JP2009050944A - 基板の厚さ測定方法および基板の加工装置 - Google Patents
基板の厚さ測定方法および基板の加工装置 Download PDFInfo
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- JP2009050944A JP2009050944A JP2007218873A JP2007218873A JP2009050944A JP 2009050944 A JP2009050944 A JP 2009050944A JP 2007218873 A JP2007218873 A JP 2007218873A JP 2007218873 A JP2007218873 A JP 2007218873A JP 2009050944 A JP2009050944 A JP 2009050944A
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- 238000012545 processing Methods 0.000 title claims abstract description 69
- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims description 15
- 239000007788 liquid Substances 0.000 claims description 24
- 238000005498 polishing Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000000691 measurement method Methods 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 64
- 238000005259 measurement Methods 0.000 abstract description 14
- 239000011521 glass Substances 0.000 abstract description 10
- 239000012466 permeate Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 112
- 239000004065 semiconductor Substances 0.000 description 15
- 239000000523 sample Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
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- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2007218873A JP2009050944A (ja) | 2007-08-24 | 2007-08-24 | 基板の厚さ測定方法および基板の加工装置 |
CN 200810145611 CN101372090B (zh) | 2007-08-24 | 2008-08-05 | 基板的加工装置 |
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JP2007218873A JP2009050944A (ja) | 2007-08-24 | 2007-08-24 | 基板の厚さ測定方法および基板の加工装置 |
Publications (1)
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JP2009050944A true JP2009050944A (ja) | 2009-03-12 |
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JP2007218873A Pending JP2009050944A (ja) | 2007-08-24 | 2007-08-24 | 基板の厚さ測定方法および基板の加工装置 |
Country Status (2)
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JP (1) | JP2009050944A (zh) |
CN (1) | CN101372090B (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012061578A (ja) * | 2010-09-17 | 2012-03-29 | Nagase Integrex Co Ltd | 工作機械 |
CN102423870A (zh) * | 2011-11-28 | 2012-04-25 | 浙江工业大学 | 微量研磨厚度测量装置 |
DE102015212289A1 (de) | 2014-07-04 | 2016-01-07 | Disco Corporation | Schleifverfahren für plattenähnliches Werkstück |
JP2016107389A (ja) * | 2014-12-10 | 2016-06-20 | 株式会社ディスコ | 研削装置 |
US9561577B2 (en) | 2011-10-26 | 2017-02-07 | Ebara Corporation | Polishing method and polishing apparatus |
KR20170028833A (ko) * | 2015-09-04 | 2017-03-14 | 가부시기가이샤 디스코 | 연삭 휠 및 피가공물의 연삭 방법 |
JP2017162868A (ja) * | 2016-03-07 | 2017-09-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2018122368A (ja) * | 2017-01-30 | 2018-08-09 | 株式会社東京精密 | 研削装置 |
KR101904062B1 (ko) * | 2014-01-10 | 2018-10-04 | 가부시키가이샤 사무코 | 워크의 두께 측정 장치, 측정 방법, 및 워크의 연마 장치 |
JP2020032513A (ja) * | 2018-08-31 | 2020-03-05 | 株式会社ディスコ | 被加工物の研削装置及び研削方法 |
KR20230029819A (ko) | 2020-06-30 | 2023-03-03 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템, 기판 처리 방법 및 기억 매체 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7929129B2 (en) * | 2009-05-22 | 2011-04-19 | Corning Incorporated | Inspection systems for glass sheets |
CN102194727B (zh) * | 2010-03-11 | 2013-09-04 | 中芯国际集成电路制造(上海)有限公司 | 一种改进的机器人伸缩臂 |
MY164183A (en) * | 2010-05-18 | 2017-11-30 | Marposs Societa' Per Azioni | Method and apparatus for optically measuring by interferometry the thickness of an object |
JP6145342B2 (ja) * | 2013-07-12 | 2017-06-07 | 株式会社荏原製作所 | 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置 |
CN104549858B (zh) * | 2013-10-29 | 2017-04-19 | 沈阳芯源微电子设备有限公司 | 一种用于化学液喷洒的摆臂装置及其喷洒方法 |
JP6374169B2 (ja) * | 2014-01-23 | 2018-08-15 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
