JP2005310989A - Method and device for delivering substrate and photomask - Google Patents

Method and device for delivering substrate and photomask Download PDF

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JP2005310989A
JP2005310989A JP2004124665A JP2004124665A JP2005310989A JP 2005310989 A JP2005310989 A JP 2005310989A JP 2004124665 A JP2004124665 A JP 2004124665A JP 2004124665 A JP2004124665 A JP 2004124665A JP 2005310989 A JP2005310989 A JP 2005310989A
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push
substrate
pins
pin
chuck
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Yuichi Shimoda
勇一 下田
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Hitachi High Tech Corp
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Hitachi High Tech Electronics Engineering Co Ltd
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  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To deal with substrates and masks in various kinds with a small number of components by also utilizing a part of push-up pins for mounting a mask on the mask holder. <P>SOLUTION: In a first pin drive mechanism, a ball screw 14 connected to a supporting plate 13 is driven by a pulse motor 15, and the push-up pins 17a and 17b are lifted or lowered simultaneously. Air cylinders 16a and 16b as second pin drive mechanisms lift or lower the push-up pins 17a and 17b, respectively. The push-up pins 17a and 17b are lifted by the first pin drive mechanism and the substrate is delivered, and the push-up pins 17a and 17b are lowered by the first pin drive mechanism and the substrate is loaded on a chuck 12. The push-up pins 17a and 17b are lifted by the first pin drive mechanism and the second pin drive mechanisms, and the mask is delivered, and the chuck 12 is lifted by Z stages 11 and the mask is fitted to the mask holder mounted on the upper section of the chuck 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、液晶ディスプレイ等のフラットパネルディスプレイ装置や、ＩＣ，ＬＳＩ等の半導体デバイスの製造において、ガラス基板や半導体ウェーハ等の基板をチャックに搭載し、かつフォトマスクをマスクホルダに装着するための基板及びフォトマスクの受け渡し方法、並びに基板及びフォトマスクの受け渡し装置に関する。   In manufacturing a flat panel display device such as a liquid crystal display or a semiconductor device such as an IC or LSI, the present invention is for mounting a substrate such as a glass substrate or a semiconductor wafer on a chuck and mounting a photomask on a mask holder. The present invention relates to a substrate and photomask delivery method, and a substrate and photomask delivery device.

例えば、液晶ディスプレイの製造は、露光装置を用いて、フォトリソグラフィ技術によりガラス基板上にパターンを形成して行われる。露光装置としては、レンズ又は鏡を用いてフォトマスク（以下、「マスク」と称す）のパターンをガラス基板上に投影するプロジェクション方式と、マスクとガラス基板との間に微小な間隙（プロキシミティギャップ）を設けてマスクのパターンを転写するプロキシミティ方式とがある。プロキシミティ方式は、プロジェクション方式に比べてパターン解像性能は劣るが、照射光学系の構成が簡単で、かつ処理能力が高く量産用に適している。   For example, a liquid crystal display is manufactured by forming a pattern on a glass substrate by a photolithography technique using an exposure apparatus. As an exposure apparatus, a projection method in which a pattern of a photomask (hereinafter referred to as “mask”) is projected onto a glass substrate using a lens or a mirror, and a minute gap (proximity gap) between the mask and the glass substrate. ) To transfer the mask pattern. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

プロキシミティ露光装置は、チャックに搭載したガラス基板をマスクホルダに装着したマスクに極めて接近させて露光を行う。通常、チャックは、マスクとの位置合わせ及びギャップ合わせを行うステージに搭載されており、ガラス基板を真空吸着して固定する。マスクホルダは、基板を搭載したチャックの上方に設けられ、マスクの外周縁部を真空吸着して固定する。ガラス基板のチャックへの搬送、及びマスクのマスクホルダへの搬送は、通常、ロボット等のハンドリングアームにより行われる。   The proximity exposure apparatus performs exposure by bringing a glass substrate mounted on a chuck very close to a mask mounted on a mask holder. Usually, the chuck is mounted on a stage that performs alignment and gap alignment with a mask, and fixes the glass substrate by vacuum suction. The mask holder is provided above the chuck on which the substrate is mounted, and fixes the outer peripheral edge of the mask by vacuum suction. The conveyance of the glass substrate to the chuck and the conveyance of the mask to the mask holder are usually performed by a handling arm such as a robot.

