JP2008118014A - Substrate holding cassette - Google Patents

Substrate holding cassette Download PDF

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Publication number
JP2008118014A
JP2008118014A JP2006301385A JP2006301385A JP2008118014A JP 2008118014 A JP2008118014 A JP 2008118014A JP 2006301385 A JP2006301385 A JP 2006301385A JP 2006301385 A JP2006301385 A JP 2006301385A JP 2008118014 A JP2008118014 A JP 2008118014A
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substrate
support
cassette
moving mechanism
large substrates
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Mototsugu Narutani
元嗣 成谷
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Japan Display Central Inc
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Toshiba Matsushita Display Technology Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier cassette by which an appropriate holding state corresponding to the thickness of large substrates can be obtained. <P>SOLUTION: The vertical position of back supports 26 which are arranged between side panels 13, 13 in a vertically movable manner can be moved by a moving mechanism 30. When the large substrates 3 are relatively thick, the back supports 26 are moved downward by the moving mechanism 30 so that the large substrates 3 may not get into contact with the back supports 26. When the large substrates 3 are relatively thin, the back supports 26 are moved upward by the moving mechanism 30 and the large substrates 3 are supported by side supports 21 and the back supports 26. In this manner, an appropriate holding state corresponding to the thickness of the large substrates 3 can be obtained. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、被収容基板を収容する基板収容カセットに関する。   The present invention relates to a substrate storage cassette that stores a substrate to be stored.

従来、例えば液晶表示素子である液晶表示パネルなどの被収容基板を収容する基板収容カセットとしては、互いに対向する側板に、被収容基板の両側部を支持する支持突部を突設したものが知られている。そして、このような被収容基板は、基板収容カセットに収容された状態で所定の搬送装置により搬送され、ロボットハンドなどにより出し入れされる（例えば、特許文献１参照。）。   2. Description of the Related Art Conventionally, as a substrate accommodation cassette for accommodating a substrate to be accommodated such as a liquid crystal display panel which is a liquid crystal display element, for example, a supporting projection that supports both side portions of the substrate to be accommodated is provided on opposite side plates. It has been. And such a to-be-accepted board | substrate is conveyed by the predetermined | prescribed conveying apparatus in the state accommodated in the board | substrate accommodation cassette, and is taken in / out with a robot hand etc. (for example, refer patent document 1).

しかしながら、近年、基板の薄型化が進み、大型の液晶表示パネルでは、総厚が０．４ｍｍ以下になると、液晶表示パネルの撓みが大きくなり、上述のような基板収容カセットでは、搬送の際に基板が割れたり、ロボットハンドでの取り出しが容易でなくなったりするおそれがある。   However, in recent years, thinning of substrates has progressed, and in a large liquid crystal display panel, when the total thickness is 0.4 mm or less, the deflection of the liquid crystal display panel becomes large. There is a possibility that the substrate may be broken or it may be difficult to take out with the robot hand.

そこで、側板間に亘って連続する支持突部を設け、被収容基板の下側全体を支持する基板収容カセットが知られている（例えば、特許文献２参照。）。
特開２００５−２８５８２３号公報 特開２００６−５４４２９号公報 In view of this, there is known a substrate storage cassette that is provided with a support protrusion that extends between side plates and supports the entire lower side of the substrate to be stored (see, for example, Patent Document 2).
JP 2005-285823 A JP 2006-54429 A

しかしながら、上述の特許文献２に記載された基板収容カセットでは、充分な厚みがあって支持を必要としない研磨前の基板などであっても、必ず支持突部に接触してしまうため、搬送中の振動や荷重によっては、液晶表示パネルの基板間のギャップむらが生じたり、基板の欠けすなわちピットが生じる頻度が大きくなったりするという問題点を有している。   However, in the substrate storage cassette described in the above-mentioned Patent Document 2, even a substrate before polishing that has a sufficient thickness and does not require support always comes into contact with the support protrusion, so that it is being transported. Depending on the vibration and load, there are problems such as uneven gaps between the substrates of the liquid crystal display panel and the frequency of chipping of the substrates, that is, occurrence of pits.

本発明は、このような点に鑑みなされたもので、被収容基板の厚みに応じて適した収容状態を得ることができる基板収容カセットを提供することを目的とする。   The present invention has been made in view of these points, and an object of the present invention is to provide a substrate storage cassette capable of obtaining a storage state suitable for the thickness of a substrate to be stored.

