JP2008504686A - 集積トランジスタモジュール及びその製造方法 - Google Patents
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- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L2224/321—Disposition
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- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
Description
Claims (24)
- 集積トランジスタモジュールであって、
少なくとも1つのロウサイドランドと少なくとも1つのハイサイドランドを画定し、その段差部分が前記ロウサイド及びハイサイドランドを機械的且つ電気的に相互接続しているリードフレームと、
前記ロウサイドランドの上に取り付けられ、そのドレインが前記ロウサイドランドに電気的に接続されているロウサイドトランジスタと、
前記ハイサイドランドの上に取り付けられ、そのソースが前記ハイサイドランドに電気的に接続されているハイサイドトランジスタと、からなることを特徴とする集積トランジスタモジュール。 - 前記リードフレームは導電性金属からなることを特徴とする請求項1に記載の集積トランジスタモジュール。
- 前記ロウサイド及び前記ハイサイドトランジスタは金属酸化膜半導体電界効果トランジスタからなることを特徴とする請求項2に記載の集積トランジスタモジュール。
- 前記ハイサイドトランジスタは前記ハイサイド表面にフリップチップ状に取り付けられていることを特徴とする請求項2に記載の集積トランジスタモジュール。
- 前記ロウサイドトランジスタはボールグリッドアレイパッケージ内に包含され、前記パッケージは前記ロウサイド表面に取り付けられていることを特徴とする請求項2に記載の集積トランジスタモジュール。
- 前記基板の前記ハイサイドランドの反対側の側面を覆う成形部分を更に含み、前記成形部は前記基板の前記ロウサイドランドの反対側の側面に対して実質的に同一平面の上部表面を有することを特徴とする請求項2に記載の集積トランジスタモジュール。
- 前記基板の前記ハイサイドランドの反対側の側面に、従って前記ロウサイド及び前記ハイサイドトランジスタの反対側に、熱的に結合したヒートシンクを更に有していることを特徴とする請求項6に記載の集積トランジスタモジュール。
- 前記ヒートシンクは前記成形部分を覆って延在することを特徴とする請求項7に記載の集積トランジスタ。
- 同期バックコンバータであって、
リードフレームと、少なくとも1つのロウサイドトランジスタと、少なくとも1つのハイサイドトランジスタと、を含む集積サブアセンブリからなり、前記リードフレームは少なくとも1つのロウサイドランド及び少なくとも1つのハイサイドランドを画定し、前記リードフレームの段差部分は前記ロウサイド及びハイサイドランドを機械的及び電気的に相互接続し、前記ロウサイドトランジスタは前記ロウサイドランド上に取り付けられ、前記ロウサイドトランジスタのドレインは前記ロウサイドランドに電気的に接続され、前記ハイサイドトランジスタは前記ハイサイドランド上に取り付けられ、前記ハイサイドトランジスタのソースは前記ハイサイドランドに電気的に接続されていることを特徴とする同期バックコンバータ。 - 前記リードフレームは導電性金属からなることを特徴とする請求項9に記載の同期バックコンバータ。
- 前記ロウサイド及び前記ハイサイドトランジスタは金属酸化膜半導体電界効果トランジスタからなることを特徴とする請求項10に記載の同期バックコンバータ。
- 前記ハイサイドトランジスタは前記ハイサイド表面にフリップチップ状に取り付けられていることを特徴とする請求項10に記載の同期バックコンバータ。
- 前記ロウサイドトランジスタはボールグリッドアレイパッケージ内に包含され、前記パッケージは前記ロウサイド表面に取り付けられていることを特徴とする請求項10に記載の同期バックコンバータ。
- 前記基板の前記ハイサイドランドの反対側の側面を覆う成形部分を更に含み、前記成形部は前記基板の前記ロウサイドランドの反対側の側面に対して実質的に同一平面の上部表面を有することを特徴とする請求項10に記載の同期バックコンバータ。
- 前記基板の前記ハイサイドランドの反対側の側面に、従って前記ロウサイド及び前記ハイサイドトランジスタの反対側に、熱的に結合したヒートシンクを更に有していることを特徴とする請求項14に記載の同期バックコンバータ。
- 前記ヒートシンクは前記成形部分を覆って延在していることを特徴とする請求項15に記載の同期バックコンバータ。
- 集積サブアセンブリであって、
少なくとも1つのロウサイドランドと少なくとも1つのハイサイドランドを画定し、その段差部分が前記ロウサイド及びハイサイドランドを機械的及び電気的に相互接続しているリードフレームと、
前記ハイサイドランドの上に取り付けられ、そのソースが前記ハイサイドランドに電気的に接続されているハイサイドトランジスタと、
前記基板の前記ハイサイドランドの反対側の側面を覆い、前記基板の前記ロウサイドランドの反対側の側面に対して実質的に同一平面である上部表面を有している成形部分と、からなることを特徴とする集積サブアセンブリ。 - 前記リードフレームは導電性金属からなることを特徴とする請求項17に記載の集積トランジスタモジュール。
- 前記ハイサイドトランジスタは金属酸化膜半導体電界効果トランジスタからなることを特徴とする請求項17に記載の集積トランジスタモジュール。
- 前記ハイサイドトランジスタは前記ハイサイド表面にフリップチップ状に取り付けられていることを特徴とする請求項17に記載の集積サブアセンブリ。
- 集積トランジスタモジュールの製造方法であって、
少なくとも1つのロウサイドランド及び前記ロウサイドランドから垂直にオフセットしている少なくとも1つのハイサイドランドを画定するリードフレームの形成ステップと、
前記ハイサイドランドに近接する前記リードフレームの一部を電気的絶縁材料の内部に包含して、前記ハイサイドランドの反対側の前記リードフレームの側面上の前記絶縁材料の上部表面が前記ロウサイドランドの反対側の前記リードフレームの側面に対して実質的に同一平面となるようにするステップと、
