JP2010023493A - 液体吐出ヘッド用基板の製造方法及び基板の加工方法 - Google Patents
液体吐出ヘッド用基板の製造方法及び基板の加工方法 Download PDFInfo
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- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
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- B23K26/36—Removing material
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- B23K26/382—Removing material by boring or cutting by boring
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
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- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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Abstract
【解決手段】液体吐出ヘッド用基板の加工方法であって、前記基板を提供し、前記裏面に対して液体を線状に吐出し、該液体に沿って該液体内を通過したレーザー光により前記裏面を加工することにより、前記裏面に凹部を設ける。
【選択図】図1
Description
(a)シリコン基板の表面のインク供給口形成部位に、基板材料に対して選択的にエッチングが可能な犠牲層を形成する工程。
(b)シリコン基板上に犠牲層を被覆するように耐エッチング性を有するパッシベイション層を形成する工程。
(c)犠牲層に対応した開口部を有するエッチングマスク層をシリコン基板の裏面に形成する工程。
(d)エッチングマスク層の開口部から犠牲層が露出するまでシリコン基板を結晶軸異方性エッチングでエッチングする工程。
(e)シリコン基板のエッチング工程によって露出させた部分から犠牲層をエッチングして除去する工程。
(f)パッシベイション層の一部を除去してインク供給口を形成する工程。
3 金属層、マスク層
5 凹部
6 供給口、インク供給口
51 レーザー光
Claims (11)
- 液体を吐出するために利用されるエネルギーを発生するエネルギー発生素子が一方の面に設けられた基板と、該基板の前記一方の面と該一方の面の裏面とを貫通して設けられる液体の供給口とを含む液体吐出ヘッド用基板の製造方法であって、
前記基板を提供し、
前記裏面に対して液体を線状に吐出し、該液体に沿って該液体内を通過したレーザー光により前記裏面を加工することにより、前記裏面に凹部を設け、
前記凹部が設けられた前記裏面から前記基板に対してエッチングを行うことにより、前記供給口を形成する、液体吐出ヘッド用基板の製造方法。 - 請求項1記載の液体吐出ヘッド用基板の製造方法であって、前記裏面に開口を有する金属層が設けられた前記基板を提供し、前記開口の内部を通じて前記裏面に対して前記レーザー光により加工を行う、液体吐出ヘッド用基板の製造方法。
- 請求項1記載の液体吐出ヘッド用基板の製造方法であって、前記エッチングはウェットエッチングである、液体吐出ヘッド用基板の製造方法。
- 請求項1記載の液体吐出ヘッド用基板の製造方法であって、前記レーザー光はパルスレーザー光であり、前記裏面に対して複数回レーザー光を照射する、液体吐出ヘッド用基板の製造方法。
- 請求項1記載の液体吐出ヘッド用基板の製造方法であって、前記一方の面の結晶面方位が(100)である、液体吐出ヘッド用基板の製造方法。
- 請求項2記載の液体吐出ヘッド用基板の製造方法であって、前記金属層が金を含み、前記レーザー光はYAGレーザーの光である、液体吐出ヘッド用基板の製造方法。
- 液体を吐出するために利用されるエネルギーを発生するエネルギー発生素子が一方の面に設けられた基板と、該基板の前記一方の面と該一方の面の裏面とを貫通して設けられる液体の供給口とを含む液体吐出ヘッド用基板の製造方法であって、
前記基板を提供し、
前記供給口を形成するために、前記裏面に対して液体を線状に吐出し、線状の液体に沿って液体内を通過したパルスレーザー光を前記裏面に複数回照射することにより加工を行い、前記裏面から表面にかけて前記一方の面に平行な断面積が大きくなり、前記断面積が最大となった位置から前記一方の面に向い前記断面積が減少する形状の凹部を設ける、液体吐出ヘッド用基板の製造方法。 - 請求項7記載の液体吐出ヘッド用基板の製造方法であって、前記凹部を前記裏面に複数設け、前記凹部が設けられた前記裏面から前記基板に対してエッチングを行うことにより、前記基板の、複数の前記凹部の間に位置する前記凹部の壁を構成する部分を除去する、液体吐出ヘッド用基板の製造方法。
- 請求項7記載の液体吐出ヘッド用基板の製造方法であって、前記裏面に開口を有する金属層が設けられた前記基板を提供し、前記開口の内部を通じて前記裏面に対して、前記レーザー光により加工を行う、液体吐出ヘッド用基板の製造方法。
- 請求項7記載の液体吐出ヘッド用基板の製造方法であって、前記金属層が金を含み、前記レーザー光はYAGレーザーの光である、液体吐出ヘッド用基板の製造方法。
- 基板の加工方法であって、
基板を提供し、
前記基板の一方の面に対して液体を線状に吐出し、線状の液体に沿って液体内を通過したパルスレーザー光を複数回照射することにより加工を行い、前記一方の面から前記一方の面の裏面にかけて、前記一方の面に平行な断面積が大きくなり、前記断面積が最大となった位置から前記一方の面に向い前記断面積が減少する形状の凹部を設ける、基板の加工方法。
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KR (1) | KR101343155B1 (ja) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013135163A (ja) * | 2011-12-27 | 2013-07-08 | Ricoh Co Ltd | 電気機械変換素子及びその製造方法、液滴吐出ヘッド、及びインクジェット記録装置 |
JP2014172202A (ja) * | 2013-03-06 | 2014-09-22 | Canon Inc | 液体吐出ヘッドの製造方法 |
JP2017007311A (ja) * | 2015-06-26 | 2017-01-12 | キヤノン株式会社 | シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6095320B2 (ja) | 2011-12-02 | 2017-03-15 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
JP5925064B2 (ja) * | 2012-06-20 | 2016-05-25 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
Citations (4)
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JP2004122173A (ja) * | 2002-10-02 | 2004-04-22 | Nippon Sharyo Seizo Kaisha Ltd | レーザマイクロジェット加工装置 |
JP2005169603A (ja) * | 2003-12-15 | 2005-06-30 | Canon Inc | 梁、梁の製造方法、梁を備えたインクジェット記録ヘッド、および該インクジェット記録ヘッドの製造方法 |
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JP2017007311A (ja) * | 2015-06-26 | 2017-01-12 | キヤノン株式会社 | シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法 |
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EP2303580A1 (en) | 2011-04-06 |
KR101343155B1 (ko) | 2013-12-19 |
CN102066114B (zh) | 2014-03-26 |
RU2011101719A (ru) | 2012-07-27 |
CN102066114A (zh) | 2011-05-18 |
US8549750B2 (en) | 2013-10-08 |
EP2303580B1 (en) | 2017-09-13 |
JP5448581B2 (ja) | 2014-03-19 |
RU2466027C2 (ru) | 2012-11-10 |
US20110041337A1 (en) | 2011-02-24 |
WO2009153987A1 (en) | 2009-12-23 |
EP2303580A4 (en) | 2011-05-25 |
KR20110018430A (ko) | 2011-02-23 |
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