1086086A (ja) * | 1996-09-12 | 1998-04-07 | Olympus Optical Co Ltd | 基板吸着部材および装置 |
JP2001267271A (ja) * | 2000-03-22 | 2001-09-28 | Yoshioka Seiko:Kk | 吸着装置 |
JP2003245886A (ja) * | 2002-02-22 | 2003-09-02 | Orc Mfg Co Ltd | 吸着機構 |
JP2004171845A (ja) * | 2002-11-18 | 2004-06-17 | Seiko Epson Corp | ワーク搬送装置及びこれを備えるワーク処理装置 |
JP2006173344A (ja) * | 2004-12-15 | 2006-06-29 | Seiko Epson Corp | 基板保持装置及び基板保持方法並びに基板加熱装置 |
JP2008235472A (ja) * | 2007-03-19 | 2008-10-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
WO2009028279A1 (ja) * | 2007-08-24 | 2009-03-05 | Sintokogio, Ltd. | エア浮上搬送装置の空気吹出し構造体及び空気吹出しユニット、ならびにそれを含むエア浮上搬送装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3216045B2 (ja) * | 1997-09-10 | 2001-10-09 | 沖電気工業株式会社 | 通帳取扱装置 |
JP4781901B2 (ja) * | 2006-05-08 | 2011-09-28 | 東京エレクトロン株式会社 | 熱処理方法,プログラム及び熱処理装置 |
-
2009
- 2009-03-27 JP JP2009078160A patent/JP4811882B2/ja active Active
- 2009-12-16 KR KR20090125380A patent/KR101486598B1/ko active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485918A (ja) * | 1990-07-30 | 1992-03-18 | Canon Inc | X線露光装置用ウエハ冷却装置 |
JPH1086086A (ja) * | 1996-09-12 | 1998-04-07 | Olympus Optical Co Ltd | 基板吸着部材および装置 |
JP2001267271A (ja) * | 2000-03-22 | 2001-09-28 | Yoshioka Seiko:Kk | 吸着装置 |
JP2003245886A (ja) * | 2002-02-22 | 2003-09-02 | Orc Mfg Co Ltd | 吸着機構 |
JP2004171845A (ja) * | 2002-11-18 | 2004-06-17 | Seiko Epson Corp | ワーク搬送装置及びこれを備えるワーク処理装置 |
JP2006173344A (ja) * | 2004-12-15 | 2006-06-29 | Seiko Epson Corp | 基板保持装置及び基板保持方法並びに基板加熱装置 |
JP2008235472A (ja) * | 2007-03-19 | 2008-10-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
WO2009028279A1 (ja) * | 2007-08-24 | 2009-03-05 | Sintokogio, Ltd. | エア浮上搬送装置の空気吹出し構造体及び空気吹出しユニット、ならびにそれを含むエア浮上搬送装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013048144A (ja) * | 2011-08-29 | 2013-03-07 | Tokyo Electron Ltd | 基板熱処理装置 |
US9463938B2 (en) | 2011-08-29 | 2016-10-11 | Tokyo Electron Limited | Substrate heat treatment device |
JP2021009923A (ja) * | 2019-07-01 | 2021-01-28 | 東京エレクトロン株式会社 | 加熱処理装置及び加熱処理方法 |
JP7261675B2 (ja) | 2019-07-01 | 2023-04-20 | 東京エレクトロン株式会社 | 加熱処理装置及び加熱処理方法 |
JP7441665B2 (ja) | 2020-02-10 | 2024-03-01 | 株式会社Screenホールディングス | 基板処理装置 |
Also Published As
Publication number | Publication date |
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KR101486598B1 (ko) | 2015-01-26 |
KR20100108185A (ko) | 2010-10-06 |
JP4811882B2 (ja) | 2011-11-09 |
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