従来、チャックとハンドリングアームとの間のガラス基板の受け渡しは、チャックの表面にハンドリングアームが挿入される溝を設けて行われていた。しかしながら、チャックの表面に設けた溝の部分と他の吸着部分とで露光光の反射率が異なり、また溝の部分の空間と他の吸着部分とに温度差が生じるため、露光時に焼きむらが発生するという問題があった。   Conventionally, the glass substrate is transferred between the chuck and the handling arm by providing a groove into which the handling arm is inserted on the surface of the chuck. However, the reflectance of the exposure light differs between the groove portion provided on the surface of the chuck and the other suction portion, and a temperature difference occurs between the space of the groove portion and the other suction portion. There was a problem that occurred.

これに対し、特許文献１に記載のように、チャックに複数の突き上げピンを設けてガラス基板を持ち上げる突き上げピン方式がある。突き上げピンの上昇及び下降は、エアシリンダにより行われる。一方、マスクホルダとハンドリングアームとの間のマスクの受け渡しに関しては、チャックの外周縁部にマスクの一時支持部材として複数のエアシリンダを設ける技術が、特許文献２に開示されている。
特開２０００−２３７９８３号公報 特開２００３−１８６１９９号公報 On the other hand, as described in Patent Document 1, there is a push-up pin method in which a plurality of push-up pins are provided on the chuck to lift the glass substrate. The push-up pins are raised and lowered by an air cylinder. On the other hand, regarding delivery of the mask between the mask holder and the handling arm, Patent Document 2 discloses a technique in which a plurality of air cylinders are provided on the outer peripheral edge of the chuck as temporary support members for the mask.
JP 2000-237983 A JP 2003-186199 A

従来の突き上げピン方式は、エアシリンダにより突き上げピンの上昇及び下降を行うため、速度調整が難しく、特に下降時に基板がチャックに衝突して基板に傷が付いたり破損したりする恐れがあった。また、基板及びマスクはそれぞれ多種のサイズがあるが、特許文献２に記載の技術を突き上げピン方式に適用すると、基板のサイズに応じて突き上げピンを多数設け、さらにマクスのサイズに対応して一時支持部材のエアシリンダを多数設けなければならなかった。   In the conventional push-up pin system, since the push-up pin is raised and lowered by the air cylinder, it is difficult to adjust the speed. In particular, the substrate may collide with the chuck when it is lowered, and the substrate may be damaged or damaged. Although the substrate and the mask have various sizes, when the technique described in Patent Document 2 is applied to the push-up pin method, a large number of push-up pins are provided according to the size of the substrate, and further, the temporary size corresponding to the maximum size is temporarily provided. Many air cylinders for the support member had to be provided.

本発明の課題は、突き上げピン方式で基板をチャックに搭載する際、基板の傷や破損を防止することである。また、本発明の他の課題は、突き上げピンの一部をマクスのマスクホルダへの装着にも利用して、少ない構成部品で多種のサイズの基板及びマスクに対応することである。   An object of the present invention is to prevent damage and breakage of a substrate when the substrate is mounted on a chuck by a push-up pin method. Another object of the present invention is to use a part of the push-up pin for mounting the mask on the mask holder, and to cope with substrates and masks of various sizes with a small number of components.

本発明の基板及びマスクの受け渡し方法は、チャックに設けられた貫通穴を通り上下に移動する複数の突き上げピンに対して、モータにより駆動され、複数の突き上げピンを同時に上昇又は下降させる第１のピン駆動機構と、緩衝機能を有し、複数の突き上げピンをそれぞれ上昇又は下降させる第２のピン駆動機構とを設け、第１のピン駆動機構により突き上げピンを上昇させて基板の受け渡しを行い、第１のピン駆動機構により突き上げピンを下降させて基板をチャックに搭載し、第１のピン駆動機構及び第２のピン駆動機構により突き上げピンを上昇させてマスクの受け渡しを行い、チャックを搭載したステージによりチャックを上昇させてマスクをチャックの上方に設けられたマスクホルダに装着するものである。   The substrate and mask delivery method of the present invention is a first method in which a plurality of push-up pins moving up and down through a through hole provided in a chuck are driven by a motor to simultaneously raise or lower the plurality of push-up pins. A pin driving mechanism and a second pin driving mechanism that has a buffer function and raises or lowers each of the plurality of push-up pins, raises the push-up pins by the first pin drive mechanism, and delivers the substrate; The push-up pin is lowered by the first pin drive mechanism to mount the substrate on the chuck, the push-up pin is raised by the first pin drive mechanism and the second pin drive mechanism to deliver the mask, and the chuck is mounted. The chuck is raised by the stage and the mask is mounted on a mask holder provided above the chuck.

