JP2009077365A - Connection structure for signal terminal and signal line conductor, electronic component mounting package and electronic apparatus - Google Patents

Connection structure for signal terminal and signal line conductor, electronic component mounting package and electronic apparatus Download PDF

Info

Publication number
JP2009077365A
JP2009077365A JP2008042362A JP2008042362A JP2009077365A JP 2009077365 A JP2009077365 A JP 2009077365A JP 2008042362 A JP2008042362 A JP 2008042362A JP 2008042362 A JP2008042362 A JP 2008042362A JP 2009077365 A JP2009077365 A JP 2009077365A
Authority
JP
Japan
Prior art keywords
signal terminal
signal
signal line
line conductor
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008042362A
Other languages
Japanese (ja)
Other versions
JP5004824B2 (en
Inventor
Hiroyuki Nakamichi
博之 中道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2008042362A priority Critical patent/JP5004824B2/en
Publication of JP2009077365A publication Critical patent/JP2009077365A/en
Application granted granted Critical
Publication of JP5004824B2 publication Critical patent/JP5004824B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Semiconductor Lasers (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of a signal terminal and a signal line conductor, which improves workability of electronic components in high frequencies by reducing a reflection loss in inputting/outputting a high frequency signal even if a higher frequency is used. <P>SOLUTION: A signal terminal 2 constituted of a linear conductor for transmitting a high frequency signal is connected to a signal line conductor 1b which is formed to an outer side of a substrate 1a on one principal surface of a wiring board 1, by brazing filler metal 3 while disposing the signal terminal 2 and the signal line conductor 1b on the same line without vertically superposing when viewed from one principal surface side, and disposing the signal terminal 2 and the wiring board 1 so as to superpose when viewed from a side surface side of the wiring board 1. An apparent thickness of the signal line conductor 1b is restrained from becoming thick in a connecting portion of the signal terminal 2 and the signal line conductor 1b, thereby reducing mismatching of characteristic impedance in the connecting portion, so that a connection structure in which a reflection loss of a high frequency signal is reduced and transmission characteristics are excellent, is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、光通信分野やマイクロ波通信およびミリ波通信等の分野で用いられる、高い周波数帯で作動する各種電子部品を収納する電子部品搭載用パッケージおよびこれを用いた電子装置に関する。   The present invention relates to an electronic component mounting package for storing various electronic components operating in a high frequency band, and an electronic apparatus using the same, which are used in the fields of optical communication, microwave communication, millimeter wave communication, and the like.

近年、40ｋｍ以下の伝送距離における高速通信に対する需要が急激に増加しており、高速大容量の情報伝送に関する研究開発が進められている。とりわけ、光通信装置を用いて光信号を受発信する半導体装置等の電子装置の高速化が注目されており、電子装置による光信号の高出力化と高速化が伝送容量を向上させるための課題として研究開発されている。   In recent years, the demand for high-speed communication at a transmission distance of 40 km or less has increased rapidly, and research and development on high-speed and large-capacity information transmission has been promoted. In particular, increasing speed of electronic devices such as semiconductor devices that receive and transmit optical signals using optical communication devices has been attracting attention, and the issue of increasing the output and speed of optical signals by electronic devices to improve transmission capacity As research and development.

従来の半導体装置に代表される電子装置の光出力は0.2〜0.5ｍＷ程度であり、電子部品として用いられる半導体素子の駆動電力は５ｍＷ程度であった。しかし、より大出力の半導体装置では、光出力が１ｍＷのレベルになってきており、また、半導体素子の駆動電力も10ｍＷ以上が要求されている。さらに、従来の半導体装置による伝送信号の周波数は2.5〜10ＧＨｚ程度であったが、近年では要求される伝送速度が高まり、伝送信号の周波数が25〜40ＧＨｚ程度まで向上してきており、半導体装置をより高出力化させ、高速化させることが要求されている。   The optical output of an electronic device typified by a conventional semiconductor device is about 0.2 to 0.5 mW, and the driving power of a semiconductor element used as an electronic component is about 5 mW. However, in a semiconductor device having a higher output, the optical output has become a level of 1 mW, and the driving power of the semiconductor element is required to be 10 mW or more. Furthermore, the frequency of the transmission signal by the conventional semiconductor device was about 2.5 to 10 GHz. However, in recent years, the required transmission speed has been increased, and the frequency of the transmission signal has been improved to about 25 to 40 GHz. There is a demand for higher output and higher speed.

光通信装置に用いられているＬＤ（Laser Diode：レーザダイオード）やＰＤ（Photo Diode：フォトダイオ−ド）等の光半導体素子を含む電子部品を従来の電子部品搭載用パッケージに搭載した電子装置の斜視図を図15に、また図15のＡ−Ａ線における断面図を図16に示す。従来の電子部品搭載用パッケージは、円板状の金属製の基体104に、基体104の上面から下面にかけて貫通する貫通孔104ｃを設け、この貫通孔104ｃに充填された絶縁性ガラスから成る封止材105を貫通して信号端子102が固定されているものである。また、基体104の下面には、２つの貫通孔104ｃ・104ｃの間に接地端子106が接続されている。この電子部品搭載用パッケージの上面に電子部品107を搭載し、電子部品搭載用パッケージの信号端子102の上端部と電子部品108の端子とをボンディングワイヤ108を介して電気的に接続し、基体104の上面の外周領域に電子部品107を覆うように金属製の蓋体109を溶接またはろう接により接合部104ｂに接合して気密封止することにより、電子装置としていた。また、蓋体109の電子部品107と対向する部分に光ファイバを固定したり、電子部品107と対向する部分に光を透過させる窓を設けたりしたものもある（例えば、特許文献１，特許文献２を参照。）。   An electronic device in which an electronic component including an optical semiconductor element such as an LD (Laser Diode) or PD (Photo Diode) used in an optical communication device is mounted on a conventional electronic component mounting package. FIG. 15 is a perspective view, and FIG. 16 is a cross-sectional view taken along the line AA in FIG. In a conventional electronic component mounting package, a disk-shaped metal base 104 is provided with a through-hole 104c penetrating from the upper surface to the lower surface of the base 104, and sealing is made of insulating glass filled in the through-hole 104c. The signal terminal 102 is fixed through the material 105. In addition, a ground terminal 106 is connected to the lower surface of the base body 104 between the two through holes 104c and 104c. The electronic component 107 is mounted on the upper surface of the electronic component mounting package, the upper end portion of the signal terminal 102 of the electronic component mounting package and the terminal of the electronic component 108 are electrically connected via the bonding wire 108, and the base 104 A metal lid 109 is joined to the joint 104b by welding or brazing so as to cover the electronic component 107 in the outer peripheral area of the upper surface of the above, and hermetically sealed. In addition, there is a case in which an optical fiber is fixed to a portion of the lid 109 facing the electronic component 107 or a window for transmitting light is provided in a portion facing the electronic component 107 (for example, Patent Document 1, Patent Document). 2).

このような電子装置では、信号端子102と電子部品107の端子とはボンディングワイヤ108を介して電気的に接続されており、ボンディングワイヤ108と接地面である搭載面104ａとの間の浮遊容量が大きいので、高周波信号の伝送損失が大きいものであった。このため、図17に斜視図で、図18に図17のＡ−Ａ線における断面図で示すように、基体104から突出した搭載部104ａを設け、基体104に対して略垂直な搭載部104ａの搭載面104ｂに搭載した配線基板101に電子部品107を搭載して、配線基板101の基板101ａ上に形成された信号線路導体101ｂと信号端子102とをろう材103で接合することにより電気的接続を行ない、より伝送特性を向上させることも行なわれていた。   In such an electronic device, the signal terminal 102 and the terminal of the electronic component 107 are electrically connected via the bonding wire 108, and the stray capacitance between the bonding wire 108 and the mounting surface 104a that is the ground plane is generated. Since it is large, the transmission loss of the high frequency signal is large. For this reason, as shown in a perspective view in FIG. 17 and in a cross-sectional view taken along line AA in FIG. 17, a mounting portion 104a protruding from the base 104 is provided, and the mounting portion 104a substantially perpendicular to the base 104 is provided. The electronic component 107 is mounted on the wiring board 101 mounted on the mounting surface 104b of the wiring board 101, and the signal line conductor 101b and the signal terminal 102 formed on the board 101a of the wiring board 101 are joined by the brazing material 103 to electrically Connections have been made to further improve transmission characteristics.

また、同様に高周波信号を伝送するための電子部品搭載用パッケージとして、基体の上面の搭載部に半導体素子および配線基板を搭載し、この載置部を囲むように、側部に貫通孔が形成された枠体を取り付け、貫通孔内に充填された封止材を貫通して固定された信号端子と配線基板上の信号線路導体とをろう材で接合することにより電気的に接続したものがある。そして、このような構造の電子部品搭載用パッケージにおいて、信号端子の信号線路導体との接続部分の厚さを残部の10〜50％とすることで、インピーダンスギャップを小さくすることが提案されている（例えば、特許文献３を参照。）。
特開2006−179775号公報 特開平８−130266号公報 特開2002−319643号公報 Similarly, as an electronic component mounting package for transmitting a high-frequency signal, a semiconductor element and a wiring board are mounted on the mounting portion on the upper surface of the base, and a through hole is formed in the side portion so as to surround the mounting portion. The frame body is attached and electrically connected by joining the signal terminal fixed through the sealing material filled in the through hole and the signal line conductor on the wiring board with a brazing material. is there. In the electronic component mounting package having such a structure, it has been proposed to reduce the impedance gap by setting the thickness of the connection portion of the signal terminal to the signal line conductor to 10 to 50% of the remaining portion. (For example, see Patent Document 3).
JP 2006-179775 A JP-A-8-130266 JP 2002-319643 A

しかしながら、近年、伝送される情報量の増大に伴い伝送信号の高周波化および伝送速度の高速化がさらに進んでおり、30ＧＨｚ以上のより高い周波数の信号を伝送する場合においては、信号端子の厚みを薄くしインピーダンスギャップを小さくしても、無視できるほど十分に小さなものではなくなってきているという問題があった。これは、従来の電子部品搭載用パッケージにおける信号端子と信号線路導体との接続構造は、信号端子と信号線路導体とを上下に重ねてその間のろう材により接続しているものであることから、この信号端子と信号線路導体とが上下に重なった接続部分では、信号端子の厚みを薄くしても残りの信号端子の厚みとろう材の厚みとにより信号線路導体の厚みが見かけ上厚くなってしまうことによるものであった。即ち、信号線路導体の厚みが厚くなることによりこの接続部分の側面の面積が増加し、この面積が増加した側面と配線基板の下面の接地導体（接地電極に接続された搭載部）との間の結合が増加することにより、この接続部分のインピーダンスが小さくなってしまい、信号線路導体の信号端子と重なっていない部分とでインピーダンスギャップが発生し、より高い周波数の信号を伝送する場合は、小さなインピーダンスギャップでも反射損失が大きくなり、伝送効率が低下してしまうからである。   However, in recent years, with the increase in the amount of information to be transmitted, the frequency of transmission signals and the transmission speed have been further increased, and in the case of transmitting a signal with a higher frequency of 30 GHz or higher, the thickness of the signal terminal is reduced. There is a problem that even if the impedance gap is reduced by making it thinner, it is no longer small enough to be ignored. This is because the connection structure between the signal terminal and the signal line conductor in the conventional electronic component mounting package is such that the signal terminal and the signal line conductor are overlapped with each other by a brazing material therebetween, In the connection part where the signal terminal and the signal line conductor overlap each other, the thickness of the signal line conductor is apparently thick due to the remaining thickness of the signal terminal and the thickness of the brazing material even if the signal terminal is thin. It was due to that. That is, as the thickness of the signal line conductor increases, the area of the side surface of the connecting portion increases, and the area between the side surface where the area increases and the ground conductor (the mounting portion connected to the ground electrode) on the lower surface of the wiring board. When the coupling of the signal line conductor increases, the impedance of this connection part becomes small, an impedance gap is generated in the part that does not overlap the signal terminal of the signal line conductor, and if a higher frequency signal is transmitted, it is small. This is because reflection loss increases even in the impedance gap, and transmission efficiency decreases.