CN104296902A (zh) * | 2014-11-02 | 2015-01-21 | 苏州精创光学仪器有限公司 | 新型全自动玻璃表面应力仪 |
DE112016000125B4 (de) * | 2015-09-15 | 2020-06-25 | Ngk Insulators, Ltd. | Verbundwerkstoff-Substrat und Dicken-Tendenz-Schätzverfahren für ein piezoelektrisches Substrat |
JP6802012B2 (ja) * | 2016-09-02 | 2020-12-16 | 株式会社ディスコ | 計測装置 |
CN106839937B (zh) * | 2017-01-23 | 2019-08-06 | 安徽三安光电有限公司 | 一种晶片厚度测量装置及其测量方法 |
JP6948868B2 (ja) * | 2017-07-24 | 2021-10-13 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
JP6953242B2 (ja) * | 2017-09-06 | 2021-10-27 | 株式会社ディスコ | 高さ検出装置、及びレーザー加工装置 |
CN112602173B (zh) * | 2018-08-23 | 2024-06-28 | 东京毅力科创株式会社 | 基板处理***和基板处理方法 |
CN112212782B (zh) * | 2019-06-25 | 2023-01-17 | 合肥欣奕华智能机器股份有限公司 | 一种玻璃基板检测方法、装置及*** |
CN110757278B (zh) * | 2019-10-23 | 2020-09-18 | 清华大学 | 一种晶圆厚度测量装置和磨削机台 |
CN115319563B (zh) * | 2022-08-30 | 2024-01-19 | 上海积塔半导体有限公司 | 固定装置和芯片打磨方法 |
CN117506703B (zh) * | 2023-12-01 | 2024-05-10 | 苏州博宏源机械制造有限公司 | 测量装置及抛光*** |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05157520A (ja) * | 1991-12-09 | 1993-06-22 | Fuji Photo Film Co Ltd | 膨潤膜厚計 |
JPH07306018A (ja) * | 1994-05-13 | 1995-11-21 | Nippondenso Co Ltd | 半導体厚非接触測定装置およびその測定方法 |
JP2002221406A (ja) * | 2001-01-25 | 2002-08-09 | Denso Corp | ウエハ厚計測装置及びウエハ研磨方法 |
-
2007
- 2007-08-24 JP JP2007218873A patent/JP2009050944A/ja active Pending
-
2008
- 2008-08-05 CN CN 200810145611 patent/CN101372090B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05157520A (ja) * | 1991-12-09 | 1993-06-22 | Fuji Photo Film Co Ltd | 膨潤膜厚計 |
JPH07306018A (ja) * | 1994-05-13 | 1995-11-21 | Nippondenso Co Ltd | 半導体厚非接触測定装置およびその測定方法 |
JP2002221406A (ja) * | 2001-01-25 | 2002-08-09 | Denso Corp | ウエハ厚計測装置及びウエハ研磨方法 |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012061578A (ja) * | 2010-09-17 | 2012-03-29 | Nagase Integrex Co Ltd | 工作機械 |
US9842783B2 (en) | 2011-10-26 | 2017-12-12 | Ebara Corporation | Polishing method and polishing apparatus |
US9561577B2 (en) | 2011-10-26 | 2017-02-07 | Ebara Corporation | Polishing method and polishing apparatus |
CN102423870A (zh) * | 2011-11-28 | 2012-04-25 | 浙江工业大学 | 微量研磨厚度测量装置 |
KR101904062B1 (ko) * | 2014-01-10 | 2018-10-04 | 가부시키가이샤 사무코 | 워크의 두께 측정 장치, 측정 방법, 및 워크의 연마 장치 |
DE102015212289A1 (de) | 2014-07-04 | 2016-01-07 | Disco Corporation | Schleifverfahren für plattenähnliches Werkstück |
JP2016107389A (ja) * | 2014-12-10 | 2016-06-20 | 株式会社ディスコ | 研削装置 |
KR20160070704A (ko) * | 2014-12-10 | 2016-06-20 | 가부시기가이샤 디스코 | 연삭 장치 |
CN105690199A (zh) * | 2014-12-10 | 2016-06-22 | 株式会社迪思科 | 磨削装置 |
TWI674948B (zh) * | 2014-12-10 | 2019-10-21 | 日商迪思科股份有限公司 | 磨削裝置 |
KR102319943B1 (ko) * | 2014-12-10 | 2021-10-29 | 가부시기가이샤 디스코 | 연삭 장치 |
CN105690199B (zh) * | 2014-12-10 | 2019-07-30 | 株式会社迪思科 | 磨削装置 |
KR20170028833A (ko) * | 2015-09-04 | 2017-03-14 | 가부시기가이샤 디스코 | 연삭 휠 및 피가공물의 연삭 방법 |
KR102443360B1 (ko) * | 2015-09-04 | 2022-09-14 | 가부시기가이샤 디스코 | 연삭 휠 및 피가공물의 연삭 방법 |
US9899275B2 (en) | 2016-03-07 | 2018-02-20 | Renesas Electronics Corporation | Manufacturing method of semiconductor device |
JP2017162868A (ja) * | 2016-03-07 | 2017-09-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US10507561B2 (en) | 2017-01-30 | 2019-12-17 | Tokyo Seimitsu Co., Ltd | Grinding apparatus |
JP2018122368A (ja) * | 2017-01-30 | 2018-08-09 | 株式会社東京精密 | 研削装置 |
JP2020032513A (ja) * | 2018-08-31 | 2020-03-05 | 株式会社ディスコ | 被加工物の研削装置及び研削方法 |
JP7185446B2 (ja) | 2018-08-31 | 2022-12-07 | 株式会社ディスコ | 被加工物の研削装置及び研削方法 |
KR20230029819A (ko) | 2020-06-30 | 2023-03-03 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템, 기판 처리 방법 및 기억 매체 |
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Publication number | Publication date |
---|---|
CN101372090A (zh) | 2009-02-25 |
CN101372090B (zh) | 2012-11-28 |
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