また、本発明の基板及びマスクの受け渡し装置は、複数の貫通穴を有するチャックと、チャックの貫通穴を通り上下に移動する複数の突き上げピンと、モータにより駆動され、複数の突き上げピンを同時に上昇又は下降させる第１のピン駆動機構と、緩衝機能を有し、複数の突き上げピンをそれぞれ上昇又は下降させる第２のピン駆動機構と、チャックを搭載しながら上昇又は下降するステージとを備え、複数の突き上げピンが、第１のピン駆動機構により上昇されて基板の受け渡しを行い、第１のピン駆動機構により下降されて基板をチャックに搭載し、第１のピン駆動機構及び第２のピン駆動機構により上昇されてマスクの受け渡しを行い、ステージにより上昇されてマスクをチャックの上方に設けられたマスクホルダに装着するものである。   Further, the substrate and mask transfer device of the present invention includes a chuck having a plurality of through-holes, a plurality of push-up pins that move up and down through the through-holes of the chuck, and a motor that drives the plurality of push-up pins at the same time. A first pin drive mechanism that lowers, a second pin drive mechanism that has a buffer function and raises or lowers the plurality of push-up pins, and a stage that rises or lowers while mounting the chuck, The push-up pin is raised by the first pin driving mechanism to deliver the substrate, and lowered by the first pin driving mechanism to mount the substrate on the chuck, and the first pin driving mechanism and the second pin driving mechanism The mask is delivered by passing the mask, and the mask is lifted by the stage and mounted on the mask holder provided above the chuck. That.

第１のピン駆動機構は、例えば、複数の突き上げピンを支持する支持部材と、支持部材に連結されたボールねじと、ボールねじを駆動するパルスモータとを有し、速度制御を容易に行うことができる。基板をチャックに搭載する際、第１のピン駆動機構が突き上げピンを下降させる速度を調整することにより、基板のチャックへの衝突による傷や破損が防止される。一方、第２のピン駆動機構は、例えばエアシリンダからなり、空気の圧縮による緩衝機能を有する。マスクをマスクホルダに装着する際、マスクがマスクホルダに接触する衝撃を第２のピン駆動機構が和らげて、マスクの傷や破損が防止される。また、マスクの受け渡しを行う際、第１のピン駆動機構と第２のピン駆動機構を併用することにより、基板を受け渡す場合に比べて、チャックとの間隔が大きくなる。   The first pin drive mechanism has, for example, a support member that supports a plurality of push-up pins, a ball screw connected to the support member, and a pulse motor that drives the ball screw, and performs speed control easily. Can do. When the substrate is mounted on the chuck, by adjusting the speed at which the first pin driving mechanism lowers the push-up pin, scratches and breakage due to the collision of the substrate with the chuck are prevented. On the other hand, the 2nd pin drive mechanism consists of air cylinders, for example, and has a buffer function by compression of air. When the mask is mounted on the mask holder, the impact of the mask coming into contact with the mask holder is softened by the second pin driving mechanism, so that the mask is not damaged or damaged. Further, when the mask is transferred, by using the first pin driving mechanism and the second pin driving mechanism in combination, the distance from the chuck becomes larger than when the substrate is transferred.

本発明によれば、突き上げピンを用いて基板をチャックに搭載する際に、基板の傷や破損を防止することができ、また突き上げピンを用いてマスクをマスクホルダに装着することができる。従って、突き上げピンの一部をマクスのマスクホルダへの装着にも利用することができ、少ない構成部品で多種のサイズの基板及びマスクに対応することができる。   According to the present invention, when the substrate is mounted on the chuck using the push-up pin, the substrate can be prevented from being damaged or damaged, and the mask can be mounted on the mask holder using the push-up pin. Accordingly, a part of the push-up pin can be used for mounting the mask on the mask holder, and it is possible to deal with various sizes of substrates and masks with a small number of components.

図１〜図８は、本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図である。受け渡し装置は、ＸＹθステージ１０、Ｚステージ１１、チャック１２、突き上げピン１７ａ，１７ｂ、第１のピン駆動機構、及び第２のピン駆動機構を含んで構成されている。   1 to 8 are partial cross-sectional side views of a substrate and mask transfer apparatus according to an embodiment of the present invention. The delivery device includes an XYθ stage 10, a Z stage 11, a chuck 12, push pins 17a and 17b, a first pin driving mechanism, and a second pin driving mechanism.