従って、本発明は上記問題点に鑑み完成されたものであり、その目的は、より高周波化が進んでも、高周波信号の入出力時における反射損失を小さくすることにより、電子部品の高周波での作動性を良好な信号端子と信号線路導体との接続構造を提供することにある。また、本発明の他の目的は、その信号端子と信号線路導体との接続構造を用いた高周波での作動が良好な電子部品搭載用パッケージを提供することにある。また、本発明のさらに他の目的は、その電子部品搭載用パッケージを用いた、高周波での作動が良好な電子装置を提供することにある。   Accordingly, the present invention has been completed in view of the above problems, and its purpose is to operate electronic components at high frequency by reducing reflection loss at the time of input / output of high frequency signals even if the frequency is increased. An object is to provide a connection structure between a signal terminal and a signal line conductor with good performance. Another object of the present invention is to provide an electronic component mounting package that uses a connection structure between the signal terminal and the signal line conductor and that operates well at high frequencies. It is still another object of the present invention to provide an electronic device that uses the electronic component mounting package and has favorable operation at high frequencies.

本発明の信号端子と信号線路導体との接続構造は、高周波信号を伝送する線状の導体からなる信号端子が、配線基板の一方の主面に基板の外辺まで形成された信号線路導体に、一方の主面側から見て前記信号端子と前記信号線路導体とが上下に重ならずに同一線上に配置され、前記配線基板の側面側から見て前記信号端子と前記配線基板とが重なるように配置されてろう材により接続されていることを特徴とするものである。   The connection structure between the signal terminal and the signal line conductor of the present invention is a signal line conductor in which a signal terminal made of a linear conductor for transmitting a high-frequency signal is formed on one main surface of the wiring board to the outer side of the board. The signal terminal and the signal line conductor are arranged on the same line as viewed from one main surface side without overlapping vertically, and the signal terminal and the wiring substrate overlap when viewed from the side surface side of the wiring substrate. And are connected by a brazing material.

本発明の信号端子と信号線路導体との接続構造は、上記構成において、前記基板は、前記一方の主面の前記外辺に他方の主面側に傾斜している傾斜面を有しており、前記信号線路導体は前記傾斜面まで延在していることを特徴とするものである。   In the connection structure between the signal terminal and the signal line conductor according to the present invention, in the above configuration, the substrate has an inclined surface inclined toward the other main surface side on the outer side of the one main surface. The signal line conductor extends to the inclined surface.

本発明の信号端子と信号線路導体との接続構造は、上記構成において、前記配線基板の側面側から見て前記信号端子の中心と前記信号線路導体の上面とが重なるように配置されていることを特徴とするものである。   The connection structure between the signal terminal and the signal line conductor according to the present invention is arranged so that the center of the signal terminal and the upper surface of the signal line conductor overlap with each other when viewed from the side surface side of the wiring board. It is characterized by.

本発明の信号端子と信号線路導体との接続構造は、上記構成において、前記信号端子が対向する前記基板の側面に側面導体が形成されており、該側面導体に前記信号端子が前記ろう材により接続されていることを特徴とするものである。   In the connection structure between the signal terminal and the signal line conductor of the present invention, in the above configuration, a side conductor is formed on the side surface of the substrate facing the signal terminal, and the signal terminal is formed on the side conductor by the brazing material. It is characterized by being connected.

本発明の電子部品搭載用パッケージは、上記いずれかの本発明の信号端子と信号線路導体との接続構造を有することを特徴とするものである。   The electronic component mounting package of the present invention is characterized by having a connection structure between any of the signal terminals of the present invention and a signal line conductor.

本発明の電子装置は、上記本発明の電子部品搭載用パッケージに電子部品が実装されて前記信号線路導体に接続されていることを特徴とするものである。   The electronic device of the present invention is characterized in that an electronic component is mounted on the electronic component mounting package of the present invention and connected to the signal line conductor.

本発明の信号端子と信号線路導体との接続構造によれば、高周波信号を伝送する線状の導体からなる信号端子が、配線基板の一方の主面に基板の外辺まで形成された信号線路導体に、一方の主面側から見て信号端子と信号線路導体とが上下に重ならずに同一線上に配置され、配線基板の側面側から見て信号端子と配線基板とが重なるように配置されてろう材により接続されていることから、信号端子と信号線路導体との接続部において信号線路導体の見かけ上の厚みが厚くなることを抑えることができるので、接合部での特性インピーダンスの不整合が小さくなり、高周波信号の反射損失が小さく伝送特性が良好な接続構造となる。   According to the connection structure between the signal terminal and the signal line conductor of the present invention, the signal line formed of a linear conductor for transmitting a high-frequency signal is formed on one main surface of the wiring board up to the outer side of the board. The signal terminal and the signal line conductor are arranged on the same line on the conductor as viewed from one main surface side without overlapping vertically, and the signal terminal and the wiring substrate are arranged so as to overlap when viewed from the side surface side of the wiring board. Since it is connected by the brazing material, it is possible to suppress an increase in the apparent thickness of the signal line conductor at the connection portion between the signal terminal and the signal line conductor. Matching is reduced, a high-frequency signal reflection loss is small, and a connection structure with good transmission characteristics is obtained.

また、本発明の信号端子と信号線路導体との接続構造によれば、上記構成において、基板は、一方の主面の外辺に他方の主面側に傾斜している傾斜面を有しており、信号線路導体は傾斜面まで延在している場合は、傾斜面上の信号線路導体と信号端子とで囲まれた空間にろう材が溜まりやすくなり、信号端子と信号線路導体との接合強度が強くなることから、高周波信号の伝送特性が良好であるとともに接合部の信頼性に優れた接続構造となる。   According to the connection structure between the signal terminal and the signal line conductor of the present invention, in the above configuration, the substrate has an inclined surface that is inclined toward the other main surface side on the outer side of the one main surface. When the signal line conductor extends to the inclined surface, the brazing material tends to collect in the space surrounded by the signal line conductor and the signal terminal on the inclined surface, and the signal terminal and the signal line conductor are joined. Since the strength is increased, the connection structure is excellent in high-frequency signal transmission characteristics and excellent in the reliability of the joint.

また、本発明の信号端子と信号線路導体との接続構造によれば、上記構成において、配線基板の側面側から見て信号端子の中心と前記信号線路導体の上面とが重なるように配置されている場合は、信号端子の上下の表面それぞれから信号線路導体の上面への距離の差が最も小さくなり、信号端子の上下それぞれの表面を伝送して信号線路導体に入射する高周波信号におけるそれぞれの伝送経路の長さの差が最も小さくなるので、反射損失がより小さくなり、高周波信号の伝送特性がより良好なものとなる。   Further, according to the connection structure between the signal terminal and the signal line conductor of the present invention, in the above configuration, the center of the signal terminal and the upper surface of the signal line conductor are arranged so as to overlap each other when viewed from the side surface side of the wiring board. The difference in distance from the upper and lower surfaces of the signal terminal to the upper surface of the signal line conductor is the smallest, and the respective transmissions in the high-frequency signal transmitted through the upper and lower surfaces of the signal terminal and incident on the signal line conductor Since the path length difference is the smallest, the reflection loss is smaller and the transmission characteristics of the high-frequency signal are better.

また、本発明の信号端子と信号線路導体との接続構造によれば、上記構成において、基板の側面に側面導体が形成されており、側面導体に信号端子がろう材により接続されている場合は、側面導体により、ろう材による信号端子と配線基板との接合面積が増加して信号端子と信号線路導体の接合が補強されるので、接合信頼性がより優れた接続構造となる。   Further, according to the connection structure of the signal terminal and the signal line conductor of the present invention, in the above configuration, when the side conductor is formed on the side surface of the substrate and the signal terminal is connected to the side conductor by the brazing material The side conductor increases the bonding area between the signal terminal and the wiring board by the brazing material and reinforces the bonding between the signal terminal and the signal line conductor, thereby providing a connection structure with more excellent bonding reliability.

本発明の電子部品搭載用パッケージによれば、上記いずれかの本発明の信号端子と信号線路導体との接続構造を有することから、信号端子と信号線路導体との接合部での特性インピーダンスのずれを小さくできるので高周波信号の反射損失を小さくすることができ、高周波での作動が良好な電子部品搭載用パッケージとなる。   According to the electronic component mounting package of the present invention, since it has the connection structure between the signal terminal and the signal line conductor according to any one of the present inventions described above, the characteristic impedance shift at the junction between the signal terminal and the signal line conductor Therefore, it is possible to reduce the reflection loss of the high-frequency signal, and the electronic component mounting package can operate well at high frequencies.

本発明の電子装置によれば、本発明の電子部品搭載用パッケージに電子部品が実装されて信号線路導体に接続されていることにより、信号端子と信号線路導体との接合部での特性インピーダンスのずれを小さくできるので高周波信号の反射損失を小さくすることができ、高周波での作動が良好な電子装置となる。   According to the electronic device of the present invention, since the electronic component is mounted on the electronic component mounting package of the present invention and connected to the signal line conductor, the characteristic impedance at the joint between the signal terminal and the signal line conductor is reduced. Since the deviation can be reduced, the reflection loss of the high-frequency signal can be reduced, and the electronic device can operate well at high frequencies.

本発明の信号端子と信号線路導体との接続構造、およびこの接続構造を有する本発明の電子部品搭載用パッケージ、ならびにこの電子部品搭載用パッケージを用いた本発明の電子装置について、添付の図面を参照しつつ詳細に説明する。   A connection structure between a signal terminal and a signal line conductor of the present invention, an electronic component mounting package of the present invention having this connection structure, and an electronic device of the present invention using this electronic component mounting package are shown in the accompanying drawings. Details will be described with reference to FIG.

図１は本発明の電子部品搭載用パッケージの実施の形態の一例を示す斜視図であり、図２は図１におけるＡ−Ａ線で切断した断面の一例を示す断面図であり、図３は図２におけるＢ部（接続部）を拡大した断面図である。   FIG. 1 is a perspective view showing an example of an embodiment of an electronic component mounting package of the present invention, FIG. 2 is a cross-sectional view showing an example of a cross section taken along line AA in FIG. 1, and FIG. It is sectional drawing to which the B section (connection part) in FIG. 2 was expanded.

図１〜図３において、１は配線基板、１ａは基板、１ｂは信号線路導体、１ｃは接地用導体、１ｄは搭載用導体、２は信号端子、３はろう材、４は基体、４ａは搭載部、４ｂは搭載面、４ｃは貫通孔、４ｄは接合部、５は封止材、６は接地端子、７は電子部品、８はボンディングワイヤ、９は蓋体である。   1-3, 1 is a wiring board, 1a is a board, 1b is a signal line conductor, 1c is a grounding conductor, 1d is a mounting conductor, 2 is a signal terminal, 3 is a brazing material, 4 is a substrate, 4a is A mounting portion, 4b is a mounting surface, 4c is a through hole, 4d is a joint portion, 5 is a sealing material, 6 is a ground terminal, 7 is an electronic component, 8 is a bonding wire, and 9 is a lid.

図１に示す本発明の電子部品搭載用パッケージは、本発明の信号端子２と信号線路導体１ｂとの接続構造を有するものの一例であり、基体４の上面から突出した突出部を搭載部４ａとして、その側面の搭載面４ｂに配線基板１が搭載され、基体４に形成された貫通孔４ｃに充填された封止材５を貫通して固定された信号端子２・２の端部と配線基板１上の信号線路導体１ｂとがはんだ等のろう材３で接続されて構成されている。そして、電子部品７を配線基板１の接地用導体１ｃ上に搭載するとともにその端子をボンディングワイヤ８で配線基板１上の信号線路導体１ｂに接続し、さらに、図２に示すように、破線で示すような蓋体９を基板４の上面の接合部４ｄに接合することにより、本発明の電子装置が基本的に構成される。   The electronic component mounting package of the present invention shown in FIG. 1 is an example of a connection structure between the signal terminal 2 and the signal line conductor 1b of the present invention, and a protruding portion protruding from the upper surface of the base 4 is used as the mounting portion 4a. The wiring board 1 is mounted on the side mounting surface 4b, and the end portions of the signal terminals 2 and 2 fixed through the sealing material 5 filled in the through holes 4c formed in the base 4 and the wiring board The signal line conductor 1b on 1 is connected by a brazing material 3 such as solder. Then, the electronic component 7 is mounted on the grounding conductor 1c of the wiring board 1 and its terminal is connected to the signal line conductor 1b on the wiring board 1 by the bonding wire 8, and further, as shown in FIG. The electronic device of the present invention is basically configured by bonding a lid body 9 as shown to the bonding portion 4d on the upper surface of the substrate 4.

