JP2008293979A - 光源モジュールとバックライトアセンブリ及びこれらを有する表示装置並びにバックライトアセンブリの厚さを減少させる方法 - Google Patents

光源モジュールとバックライトアセンブリ及びこれらを有する表示装置並びにバックライトアセンブリの厚さを減少させる方法 Download PDF

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Publication number
JP2008293979A
JP2008293979A JP2008136336A JP2008136336A JP2008293979A JP 2008293979 A JP2008293979 A JP 2008293979A JP 2008136336 A JP2008136336 A JP 2008136336A JP 2008136336 A JP2008136336 A JP 2008136336A JP 2008293979 A JP2008293979 A JP 2008293979A
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JP
Japan
Prior art keywords
power supply
supply plate
light emitting
emitting chip
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008136336A
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English (en)
Japanese (ja)
Other versions
JP2008293979A5 (ko
Inventor
Seung-Gyun Woo
勝 均 禹
Young-Bee Chu
榮 備 周
Ik-Soo Lee
益 洙 李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2008293979A publication Critical patent/JP2008293979A/ja
Publication of JP2008293979A5 publication Critical patent/JP2008293979A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
JP2008136336A 2007-05-25 2008-05-26 光源モジュールとバックライトアセンブリ及びこれらを有する表示装置並びにバックライトアセンブリの厚さを減少させる方法 Pending JP2008293979A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070050619A KR101352921B1 (ko) 2007-05-25 2007-05-25 광원모듈, 이를 갖는 백라이트 어셈블리 및 이를 갖는표시장치

Publications (2)

Publication Number Publication Date
JP2008293979A true JP2008293979A (ja) 2008-12-04
JP2008293979A5 JP2008293979A5 (ko) 2011-07-07

Family

ID=39714129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008136336A Pending JP2008293979A (ja) 2007-05-25 2008-05-26 光源モジュールとバックライトアセンブリ及びこれらを有する表示装置並びにバックライトアセンブリの厚さを減少させる方法

Country Status (5)

Country Link
US (1) US8053968B2 (ko)
EP (1) EP1995795A3 (ko)
JP (1) JP2008293979A (ko)
KR (1) KR101352921B1 (ko)
CN (1) CN101311616B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295146B1 (ko) 2008-12-19 2013-08-09 엘지디스플레이 주식회사 액정표시소자

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI368336B (en) * 2007-07-12 2012-07-11 Chi Mei Lighting Tech Corp Light emitting diode device and applications thereof
JP5499905B2 (ja) * 2010-05-28 2014-05-21 三菱電機株式会社 表示・照明装置
TWI531840B (zh) * 2011-05-24 2016-05-01 友達光電股份有限公司 背光模組
JP5802277B2 (ja) * 2011-09-30 2015-10-28 シャープ株式会社 表示装置及びテレビ受信装置
KR102023457B1 (ko) * 2011-12-21 2019-09-20 엘지이노텍 주식회사 반사판 및 이를 포함하는 백라이트 유닛
JP5927056B2 (ja) * 2012-06-14 2016-05-25 ルネサスエレクトロニクス株式会社 半導体装置
KR102068766B1 (ko) * 2013-01-22 2020-01-21 엘지디스플레이 주식회사 발광다이오드 어셈블리 및 이를 포함하는 액정표시장치
DE102014208960A1 (de) * 2014-05-12 2015-11-12 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements
JP6323806B2 (ja) * 2014-06-30 2018-05-16 パナソニックＩｐマネジメント株式会社 発光デバイス及び移動体
CN104360528B (zh) * 2014-11-18 2017-06-06 深圳市华星光电技术有限公司 一种显示模组
US11019412B2 (en) 2018-05-04 2021-05-25 Red E Innovations, Llc System for monitoring an injection mold or stamping die
CN110174801B (zh) * 2019-05-30 2024-03-26 武汉华星光电技术有限公司 显示模组

Citations (1)

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JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置

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JPH08201805A (ja) 1995-01-31 1996-08-09 Minolta Co Ltd 液晶表示面の照明構造
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
EP1189292A4 (en) * 2000-03-17 2008-10-01 Matsushita Electric Ind Co Ltd LIGHT-EMITTING SEMICONDUCTOR DEVICE AND SURFACE-EMITTING DEVICE
US20020123163A1 (en) 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
JP3930710B2 (ja) * 2000-09-13 2007-06-13 シチズン電子株式会社 チップ型発光ダイオード及びその製造方法
JP4379786B2 (ja) * 2003-11-11 2009-12-09 株式会社エンプラス 面光源装置
JP2005191530A (ja) 2003-12-03 2005-07-14 Sumitomo Electric Ind Ltd 発光装置
JP2005260276A (ja) * 2003-12-03 2005-09-22 Sumitomo Electric Ind Ltd 発光装置
CN100481535C (zh) 2004-03-24 2009-04-22 日立电线精密株式会社 发光器件的制造方法和发光器件
JP4902114B2 (ja) * 2004-12-16 2012-03-21 日亜化学工業株式会社 発光装置
KR20060104795A (ko) 2005-03-31 2006-10-09 삼성에스디아이 주식회사 평판표시장치의 백라이트 유닛
KR100665216B1 (ko) * 2005-07-04 2007-01-09 삼성전기주식회사 개선된 측벽 반사 구조를 갖는 측면형 발광다이오드
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Publication number Priority date Publication date Assignee Title
JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295146B1 (ko) 2008-12-19 2013-08-09 엘지디스플레이 주식회사 액정표시소자

Also Published As

Publication number Publication date
US8053968B2 (en) 2011-11-08
EP1995795A2 (en) 2008-11-26
KR20080103634A (ko) 2008-11-28
US20080291365A1 (en) 2008-11-27
EP1995795A3 (en) 2009-02-11
CN101311616A (zh) 2008-11-26
KR101352921B1 (ko) 2014-01-24
CN101311616B (zh) 2014-04-23

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