JP2009170493A - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP2009170493A JP2009170493A JP2008004124A JP2008004124A JP2009170493A JP 2009170493 A JP2009170493 A JP 2009170493A JP 2008004124 A JP2008004124 A JP 2008004124A JP 2008004124 A JP2008004124 A JP 2008004124A JP 2009170493 A JP2009170493 A JP 2009170493A
- Authority
- JP
- Japan
- Prior art keywords
- transfer member
- heat transfer
- wiring board
- heat
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】発熱部品が実装される部分に伝熱部材16が圧入される配線基板1に於いて、前記伝熱部材が嵌合される伝熱部材嵌込み孔15の圧入側周縁に大径部18が形成され、前記伝熱部材に、該伝熱部材圧入状態で前記大径部に係合するフランジ部17を形成した。
【選択図】図1
Description
2 発熱部品
3 ソース端子
6 ヒートシンク
7,8 ハンダ
9 ランド
15 伝熱部材嵌込み孔
16 伝熱部材
17 フランジ部
18 大径部
21 導通孔
Claims (1)
- 発熱部品が実装される部分に伝熱部材が圧入される配線基板に於いて、前記伝熱部材が嵌合される伝熱部材嵌込み孔の圧入側周縁に大径部が形成され、前記伝熱部材に、該伝熱部材圧入状態で前記大径部に係合するフランジ部を形成したことを特徴とする配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008004124A JP4988609B2 (ja) | 2008-01-11 | 2008-01-11 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008004124A JP4988609B2 (ja) | 2008-01-11 | 2008-01-11 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009170493A true JP2009170493A (ja) | 2009-07-30 |
JP4988609B2 JP4988609B2 (ja) | 2012-08-01 |
Family
ID=40971381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008004124A Active JP4988609B2 (ja) | 2008-01-11 | 2008-01-11 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4988609B2 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012134255A (ja) * | 2010-12-20 | 2012-07-12 | Toshiba Corp | 放熱構造 |
CN102917535A (zh) * | 2012-11-16 | 2013-02-06 | 东莞生益电子有限公司 | 导热金属芯及用该导热金属芯的pcb板 |
JP2013169128A (ja) * | 2012-02-17 | 2013-08-29 | Mitsubishi Heavy Ind Ltd | インバータ装置、一体型電動圧縮機 |
JP2015018857A (ja) * | 2013-07-09 | 2015-01-29 | 三菱電機株式会社 | 高放熱基板、部品の放熱構造 |
DE102015200031A1 (de) | 2014-01-10 | 2015-07-16 | Denso Corporation | Platine und elektronische vorrichtung |
JP2017005093A (ja) * | 2015-06-10 | 2017-01-05 | 日本電気株式会社 | 基板放熱構造およびその組み立て方法 |
JP2017063070A (ja) * | 2015-09-24 | 2017-03-30 | アイシン精機株式会社 | 配線基板 |
JPWO2017086095A1 (ja) * | 2015-11-17 | 2018-07-05 | 株式会社村田製作所 | 多層基板及び電子機器 |
JP2020190436A (ja) * | 2019-05-20 | 2020-11-26 | 三菱電機株式会社 | 電子デバイスの電気特性評価治具 |
JP6852232B1 (ja) * | 2020-06-16 | 2021-03-31 | 株式会社メイコー | 放熱部材及びこれを用いた放熱基板 |
US11490522B2 (en) | 2016-02-22 | 2022-11-01 | Daiwa Co., Ltd. | Method for manufacturing wiring board or wiring board material |
KR20240060656A (ko) | 2021-12-27 | 2024-05-08 | 가부시키가이샤 다이와 고교 | 배선기판 또는 배선기판 재료의 제조방법 |
KR20240103995A (ko) | 2022-12-27 | 2024-07-04 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 비닐 수지, 그 제조 방법, 조성물 및 경화물 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102440882B1 (ko) | 2015-06-29 | 2022-09-05 | 타츠타 전선 주식회사 | 방열재료 접착용 조성물, 접착제 부착 방열재료, 인레이 기판 및 그 제조방법 |