本発明の信号端子２と信号線路導体１ｂとの接続構造は、図３に示すように、高周波信号を伝送する線状の導体からなる信号端子２が、配線基板１の一方の主面に基板１ａの外辺まで形成された信号線路導体１ｂに、一方の主面側から見て信号端子２と信号線路導体１ｂとが上下に重ならずに同一線上に配置され、その線に交差する方向の配線基板１の側面側から見て信号端子２と配線基板１とが前後で重なるように配置されて、両者の端部間に配置したろう材３により接続されていることを特徴とするものである。   The connection structure between the signal terminal 2 and the signal line conductor 1b according to the present invention is such that the signal terminal 2 made of a linear conductor for transmitting a high-frequency signal is provided on one main surface of the wiring board 1 as shown in FIG. A direction in which the signal terminal 2 and the signal line conductor 1b are arranged on the same line in the signal line conductor 1b formed up to the outer side of 1a and do not overlap vertically when viewed from one main surface side, and intersect the line The signal terminal 2 and the wiring board 1 are arranged so as to overlap each other when viewed from the side surface side of the wiring board 1, and are connected by a brazing material 3 arranged between the end portions of the both. It is.

このことから、信号端子２と信号線路導体１ｂとを上下に重ねてその間のろう材３により接続した従来の接続構造と比較すると、信号端子２と信号線路導体１ｂとの接続部において信号線路導体１ｂの見かけ上の厚みが厚くなることを抑えることができるので、接続部での特性インピーダンスの不整合が小さくなり、高周波信号の反射損失が小さく伝送特性が良好な接続構造となる。   Therefore, when compared with the conventional connection structure in which the signal terminal 2 and the signal line conductor 1b are overlapped with each other and connected by the brazing material 3 therebetween, the signal line conductor at the connection portion between the signal terminal 2 and the signal line conductor 1b is compared. Since the increase in the apparent thickness of 1b can be suppressed, a mismatch in characteristic impedance at the connection portion is reduced, a high-frequency signal reflection loss is reduced, and a connection structure with good transmission characteristics is obtained.

図４は、図３と同様の本発明の電子部品搭載用パッケージの一例を示す断面図であり、信号端子２と信号線路導体１ｂとの接続部を拡大して示したものである。図４において、１ｅは、基板１ａの信号線路導体１ｂが形成された側の主面の外辺に設けられた、外辺に向かって他方の主面側に傾斜している傾斜面である。   FIG. 4 is a cross-sectional view showing an example of the electronic component mounting package of the present invention similar to FIG. 3, and shows an enlarged connection portion between the signal terminal 2 and the signal line conductor 1b. In FIG. 4, 1e is an inclined surface provided on the outer side of the main surface on the side where the signal line conductor 1b of the substrate 1a is formed and inclined toward the other main surface side toward the outer side.

本発明の信号端子２と信号線路導体１ｂとの接続構造は、図４に示す例のように、上記構成において、基板１ａは一方の主面の外辺に他方の主面側に傾斜している傾斜面１ｅを有しており、一方の主面に形成された信号線路導体１ｂは傾斜面１ｅまで延在していることが好ましい。   The connection structure between the signal terminal 2 and the signal line conductor 1b according to the present invention is, as in the example shown in FIG. 4, in the above configuration, the substrate 1a is inclined to the outer side of one main surface and the other main surface side. It is preferable that the signal line conductor 1b formed on one main surface extends to the inclined surface 1e.

このことにより、傾斜面１ｅ上の信号線路導体１ｂとこれに接続される信号端子２とで囲まれた空間にろう材３が溜まりやすくなり、信号端子２と信号線路導体１ｂとの接合強度が強くなることから、高周波信号の伝送特性が良好であるとともに接合部の信頼性に優れた接続構造となる。   As a result, the brazing material 3 tends to accumulate in the space surrounded by the signal line conductor 1b on the inclined surface 1e and the signal terminal 2 connected thereto, and the bonding strength between the signal terminal 2 and the signal line conductor 1b is increased. Since it becomes strong, it becomes a connection structure in which the transmission characteristic of the high frequency signal is good and the reliability of the joint is excellent.

信号端子２と信号線路導体１ｂとの接続部においては、信号配線の長さが不要に長くならないように、信号端子２を配線基板１に近付けて信号端子２と信号線路導体１ｂとの間のろう材３をできるだけ短くして接続するのが好ましい。高周波信号は表皮効果により導体の表面を流れるが、図３に示すような例の場合は、信号端子２の配線基板１側（図３における右側）の表面から信号線路導体１ｂの上面への高周波信号の伝送経路は屈曲したものになるので、高周波信号の減衰が発生しやすい。これに対して、図４に示すような傾斜面１ｅを有する場合は、信号端子２の配線基板１側の表面から信号線路導体１ｂの上面への伝送経路はなだらかになるので、高周波信号の減衰を抑えることができる。このことから、傾斜面１ｂの外辺側の角部は、信号端子２より配線基板１の他方の主面側に位置するように、外辺に向かって他方の主面側に傾斜させて設けるのが好ましい。   At the connecting portion between the signal terminal 2 and the signal line conductor 1b, the signal terminal 2 is brought close to the wiring board 1 so that the length of the signal wiring does not become unnecessarily long, and between the signal terminal 2 and the signal line conductor 1b. It is preferable to connect the brazing material 3 as short as possible. The high-frequency signal flows on the surface of the conductor due to the skin effect, but in the example shown in FIG. 3, the high-frequency signal from the surface of the signal terminal 2 on the wiring board 1 side (right side in FIG. 3) to the upper surface of the signal line conductor 1b. Since the signal transmission path is bent, the high-frequency signal is likely to be attenuated. On the other hand, when the inclined surface 1e as shown in FIG. 4 is provided, the transmission path from the surface of the signal terminal 2 on the side of the wiring board 1 to the upper surface of the signal line conductor 1b becomes gentle. Can be suppressed. From this, the corner on the outer side of the inclined surface 1b is provided to be inclined toward the other main surface toward the outer side so as to be positioned on the other main surface side of the wiring board 1 with respect to the signal terminal 2. Is preferred.

また、本発明の信号端子２と信号線路導体１ｂとの接続構造は、図４に示す例のように、上記構成において、配線基板１の側面側（信号端子２と信号線路導１ｂとが同一線上に配置されているその線に交差する方向の側面の側）から見て、信号端子２の中心と信号線路導体１ｂの上面とが重なるように配置されていることが好ましい。   Further, the connection structure between the signal terminal 2 and the signal line conductor 1b according to the present invention is the same as the example shown in FIG. 4 in the above configuration, in which the side surface side of the wiring board 1 (the signal terminal 2 and the signal line conductor 1b are the same). It is preferable that the center of the signal terminal 2 and the upper surface of the signal line conductor 1b overlap with each other when viewed from the side of the side in the direction intersecting with the line arranged on the line.

このことにより、信号端子２の上下の表面それぞれからろう材３を介して信号線路導体１ｂの上面への距離の差が最も小さくなり、信号端子２の上下それぞれの表面を伝送してろう材３を介して信号線路導体１ｂに入射する高周波信号におけるそれぞれの伝送経路の長さの差が最も小さくなる。また、信号端子２と信号線路導体１ｂとの間のろう材３による信号の伝送経路も短くなり、信号端子２や信号線路導体１ｂに対して高周波信号の伝送経路の屈曲角度が小さいものとなる。このようなことから、信号端子２と信号線路導体１ｂとの接続部における反射損失がより小さくなり、高周波信号の伝送特性がより良好なものなる。   As a result, the difference in distance from the upper and lower surfaces of the signal terminal 2 to the upper surface of the signal line conductor 1b via the brazing material 3 is minimized, and the brazing material 3 is transmitted through the upper and lower surfaces of the signal terminal 2 respectively. The difference in the lengths of the respective transmission paths in the high-frequency signal incident on the signal line conductor 1b via the line is the smallest. Also, the signal transmission path by the brazing material 3 between the signal terminal 2 and the signal line conductor 1b is shortened, and the bending angle of the high-frequency signal transmission path is small with respect to the signal terminal 2 and the signal line conductor 1b. . For this reason, the reflection loss at the connection portion between the signal terminal 2 and the signal line conductor 1b becomes smaller, and the transmission characteristics of the high-frequency signal become better.

図７および図８は、図３と同様の本発明の電子部品搭載用パッケージの一例を示す断面図であり、信号端子２と信号線路導体１ｂとの接続部を拡大して示したものである。図７および図８において、１ｆは信号端子２が対向する基板１ａの側面に設けられた側面導体である。   7 and 8 are cross-sectional views showing an example of the electronic component mounting package of the present invention similar to that in FIG. 3, and an enlarged view of the connecting portion between the signal terminal 2 and the signal line conductor 1b. . 7 and 8, 1f is a side conductor provided on the side of the substrate 1a facing the signal terminal 2.

本発明の信号端子２と信号線路導体１ｂとの接続構造は、図７および図８に示す例のように、上記構成において、信号端子２が対向する基板１ａの側面に側面導体１ｆが形成されており、この側面導体１ｆに信号端子２がろう材３により接続されているときには、側面導体１ｆにより、ろう材３による信号端子２と配線基板１との接合面積が増加して信号端子２と信号線路導体１ｂとの接続が補強されるので、接合信頼性がより優れた接続構造となる。   The connection structure between the signal terminal 2 and the signal line conductor 1b according to the present invention has a configuration in which the side conductor 1f is formed on the side surface of the substrate 1a facing the signal terminal 2 in the above configuration, as in the examples shown in FIGS. When the signal terminal 2 is connected to the side conductor 1 f by the brazing material 3, the side conductor 1 f increases the bonding area between the signal terminal 2 and the wiring board 1 by the brazing material 3. Since the connection with the signal line conductor 1b is reinforced, a connection structure with better joint reliability is obtained.

本発明の電子部品搭載用パッケージは、上記いずれかの本発明の信号端子２と信号線路導体１ｂとの接続構造を有することを特徴とするものである。このことから、信号端子２と信号線路導体１ｂとの接合部での特性インピーダンスのずれを小さくできるので高周波信号の反射損失を小さくすることができ、高周波での作動を良好な電子部品搭載用パッケージとなる。   The electronic component mounting package of the present invention is characterized by having a connection structure between any one of the signal terminals 2 of the present invention and the signal line conductor 1b. Therefore, the deviation of characteristic impedance at the junction between the signal terminal 2 and the signal line conductor 1b can be reduced, so that the reflection loss of the high frequency signal can be reduced, and the electronic component mounting package with good operation at high frequency. It becomes.

本発明の電子装置は、上記本発明の電子部品搭載用パッケージに電子部品７が実装されて信号線路導体１ｂに接続されていることを特徴とするものである。このことにより、電子部品７の端子に接続された信号線路導体１ｂと信号端子２との接合部での特性インピーダンスのずれを小さくできるので高周波信号の反射損失を小さくすることができ、高周波での作動が良好な電子装置となる。   The electronic device of the present invention is characterized in that the electronic component 7 is mounted on the electronic component mounting package of the present invention and is connected to the signal line conductor 1b. As a result, the deviation of the characteristic impedance at the junction between the signal line conductor 1b connected to the terminal of the electronic component 7 and the signal terminal 2 can be reduced, so that the reflection loss of the high frequency signal can be reduced, An electronic device that operates well.

配線基板１は、例えば図１に示す例では、配線導体として基板１ａの上面には高周波信号を伝送するとともに信号端子２・２が接続される信号線路導体１ｂと、電子部品７を搭載するとともに電子部品７の下面の接地電極を接続するための接地用導体１ｃとが形成され、下面には配線基板１を基体４に搭載して接続するための搭載用導体１ｄが形成されており、接地用導体１ｃと搭載用導体１ｄとは、基板１ａの側面に形成された、または基板１ａを貫通して形成された接続導体により接続される。また、図７および図８に示す例では、配線導体として、信号端子２が対向する基板１ａの側面に、信号端子２がろう材３により接続される側面導体１ｆがさらに形成されている。このような配線導体は、電子部品７によりその接続が異なるので、それに応じて形成されるものである。   For example, in the example shown in FIG. 1, the wiring board 1 has a signal line conductor 1 b that transmits a high-frequency signal as a wiring conductor and is connected to the signal terminals 2 and 2, and an electronic component 7. A grounding conductor 1c for connecting the ground electrode on the lower surface of the electronic component 7 is formed, and a mounting conductor 1d for mounting the wiring board 1 on the base 4 for connection is formed on the lower surface. The conductor for 1c and the mounting conductor 1d are connected by a connection conductor formed on the side surface of the substrate 1a or formed through the substrate 1a. In the example shown in FIGS. 7 and 8, a side conductor 1f is further formed as a wiring conductor on the side surface of the substrate 1a opposite to the signal terminal 2 to which the signal terminal 2 is connected by the brazing material 3. Such a wiring conductor is formed according to the connection of the electronic component 7 because the connection is different.