本発明は、互いに対向する対をなす側板を備えたカセット本体と、前記対をなす側板に突設され、被収容基板の両側部が載置されてこの被収容基板を支持する支持突部と、前記側板間に上下動可能に設けられ、前記被収容基板の両側部間の中間部を支持可能な支持体と、この支持体の上下位置を移動可能な移動機構部とを具備したものである。   The present invention includes a cassette main body having a pair of side plates facing each other, a support protrusion protruding from the pair of side plates, on which both side portions of the substrate to be received are placed, and supporting the substrate to be stored. And a support body provided between the side plates so as to be movable up and down and capable of supporting an intermediate part between both side parts of the substrate to be accommodated, and a moving mechanism part capable of moving the vertical position of the support body. is there.

そして、側板間に上下動可能に設けた支持体の上下位置を移動機構部により移動可能とする。   And the vertical position of the support body provided between the side plates so as to be movable up and down is made movable by the movement mechanism section.

本発明によれば、被収容基板が比較的厚い場合には、移動機構部により支持体を下方へと移動させて被収容基板に支持体が接触しないようにし、被収容基板が比較的薄い場合には、移動機構部により支持体を上方へと移動させて被収容基板を支持突部と支持体とで支持するなど、被収容基板の厚みに応じて適した収容状態を得ることができる。   According to the present invention, when the substrate to be accommodated is relatively thick, the support is moved downward by the moving mechanism unit so that the support does not contact the substrate to be accommodated, and the substrate to be accommodated is relatively thin. In other words, it is possible to obtain an accommodation state suitable for the thickness of the substrate to be accommodated, for example, by supporting the substrate to be accommodated by the support protrusion and the support by moving the support body upward by the moving mechanism unit.

以下、本発明の一実施の形態の基板収容カセットの構成を図１ないし図５を参照して説明する。   Hereinafter, the configuration of a substrate storage cassette according to an embodiment of the present invention will be described with reference to FIGS.

図１ないし図５において、１は基板収容カセットとしてのキャリアカセットを示し、このキャリアカセット１は、液晶表示素子である液晶表示パネル２をマトリクス状に複数切り出す被収容基板としての大型基板３を、内部に複数収容可能なもので、載置台５上に載置されるカセット本体６を備えている。   In FIG. 1 to FIG. 5, reference numeral 1 denotes a carrier cassette as a substrate storage cassette. This carrier cassette 1 includes a large substrate 3 as a substrate to be received by cutting out a plurality of liquid crystal display panels 2 as liquid crystal display elements in a matrix. A cassette main body 6 that can be accommodated inside and mounted on the mounting table 5 is provided.

液晶表示パネル２は、図示しない所定の回路が成膜された一対のガラス基板を互いに所定の隙間すなわちギャップで保持した状態で対向させて貼り合わせたものである。   The liquid crystal display panel 2 is formed by bonding a pair of glass substrates on which a predetermined circuit (not shown) is formed facing each other while being held at a predetermined gap, that is, a gap.

載置台５は、例えばローダ／アンローダ(LD/ULD)ステージ、あるいは、搬送装置のアーム部などである。   The mounting table 5 is, for example, a loader / unloader (LD / ULD) stage or an arm unit of a transfer device.

カセット本体６は、天板11、底板12、および、これら天板11と底板12との両側間で互いに対向した側板13，13を有する枠状に形成され、図２中左側(図５中下側)である前部に、大型基板３を搬入搬出装置であるロボットハンド14により出し入れ可能な前面開口15が形成されている。また、このカセット本体６の前面開口15と対向する後部には、支持装置16が設けられている。   The cassette body 6 is formed in a frame shape having a top plate 11, a bottom plate 12, and side plates 13 and 13 facing each other between both sides of the top plate 11 and the bottom plate 12, and the left side in FIG. A front opening 15 through which the large-sized substrate 3 can be taken in and out by a robot hand 14 as a loading / unloading device is formed in the front portion. A support device 16 is provided at the rear of the cassette body 6 facing the front opening 15.

各側板13には、大型基板３の両側部が載置されてこの大型基板３を支持する支持突部としてのサイドサポート21が複数突設されている。これらサイドサポート21は、各側板13の上下方向に略等間隔に離間されて配設され、かつ、側板13の前後方向に、例えば３列、略等間隔に設けられている。なお、これらサイドサポート21の上下方向の間隔は、大型基板３をそれぞれ載置した状態で、これら大型基板３が干渉しないように設定されている。   Each side plate 13 is provided with a plurality of side supports 21 as support protrusions on which both side portions of the large substrate 3 are placed to support the large substrate 3. The side supports 21 are disposed at substantially equal intervals in the vertical direction of the side plates 13 and are provided at approximately equal intervals, for example, in three rows in the front-rear direction of the side plates 13. Note that the vertical intervals of the side supports 21 are set so that the large substrates 3 do not interfere with each other when the large substrates 3 are placed thereon.