前記ハイサイドランドの上にハイサイドトランジスタを前記ハイサイドトランジスタのソースが前記ハイサイドランドに電気的に接続されるように取り付けるステップと、からなることを特徴とする方法。 - ロウサイドトランジスタを前記ロウサイドランドの上に取り付けるステップを更に含み、前記ロウサイドトランジスタのドレインが前記ロウサイドランドに電気的に接続され、前記リードフレームが前記ハイサイドトランジスタの前記ソースを前記ロウサイドトランジスタの前記ドレインに電気的に相互接続することを特徴とする請求項21に記載の方法。
- 前記ハイサイドトランジスタは前記ハイサイド表面にフリップチップ状に取り付けられていることを特徴とする請求項22に記載の方法。
- 前記ロウサイドトランジスタはボールグリッドアレイパッケージ内に包含されていることを特徴とする請求項22に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US10/876,248 | 2004-06-24 | ||
US10/876,248 US7501702B2 (en) | 2004-06-24 | 2004-06-24 | Integrated transistor module and method of fabricating same |
PCT/US2005/021877 WO2006012110A2 (en) | 2004-06-24 | 2005-06-22 | Integrated transistor module and method of fabricating same |
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JP2008504686A true JP2008504686A (ja) | 2008-02-14 |
JP4999684B2 JP4999684B2 (ja) | 2012-08-15 |
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US (2) | US7501702B2 (ja) |
JP (1) | JP4999684B2 (ja) |
KR (1) | KR101167742B1 (ja) |
CN (1) | CN101015056B (ja) |
DE (1) | DE112005001457T5 (ja) |
TW (1) | TWI405315B (ja) |
WO (1) | WO2006012110A2 (ja) |
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CN107924949A (zh) * | 2015-09-27 | 2018-04-17 | 英特尔公司 | 与磁感应器集成的晶体管的两侧上的金属 |
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- 2005-06-22 JP JP2007518193A patent/JP4999684B2/ja not_active Expired - Fee Related
- 2005-06-22 CN CN2005800211001A patent/CN101015056B/zh not_active Expired - Fee Related
- 2005-06-22 DE DE112005001457T patent/DE112005001457T5/de not_active Withdrawn
- 2005-06-22 WO PCT/US2005/021877 patent/WO2006012110A2/en active Application Filing
- 2005-06-22 KR KR1020067027196A patent/KR101167742B1/ko not_active IP Right Cessation
- 2005-06-24 TW TW094121315A patent/TWI405315B/zh not_active IP Right Cessation
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2009
- 2009-01-06 US US12/349,140 patent/US7842555B2/en not_active Expired - Lifetime
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JPS616849A (ja) * | 1984-06-01 | 1986-01-13 | ブラウン・ボバリ・ウント・シー・アクチエンゲゼルシヤフト | パワー用半導体モジユールの製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
WO2006012110A3 (en) | 2006-09-08 |
TWI405315B (zh) | 2013-08-11 |
TW200614482A (en) | 2006-05-01 |
CN101015056A (zh) | 2007-08-08 |
US7501702B2 (en) | 2009-03-10 |
KR20070020304A (ko) | 2007-02-20 |
US20090117690A1 (en) | 2009-05-07 |
US7842555B2 (en) | 2010-11-30 |
US20050285238A1 (en) | 2005-12-29 |
WO2006012110A2 (en) | 2006-02-02 |
DE112005001457T5 (de) | 2007-05-16 |
JP4999684B2 (ja) | 2012-08-15 |
KR101167742B1 (ko) | 2012-07-23 |
CN101015056B (zh) | 2010-06-09 |
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