ＸＹθステージ１０の上にＺステージ１１が搭載され、Ｚステージ１１の上にチャック１２が搭載されている。ＸＹθステージ１０は、チャック１２をＸＹ方向に移動させ、またθ方向に回転させて、基板とマスクとの位置合わせを行う。Ｚステージ１１は、チャック１２をＺ軸方向に移動させて、基板を水平にし、また基板とマスクとのギャップ合わせを行う。なお、Ｚステージ１１は、ＸＹθステージ１０の中心から等距離（必ずしも等距離でなくてもよい）に１２０度毎の角度で３つ配置されているが、図１〜図８ではこれらのうち２つのＺステージ１１だけが示されている。   A Z stage 11 is mounted on the XYθ stage 10, and a chuck 12 is mounted on the Z stage 11. The XYθ stage 10 moves the chuck 12 in the XY direction and rotates it in the θ direction to align the substrate and the mask. The Z stage 11 moves the chuck 12 in the Z-axis direction to level the substrate and adjust the gap between the substrate and the mask. Three Z stages 11 are arranged at an angle of 120 degrees at an equal distance (not necessarily equal) from the center of the XYθ stage 10, but two of these are shown in FIGS. 1 to 8. Only one Z stage 11 is shown.

チャック１２には複数の貫通穴が設けられており、貫通穴には突き上げピン１７ａ，１７ｂが挿入されている。なお、突き上げピンは、基板及びマスクのサイズに対応して多数設けられているが、図１〜図８ではその一部だけが示されている。   The chuck 12 is provided with a plurality of through holes, and push-up pins 17a and 17b are inserted into the through holes. A number of push-up pins are provided corresponding to the size of the substrate and the mask, but only a part of them is shown in FIGS.

第１のピン駆動機構は、支持板１３、ボールねじ１４及びパルスモータ１５を含んで構成されている。また、第２のピン駆動機構は、エアシリンダ１６ａ，１６ｂからなる。突き上げピン１７ａ，１７ｂは、エアシリンダ１６ａ，１６ｂの先端に取り付けられている。支持板１３は、エアシリンダ１６ａ，１６ｂを介して突き上げピン１７ａ，１７ｂを支持している。図示しない駆動回路からパルスモータ１５へ駆動パルス信号を供給することにより、第１のピン駆動機構は、支持板１３に連結されたボールねじ１４をパルスモータ１５により駆動して、突き上げピン１７ａ，１７ｂを同時に上昇又は下降させる。また、図示しないエアポンプからエアを供給し、またはエアを排出することにより、第２のピン駆動機構であるエアシリンダ１６ａ，１６ｂは、突き上げピン１７ａ，１７ｂをそれぞれ上昇又は下降させる。   The first pin driving mechanism includes a support plate 13, a ball screw 14, and a pulse motor 15. The second pin driving mechanism is composed of air cylinders 16a and 16b. The push-up pins 17a and 17b are attached to the tips of the air cylinders 16a and 16b. The support plate 13 supports the push-up pins 17a and 17b via the air cylinders 16a and 16b. By supplying a driving pulse signal to the pulse motor 15 from a driving circuit (not shown), the first pin driving mechanism drives the ball screw 14 connected to the support plate 13 by the pulse motor 15 and pushes pins 17a and 17b. Are simultaneously raised or lowered. Further, by supplying air from an air pump (not shown) or discharging air, the air cylinders 16a and 16b as the second pin driving mechanism raise or lower the push-up pins 17a and 17b, respectively.

まず、本発明の一実施の形態による基板の受け渡し方法について、図１〜図３を用いて説明する。基板の受け渡しを行う場合、受け渡し装置は、第１のピン駆動機構を用いて突き上げピン１７ａ，１７ｂを上昇させる。図１は突き上げピン１７ａ，１７ｂを上昇させない状態、図２は第１のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させた状態を示す。図２に示すように第１のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させた状態で、受け渡し装置は、図示しないハンドリングアームとの間で基板１の受け渡しを行う。本実施の形態では、基板１は、突き上げピン１７ｂによって支持される。   First, a substrate transfer method according to an embodiment of the present invention will be described with reference to FIGS. When delivering a substrate, the delivery device raises the push-up pins 17a and 17b using the first pin driving mechanism. FIG. 1 shows a state where the push-up pins 17a and 17b are not raised, and FIG. 2 shows a state where the push-up pins 17a and 17b are raised by the first pin driving mechanism. As shown in FIG. 2, the transfer device transfers the substrate 1 to / from a handling arm (not shown) in a state where the push-up pins 17a and 17b are raised by the first pin driving mechanism. In the present embodiment, the substrate 1 is supported by the push-up pins 17b.