ロボットハンド14は、前後方向に長手状に形成された例えば互いに水平かつ略等しい高さに配設された一対のハンド部14a，14a上に、大型基板３の下側すなわち裏面を吸着支持する複数の吸盤部14bを、前後方向に略等間隔に配設して構成されている。   The robot hand 14 has a plurality of suction-supporting units on the lower side, that is, the back surface of the large substrate 3, on a pair of hand portions 14a, 14a formed in a longitudinal shape in the front-rear direction, for example, horizontally and substantially at the same height. The suction cups 14b are arranged at substantially equal intervals in the front-rear direction.

支持装置16は、上下方向に長手状の機構部本体としての支持装置本体24と、この支持装置本体24を上下動可能に保持した保持体25とを有し、カセット本体６の左右方向の略中心域に配設されている。   The support device 16 includes a support device main body 24 as a mechanism unit main body that is long in the vertical direction, and a holding body 25 that holds the support device main body 24 so as to be movable up and down. Arranged in the central area.

支持装置本体24には、支持体としてのバックサポート26が前方へと複数突設されている。また、この支持装置本体24の上下部には、カセット本体６の天板11と底板12との間に、付勢手段としてのスプリング27，28が配設されている。さらに、この支持装置本体24は、載置台５上に設けられた突部としての高さ調整ピン29が下端部に当接することで、スプリング27を縮めスプリング28を伸ばすように上方へと押し上げ可能である。   A plurality of back supports 26 serving as a support are provided on the support device body 24 so as to protrude forward. In addition, springs 27 and 28 as urging means are disposed between the top plate 11 and the bottom plate 12 of the cassette body 6 at the upper and lower portions of the support device body 24. Further, the support device main body 24 can be pushed upward so that the spring 27 is contracted and the spring 28 is extended by a height adjustment pin 29 as a protrusion provided on the mounting table 5 contacting the lower end portion. It is.

バックサポート26は、サイドサポート21と等しい個数設けられ、これらサイドサポート21に対応する位置に突設されている。そして、これらバックサポート26は、支持装置本体24の上下動により、一体的に上下動可能である。   The back supports 26 are provided in the same number as the side supports 21, and project from the positions corresponding to the side supports 21. These back supports 26 can be integrally moved up and down by the up and down movement of the support device body 24.

また、スプリング27，28は、支持装置本体24を上下方向から付勢している。   Further, the springs 27 and 28 urge the support device body 24 from above and below.

そして、上記支持装置本体24、保持体25、スプリング27，28および高さ調整ピン29などにより、バックサポート26の上下位置を移動可能な移動機構部30が構成されている。   The support device main body 24, the holding body 25, the springs 27 and 28, the height adjustment pin 29, and the like constitute a moving mechanism unit 30 that can move the vertical position of the back support 26.

次に、上記一実施の形態の動作を説明する。   Next, the operation of the above embodiment will be described.

液晶表示パネル２の製造において、例えば一対のガラス基板を互いに貼り合わせて組み立てるまでの工程においては、大型基板３の厚みが例えば約１．０〜１．４ｍｍ程度と比較的厚く、大型基板３の撓みが少ない。   In the manufacture of the liquid crystal display panel 2, for example, in the process until a pair of glass substrates are bonded together and assembled, the thickness of the large substrate 3 is relatively thick, for example, about 1.0 to 1.4 mm. There is little bending.

この場合には、図１および図２に示すように、載置台５上の高さ調整ピン29の高さを相対的に低くすることで、支持装置本体24をカセット本体６に対して相対的に下降させ、各バックサポート26を各大型基板３に接触しない状態とする。   In this case, as shown in FIGS. 1 and 2, the height of the height adjustment pin 29 on the mounting table 5 is made relatively low so that the support device main body 24 is relative to the cassette main body 6. So that each back support 26 is not in contact with each large substrate 3.

そして、この状態で、例えばキャリアカセット１を、搬送装置により所定位置に搬送し、ロボットハンド14で前面開口15から大型基板３を出し入れする。   In this state, for example, the carrier cassette 1 is transported to a predetermined position by the transport device, and the large-sized substrate 3 is taken in and out from the front opening 15 by the robot hand 14.

なお、搬送装置においては、アーム部に高さ調整ピン29を設けておくことで、上記図１および図２に示すバックサポート26の下降状態が維持される。   In the transport apparatus, by providing the arm portion with the height adjustment pin 29, the lowered state of the back support 26 shown in FIGS. 1 and 2 is maintained.

