JPWO2021166073A1 - - Google Patents

Info

Publication number
JPWO2021166073A1
JPWO2021166073A1 JP2020547237A JP2020547237A JPWO2021166073A1 JP WO2021166073 A1 JPWO2021166073 A1 JP WO2021166073A1 JP 2020547237 A JP2020547237 A JP 2020547237A JP 2020547237 A JP2020547237 A JP 2020547237A JP WO2021166073 A1 JPWO2021166073 A1 JP WO2021166073A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020547237A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021166073A1 publication Critical patent/JPWO2021166073A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
JP2020547237A 2020-02-18 2020-02-18 Pending JPWO2021166073A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/006307 WO2021166073A1 (en) 2020-02-18 2020-02-18 To-can type optical semiconductor module

Publications (1)

Publication Number Publication Date
JPWO2021166073A1 true JPWO2021166073A1 (en) 2021-08-26

Family

ID=77390707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020547237A Pending JPWO2021166073A1 (en) 2020-02-18 2020-02-18

Country Status (2)

Country Link
JP (1) JPWO2021166073A1 (en)
WO (1) WO2021166073A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023109210A1 (en) * 2021-12-17 2023-06-22 青岛海信宽带多媒体技术有限公司 Optical module

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105911A1 (en) * 2003-11-14 2005-05-19 Yong-Chan Keh TO-can type optical module
JP2006216839A (en) * 2005-02-04 2006-08-17 Mitsubishi Electric Corp Optical module
JP2007150182A (en) * 2005-11-30 2007-06-14 Mitsubishi Electric Corp Stem for optical element and optical semiconductor device using the same
JP2009077365A (en) * 2007-08-29 2009-04-09 Kyocera Corp Connection structure for signal terminal and signal line conductor, electronic component mounting package and electronic apparatus
JP2009152520A (en) * 2007-11-26 2009-07-09 Kyocera Corp Connection structure between signal terminal and signal line conductor, electronic component mounting package, and electronic apparatus
JP2010062512A (en) * 2008-07-02 2010-03-18 Kyocera Corp Package for mounting electronic component, and electronic apparatus using the same
JP2011061750A (en) * 2009-09-15 2011-03-24 Nippon Telegr & Teleph Corp <Ntt> Connection method and structure for high-frequency line, and package having the structure
JP2016225457A (en) * 2015-05-29 2016-12-28 新光電気工業株式会社 Stem for semiconductor device and semiconductor device
JP2017050357A (en) * 2015-08-31 2017-03-09 日本オクラロ株式会社 Optical module
JP2018186130A (en) * 2017-04-24 2018-11-22 日本オクラロ株式会社 Optical assembly, optical module, and optical transmission system
WO2019082602A1 (en) * 2017-10-26 2019-05-02 京セラ株式会社 Bonding structure, semiconductor package and semiconductor device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105911A1 (en) * 2003-11-14 2005-05-19 Yong-Chan Keh TO-can type optical module
JP2006216839A (en) * 2005-02-04 2006-08-17 Mitsubishi Electric Corp Optical module
JP2007150182A (en) * 2005-11-30 2007-06-14 Mitsubishi Electric Corp Stem for optical element and optical semiconductor device using the same
JP2009077365A (en) * 2007-08-29 2009-04-09 Kyocera Corp Connection structure for signal terminal and signal line conductor, electronic component mounting package and electronic apparatus
JP2009152520A (en) * 2007-11-26 2009-07-09 Kyocera Corp Connection structure between signal terminal and signal line conductor, electronic component mounting package, and electronic apparatus
JP2010062512A (en) * 2008-07-02 2010-03-18 Kyocera Corp Package for mounting electronic component, and electronic apparatus using the same
JP2011061750A (en) * 2009-09-15 2011-03-24 Nippon Telegr & Teleph Corp <Ntt> Connection method and structure for high-frequency line, and package having the structure
JP2016225457A (en) * 2015-05-29 2016-12-28 新光電気工業株式会社 Stem for semiconductor device and semiconductor device
JP2017050357A (en) * 2015-08-31 2017-03-09 日本オクラロ株式会社 Optical module
JP2018186130A (en) * 2017-04-24 2018-11-22 日本オクラロ株式会社 Optical assembly, optical module, and optical transmission system
WO2019082602A1 (en) * 2017-10-26 2019-05-02 京セラ株式会社 Bonding structure, semiconductor package and semiconductor device

Also Published As

Publication number Publication date
WO2021166073A1 (en) 2021-08-26

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