基板１を受け取った後、受け渡し装置は、第１のピン駆動機構を用いて突き上げピン１７ａ，１７ｂを下降させる。図３は、第１のピン駆動機構により突き上げピン１７ａ，１７ｂを下降させた状態を示す。基板１を支持していた突き上げピン１７ｂを下降させることによって、基板１はチャック１２に搭載される。   After receiving the substrate 1, the delivery device lowers the push-up pins 17a and 17b using the first pin driving mechanism. FIG. 3 shows a state in which the push-up pins 17a and 17b are lowered by the first pin driving mechanism. The substrate 1 is mounted on the chuck 12 by lowering the push-up pins 17 b that have supported the substrate 1.

本実施の形態によれば、基板１をチャック１２に搭載する際、図示しない駆動回路からパルスモータ１５へ供給する駆動パルス信号でパルスモータ１５を制御して、第１のピン駆動機構が突き上げピン１７ａ，１７ｂを下降させる速度を調整することにより、基板１のチャック１２への衝突による傷や破損を防止することができる。   According to this embodiment, when the substrate 1 is mounted on the chuck 12, the pulse motor 15 is controlled by the drive pulse signal supplied from the drive circuit (not shown) to the pulse motor 15, and the first pin drive mechanism is pushed up. By adjusting the speed at which 17a and 17b are lowered, it is possible to prevent damage and breakage due to the collision of the substrate 1 with the chuck 12.

次に、本発明の一実施の形態によるマスクの受け渡し方法について、図４〜図８を用いて説明する。マスクの受け渡しを行う場合、受け渡し装置は、第１のピン駆動機構及び第２のピン駆動機構を用いて突き上げピン１７ａ，１７ｂを上昇させる。図４はまず第２のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させた状態を示し、図５はさらに第１のピン駆動機構により突き上げピンを上昇させた状態を示す。図５に示すように第１のピン駆動機構及び第２のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させた状態で、受け渡し装置は、図示しないハンドリングアームとの間でマスク２ａの受け渡しを行う。本実施の形態では、マスク２ａは、突き上げピン１７ａによって外周部が支持される。   Next, a mask delivery method according to an embodiment of the present invention will be described with reference to FIGS. When delivering the mask, the delivery device raises the push-up pins 17a and 17b using the first pin driving mechanism and the second pin driving mechanism. 4 shows a state in which the push-up pins 17a and 17b are raised by the second pin drive mechanism, and FIG. 5 shows a state in which the push-up pin is raised by the first pin drive mechanism. As shown in FIG. 5, the transfer device transfers the mask 2a to and from a handling arm (not shown) in a state where the push-up pins 17a and 17b are raised by the first pin driving mechanism and the second pin driving mechanism. . In the present embodiment, the outer periphery of the mask 2a is supported by the push-up pins 17a.

なお、突き上げピン１７ａ，１７ｂを上昇させる順番は、第１のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させてから、第２のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させてもよい。   The order of raising the push-up pins 17a and 17b may be such that the push-up pins 17a and 17b are raised by the first pin drive mechanism and then the push-up pins 17a and 17b are raised by the second pin drive mechanism.

マスク２ａを受け取った後、受け渡し装置は、第１のピン駆動機構及び第２のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させたまま、Ｚステージ１１を用いてチャック１２を上昇させる。図６は、Ｚステージ１１によりチャック１２を上昇させた状態を示す。チャック１２を上昇させることにより、マスク２ａを支持する突き上げピン１７ａが上昇され、マスク２ａはチャックの上方に設けられたマスクホルダ３ａの下面に押し付けられて装着される。マスクホルダ３ａは、マスク２ａの外周部を真空吸着して固定する。   After receiving the mask 2a, the delivery device raises the chuck 12 using the Z stage 11 while raising the push-up pins 17a and 17b by the first pin driving mechanism and the second pin driving mechanism. FIG. 6 shows a state where the chuck 12 is raised by the Z stage 11. By raising the chuck 12, the push-up pin 17a that supports the mask 2a is raised, and the mask 2a is pressed against the lower surface of the mask holder 3a provided above the chuck and mounted. The mask holder 3a fixes the outer peripheral portion of the mask 2a by vacuum suction.