また、大型基板３をケミカル研磨などにより研磨する研磨工程以降の工程においては、大型基板３の厚みが、薄いものでは０．４ｍｍ程度となり、大型基板３の撓みが大きくなる。   Further, in the steps after the polishing step of polishing the large substrate 3 by chemical polishing or the like, the thickness of the large substrate 3 is about 0.4 mm when the thin substrate is thin, and the deflection of the large substrate 3 is increased.

この場合には、図３および図４に示すように、載置台５上の高さ調整ピン29の高さを相対的に高くすることで、支持装置本体24がカセット本体６に対して相対的に上昇し、各バックサポート26が各大型基板３の裏面にてこれら大型基板３の両側部間の中間部に接触して、これら大型基板３を、サイドサポート21とともに支持して、大型基板３の撓みを抑制し、上記図１および図２に示す場合と同様に、キャリアカセット１を搬送装置により所定位置に搬送し、ロボットハンド14で前面開口15から大型基板３を出し入れする。   In this case, as shown in FIGS. 3 and 4, the height of the height adjustment pin 29 on the mounting table 5 is made relatively high so that the support device main body 24 is relative to the cassette main body 6. Each back support 26 comes into contact with an intermediate portion between both sides of the large substrate 3 on the back surface of each large substrate 3, supports the large substrate 3 together with the side support 21, and As in the case shown in FIGS. 1 and 2, the carrier cassette 1 is transported to a predetermined position by the transport device, and the large substrate 3 is put in and out of the front opening 15 by the robot hand 14.

上述したように、上記一実施の形態によれば、側板13，13間に上下動可能に設けたバックサポート26の上下位置を移動機構部30により移動可能とすることで、大型基板３が比較的厚い場合には、移動機構部30によりバックサポート26を下方へと移動させて大型基板３にバックサポート26が接触しないようにし、大型基板３が比較的薄い場合には、移動機構部30によりバックサポート26を上方へと移動させて大型基板３をサイドサポート21とバックサポート26とで支持するなど、大型基板３の厚みに応じて適した収容状態を得ることができる。   As described above, according to the above-described embodiment, the large substrate 3 is compared by allowing the moving mechanism 30 to move the vertical position of the back support 26 provided between the side plates 13 and 13 so as to be movable up and down. If the substrate is thick, the back support 26 is moved downward by the moving mechanism 30 so that the back support 26 does not contact the large substrate 3. If the large substrate 3 is relatively thin, the moving mechanism 30 An accommodation state suitable for the thickness of the large substrate 3 can be obtained, for example, the large substrate 3 is supported by the side support 21 and the back support 26 by moving the back support 26 upward.

この結果、大型基板３の厚みが薄い場合でも、キャリアカセット１の搬送時に、大型基板３が撓みにより割れたり、撓みによりロボットハンド14で取り出しできなくなったりすることを防止でき、また、大型基板３が、バックサポート26による支持が必要でない厚みである場合でも、キャリアカセット１の搬送時の振動や荷重により、バックサポート26との接触で大型基板３にギャップむらや欠けすなわちピットが生じたりすることを防止できる。   As a result, even when the large substrate 3 is thin, it is possible to prevent the large substrate 3 from being broken due to bending or being unable to be taken out by the robot hand 14 due to bending when the carrier cassette 1 is transported. However, even when the thickness is not required to be supported by the back support 26, gaps or chips, that is, pits may occur in the large substrate 3 due to the vibration or load when the carrier cassette 1 is conveyed due to contact with the back support 26. Can be prevented.

特に、液晶表示パネル２を切り出す大型基板３は、ガラスで形成されているので、振動などにより割れやピットが生じやすく、また、近年の大型化および薄型化によって撓みが生じやすいので、キャリアカセット１を上記のように構成することで、大型基板３の大型化や薄型化に対応することができる。   In particular, since the large substrate 3 from which the liquid crystal display panel 2 is cut out is made of glass, cracks and pits are likely to occur due to vibrations, etc., and flexure is likely to occur due to the recent increase in size and thickness. As described above, the large substrate 3 can be made larger and thinner.

また、移動機構部30を、バックサポート26と一体的に設けた支持装置本体24と、載置台５に設けた高さ調整ピン29などとにより構成することで、移動機構部30を容易に構成できる。   In addition, the moving mechanism unit 30 is configured easily by the support device main body 24 provided integrally with the back support 26, the height adjusting pin 29 provided on the mounting table 5, and the like. it can.

なお、上記一実施の形態において、移動機構部30は、バックサポート26の上下方向位置を可変できれば、任意に構成できる。   In the above embodiment, the moving mechanism unit 30 can be arbitrarily configured as long as the position of the back support 26 in the vertical direction can be varied.