US10893603B2 (en) | 2016-12-28 | 2021-01-12 | Tatsuta Electric Wire & Cable Co., Ltd. | Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4863274A (ja) * | 1971-12-07 | 1973-09-03 | ||
JPS55165657A (en) * | 1979-06-11 | 1980-12-24 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Multi-chip package |
JPH0697331A (ja) * | 1992-07-15 | 1994-04-08 | Motorola Inc | 熱導体をもつパッド・アレイ半導体およびその製法 |
JPH10321759A (ja) * | 1997-05-15 | 1998-12-04 | Ngk Spark Plug Co Ltd | 電子部品用パッケージ本体及び電子部品用パッケージ |
JP2004179309A (ja) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | プリント回路基板の放熱構造とその製造方法 |
JP2007311510A (ja) * | 2006-05-18 | 2007-11-29 | Ngk Spark Plug Co Ltd | 配線基板 |
-
2008
- 2008-01-11 JP JP2008004124A patent/JP4988609B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4863274A (ja) * | 1971-12-07 | 1973-09-03 | ||
JPS55165657A (en) * | 1979-06-11 | 1980-12-24 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Multi-chip package |
JPH0697331A (ja) * | 1992-07-15 | 1994-04-08 | Motorola Inc | 熱導体をもつパッド・アレイ半導体およびその製法 |
JPH10321759A (ja) * | 1997-05-15 | 1998-12-04 | Ngk Spark Plug Co Ltd | 電子部品用パッケージ本体及び電子部品用パッケージ |
JP2004179309A (ja) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | プリント回路基板の放熱構造とその製造方法 |
JP2007311510A (ja) * | 2006-05-18 | 2007-11-29 | Ngk Spark Plug Co Ltd | 配線基板 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012134255A (ja) * | 2010-12-20 | 2012-07-12 | Toshiba Corp | 放熱構造 |
JP2013169128A (ja) * | 2012-02-17 | 2013-08-29 | Mitsubishi Heavy Ind Ltd | インバータ装置、一体型電動圧縮機 |
CN102917535A (zh) * | 2012-11-16 | 2013-02-06 | 东莞生益电子有限公司 | 导热金属芯及用该导热金属芯的pcb板 |
JP2015018857A (ja) * | 2013-07-09 | 2015-01-29 | 三菱電機株式会社 | 高放熱基板、部品の放熱構造 |
DE102015200031A1 (de) | 2014-01-10 | 2015-07-16 | Denso Corporation | Platine und elektronische vorrichtung |
JP2017005093A (ja) * | 2015-06-10 | 2017-01-05 | 日本電気株式会社 | 基板放熱構造およびその組み立て方法 |
JP2017063070A (ja) * | 2015-09-24 | 2017-03-30 | アイシン精機株式会社 | 配線基板 |
JPWO2017086095A1 (ja) * | 2015-11-17 | 2018-07-05 | 株式会社村田製作所 | 多層基板及び電子機器 |
US11490522B2 (en) | 2016-02-22 | 2022-11-01 | Daiwa Co., Ltd. | Method for manufacturing wiring board or wiring board material |
JP2020190436A (ja) * | 2019-05-20 | 2020-11-26 | 三菱電機株式会社 | 電子デバイスの電気特性評価治具 |
JP7226087B2 (ja) | 2019-05-20 | 2023-02-21 | 三菱電機株式会社 | 電気特性評価治具 |
JP6852232B1 (ja) * | 2020-06-16 | 2021-03-31 | 株式会社メイコー | 放熱部材及びこれを用いた放熱基板 |
WO2021255829A1 (ja) * | 2020-06-16 | 2021-12-23 | 株式会社メイコー | 放熱部材及びこれを用いた放熱基板 |
KR20240060656A (ko) | 2021-12-27 | 2024-05-08 | 가부시키가이샤 다이와 고교 | 배선기판 또는 배선기판 재료의 제조방법 |
KR20240103995A (ko) | 2022-12-27 | 2024-07-04 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 비닐 수지, 그 제조 방법, 조성물 및 경화물 |
Also Published As
Publication number | Publication date |
---|---|
JP4988609B2 (ja) | 2012-08-01 |
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