また、電子部品７と配線導体とは例えばボンディングワイヤ８により接続されるが、このボンディングワイヤ８を短くすることで高周波信号の伝送損失を少なくするために、例えば図１に示すように信号線路導体１ｂを信号端子２と電子部品７との間で屈曲した形状として、ボンディングワイヤ８の接続位置が電子部品７にできるだけ近くなるようにしてもよい。なお、信号線路導体１ｂを屈曲させる場合には、例えば図１に示すように屈曲角度が90°より大きくなるように段階的に屈曲させたり、屈曲する角部に丸みをつけたりすると、屈曲部での反射による高周波信号の損失を少なくすることができるので好ましい。信号線路導体１ｂを段階的に屈曲させる場合は、屈曲角度を120°以上とすると、高周波信号の損失がより少なくなるのでより好ましい。   The electronic component 7 and the wiring conductor are connected by, for example, a bonding wire 8. In order to reduce the transmission loss of the high frequency signal by shortening the bonding wire 8, for example, as shown in FIG. The connecting position of the bonding wire 8 may be as close as possible to the electronic component 7 by bending 1b between the signal terminal 2 and the electronic component 7. When the signal line conductor 1b is bent, for example, as shown in FIG. 1, if the bending angle is bent stepwise so that the bending angle becomes larger than 90 °, or the bent corner is rounded, This is preferable because the loss of the high-frequency signal due to the reflection can be reduced. When the signal line conductor 1b is bent stepwise, it is more preferable that the bending angle be 120 ° or more because the loss of the high-frequency signal is reduced.

図９〜図11は、それぞれ図８のＡ−Ａ線切断面側から配線基板１を見た側面図である。これらの図においては、側面導体１ｆの形状等が分かりやすいように、ろう材３を省略している。   9 to 11 are side views of the wiring board 1 as viewed from the AA line cut surface side of FIG. In these drawings, the brazing material 3 is omitted so that the shape and the like of the side conductor 1f can be easily understood.

側面導体１ｆは、信号端子２が対向する基板１ａの側面に形成されていれば、信号端子２とろう材３により接続することで信号端子２と信号線路導体１ｂとの接続の補強となるので、側面導体１ｆは、図７に示す例のように信号線路導体１ｂと接続されていなくてもよいし、図８に示す例のように信号線路導体１ｂと接続されていてもよい。図７に示す例のように、側面導体１ｆが信号線路導体１ｂから離れて信号の伝送経路がろう材３の部分で分岐した形状になると、この部分で信号の反射が発生して損失が大きくなる場合があるので、図８〜図11に示す例のように、側面導体１ｆは信号線路導体１ｂから連続して形成されて接続されているのが好ましい。   If the side conductor 1f is formed on the side of the substrate 1a facing the signal terminal 2, the connection between the signal terminal 2 and the signal line conductor 1b is reinforced by connecting the signal terminal 2 and the brazing material 3 to each other. The side conductor 1f may not be connected to the signal line conductor 1b as in the example shown in FIG. 7, or may be connected to the signal line conductor 1b as in the example shown in FIG. If the side conductor 1f is separated from the signal line conductor 1b and the signal transmission path is branched at the brazing material 3 portion as in the example shown in FIG. 7, signal reflection occurs at this portion, resulting in a large loss. Therefore, as in the example shown in FIGS. 8 to 11, the side conductor 1f is preferably formed continuously from the signal line conductor 1b and connected thereto.

また、図８〜図11に示す例のように、信号端子２と信号線路導体１ｂとの接合を補強し、信号の反射を抑えるためには、基板１ａの側面の信号端子２が対向する領域（側面視して信号端子２と重なる領域）に形成されているのが好ましい。信号端子２と信号線路導体１ｂとの接合を補強するためには、側面導体１ｆの面積を基板１ａの側面の信号端子２が対向する領域よりもある程度大きくするのが好ましい。   Further, as in the example shown in FIGS. 8 to 11, in order to reinforce the bonding between the signal terminal 2 and the signal line conductor 1b and suppress the reflection of the signal, the region where the signal terminal 2 on the side surface of the substrate 1a faces. It is preferably formed in a region overlapping with the signal terminal 2 in a side view. In order to reinforce the bonding between the signal terminal 2 and the signal line conductor 1b, it is preferable that the area of the side conductor 1f is made somewhat larger than the area where the signal terminal 2 on the side face of the substrate 1a faces.

このとき、図10や図11に示す例のように、側面導体１ｆの形状を信号線路導体１ｂの幅に対して両側に同程度拡がった形状にすると、ろう材３による接続を行なう際に、溶融したろう材の表面張力により信号端子２が引っ張られ、信号端子２と信号線路導体１ｂとが同一線上からずれてしまうことがないので好ましい。また、図10に示す例のように、信号端子２から側面導体１ｆの端部までの距離が均等になるような形状（信号端子２が対向する領域の相似形状）とすると、信号端子２の周囲に形成されるろう材のフィレット形状や大きさが均等になり、接続信頼性がより高くなるので好ましい。   At this time, as shown in FIG. 10 and FIG. 11, when the shape of the side conductor 1f is expanded to the same extent on both sides with respect to the width of the signal line conductor 1b, It is preferable because the signal terminal 2 is pulled by the surface tension of the molten brazing material and the signal terminal 2 and the signal line conductor 1b are not displaced from the same line. Further, as in the example shown in FIG. 10, if the distance from the signal terminal 2 to the end of the side conductor 1 f is uniform (similar shape in the region where the signal terminal 2 faces), the signal terminal 2 It is preferable because the fillet shape and size of the brazing material formed in the periphery are uniform, and the connection reliability is higher.

また、信号端子２と信号線路導体１ｂとの接合をより強固にするために、側面導体１ｆをより大きくする場合は、信号線路導体１ｂに接続された側面導体１ｆが搭載用導体１ｄ（基体４）に近づくと側面導体１ｆに接続された信号端子２と搭載用導体１ｄ（基体４）との間の容量結合が大きくなってインピーダンスが低下しやすいため、図11に示す例のように、側面導体１ｆを基板１ａの厚み方向ではなく、幅方向に大きくするのが好ましい。   When the side conductor 1f is made larger in order to further strengthen the bonding between the signal terminal 2 and the signal line conductor 1b, the side conductor 1f connected to the signal line conductor 1b is mounted on the mounting conductor 1d (base 4). ), The capacitive coupling between the signal terminal 2 connected to the side conductor 1f and the mounting conductor 1d (base 4) tends to increase and the impedance tends to decrease. Therefore, as shown in FIG. The conductor 1f is preferably enlarged in the width direction, not in the thickness direction of the substrate 1a.

配線基板１は、例えば、比誘電率が9.5の酸化アルミニウム質焼結体から成り、厚みが0.3ｍｍである基板１ａを用いた場合であれば、信号線路導体１ｂの幅を0.3ｍｍとし、厚みを0.002ｍｍとすることにより、信号線路導体１ｂを50Ωにインピーダンス整合させることができる。   For example, if the wiring board 1 is made of an aluminum oxide sintered body having a relative dielectric constant of 9.5 and a thickness of 0.3 mm, the width of the signal line conductor 1b is set to 0.3 mm. By setting the distance to 0.002 mm, the signal line conductor 1b can be impedance-matched to 50Ω.

配線基板１は、酸化アルミニウム（アルミナ：Ａｌ２Ｏ３）質焼結体，窒化アルミニウム（ＡｌＮ）質焼結体等のセラミックス絶縁材料等から成る基板１ａに信号線路導体１ｂを含む配線導体が形成されたものである。基板１ａが例えば酸化アルミニウム質焼結体から成る場合であれば、まずアルミナ（Ａｌ２Ｏ３）やシリカ（ＳｉＯ２），カルシア（ＣａＯ），マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤，溶媒を添加混合して泥漿状とし、これを周知のドクターブレード法やカレンダーロール法等によりシート状に成形してセラミックグリーンシート（以下、グリーンシートともいう）を得る。その後、グリーンシートを所定形状に打ち抜き加工するとともに必要に応じて複数枚積層し、これを約1600℃の温度で焼成することにより製作される。 The wiring substrate 1 includes a wiring conductor including a signal line conductor 1b formed on a substrate 1a made of a ceramic insulating material such as an aluminum oxide (alumina: Al 2 O 3 ) sintered body or an aluminum nitride (AlN) sintered body. It has been done. When the substrate 1a is made of, for example, an aluminum oxide sintered body, first, an organic solvent suitable for a raw material powder such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO), etc. , A solvent is added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of sheets are laminated as necessary, and the green sheet is fired at a temperature of about 1600 ° C.

基板１ａに傾斜面１ｅを形成するには、平板状の基板１ａを作製した後に、一方の主面の外辺を研磨するか、基板１ａに傾斜した内側面を持つ溝を形成して溝部で切断すればよい。傾斜面１ｅの大きさは、配線基板１の大きさや信号端子２の大きさに応じて決められる。配線基板１の側面側から見て信号端子２の中心と信号線路導体１ｂの上面とが重なるように配置する場合は、傾斜面１ｂの他方の主面側の角部は、一方の主面から他方の主面側へ信号端子２の太さの１／２程度以上の距離移動した位置になるように設ければよい。   In order to form the inclined surface 1e on the substrate 1a, after manufacturing the flat substrate 1a, the outer side of one main surface is polished or a groove having an inclined inner surface is formed on the substrate 1a. Just cut it. The size of the inclined surface 1 e is determined according to the size of the wiring substrate 1 and the size of the signal terminal 2. When arranged so that the center of the signal terminal 2 and the upper surface of the signal line conductor 1b overlap each other when viewed from the side surface side of the wiring board 1, the corner on the other main surface side of the inclined surface 1b is from one main surface. What is necessary is just to provide so that it may become the position which moved the distance of about 1/2 or more of the thickness of the signal terminal 2 to the other main surface side.

信号線路導体１ｂを含む配線導体の形成方法は、基板１ａと同時焼成により、あるいは基板１ａを作製した後に金属メタライズを形成する周知の方法や、基板１ａを作製した後に蒸着法やフォトリソグラフィ法により形成する方法がある。電子装置が小型であり、それに搭載される配線基板１はさらに小さいので、配線導体は微細なものとなるため、信号線路導体１ｂと信号端子２・２との位置合わせ精度を高めるためには、蒸着法やフォトリソグラフィ法により形成する方法が好ましい。この場合は、配線導体の形成前に必要に応じて基板１ａの主面に研磨加工を施す場合もある。   The wiring conductor including the signal line conductor 1b can be formed by a well-known method of forming metal metallization after the substrate 1a is produced by simultaneous firing with the substrate 1a, or by vapor deposition or photolithography after the substrate 1a is produced. There is a method of forming. Since the electronic device is small and the wiring board 1 mounted on the electronic device is smaller, the wiring conductor is fine. In order to increase the alignment accuracy between the signal line conductor 1b and the signal terminals 2 and 2, A method of forming by vapor deposition or photolithography is preferred. In this case, polishing may be performed on the main surface of the substrate 1a as necessary before the formation of the wiring conductor.

傾斜面１ｅを有する基板１ａの上に蒸着法により薄膜導体を全面に形成した後、フォトリソグラフィ法により信号線路導体１ｂ等の配線導体を形成する場合は、傾斜面１ｅの傾斜に合わせた３次元構造の金属製のマスクを用いることにより、傾斜面１ｅの上でもマスクと薄膜導体とを密着させることができ、精度よく信号線路導体１ｂを形成することができる。基板１ａの側面に形成した側面導体１ｆについても、必要に応じて基板１ａの主面および側面のそれぞれに同様にして薄膜導体を形成した後に、基板１ａの主面および側面に密着する３次元構造のマスクを用いることにより形成することができる。   When a thin film conductor is formed on the entire surface of the substrate 1a having the inclined surface 1e by vapor deposition, and then a wiring conductor such as the signal line conductor 1b is formed by photolithography, the three-dimensional shape is adjusted to the inclination of the inclined surface 1e. By using a metal mask having a structure, the mask and the thin film conductor can be brought into close contact with each other even on the inclined surface 1e, and the signal line conductor 1b can be formed with high accuracy. For the side conductor 1f formed on the side surface of the substrate 1a, a thin film conductor is formed on each of the main surface and side surface of the substrate 1a as necessary, and then the three-dimensional structure is in close contact with the main surface and side surface of the substrate 1a. It can be formed by using the mask.

以下、配線導体を蒸着法やフォトリソグラフィ法により形成する場合について詳細に説明する。配線導体は、例えば密着金属層，拡散防止層および主導体層が順次積層された３層構造の導体層から成る。   Hereinafter, the case where the wiring conductor is formed by vapor deposition or photolithography will be described in detail. The wiring conductor is composed of a conductor layer having a three-layer structure in which, for example, an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated.