図７及び図８は、サイズの異なるマスクの受け渡しを行う場合であって、図７は、図５と同様に第１のピン駆動機構及び第２のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させた状態を示す。図７に示すように第１のピン駆動機構及び第２のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させた状態で、受け渡し装置は、図示しないハンドリングアームとの間でマスク２ｂの受け渡しを行う。この場合、マスク２ｂは、突き上げピン１７ｂによって外周部が支持される。   FIGS. 7 and 8 show a case where masks of different sizes are delivered. FIG. 7 shows that the push-up pins 17a and 17b are lifted by the first pin driving mechanism and the second pin driving mechanism as in FIG. Indicates the state of the As shown in FIG. 7, the transfer device transfers the mask 2b to / from a handling arm (not shown) in a state where the push-up pins 17a and 17b are raised by the first pin driving mechanism and the second pin driving mechanism. . In this case, the outer periphery of the mask 2b is supported by the push-up pins 17b.

マスク２ｂを受け取った後、受け渡し装置は、第１のピン駆動機構及び第２のピン駆動機構により突き上げピン１７ａ，１７ｂを上昇させたまま、Ｚステージ１１を用いてチャック１２を上昇させる。図８は、図６と同様にＺステージ１１によりチャック１２を上昇させた状態を示す。チャック１２を上昇させることにより、マスク２ｂを支持する突き上げピン１７ｂが上昇され、マスク２ｂはチャックの上方に設けられたマスクホルダ３ｂの下面に押し付けられて装着される。マスクホルダ３ｂは、マスク２ｂの外周部を真空吸着して固定する。   After receiving the mask 2b, the delivery device raises the chuck 12 using the Z stage 11 while raising the push-up pins 17a and 17b by the first pin driving mechanism and the second pin driving mechanism. FIG. 8 shows a state where the chuck 12 is raised by the Z stage 11 as in FIG. By raising the chuck 12, the push-up pin 17b that supports the mask 2b is raised, and the mask 2b is pressed against and attached to the lower surface of the mask holder 3b provided above the chuck. The mask holder 3b fixes the outer periphery of the mask 2b by vacuum suction.

本実施の形態によれば、第２のピン駆動機構であるエアシリンダ１６ａ，１６ｂは、空気の圧縮による緩衝機能を有する。従って、マスク２ａ，２ｂをマスクホルダ３ａ，３ｂに装着する際、マスク２ａ，２ｂがマスクホルダ３ａ，３ｂに接触する衝撃をエアシリンダ１６ａ，１６ｂが和らげて、マスク２ａ，２ｂの傷や破損を防止することができる。また、マスク２ａ，２ｂの受け渡しを行う際、第１のピン駆動機構と第２のピン駆動機構を併用することにより、基板１を受け渡す場合に比べて、チャック１２との間隔を大きくすることができる。従って、マスク２ａ，２ｂの下面にパターン面を保護する突起部があっても、ハンドリングアームが出入りする空間を確保することができる。   According to the present embodiment, the air cylinders 16a and 16b, which are the second pin driving mechanism, have a buffer function by compressing air. Therefore, when the masks 2a and 2b are mounted on the mask holders 3a and 3b, the impact of the masks 2a and 2b coming into contact with the mask holders 3a and 3b is reduced by the air cylinders 16a and 16b, so that the masks 2a and 2b are not damaged or damaged. Can be prevented. Further, when the masks 2a and 2b are transferred, the distance between the mask 12 and the chuck 12 is increased by using both the first pin driving mechanism and the second pin driving mechanism in combination. Can do. Therefore, even if there are protrusions that protect the pattern surface on the lower surfaces of the masks 2a and 2b, a space for the handling arm to enter and exit can be secured.

以上説明した実施の形態によれば、突き上げピン１７ｂを用いて基板１をチャック１２に搭載する際に、基板１の傷や破損を防止することができ、また突き上げピン１７ｂを用いてマスク２ｂをマスクホルダ２ｂに装着することができる。従って、突き上げピンの一部をマクスのマスクホルダへの装着にも利用することができ、少ない構成部品で多種のサイズの基板及びマスクに対応することができる。   According to the embodiment described above, when the substrate 1 is mounted on the chuck 12 using the push-up pins 17b, the substrate 1 can be prevented from being damaged or damaged, and the mask 2b can be formed using the push-up pins 17b. It can be attached to the mask holder 2b. Accordingly, a part of the push-up pin can be used for mounting the mask on the mask holder, and it is possible to deal with various sizes of substrates and masks with a small number of components.

