JP2008270745A - 印刷回路基板の製造方法 - Google Patents
印刷回路基板の製造方法 Download PDFInfo
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- JP2008270745A JP2008270745A JP2008048386A JP2008048386A JP2008270745A JP 2008270745 A JP2008270745 A JP 2008270745A JP 2008048386 A JP2008048386 A JP 2008048386A JP 2008048386 A JP2008048386 A JP 2008048386A JP 2008270745 A JP2008270745 A JP 2008270745A
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- pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】本発明による印刷回路基板の製造方法は、ベース板の表面に凸状パターンと凹状パターンとを形成する段階(a)〜(f)と、凸状パターンの表面と凹状パターンの表面とにメッキで積層され、凸状パターンと凹状パターンの形態に対応した金属パターンを有する金属板を形成する段階(g)〜(h)と、金属板をベース板から分離する段階(i)〜(j)と、金属板を金属パターン方向への絶縁層に加圧して積層する段階(k)〜(m)と、金属板の一部を除去して金属パターンを露出させる段階(n)と、を含むことを特徴とする。
【選択図】図2
Description
22a 第1感光性フィルム
22b 第2感光性フィルム
221b 凸状パターン
222b 凹状パターン
23 シード層
24 金属板
24a 金属パターン
25 板部材
26 粘着物質
27 プレス板
Claims (8)
- ベース板の表面に凸状パターンと凹状パターンとを形成する段階と、
前記凸状パターンの表面と前記凹状パターンの表面とにメッキで積層され、前記凸状パターンと前記凹状パターンとの形態に対応した金属パターンを有する金属板を形成する段階と、
前記金属板を前記ベース板から分離する段階と、
前記金属板を前記金属パターン方向への絶縁層に加圧して積層する段階と、
前記金属板の一部を除去して前記金属パターンを露出させる段階と、
を含むことを特徴とする印刷回路基板の製造方法。 - 前記ベース板の表面に凸状パターンと凹状パターンとを形成する段階が、
前記ベース板の表面に感光性フィルムを積層し、前記感光性フィルムの一部を除去して前記凸状パターンと前記凹状パターンとを形成する段階を含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。 - 前記ベース板の表面に感光性フィルムを積層し、前記感光性フィルムの一部を除去して前記凸状パターンと前記凹状パターンとを形成する段階を含む段階が、
前記ベース板の表面に第1感光性フィルムを積層し、露光して硬化させる段階と、
前記第1感光性フィルムの上面に第2感光性フィルムを積層する段階と、
前記第2感光性フィルムの一部を露光及び現像工程で除去する段階と、
を含むことを特徴とする請求項2に記載の印刷回路基板の製造方法。 - 前記第2感光性フィルムの一部を露光及び現像工程で除去する段階の後に、
前記第2感光性フィルムの残留部分を前記露光工程より強い紫外線を用いて再露光する段階をさらに含むことを特徴とする請求項3に記載の印刷回路基板の製造方法。 - 前記ベース板の表面に凸状パターンと凹状パターンとを形成する段階の後に、
前記凸状パターンの表面と前記凹状パターンの表面とにシード層を形成する段階をさらに含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。 - 前記凸状パターンの表面と前記凹状パターンの表面とにシード層を形成する段階が、
前記凸状パターンの表面と前記凹状パターンの表面とに伝導性微粒子を塗布することにより行われることを特徴とする請求項5に記載の印刷回路基板の製造方法。 - 前記伝導性微粒子が、黒煙、銀(Ag)、金(Au)、ニッケル、白金の中の少なくともいずれか一つであることを特徴とする請求項6に記載の印刷回路基板の製造方法。
- 前記金属板を前記ベース板から分離する段階が、
粘着物質が付着された板部材を前記金属板に接着する段階と、
前記粘着物質の密着力を用いて前記金属板を前記ベース板から分離する段階と、
を含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070039390A KR100811768B1 (ko) | 2007-04-23 | 2007-04-23 | 인쇄회로기판의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008270745A true JP2008270745A (ja) | 2008-11-06 |
JP4659055B2 JP4659055B2 (ja) | 2011-03-30 |
Family
ID=39398154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008048386A Expired - Fee Related JP4659055B2 (ja) | 2007-04-23 | 2008-02-28 | 印刷回路基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7824838B2 (ja) |
JP (1) | JP4659055B2 (ja) |
KR (1) | KR100811768B1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003884A (ja) * | 2009-05-20 | 2011-01-06 | Fujitsu Ltd | 回路基板及びその製造方法 |
WO2011058978A1 (ja) * | 2009-11-10 | 2011-05-19 | 株式会社フジクラ | 配線基板の製造方法 |
JP2011222566A (ja) * | 2010-04-02 | 2011-11-04 | Fujitsu Ltd | 電子部品とその製造方法 |
JP2012227302A (ja) * | 2011-04-19 | 2012-11-15 | Fujikura Ltd | 配線板の製造方法 |
JP2013030809A (ja) * | 2008-12-22 | 2013-02-07 | Fujitsu Ltd | 電子部品とその製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100887382B1 (ko) * | 2007-03-28 | 2009-03-06 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR101136394B1 (ko) | 2009-11-11 | 2012-04-18 | 엘지이노텍 주식회사 | 인쇄회로기판의 제조방법 |
TWI393508B (zh) * | 2009-12-17 | 2013-04-11 | Unimicron Technology Corp | 線路板及其製程 |
KR101032702B1 (ko) | 2010-04-19 | 2011-05-06 | 삼성전기주식회사 | 반도체 패키지용 인쇄회로기판의 제조방법 |
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2007
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-
2008
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- 2008-02-28 JP JP2008048386A patent/JP4659055B2/ja not_active Expired - Fee Related
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030809A (ja) * | 2008-12-22 | 2013-02-07 | Fujitsu Ltd | 電子部品とその製造方法 |
US8704106B2 (en) | 2008-12-22 | 2014-04-22 | Fujitsu Limited | Ferroelectric component and manufacturing the same |
JP2011003884A (ja) * | 2009-05-20 | 2011-01-06 | Fujitsu Ltd | 回路基板及びその製造方法 |
WO2011058978A1 (ja) * | 2009-11-10 | 2011-05-19 | 株式会社フジクラ | 配線基板の製造方法 |
JP2011222566A (ja) * | 2010-04-02 | 2011-11-04 | Fujitsu Ltd | 電子部品とその製造方法 |
JP2012227302A (ja) * | 2011-04-19 | 2012-11-15 | Fujikura Ltd | 配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100811768B1 (ko) | 2008-03-07 |
US7824838B2 (en) | 2010-11-02 |
JP4659055B2 (ja) | 2011-03-30 |
US20080261158A1 (en) | 2008-10-23 |
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