密着金属層は、セラミックス等から成る基板１ａとの密着性を良好とするという観点からは、チタン（Ｔｉ），クロム（Ｃｒ），タンタル（Ｔａ），ニオブ（Ｎｂ），ニッケル−クロム（Ｎｉ−Ｃｒ）合金，窒化タンタル（Ｔａ２Ｎ）等の熱膨張率がセラミックスと近い金属のうちの少なくとも１種より成るのが好ましく、その厚みは0.01〜0.2μｍ程度が好ましい。密着金属層の厚みが0.01μｍ未満では、密着金属層を基板１ａに強固に密着させることが困難となる傾向がある。一方、密着金属層の厚みが0.2μｍを超えると、成膜時の内部応力によって密着金属層が基板１ａから剥離し易くなる傾向がある。 From the viewpoint of improving the adhesion with the substrate 1a made of ceramics or the like, the adhesion metal layer is made of titanium (Ti), chromium (Cr), tantalum (Ta), niobium (Nb), nickel-chromium (Ni-). It is preferable that the thermal expansion coefficient is at least one of metals close to that of ceramics, such as a Cr) alloy and tantalum nitride (Ta 2 N), and the thickness is preferably about 0.01 to 0.2 μm. If the thickness of the adhesion metal layer is less than 0.01 μm, it tends to be difficult to firmly adhere the adhesion metal layer to the substrate 1a. On the other hand, if the thickness of the adhesion metal layer exceeds 0.2 μm, the adhesion metal layer tends to be peeled off from the substrate 1a due to internal stress during film formation.

拡散防止層は、密着金属層と主導体層との相互拡散を防ぐという観点からは、白金（Ｐｔ），パラジウム（Ｐｄ），ロジウム（Ｒｈ），ニッケル（Ｎｉ），Ｎｉ−Ｃｒ合金，Ｔｉ−Ｗ合金等の熱伝導性の良好な金属のうち少なくとも１種より成ることが好ましく、その厚みは0.05〜１μｍ程度が好ましい。拡散防止層の厚みが0.05μｍ未満では、ピンホール等の欠陥が発生して拡散防止層としての機能を果たしにくくなる傾向があり、１μｍを超えると、成膜時の内部応力により拡散防止層が密着金属層から剥離し易く成る傾向がある。なお、拡散防止層にＮｉ−Ｃｒ合金を用いる場合は、Ｎｉ−Ｃｒ合金は基板１ａとの密着性が良好なため、密着金属層を省くことも可能である。   From the viewpoint of preventing mutual diffusion between the adhesion metal layer and the main conductor layer, the diffusion prevention layer is platinum (Pt), palladium (Pd), rhodium (Rh), nickel (Ni), Ni—Cr alloy, Ti— It is preferably made of at least one metal having good thermal conductivity such as W alloy, and the thickness is preferably about 0.05 to 1 μm. If the thickness of the diffusion prevention layer is less than 0.05 μm, defects such as pinholes tend to be generated, making it difficult to perform the function as the diffusion prevention layer. If the thickness exceeds 1 μm, the diffusion prevention layer is caused by internal stress during film formation. There is a tendency to easily peel from the adhesion metal layer. When a Ni—Cr alloy is used for the diffusion preventing layer, the Ni—Cr alloy has good adhesion to the substrate 1a, so that the adhesion metal layer can be omitted.

主導体層は、電気抵抗の小さい金（Ａｕ），Ｃｕ，Ｎｉ，銀（Ａｇ）の少なくとも１種より成ることが好ましく、その厚みは0.1〜５μｍ程度が好ましい。主導体層の厚みが0.1μｍ未満では、電気抵抗が大きなものとなって配線基板１の配線導体に要求される電気抵抗を満足できなくなる傾向があり、５μｍを超えると、成膜時の内部応力により主導体層が拡散防止層から剥離し易く成る傾向がある。また、Ｃｕは酸化し易いので、その上にＮｉおよびＡｕからなる保護層を被覆してもよい。   The main conductor layer is preferably made of at least one of gold (Au), Cu, Ni, and silver (Ag) having a low electric resistance, and the thickness is preferably about 0.1 to 5 μm. If the thickness of the main conductor layer is less than 0.1 μm, the electric resistance tends to be large and the electric resistance required for the wiring conductor of the wiring board 1 tends not to be satisfied. Therefore, the main conductor layer tends to be easily peeled off from the diffusion preventing layer. Further, since Cu is easily oxidized, a protective layer made of Ni and Au may be coated thereon.

信号端子２は、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属から成る。例えば信号端子２がＦｅ−Ｎｉ−Ｃｏ合金から成る場合は、Ｆｅ−Ｎｉ−Ｃｏ合金のインゴット（塊）に圧延加工や打ち抜き加工あるいは引き抜き加工や押し出し加工等の周知の金属加工方法を施すことによって、長さが1.5〜22ｍｍで直径が0.1〜１ｍｍの線状に製作される。信号端子２の強度を確保しながら、基体４に形成された貫通孔４ｃに充填された封止材５を貫通して固定した状態でより高いインピーダンスでのマッチングを行ないつつ小型にするには、信号端子２の直径は0.15〜0.6ｍｍが好ましい。信号端子２の直径が0.15ｍｍより細くなると、電子部品搭載用パッケージを実装する場合の取り扱いで信号端子２が曲がりやすくなり、作業性が低下しやすくなる。また、直径が0.6ｍｍより太くなると、インピーダンス整合させた場合の貫通孔１ｃの径が信号端子２の径に伴い大きくなるので、製品の小型化に向かないものとなってしまう。   The signal terminal 2 is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy. For example, when the signal terminal 2 is made of an Fe—Ni—Co alloy, a known metal working method such as rolling, stamping, drawing or extruding is applied to the ingot of the Fe—Ni—Co alloy. It is manufactured in a linear shape with a length of 1.5-22 mm and a diameter of 0.1-1 mm. In order to make the signal terminal 2 small while performing matching with a higher impedance in a state where the sealing material 5 filled in the through hole 4c formed in the base body 4 is fixed while securing the strength of the signal terminal 2, The diameter of the signal terminal 2 is preferably 0.15 to 0.6 mm. When the diameter of the signal terminal 2 is smaller than 0.15 mm, the signal terminal 2 is easily bent by handling when mounting the electronic component mounting package, and the workability is easily lowered. On the other hand, if the diameter is larger than 0.6 mm, the diameter of the through hole 1c when impedance matching is increased with the diameter of the signal terminal 2, which is not suitable for downsizing of the product.

また、図５および図６に図３と同様の断面図で示すように、信号端子２は、貫通孔１ｃから突出した部分において配線基板１の側面側から見て信号線路導体１ｂとの接続部側の端部にかけて細くなる（厚みが薄くなる）形状であるのが好ましい。このような形状にすると、信号端子２の端部におけるインピーダンスの変化が緩やかになるとともに、十分な接合強度が得られるようなろう材３のフィレット形状にしても、信号線路導体１ｂの上のろう材３の厚みを薄くすることができるので、インピーダンスの低下がより少なくなり、高周波信号の反射損失が小さく伝送特性が良好な接続構造とすることができる。また、信号線路導体１ｂの上のろう材３の厚みを薄くしつつ、信号端子２とろう材３とが接続される面積を増加させることができるので、信号端子２と信号線路導体１ｂとの接続強度が向上し、接続信頼性に優れた接続構造とすることができる。   5 and 6, the signal terminal 2 is connected to the signal line conductor 1b when viewed from the side of the wiring board 1 at a portion protruding from the through hole 1c. A shape that becomes thinner (thinner thickness is reduced) is preferable. With such a shape, the change in impedance at the end of the signal terminal 2 becomes gradual, and the brazing material 3 has a fillet shape so that sufficient bonding strength can be obtained. Since the thickness of the material 3 can be reduced, it is possible to obtain a connection structure in which the decrease in impedance is reduced, the reflection loss of high-frequency signals is small, and the transmission characteristics are good. Moreover, since the area where the signal terminal 2 and the brazing material 3 are connected can be increased while reducing the thickness of the brazing material 3 on the signal line conductor 1b, the signal terminal 2 and the signal line conductor 1b can be connected to each other. The connection strength is improved, and a connection structure with excellent connection reliability can be obtained.

図５および図６に示す例のように、配線基板１の側面側から見て信号端子２の中心と信号線路導体１ｂの上面とが重なるように配置されている場合は、信号端子２の端部を上下から中心に向かって同程度薄くなるようにすればよい。信号端子２の中心が信号線路導体１ｂの上面とずれて配置される場合は、信号端子２の上下から信号線路導体１ｂの上面に向かって薄くなるようにすればよい。   5 and 6, when the center of the signal terminal 2 and the upper surface of the signal line conductor 1 b overlap with each other when viewed from the side of the wiring board 1, the end of the signal terminal 2 What is necessary is just to make a part thin about the same from the upper and lower sides toward the center. When the center of the signal terminal 2 is shifted from the upper surface of the signal line conductor 1b, the signal terminal 2 may be thinned from the upper and lower sides of the signal terminal 2 toward the upper surface of the signal line conductor 1b.

信号端子２の端部を薄くするには、線状に形成した信号端子２の端部をプレス加工や研削加工することにより可能である。   The end of the signal terminal 2 can be thinned by pressing or grinding the end of the signal terminal 2 formed in a linear shape.

図１に示すような電子部品搭載用パッケージの場合は、信号端子２を基体４に形成された貫通孔４ｃに充填された封止材５を貫通して固定し、例えば金−ゲルマニウム（Ａｕ−Ｇｅ）合金で配線基板１を搭載部４ａ上に接合して搭載した後に、信号端子２と信号線路導体１ｂとをろう材３で接続する。   In the case of a package for mounting an electronic component as shown in FIG. 1, the signal terminal 2 is fixed by penetrating a sealing material 5 filled in a through hole 4c formed in the base 4 and, for example, gold-germanium (Au— After the wiring board 1 is bonded and mounted on the mounting portion 4 a with a Ge) alloy, the signal terminal 2 and the signal line conductor 1 b are connected by the brazing material 3.

配線基板１と信号端子２との距離はできるだけ小さくする（例えば0.15ｍｍ以下）と、損失が小さくなるので好ましい。この場合は、例えば、信号線路導体１ｂと信号端子２との間をつなぐようにろう材３として金−錫（Ａｕ−Ｓｎ）合金等の半田のペーストをシリンジで塗布するか、金−錫合金半田リボンを載置した後に、窒素中で半田が溶融する330℃程度まで加熱することで接続できる。一方、配線基板１と信号端子２との距離が大きい場合には、信号線路導体１ｂおよび信号端子２のそれぞれの接合部側の端部に予めろう材３として金−錫合金を形成しておき、それらをつなぐようにして同じくろう材３として金−錫合金等から成る半田リボンを載置し、窒素中で金錫合金半田が溶融する330℃程度まで加熱することで接続できる。このとき、予め形成しておく金−錫合金を共晶組成にしておき、金−錫合金半田リボンを共晶温度より高い温度で溶融する組成にしておくと、両方の端をなだらかな形状にして接続できるので、高周波特性のよい接続部とすることができる。信号線路導体１ｂおよび信号端子２の端部に予め金−錫合金を形成するには、これらの上にそれぞれ金−錫合金半田のペーストを塗布して加熱することにより行なえばよい。   It is preferable to make the distance between the wiring board 1 and the signal terminal 2 as small as possible (for example, 0.15 mm or less) because loss is reduced. In this case, for example, a solder paste such as a gold-tin (Au—Sn) alloy is applied as a brazing material 3 with a syringe so as to connect between the signal line conductor 1 b and the signal terminal 2, or a gold-tin alloy. After placing the solder ribbon, it can be connected by heating to about 330 ° C. where the solder melts in nitrogen. On the other hand, when the distance between the wiring board 1 and the signal terminal 2 is large, a gold-tin alloy is previously formed as the brazing material 3 at the end of each of the signal line conductor 1b and the signal terminal 2 on the joint portion side. Similarly, a solder ribbon made of gold-tin alloy or the like is placed as the brazing material 3 so as to connect them, and can be connected by heating to about 330 ° C. at which the gold-tin alloy solder melts in nitrogen. At this time, if the gold-tin alloy previously formed has a eutectic composition and the gold-tin alloy solder ribbon is melted at a temperature higher than the eutectic temperature, both ends have a gentle shape. Therefore, it is possible to provide a connection portion with good high frequency characteristics. In order to form the gold-tin alloy in advance on the ends of the signal line conductor 1b and the signal terminal 2, it is only necessary to apply and heat a gold-tin alloy solder paste on them.