本発明は、液晶ディスプレイ等のフラットパネルディスプレイ装置製造時の露光に限らず、ＩＣ，ＬＳＩ等の半導体デバイス製造時の露光にも適用される。   The present invention is not limited to exposure at the time of manufacturing a flat panel display device such as a liquid crystal display, but is also applied to exposure at the time of manufacturing a semiconductor device such as an IC or LSI.

本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、突き上げピンを上昇させない状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one Embodiment of this invention, Comprising: The state which does not raise a push-up pin is shown. 本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、第１のピン駆動機構により突き上げピンを上昇させた状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one Embodiment of this invention, Comprising: The state which raised the push-up pin with the 1st pin drive mechanism is shown. 本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、第１のピン駆動機構により突き上げピンを下降させた状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one Embodiment of this invention, Comprising: The state which raised the raising pin with the 1st pin drive mechanism is shown. 本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、第２のピン駆動機構により突き上げピンを上昇させた状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one Embodiment of this invention, Comprising: The state which raised the thrust pin with the 2nd pin drive mechanism is shown. 本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、第１のピン駆動機構及び第２のピン駆動機構により突き上げピンを上昇させた状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one embodiment of this invention, Comprising: The state which raised the push-up pin with the 1st pin drive mechanism and the 2nd pin drive mechanism is shown. 本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、Ｚステージよりチャックを上昇させた状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one Embodiment of this invention, Comprising: The state which raised the chuck | zipper from Z stage is shown. 本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、第１のピン駆動機構及び第２のピン駆動機構により突き上げピンを上昇させた状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one embodiment of this invention, Comprising: The state which raised the push-up pin with the 1st pin drive mechanism and the 2nd pin drive mechanism is shown. 本発明の一実施の形態による基板及びマスクの受け渡し装置の一部断面側面図であって、Ｚステージよりチャックを上昇させた状態を示す。It is a partial cross section side view of the board | substrate and mask delivery apparatus by one Embodiment of this invention, Comprising: The state which raised the chuck | zipper from Z stage is shown.

符号の説明Explanation of symbols

１ 基板
２ａ，２ｂ マスク
３ａ，３ｂ マスクホルダ
１０ ＸＹθステージ
１１ Ｚステージ
１２ チャック
１３ 支持板
１４ ボールねじ
１５ パルスモータ
１６ａ，１６ｂ エアシリンダ
１７ａ，１７ｂ 突き上げピン 1 Substrate 2a, 2b Mask 3a, 3b Mask holder 10 XYθ stage 11 Z stage 12 Chuck 13 Support plate 14 Ball screw 15 Pulse motor 16a, 16b Air cylinder 17a, 17b Push-up pin

Claims (6)