また、キャリアカセット１に収容する被収容基板は、液晶表示パネル２を切り出す大型基板３以外の基板であってもよい。   Further, the substrate to be stored in the carrier cassette 1 may be a substrate other than the large substrate 3 from which the liquid crystal display panel 2 is cut out.

本発明の一実施の形態の基板収容カセットの支持体の下降状態を示す正面図である。It is a front view which shows the downward state of the support body of the board | substrate accommodation cassette of one embodiment of this invention. 同上支持体の下降状態を示す側面図である。It is a side view which shows the downward state of a support body same as the above. 同上支持体の上昇状態を示す正面図である。It is a front view which shows the raising state of a support body same as the above. 同上支持体の上昇状態を示す側面図である。It is a side view which shows the raising state of a support body same as the above. 同上基板収容カセットを示す平面図である。It is a top view which shows a board | substrate accommodation cassette same as the above.

符号の説明Explanation of symbols

１ 基板収容カセットとしてのキャリアカセット
３ 被収容基板としての大型基板
５ 載置台
６ カセット本体
13 側板
21 支持突部としてのサイドサポート
24 機構部本体としての支持装置本体
26 支持体としてのバックサポート
29 突部としての高さ調整ピン
30 移動機構部 DESCRIPTION OF SYMBOLS 1 Carrier cassette as a board | substrate accommodation cassette 3 Large board | substrate as a to-be-accepted board | substrate 5 Mounting stand 6 Cassette main body
13 Side plate
21 Side support as support protrusion
24 Supporting device body as the mechanism body
26 Back support as support
29 Height adjustment pin as protrusion
30 Moving mechanism

Claims (2)

互いに対向する対をなす側板を備えたカセット本体と、
前記対をなす側板に突設され、被収容基板の両側部が載置されてこの被収容基板を支持する支持突部と、
前記側板間に上下動可能に設けられ、前記被収容基板の両側部間の中間部を支持可能な支持体と、
この支持体の上下位置を移動可能な移動機構部と
を具備したことを特徴とした基板収容カセット。 A cassette body having a pair of side plates facing each other;
Projectingly provided on the pair of side plates, and supporting protrusions for supporting the substrate to be received on both sides of the substrate to be stored;
A support body provided between the side plates so as to be movable up and down, and capable of supporting an intermediate portion between both side portions of the substrate to be accommodated;
A substrate storage cassette comprising: a moving mechanism unit capable of moving the vertical position of the support. 前記カセット本体は、載置台上に載置可能であり、
前記移動機構部は、
前記支持体と一体的に設けられた機構部本体と、
前記載置台に設けられ、この載置台への載置により前記機構部本体の下部に当接して前記機構部本体を押し上げる突部とを備えている
ことを特徴とした請求項１記載の基板収容カセット。 The cassette body can be mounted on a mounting table,
The moving mechanism unit is
A mechanism body provided integrally with the support;
The board accommodation according to claim 1, further comprising: a protrusion provided on the mounting table, and a protrusion that contacts the lower portion of the mechanism unit main body and pushes up the mechanism unit main body by mounting on the mounting table. cassette.
JP2006301385A 2006-11-07 2006-11-07 Substrate holding cassette Pending JP2008118014A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101213538B1 (en) 2011-06-28 2012-12-24 (주) 씨앤아이테크놀로지 A cassete for loading display pannels, rotating apparatus having the same and driving method thereof
CN102874530A (en) * 2011-07-12 2013-01-16 村田自动化机械有限公司 Transport carriage
JP2013161972A (en) * 2012-02-06 2013-08-19 Disco Abrasive Syst Ltd Housing cassette
CN115440648A (en) * 2022-08-10 2022-12-06 常州承芯半导体有限公司 Bearing device for automatically loading wafers and conveying method for automatically loading wafers

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101213538B1 (en) 2011-06-28 2012-12-24 (주) 씨앤아이테크놀로지 A cassete for loading display pannels, rotating apparatus having the same and driving method thereof
CN102874530A (en) * 2011-07-12 2013-01-16 村田自动化机械有限公司 Transport carriage
JP2013021166A (en) * 2011-07-12 2013-01-31 Murata Mach Ltd Conveyance vehicle
JP2013161972A (en) * 2012-02-06 2013-08-19 Disco Abrasive Syst Ltd Housing cassette
CN115440648A (en) * 2022-08-10 2022-12-06 常州承芯半导体有限公司 Bearing device for automatically loading wafers and conveying method for automatically loading wafers

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