基体４は、上面の中央部に電子部品７の搭載部４ａを有するとともに搭載された電子部品７が発生する熱をパッケージの外部に放散する機能を有する。このため、基体４は、熱伝導性の良い金属から成り、搭載される電子部品７やセラミック製の配線基板１の熱膨張係数に近いものやコストの安いものとして、例えば、Ｆｅ99.6質量％−Ｍｎ0.4質量％系のＳＰＣ（Steel Plate Cold）材や、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｍｎ合金等から選ばれる。例えば基体４がＦｅ−Ｍｎ合金から成る場合は、Ｆｅ−Ｍｎ合金のインゴット（塊）に圧延加工や打ち抜き加工等の周知の金属加工方法を施すことによって所定形状に製作され、貫通孔１ｃはドリル加工や金型による打ち抜き加工により形成される。また、基体４が搭載部４ａとして突出部を有する形状の場合は、切削加工やプレス加工により形成することができる。   The base 4 has a mounting portion 4a for the electronic component 7 in the center of the upper surface and has a function of radiating heat generated by the mounted electronic component 7 to the outside of the package. For this reason, the base 4 is made of a metal having good thermal conductivity, and is close to the thermal expansion coefficient of the electronic component 7 or ceramic wiring board 1 to be mounted or has a low cost. For example, Fe 99.6% by mass -Mn 0.4 mass% SPC (Steel Plate Cold) material, Fe-Ni-Co alloy, Fe-Mn alloy, or the like. For example, when the substrate 4 is made of an Fe—Mn alloy, the ingot (lumb) of the Fe—Mn alloy is manufactured to a predetermined shape by applying a known metal processing method such as rolling or punching, and the through hole 1c is drilled. It is formed by machining or punching with a mold. Moreover, when the base | substrate 4 is a shape which has a protrusion part as the mounting part 4a, it can form by cutting or press work.

基体４の形状は、通常は厚みが0.5〜２ｍｍの平板状であり、その形状は特に制限はないが、例えば直径が３〜10ｍｍの円板状，半径が1.5〜８ｍｍの円周の一部を切り取った半円板状，一辺が３〜15ｍｍの四角板状等であり、上面から下面にかけて形成された直径が0.6〜2.65ｍｍの貫通孔１ｃを複数有する。図１〜図11に示す例では、２つの貫通孔１ｃを有する基体４に１個の電子部品７を搭載しているが、複数の電子部品７を搭載したり、電子部品７の数や電子部品７の端子の数に応じて信号端子２を固定する貫通孔１ｃを２つより多く形成したりしても構わない。   The shape of the substrate 4 is usually a flat plate having a thickness of 0.5 to 2 mm, and the shape is not particularly limited, but for example, a disk having a diameter of 3 to 10 mm and a part of a circumference having a radius of 1.5 to 8 mm. And a plurality of through holes 1c having a diameter of 0.6 to 2.65 mm formed from the upper surface to the lower surface. In the example shown in FIGS. 1 to 11, one electronic component 7 is mounted on the base 4 having two through holes 1 c, but a plurality of electronic components 7 are mounted, the number of electronic components 7, and the number of electronic components 7 Depending on the number of terminals of the component 7, more than two through holes 1c for fixing the signal terminal 2 may be formed.

基体４の厚みは0.5ｍｍ以上２ｍｍ以下が好ましい。基体４の厚みが0.5ｍｍ未満の場合は、電子部品７を保護するための金属製の蓋体９を金属製の基体４の上面に接合する際に、接合温度等の接合条件により基体４が曲がったりして変形し易くなる。一方、基体４の厚みが２ｍｍを超えると、電子部品搭載用パッケージや電子装置の厚みが不要に厚いものとなり、小型化し難くなる。   The thickness of the substrate 4 is preferably 0.5 mm or more and 2 mm or less. When the thickness of the substrate 4 is less than 0.5 mm, when the metal lid 9 for protecting the electronic component 7 is bonded to the upper surface of the metal substrate 4, the substrate 4 is bonded depending on the bonding conditions such as the bonding temperature. It becomes easy to bend and deform. On the other hand, when the thickness of the substrate 4 exceeds 2 mm, the thickness of the electronic component mounting package or the electronic device becomes unnecessarily thick, and it is difficult to reduce the size.

また、基体４の表面には、耐食性に優れ、電子部品７や配線基板１あるいは蓋体９を接合し固定するためのろう材との濡れ性に優れた、厚さが0.5〜９μｍのＮｉ層と厚さが0.5〜５μｍのＡｕ層とをめっき法により順次被着させておくのがよい。これにより、基体４が酸化腐食するのを有効に防止できるとともに、電子部品７や配線基板１あるいは蓋体９を基体４に良好にろう付けすることができる。   Further, a Ni layer having a thickness of 0.5 to 9 μm is excellent on the surface of the base body 4 with excellent corrosion resistance, excellent wettability with a brazing material for joining and fixing the electronic component 7, the wiring board 1 or the lid 9. And an Au layer having a thickness of 0.5 to 5 μm are preferably sequentially deposited by a plating method. Thereby, it is possible to effectively prevent the base 4 from being oxidatively corroded, and the electronic component 7, the wiring board 1 or the lid 9 can be brazed to the base 4 satisfactorily.

基体４に形成された貫通孔１ｃには、封止材５が充填されており、この封止材５を貫通して信号端子２が固定されている。信号端子２は、一方の端部（上端部）は基体４の上面と面一とするか、あるいは２ｍｍ程度まで突出させて固定される。信号端子２の径が小さくろう材３との接合面積が小さい場合は、信号端子２の端部を基体４の上面から突出させるのが好ましい。一方、信号端子２の他方の端部（下端部）は、外部電気回路（図示せず）に接続するために基体４の下面から１〜20ｍｍ程度突出しているのが好ましい。こうして、図１に示す例のように、信号端子２の上端部と電子部品７とを電気的に接続するとともに、信号端子２の下端部を外部電気回路（図示せず）に電気的に接続することにより、信号端子２は電子部品７と外部電気回路との間で高周波の入出力信号を伝送する機能を果たす。   A through hole 1 c formed in the base 4 is filled with a sealing material 5, and the signal terminal 2 is fixed through the sealing material 5. The signal terminal 2 is fixed with one end (upper end) being flush with the upper surface of the base 4 or protruding to about 2 mm. When the diameter of the signal terminal 2 is small and the bonding area with the brazing material 3 is small, it is preferable to project the end of the signal terminal 2 from the upper surface of the base 4. On the other hand, it is preferable that the other end (lower end) of the signal terminal 2 protrudes from the lower surface of the base 4 by about 1 to 20 mm in order to connect to an external electric circuit (not shown). Thus, as in the example shown in FIG. 1, the upper end of the signal terminal 2 and the electronic component 7 are electrically connected, and the lower end of the signal terminal 2 is electrically connected to an external electric circuit (not shown). Thus, the signal terminal 2 functions to transmit high-frequency input / output signals between the electronic component 7 and the external electric circuit.

封止材５は、ガラスやセラミックスなどの絶縁性の無機材料から成り、信号端子２と基体４との絶縁間隔を確保するとともに、信号端子２を基体４の貫通孔１ｃ内に固定する機能を有する。このような封止材５の例としては、ホウケイ酸ガラス，ソーダガラス等のガラスおよびこれらのガラスに封止材５の熱膨張係数や比誘電率を調整するためのセラミックフィラーを加えたものが挙げられ、インピーダンスマッチングのためにその比誘電率を適宜選択する。比誘電率を低下させるフィラーとしては、酸化リチウム等が挙げられる。例えば、特性インピーダンスを50Ωとするには、貫通孔１ｃの内径が1.75ｍｍで信号端子２の外径が0.2ｍｍの場合、あるいは貫通孔１ｃの内径が2.2ｍｍで信号端子２の外径が0.25ｍｍの場合であれば、封止材５の比誘電率が6.8であるものを用いればよい。また、貫通孔１ｃの内径が1.65ｍｍで信号端子２の外径が0.25ｍｍの場合であれば、封止材５の比誘電率が５であるものを用いればよい。   The sealing material 5 is made of an insulating inorganic material such as glass or ceramics, and has a function of securing an insulating interval between the signal terminal 2 and the base 4 and fixing the signal terminal 2 in the through hole 1 c of the base 4. Have. Examples of such a sealing material 5 include glass such as borosilicate glass and soda glass, and those added with a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of the sealing material 5. The relative dielectric constant is appropriately selected for impedance matching. Examples of the filler that lowers the dielectric constant include lithium oxide. For example, in order to set the characteristic impedance to 50Ω, the inner diameter of the through hole 1c is 1.75 mm and the outer diameter of the signal terminal 2 is 0.2 mm, or the inner diameter of the through hole 1c is 2.2 mm and the outer diameter of the signal terminal 2 is 0.25. In the case of mm, the sealing material 5 having a relative dielectric constant of 6.8 may be used. Further, when the inner diameter of the through hole 1c is 1.65 mm and the outer diameter of the signal terminal 2 is 0.25 mm, the sealing material 5 having a relative dielectric constant of 5 may be used.

信号端子２を貫通孔１ｃに充填された封止材５を貫通して固定するには、例えば、封止材５がガラスから成る場合は、周知の粉体プレス法や押し出し成形法を用いてガラス粉末を成形して、内径を信号端子２の外径に合わせ、外径を貫通孔１ｃの内径に合わせた筒状の成形体を作製し、この封止材５の成形体を貫通孔１ｃに挿入し、さらに信号端子２をこの封止材５の孔に挿通し、しかる後、所定の温度に加熱して封止材５を溶融させた後、冷却して固化させることにより行なうことができる。これにより、封止材５により貫通孔１ｃが気密に封止されるとともに、封止材５によって信号端子２が基体４と絶縁されて固定され、同軸線路が形成される。   To fix the signal terminal 2 through the sealing material 5 filled in the through hole 1c, for example, when the sealing material 5 is made of glass, a known powder pressing method or extrusion molding method is used. A glass powder is molded to make a cylindrical molded body whose inner diameter is matched with the outer diameter of the signal terminal 2 and whose outer diameter is matched with the inner diameter of the through hole 1c, and the molded body of the sealing material 5 is formed into the through hole 1c. The signal terminal 2 is inserted into the hole of the sealing material 5 and then heated to a predetermined temperature to melt the sealing material 5 and then cooled and solidified. it can. Thus, the through hole 1c is hermetically sealed by the sealing material 5, and the signal terminal 2 is insulated and fixed by the sealing material 5 from the base body 4, thereby forming a coaxial line.

接地端子６は、信号端子２と同じ様にして製作され、基体４の下面にろう材等を用いて接合される。図２に示す例のように、位置決めの容易性と接合強度の向上のために、予め基体４の下面に穴を形成しておき、その穴に接地端子６を挿入して接合してもよい。また、同様の理由で、図２に示す例のように、基体４の下面に当接するように接地端子６に鍔をつけて、接合面積をより大きくしてもよい。このようにして基体４に接地端子６を接合することにより、接続端子４を外部電気回路に接続した際には、基体４が接地導体としても機能する。   The ground terminal 6 is manufactured in the same manner as the signal terminal 2 and is joined to the lower surface of the base 4 using a brazing material or the like. As in the example shown in FIG. 2, in order to facilitate positioning and improve the bonding strength, a hole may be formed in the lower surface of the base 4 in advance, and the ground terminal 6 may be inserted into the hole for bonding. . Further, for the same reason, as in the example shown in FIG. 2, the grounding terminal 6 may be provided with a ridge so as to be in contact with the lower surface of the base body 4 to increase the bonding area. By bonding the ground terminal 6 to the base body 4 in this way, the base body 4 also functions as a ground conductor when the connection terminal 4 is connected to an external electric circuit.

このような本発明の電子部品搭載用パッケージの搭載部４ａに配線基板１を介して電子部品７を搭載するとともに、基体４の接合部４ｄに蓋体９を接合することにより、本発明の電子装置となる。   The electronic component 7 is mounted on the mounting portion 4a of the electronic component mounting package of the present invention via the wiring board 1, and the lid 9 is bonded to the bonding portion 4d of the base 4 to thereby provide the electronic component of the present invention. It becomes a device.