チャックに設けられた貫通穴を通り上下に移動する複数の突き上げピンに対して、
モータにより駆動され、複数の突き上げピンを同時に上昇又は下降させる第１のピン駆動機構と、
緩衝機能を有し、複数の突き上げピンをそれぞれ上昇又は下降させる第２のピン駆動機構とを設け、
第１のピン駆動機構により突き上げピンを上昇させて基板の受け渡しを行い、第１のピン駆動機構により突き上げピンを下降させて基板をチャックに搭載し、
第１のピン駆動機構及び第２のピン駆動機構により突き上げピンを上昇させてフォトマスクの受け渡しを行い、チャックを搭載したステージによりチャックを上昇させてフォトマスクをチャックの上方に設けられたマスクホルダに装着することを特徴とする基板及びフォトマスクの受け渡し方法。 For a plurality of push-up pins that move up and down through the through holes provided in the chuck,
A first pin drive mechanism that is driven by a motor and simultaneously raises or lowers a plurality of push-up pins;
A second pin driving mechanism that has a buffer function and raises or lowers each of the plurality of push-up pins;
The first pin drive mechanism raises the push-up pin to deliver the substrate, the first pin drive mechanism lowers the push-up pin to mount the substrate on the chuck,
A mask holder in which the push pin is raised by the first pin driving mechanism and the second pin driving mechanism to deliver the photomask, and the chuck is raised by the stage on which the chuck is mounted, and the photomask is provided above the chuck. A method for delivering a substrate and a photomask, characterized in that the substrate and the photomask are mounted on the substrate. 第１のピン駆動機構として、複数の突き上げピンを支持する支持部材と、支持部材に連結されたボールねじと、ボールねじを駆動するパルスモータとを用いたことを特徴とする請求項１に記載の基板及びフォトマスクの受け渡し方法。   The first pin driving mechanism includes a support member that supports a plurality of push-up pins, a ball screw connected to the support member, and a pulse motor that drives the ball screw. Substrate and photomask delivery method. 第２のピン駆動機構として、エアシリンダを用いたことを特徴とする請求項１に記載の基板及びフォトマスクの受け渡し方法。   2. The substrate and photomask delivery method according to claim 1, wherein an air cylinder is used as the second pin driving mechanism. 複数の貫通穴を有するチャックと、
前記チャックの貫通穴を通り上下に移動する複数の突き上げピンと、
モータにより駆動され、前記複数の突き上げピンを同時に上昇又は下降させる第１のピン駆動機構と、
緩衝機能を有し、前記複数の突き上げピンをそれぞれ上昇又は下降させる第２のピン駆動機構と、
前記チャックを搭載しながら上昇又は下降するステージとを備え、
前記複数の突き上げピンは、
前記第１のピン駆動機構により上昇されて基板の受け渡しを行い、前記第１のピン駆動機構により下降されて基板をチャックに搭載し、
前記第１のピン駆動機構及び前記第２のピン駆動機構により上昇されてフォトマスクの受け渡しを行い、前記ステージにより上昇されてフォトマスクをチャックの上方に設けられたマスクホルダに装着することを特徴とする基板及びフォトマスクの受け渡し装置。 A chuck having a plurality of through holes;
A plurality of push-up pins that move up and down through the through holes of the chuck;
A first pin driving mechanism that is driven by a motor and simultaneously raises or lowers the plurality of push-up pins;
A second pin driving mechanism having a buffering function and raising or lowering each of the plurality of push-up pins;
A stage that rises or falls while mounting the chuck,
The plurality of push-up pins are
The substrate is transferred by being lifted by the first pin driving mechanism, and the substrate is mounted on the chuck by being lowered by the first pin driving mechanism,
The photomask is transferred by being lifted by the first pin driving mechanism and the second pin driving mechanism, and the photomask is lifted by the stage and mounted on a mask holder provided above the chuck. A substrate and photomask delivery device. 前記第１のピン駆動機構は、前記複数の突き上げピンを支持する支持部材と、該支持部材に連結されたボールねじと、該ボールねじを駆動するパルスモータとを有することを特徴とする請求項４に記載の基板及びフォトマスクの受け渡し装置。   The first pin driving mechanism includes a support member that supports the plurality of push-up pins, a ball screw connected to the support member, and a pulse motor that drives the ball screw. 5. The substrate and photomask delivery device according to 4. 前記第２のピン駆動機構は、エアシリンダからなることを特徴とする請求項４に記載の基板及びフォトマスクの受け渡し装置。   5. The substrate and photomask transfer device according to claim 4, wherein the second pin driving mechanism comprises an air cylinder.
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CN102859031A (en) * 2010-04-28 2013-01-02 株式会社爱发科 Vacuum processing device, method for moving substrate and alignment mask, alignment method, and film forming method
CN102859031B (en) * 2010-04-28 2014-08-20 株式会社爱发科 Vacuum processing device, method for moving substrate and alignment mask, alignment method, and film forming method
TWI457457B (en) * 2010-04-28 2014-10-21 Ulvac Inc Vacuum processing apparatus, moving method and alignment method for substrate and aligment mask and film forming method
KR101235342B1 (en) 2012-02-15 2013-02-19 주식회사 테라세미콘 Method for transfering a substrate
KR101235334B1 (en) 2012-02-15 2013-02-19 주식회사 테라세미콘 Apparatus for transfering a substrate
JP2014093495A (en) * 2012-11-07 2014-05-19 Canon Inc Exposure apparatus and method of manufacturing device using the same
JP2016503965A (en) * 2013-01-04 2016-02-08 スス マイクロテク リソグラフィー，ゲーエムベーハー Chuck used especially in mask aligner
KR20160087056A (en) * 2015-01-12 2016-07-21 삼성디스플레이 주식회사 Manufacturing apparatus for display apparatus
KR102253447B1 (en) * 2015-01-12 2021-05-20 삼성디스플레이 주식회사 Manufacturing apparatus for display apparatus
KR20180066627A (en) * 2016-12-09 2018-06-19 주식회사 아바코 Apparatus for Lifting Substrate of Mask Aligner
KR101949367B1 (en) 2016-12-09 2019-02-18 주식회사 아바코 Apparatus for Lifting Substrate of Mask Aligner
JPWO2019038902A1 (en) * 2017-08-25 2020-11-05 株式会社日本製鋼所 Laser irradiation device

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