JP4811882B2 - 基板熱処理装置 - Google Patents
基板熱処理装置 Download PDFInfo
- Publication number
- JP4811882B2 JP4811882B2 JP2009078160A JP2009078160A JP4811882B2 JP 4811882 B2 JP4811882 B2 JP 4811882B2 JP 2009078160 A JP2009078160 A JP 2009078160A JP 2009078160 A JP2009078160 A JP 2009078160A JP 4811882 B2 JP4811882 B2 JP 4811882B2
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- Japan
- Prior art keywords
- suction
- heat treatment
- substrate
- wafer
- treatment apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
70 熱板(熱処理板)
73 ヒータ
76 吸引口
77,77A 接続部材
77a 蛇腹部
77b 先端開口部
77c 密接片
77d 屈曲波形部
77d1 先端屈曲波形部
77d2 先端屈曲波形部以外の屈曲波形部
78 吸引管
78b 吸引ベース部材
78c 流路
78d 連通口
79 真空ポンプ(吸引手段)
Claims (4)
- 基板を載置して熱処理する熱処理板と、この熱処理板の基板載置面から裏面の厚さ方向に貫通して形成されて、上記熱板を加熱するヒータと干渉しない位置に設けられ、基板を吸引するために同心円状に設けられた複数の吸引口と、この各吸引口と吸引手段とを夫々に接続する複数の吸引管と、を具備する基板熱処理装置において、
上記吸引管の一端に、上記吸引口の熱処理板下面の吸引部に密接させる断熱性及び可撓性を有する合成ゴム製の先端が蛇腹状に形成された接続部材と、
上記複数の吸引管の他端と接続し、上記吸引管と連通する流路が設けられ、リング状に構成され一括して吸引するための吸引ベース部材と、
上記吸引ベース部材に設けられる上記流路に連通する連通口と連通する上記吸引手段と、
上記熱処理板に貫通した貫通孔を有し上下に昇降自在に構成され上記熱処理板に基板を載置させるときに基板裏面を支持する複数の支持ピンと、
上記支持ピンを上下動させる昇降駆動機構と、
上記吸引ベース部材のリング状の内方空間に設けられる上記支持ピンを保持する保持部材と、
を備えることを特徴とする基板熱処理装置。 - 請求項1記載の基板熱処理装置において、
上記接続部材の先端に、外方に向かって拡開テーパ状の密接片が形成され、この密接片の裏面中間部に屈曲波形部が連結されると共に、この屈曲波形部の上記密接片に連結する先端波形部の肉厚を先端波形部以外の波形部の肉厚より薄く形成してなる、ことを特徴とする基板熱処理装置。 - 請求項1又は2記載の基板熱処理装置において、
上記吸引管内における上記吸引口側に、下方に向かって狭小テーパ状に形成される復元可能な可撓性を有する逆流抑制部材を配設し、上記吸引手段の吸引時の負圧により上記逆流抑制部材の開口部が拡径し、上記吸引手段の吸引停止時には開口部が復元して縮径可能に形成してなる、ことを特徴とする基板熱処理装置。 - 請求項1ないし3のいずれかに記載の基板熱処理装置において、
上記吸引管内の先端側に、吸引管内を流れる気体中に含まれるパーティクルを捕集する網目状のフィルタを嵌挿してなる、ことを特徴とする基板熱処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009078160A JP4811882B2 (ja) | 2009-03-27 | 2009-03-27 | 基板熱処理装置 |
KR20090125380A KR101486598B1 (ko) | 2009-03-27 | 2009-12-16 | 기판 열처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009078160A JP4811882B2 (ja) | 2009-03-27 | 2009-03-27 | 基板熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010232415A JP2010232415A (ja) | 2010-10-14 |
JP4811882B2 true JP4811882B2 (ja) | 2011-11-09 |
Family
ID=43047967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009078160A Active JP4811882B2 (ja) | 2009-03-27 | 2009-03-27 | 基板熱処理装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4811882B2 (ja) |
KR (1) | KR101486598B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5611152B2 (ja) * | 2011-08-29 | 2014-10-22 | 東京エレクトロン株式会社 | 基板熱処理装置 |
JP7261675B2 (ja) * | 2019-07-01 | 2023-04-20 | 東京エレクトロン株式会社 | 加熱処理装置及び加熱処理方法 |
JP7441665B2 (ja) | 2020-02-10 | 2024-03-01 | 株式会社Screenホールディングス | 基板処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2928603B2 (ja) * | 1990-07-30 | 1999-08-03 | キヤノン株式会社 | X線露光装置用ウエハ冷却装置 |
JP3782523B2 (ja) * | 1996-09-12 | 2006-06-07 | オリンパス株式会社 | 基板吸着部材および装置 |
JP3216045B2 (ja) * | 1997-09-10 | 2001-10-09 | 沖電気工業株式会社 | 通帳取扱装置 |
JP2001267271A (ja) * | 2000-03-22 | 2001-09-28 | Yoshioka Seiko:Kk | 吸着装置 |
JP2003245886A (ja) * | 2002-02-22 | 2003-09-02 | Orc Mfg Co Ltd | 吸着機構 |
JP2004171845A (ja) * | 2002-11-18 | 2004-06-17 | Seiko Epson Corp | ワーク搬送装置及びこれを備えるワーク処理装置 |
JP4600655B2 (ja) * | 2004-12-15 | 2010-12-15 | セイコーエプソン株式会社 | 基板保持方法 |
JP4781901B2 (ja) * | 2006-05-08 | 2011-09-28 | 東京エレクトロン株式会社 | 熱処理方法,プログラム及び熱処理装置 |
JP2008235472A (ja) * | 2007-03-19 | 2008-10-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
WO2009028279A1 (ja) * | 2007-08-24 | 2009-03-05 | Sintokogio, Ltd. | エア浮上搬送装置の空気吹出し構造体及び空気吹出しユニット、ならびにそれを含むエア浮上搬送装置 |
-
2009
- 2009-03-27 JP JP2009078160A patent/JP4811882B2/ja active Active
- 2009-12-16 KR KR20090125380A patent/KR101486598B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20100108185A (ko) | 2010-10-06 |
KR101486598B1 (ko) | 2015-01-26 |
JP2010232415A (ja) | 2010-10-14 |
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