電子部品７としては、ＬＤ（レーザーダイオード）やＰＤ（フォトダイオ−ド）等の光半導体素子，半導体集積回路素子を含む半導体素子，水晶振動子や弾性表面波素子等の圧電素子，圧力センサー素子，容量素子，抵抗器等が挙げられる。   Examples of the electronic component 7 include optical semiconductor elements such as LD (laser diode) and PD (photodiode), semiconductor elements including semiconductor integrated circuit elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, and pressure sensor elements. , Capacitive elements, resistors and the like.

電子部品７の電子部品搭載用パッケージや配線基板１への搭載、あるいは配線基板１の電子部品搭載用パッケージへの搭載は、低融点ろう材により固定することにより行なえばよい。例えば、配線基板１を基体４上に搭載した後に電子部品７を配線基板１上に搭載する場合は、配線基板１の固定には金−錫（Ａｕ−Ｓｎ）合金や金−ゲルマニウム（Ａｕ−Ｇｅ）合金をろう材として用い、電子部品７の固定には、これらより融点の低い錫−銀（Ｓｎ−Ａｇ）合金や錫−銀−銅（Ｓｎ−Ａｇ−Ｃｕ）合金のろう材や、融点より低い温度で硬化可能な、Ａｇエポキシ等の樹脂製の接着剤を用いればよい。また、電子部品７を配線基板１上に搭載した後に配線基板１を基体４上に搭載してもよく、その場合は上記とは逆に、配線基板１を基体４上に搭載する際に用いるろう材の融点の方を低くすればよい。いずれの場合であっても、配線基板１上や基体４の搭載部４ａ上にろう材ペーストを周知のスクリーン印刷法を用いて印刷したり、フォトリソグラフィ法によってろう材層を形成したり、低融点ろう材のプリフォームを載置するなどすればよい。   The mounting of the electronic component 7 on the electronic component mounting package or the wiring substrate 1 or the mounting of the wiring substrate 1 on the electronic component mounting package may be performed by fixing with a low melting point brazing material. For example, when the electronic component 7 is mounted on the wiring board 1 after mounting the wiring board 1 on the base body 4, a gold-tin (Au—Sn) alloy or gold-germanium (Au—) is used to fix the wiring board 1. A Ge) alloy is used as a brazing material, and for fixing the electronic component 7, a brazing material of a tin-silver (Sn-Ag) alloy or a tin-silver-copper (Sn-Ag-Cu) alloy having a lower melting point than these, A resin adhesive such as Ag epoxy that can be cured at a temperature lower than the melting point may be used. Further, after mounting the electronic component 7 on the wiring board 1, the wiring board 1 may be mounted on the base 4. In this case, contrary to the above, it is used when mounting the wiring board 1 on the base 4. The melting point of the brazing material may be lowered. In any case, a brazing material paste is printed on the wiring substrate 1 or the mounting portion 4a of the base 4 by using a well-known screen printing method, a brazing material layer is formed by a photolithography method, etc. A preform of a melting point brazing material may be placed.

蓋体９は、平面視で基体４の上面の外周領域の接合部４ｄの形状に沿った外形で、基体４の上面の搭載部４ａに搭載された配線基板１および電子部品７を覆うような空間を有する形状のものである。蓋体９には、電子部品７と対向する部分に光を透過させる窓を設けてもよいし、窓に換えて、または窓に加えて光ファイバおよび戻り光防止用の光アイソレータを接合したものでもよい。   The lid 9 has an outer shape along the shape of the joint portion 4d in the outer peripheral area of the upper surface of the base body 4 in plan view so as to cover the wiring substrate 1 and the electronic component 7 mounted on the mounting portion 4a on the upper surface of the base body 4. The shape has a space. The lid 9 may be provided with a window that transmits light at a portion facing the electronic component 7, or an optical fiber and an optical isolator for preventing return light joined in place of or in addition to the window But you can.

蓋体９は、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金、Ｆｅ−Ｍｎ合金等の金属から成り、これらの板材にプレス加工や打ち抜き加工等の周知の金属加工方法を施すことによって作製される。蓋体９は、基体４の材料と同程度の熱膨張係数を有するものが好ましく、基体４の材料と同じものを用いるのがより好ましい。蓋体９が窓を有する場合は、電子部品７と対向する部分に孔を設けたものに、平板状やレンズ状のガラス製の窓部材を低融点ガラスなどにより接合する。   The lid body 9 is made of a metal such as an Fe—Ni—Co alloy, an Fe—Ni alloy, or an Fe—Mn alloy, and is produced by subjecting these plate materials to a known metal working method such as press working or punching. . The lid 9 preferably has the same thermal expansion coefficient as the material of the base 4, and more preferably the same as the material of the base 4. When the lid 9 has a window, a plate-like or lens-like glass window member is joined to a member provided with a hole in the portion facing the electronic component 7 with a low melting point glass or the like.

蓋体９の基体４の接合部４ｄへの接合は、シーム溶接やＹＡＧレーザ溶接等の溶接またはＡｕ−Ｓｎろう材等のろう材によるろう付け等のろう接により行なわれる。   The lid 9 is joined to the joint 4d of the base body 4 by welding such as seam welding or YAG laser welding or brazing using a brazing material such as an Au-Sn brazing material.

なお、本発明は上述の最良の形態および実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更を行なうことは何等差し支えない。   Note that the present invention is not limited to the above-described best modes and examples, and various modifications may be made without departing from the scope of the present invention.

例えば、以上の例では、図１〜図11に示すような円形の金属ステムを用いた電子部品搭載用パッケージを例として説明したが、本発明の電子部品搭載用パッケージは図12〜図14に示すような箱型の電子部品搭載用パッケージでも構わない。図12は本発明の電子部品搭載用パッケージの実施の形態の他の一例を示す斜視図であり、図13は図12におけるＡ−Ａ線で切断した断面の一例を示す断面図であり、図14は図13におけるＢ部（接続部）を拡大した断面図である。図12〜図14において、４ｅは基体４の枠部、４ｆは基体４の筒状部、５ａは管状部材、10は透光性部材である。   For example, in the above example, the electronic component mounting package using the circular metal stem as shown in FIGS. 1 to 11 has been described as an example. However, the electronic component mounting package of the present invention is illustrated in FIGS. It may be a box-type electronic component mounting package as shown. 12 is a perspective view showing another example of the embodiment of the electronic component mounting package of the present invention, and FIG. 13 is a cross-sectional view showing an example of a cross section taken along the line AA in FIG. 14 is an enlarged cross-sectional view of a portion B (connection portion) in FIG. 12 to 14, 4 e is a frame portion of the base 4, 4 f is a cylindrical portion of the base 4, 5 a is a tubular member, and 10 is a translucent member.

図12〜図14に示す例の電子部品搭載用パッケージは、基体４の上には搭載部４ａが設けられ、この搭載部４ａを囲むように搭載部４ａの搭載面４ｂに略垂直な枠部４ｅが設けられている。配線基板１は搭載部４ａの搭載面４ｂの上に搭載され、信号端子２は枠部４ｅに形成された貫通孔４ｃ内に固定されている。そして、この信号端子２と配線基板１の主面上の信号線路導体１ｂとがろう材３により電気的に接続され、本発明の信号端子２と信号線路導体１ｂとの接続構造となっている。   In the example of the electronic component mounting package shown in FIGS. 12 to 14, a mounting portion 4a is provided on the base 4, and a frame portion that is substantially perpendicular to the mounting surface 4b of the mounting portion 4a so as to surround the mounting portion 4a. 4e is provided. The wiring board 1 is mounted on the mounting surface 4b of the mounting portion 4a, and the signal terminal 2 is fixed in a through hole 4c formed in the frame portion 4e. And this signal terminal 2 and the signal line conductor 1b on the main surface of the wiring board 1 are electrically connected by the brazing material 3, and it has the connection structure of the signal terminal 2 and the signal line conductor 1b of this invention. .

枠部４ｅは、基体４と同様の金属のインゴットを圧延加工，打ち抜き加工，切削加工など周知の金属加工法を用いて作製した枠体を銀ろう等の接合材で基体４に接合することにより形成される。また、例えばメタル・インジェクション・モールド法等によって枠部４ｅを基体４と一体的に形成してもよい。   The frame portion 4e is obtained by joining a frame body made of a metal ingot similar to that of the base body 4 using a known metal working method such as rolling, punching, cutting, etc., to the base body 4 with a joining material such as silver brazing. It is formed. Further, the frame portion 4e may be formed integrally with the base body 4 by, for example, a metal injection molding method or the like.

枠部４ｅの貫通孔４ｃが形成された壁と対向する壁にも内面から外面にかけて貫通孔が設けられており、枠部４ｅの外面にはこの貫通孔と内部がつながった筒状部４ｆが形成されている。この筒状部４ｆ内には、ホウ珪酸ガラスや鉛系ガラス等の非晶質ガラスやサファイアから成る、球状，半球状，凸レンズ状，ロッドレンズ状等の透光性部材10が固定されている。筒状部４ｆは、基体４と同様の金属からなる筒状体を銀ろう等の接合材で枠部４ｅに固定して形成する。   A through hole is also provided from the inner surface to the outer surface on the wall facing the wall in which the through hole 4c of the frame portion 4e is formed, and a cylindrical portion 4f that connects the through hole and the inside is formed on the outer surface of the frame portion 4e. Is formed. A translucent member 10 made of amorphous glass such as borosilicate glass or lead glass or sapphire, such as spherical, hemispherical, convex lens, or rod lens, is fixed in the cylindrical portion 4f. . The cylindrical portion 4f is formed by fixing a cylindrical body made of the same metal as the base 4 to the frame portion 4e with a bonding material such as silver solder.

信号端子２は、外周導体となる基体４と同様の金属製の管状部材５ａ内に充填された封止材５の中心を貫通することにより同軸コネクタを形成しており、これを貫通孔４ｃ内に嵌着して金−錫合金半田等の接合材により枠部４ｅに接合することで固定されている。管状部材５ａの孔の断面形状は円形であり、外形は特に制限はなく、円形や四角形等の多角形でもよい。信号端子２の端部を薄くする場合は、管状部材５ａの外形を多角形状にしておくと、同軸コネクタを貫通孔４ｃ内に固定する際に管状部材５ａごと信号端子２が回転することがないので、信号端子２の端部の厚みが薄くなる方向がずれてしまうことがないのでよい。   The signal terminal 2 forms a coaxial connector by penetrating through the center of the sealing material 5 filled in the metal tubular member 5a similar to the base 4 serving as the outer conductor, and this is formed in the through hole 4c. And fixed to the frame portion 4e by a bonding material such as gold-tin alloy solder. The cross-sectional shape of the hole of the tubular member 5a is circular, and the outer shape is not particularly limited, and may be a polygon such as a circle or a rectangle. When the end of the signal terminal 2 is made thin, if the outer shape of the tubular member 5a is made polygonal, the signal terminal 2 will not rotate together with the tubular member 5a when the coaxial connector is fixed in the through hole 4c. Therefore, the direction in which the thickness of the end portion of the signal terminal 2 is reduced is not shifted.

図12〜図14に示す例の場合の配線基板１は、図１に示す例の配線基板１と同様にして作製されるが、配線基板１の一方の主面には電子部品７は搭載されないので信号線路導体１ｂのみが形成され、この信号線路導体１ｂと接地導体として機能する他方の主面側の搭載用導体１ｄとでマイクロストリップ線路を構成している。   The wiring board 1 in the case of the example shown in FIGS. 12 to 14 is manufactured in the same manner as the wiring board 1 in the example shown in FIG. 1, but the electronic component 7 is not mounted on one main surface of the wiring board 1. Therefore, only the signal line conductor 1b is formed, and the signal line conductor 1b and the mounting conductor 1d on the other main surface functioning as a ground conductor constitute a microstrip line.

基体４の搭載部ａの上に電子部品７を搭載し、電子部品７の端子と配線基板１の信号線路導体１ｂとをボンディングワイヤ８で接続するとともに、枠状部４ｅの上面の接合部４ｄに蓋体９を接合することにより、本発明の電子装置となる。この場合の電子部品７はＬＤやＰＤ等の光半導体素子であり、透光性部材10を通して外部回路との光信号の入出力が行なわれる。筒状部４ｆの外側の端面には、例えば、外部回路に接続される光アイソレータと光ファイバとが樹脂接着剤で接着された金属ホルダが、ＹＡＧレーザ溶接等により固定される。   The electronic component 7 is mounted on the mounting portion a of the base 4, the terminal of the electronic component 7 and the signal line conductor 1 b of the wiring substrate 1 are connected by the bonding wire 8, and the joint portion 4 d on the upper surface of the frame-like portion 4 e. The lid 9 is joined to the electronic device of the present invention. The electronic component 7 in this case is an optical semiconductor element such as an LD or PD, and an optical signal is input / output to / from an external circuit through the translucent member 10. For example, a metal holder in which an optical isolator connected to an external circuit and an optical fiber are bonded with a resin adhesive is fixed to the outer end face of the cylindrical portion 4f by YAG laser welding or the like.

この例では電子部品７は基体４の搭載部４ａに直接搭載されているが、これは電子部品７で発生した熱を金属製の基体４の搭載部４ａを通して外部へ放熱するためである。電子部品７の発熱が大きい場合は、電子部品７（および配線基板１）と搭載部４ａとの間にペルチェ素子等を搭載して、電子部品７を冷却するようにしてもよい。   In this example, the electronic component 7 is directly mounted on the mounting portion 4 a of the base 4, which is to radiate the heat generated in the electronic component 7 to the outside through the mounting portion 4 a of the metallic base 4. When the heat generation of the electronic component 7 is large, a Peltier element or the like may be mounted between the electronic component 7 (and the wiring board 1) and the mounting portion 4a to cool the electronic component 7.

本発明の電子部品搭載用パッケージの実施の形態の一例を示す斜視図である。It is a perspective view which shows an example of embodiment of the electronic component mounting package of this invention. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component mounting package of this invention. 図２のＢ部を拡大した断面図である。It is sectional drawing to which the B section of FIG. 2 was expanded. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component mounting package of this invention. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component mounting package of this invention. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component mounting package of this invention. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component mounting package of this invention. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component mounting package of this invention. 図８のＡ−Ａ線切断面側から見た側面図である。It is the side view seen from the AA line cut surface side of FIG. 図８のＡ−Ａ線切断面側から見た側面図である。It is the side view seen from the AA line cut surface side of FIG. 図８のＡ−Ａ線切断面側から見た側面図である。It is the side view seen from the AA line cut surface side of FIG. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す斜視図である。It is a perspective view which shows an example of embodiment of the electronic component mounting package of this invention. 本発明の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component mounting package of this invention. 図１３のＢ部を拡大した断面図である。It is sectional drawing to which the B section of FIG. 13 was expanded. 従来の電子部品搭載用パッケージの実施の形態の一例を示す斜視図である。It is a perspective view which shows an example of embodiment of the conventional electronic component mounting package. 従来の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the conventional electronic component mounting package. 従来の電子部品搭載用パッケージの実施の形態の一例を示す斜視図である。It is a perspective view which shows an example of embodiment of the conventional electronic component mounting package. 従来の電子部品搭載用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the conventional electronic component mounting package.

符号の説明Explanation of symbols

１・・・・・配線基板
１ａ・・・・基板
１ｂ・・・・信号線路導体
１ｃ・・・・接地用導体
１ｄ・・・・搭載用導体
１ｅ・・・・傾斜面
１ｆ・・・・側面導体
２・・・・・信号端子
３・・・・・ろう材
４・・・・・基体
４ａ・・・・搭載部
４ｂ・・・・搭載面
４ｃ・・・・貫通孔
４ｄ・・・・接合部
４ｅ・・・・枠部
５・・・・・封止材
６・・・・・接地端子
７・・・・・電子部品
８・・・・・ボンディングワイヤ
９・・・・・蓋体 DESCRIPTION OF SYMBOLS 1 ... Wiring board 1a ... Circuit board 1b ... Signal line conductor 1c ... Grounding conductor 1d ... Mounting conductor 1e ... Inclined surface 1f ... Side conductor 2... Signal terminal 3... Brazing material 4... Base 4 a... Mounting portion 4 b... Mounting surface 4 c.・ Joint part 4e ・ ・ ・ ・ Frame part 5 ・ ・ ・ Sealing material 6 ・ ・ ・ ・ ・ Grounding terminal 7 ・ ・ ・ ・ ・ Electronic component 8 ・ ・ ・ ・ ・ Bonding wire 9 ・ ・ ・ Lid body

Claims (6)

高周波信号を伝送する線状の導体からなる信号端子が、配線基板の一方の主面に基板の外辺まで形成された信号線路導体に、一方の主面側から見て前記信号端子と前記信号線路導体とが上下に重ならずに同一線上に配置され、前記配線基板の側面側から見て前記信号端子と前記配線基板とが重なるように配置されてろう材により接続されていることを特徴とする信号端子と信号線路導体との接続構造。 A signal terminal made of a linear conductor for transmitting a high-frequency signal is connected to the signal line conductor formed on one main surface of the wiring board up to the outer side of the substrate, and the signal terminal and the signal as viewed from one main surface side. The line conductor is arranged on the same line without overlapping vertically, and the signal terminal and the wiring board are arranged so as to overlap each other when viewed from the side of the wiring board and are connected by a brazing material. A connection structure between a signal terminal and a signal line conductor. 前記基板は、前記一方の主面の前記外辺に他方の主面側に傾斜している傾斜面を有しており、前記信号線路導体は前記傾斜面まで延在していることを特徴とする請求項１記載の信号端子と信号線路導体との接続構造。 The substrate has an inclined surface inclined toward the other main surface side on the outer side of the one main surface, and the signal line conductor extends to the inclined surface. The connection structure between the signal terminal and the signal line conductor according to claim 1. 前記配線基板の側面側から見て前記信号端子の中心と前記信号線路導体の上面とが重なるように配置されていることを特徴とする請求項１または請求項２に記載の信号端子と信号線路導体との接続構造。 3. The signal terminal and the signal line according to claim 1, wherein the signal terminal and the signal line are arranged so that a center of the signal terminal and an upper surface of the signal line conductor overlap each other when viewed from a side surface side of the wiring board. Connection structure with conductor. 前記信号端子が対向する前記基板の側面に側面導体が形成されており、該側面導体に前記信号端子が前記ろう材により接続されていることを特徴とする請求項１乃至請求項３のいずれかに記載の信号端子と信号線路導体との接続構造。 The side surface conductor is formed in the side surface of the said board | substrate which the said signal terminal opposes, The said signal terminal is connected to this side surface conductor by the said brazing | wax material, The one of Claim 1 thru | or 3 characterized by the above-mentioned. A connection structure between the signal terminal and the signal line conductor described in 1. 請求項１乃至請求項４のいずれかに記載の信号端子と信号線路導体との接続構造を有することを特徴とする電子部品搭載用パッケージ。 5. An electronic component mounting package comprising a connection structure between the signal terminal according to claim 1 and a signal line conductor. 請求項５に記載の電子部品搭載用パッケージに電子部品が実装されて前記信号線路導体に接続されていることを特徴とする電子装置。 An electronic device, wherein an electronic component is mounted on the electronic component mounting package according to claim 5 and connected to the signal line conductor.
JP2008042362A 2007-08-29 2008-02-25 Connection structure between signal terminal and signal line conductor, electronic component mounting package and electronic device Expired - Fee Related JP5004824B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008042362A JP5004824B2 (en) 2007-08-29 2008-02-25 Connection structure between signal terminal and signal line conductor, electronic component mounting package and electronic device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007222970 2007-08-29
JP2007222970 2007-08-29
JP2008042362A JP5004824B2 (en) 2007-08-29 2008-02-25 Connection structure between signal terminal and signal line conductor, electronic component mounting package and electronic device

Publications (2)

Publication Number Publication Date
JP2009077365A true JP2009077365A (en) 2009-04-09
JP5004824B2 JP5004824B2 (en) 2012-08-22

Family

ID=40611876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008042362A Expired - Fee Related JP5004824B2 (en) 2007-08-29 2008-02-25 Connection structure between signal terminal and signal line conductor, electronic component mounting package and electronic device

Country Status (1)

Country Link
JP (1) JP5004824B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061750A (en) * 2009-09-15 2011-03-24 Nippon Telegr & Teleph Corp <Ntt> Connection method and structure for high-frequency line, and package having the structure
JP2011119634A (en) * 2009-10-28 2011-06-16 Kyocera Corp Package for electronic component mounting, and electronic device using the same
JP2016225457A (en) * 2015-05-29 2016-12-28 新光電気工業株式会社 Stem for semiconductor device and semiconductor device
WO2019082602A1 (en) * 2017-10-26 2019-05-02 京セラ株式会社 Bonding structure, semiconductor package and semiconductor device
WO2020158928A1 (en) * 2019-01-31 2020-08-06 京セラ株式会社 Electronic component mounting package, and electronic device
WO2021166073A1 (en) * 2020-02-18 2021-08-26 三菱電機株式会社 To-can type optical semiconductor module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257510A (en) * 2000-03-14 2001-09-21 Japan Aviation Electronics Industry Ltd Coaxial connector strip line hermetic seal structure
JP2003258403A (en) * 2002-03-01 2003-09-12 Ryowa Denshi Kk High-frequency transmission line connection system and method therefor
JP2006186678A (en) * 2004-12-27 2006-07-13 Mitsubishi Electric Corp High-output amplifier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257510A (en) * 2000-03-14 2001-09-21 Japan Aviation Electronics Industry Ltd Coaxial connector strip line hermetic seal structure
JP2003258403A (en) * 2002-03-01 2003-09-12 Ryowa Denshi Kk High-frequency transmission line connection system and method therefor
JP2006186678A (en) * 2004-12-27 2006-07-13 Mitsubishi Electric Corp High-output amplifier

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061750A (en) * 2009-09-15 2011-03-24 Nippon Telegr & Teleph Corp <Ntt> Connection method and structure for high-frequency line, and package having the structure
JP2011119634A (en) * 2009-10-28 2011-06-16 Kyocera Corp Package for electronic component mounting, and electronic device using the same
JP2016225457A (en) * 2015-05-29 2016-12-28 新光電気工業株式会社 Stem for semiconductor device and semiconductor device
WO2019082602A1 (en) * 2017-10-26 2019-05-02 京セラ株式会社 Bonding structure, semiconductor package and semiconductor device
CN111316425A (en) * 2017-10-26 2020-06-19 京瓷株式会社 Bonded structure, semiconductor package, and semiconductor device
JPWO2019082602A1 (en) * 2017-10-26 2020-11-12 京セラ株式会社 Bonded structures, semiconductor packages and semiconductor devices
CN111316425B (en) * 2017-10-26 2024-02-06 京瓷株式会社 Bonding structure, semiconductor package, and semiconductor device
WO2020158928A1 (en) * 2019-01-31 2020-08-06 京セラ株式会社 Electronic component mounting package, and electronic device
WO2021166073A1 (en) * 2020-02-18 2021-08-26 三菱電機株式会社 To-can type optical semiconductor module
JPWO2021166073A1 (en) * 2020-02-18 2021-08-26

Also Published As

Publication number Publication date
JP5004824B2 (en) 2012-08-22

Similar Documents

Publication Publication Date Title
JP5537673B2 (en) Electronic component mounting package and electronic device using the same
JP5473583B2 (en) Electronic component mounting package and electronic device using the same
JP5409432B2 (en) Electronic component mounting package and electronic device using the same
JP2010062512A (en) Package for mounting electronic component, and electronic apparatus using the same
JP4874298B2 (en) Connection structure between signal terminal and signal line conductor, electronic component mounting package and electronic device
JP2009152520A (en) Connection structure between signal terminal and signal line conductor, electronic component mounting package, and electronic apparatus
JP2016189431A (en) Package for mounting electronic component and electronic component using the same
JP5004824B2 (en) Connection structure between signal terminal and signal line conductor, electronic component mounting package and electronic device
JP5127475B2 (en) Connection board and electronic device
JP5616178B2 (en) Electronic component mounting package and communication module
JP6412274B2 (en) Electronic component mounting package and electronic device using the same
JP5312358B2 (en) Electronic component mounting package and electronic device using the same
JP2010245507A (en) Package for mounting electronic component thereon, and electronic device using the same
JP6431441B2 (en) Electronic component mounting package and electronic device using the same
JP2009054982A (en) Package for mounting electronic component, and electronic equipment using the same
JP5361609B2 (en) Electronic component mounting package and electronic device
JP5361637B2 (en) Electronic component mounting package and electronic device using the same
JP6849670B2 (en) Semiconductor package and semiconductor device using it
JP5404484B2 (en) Electronic component mounting package and electronic device using the same
JP5705491B2 (en) Electronic component mounting package and electronic device using the same
JP5460089B2 (en) Electronic component mounting package and electronic device using the same
JP2011114104A (en) Sub-mount and electronic device using the same
JP2009054750A (en) Package for mounting electronic component, and electronic equipment using the same
JP2012227482A (en) Electronic component mounting package and electronic device using the same
JP2009158520A (en) Connection substrate and electronic device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100915

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110826

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110920

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111117

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120424

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120522

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150601

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5004824

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees