JP2008082694A - 冷却方法及びそれによる冷却装置 - Google Patents

冷却方法及びそれによる冷却装置 Download PDF

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Publication number
JP2008082694A
JP2008082694A JP2007204910A JP2007204910A JP2008082694A JP 2008082694 A JP2008082694 A JP 2008082694A JP 2007204910 A JP2007204910 A JP 2007204910A JP 2007204910 A JP2007204910 A JP 2007204910A JP 2008082694 A JP2008082694 A JP 2008082694A
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JP
Japan
Prior art keywords
cooling
condensing unit
working fluid
cooled
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007204910A
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English (en)
Japanese (ja)
Inventor
Chin Kuang Luo
チン コアン ルオ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JP2008082694A publication Critical patent/JP2008082694A/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2007204910A 2006-09-28 2007-08-07 冷却方法及びそれによる冷却装置 Pending JP2008082694A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095136005A TW200815968A (en) 2006-09-28 2006-09-28 Phase change heat dissipation device and method

Publications (1)

Publication Number Publication Date
JP2008082694A true JP2008082694A (ja) 2008-04-10

Family

ID=39259822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007204910A Pending JP2008082694A (ja) 2006-09-28 2007-08-07 冷却方法及びそれによる冷却装置

Country Status (5)

Country Link
US (1) US20080078202A1 (zh)
JP (1) JP2008082694A (zh)
KR (1) KR20080029756A (zh)
BR (1) BRPI0702368A (zh)
TW (1) TW200815968A (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7630198B2 (en) * 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) * 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
GB2462098A (en) * 2008-07-23 2010-01-27 Ryan James Mcglen Thermal management device comprising heat pipes
US7903403B2 (en) * 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) * 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
TWI411390B (zh) * 2010-07-26 2013-10-01 I-Ming Lin 串聯型連續降溫及升溫裝置
CN102097403A (zh) * 2010-11-25 2011-06-15 昆明理工大学 芯片热沉及带芯片热沉的芯片冷却装置
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
CN102917570A (zh) * 2011-08-05 2013-02-06 仪信股份有限公司 液态冷却***
DE112013007739T5 (de) * 2013-12-31 2016-12-29 Gentherm Automotive Systems (China) Ltd. Ventilationssystem
CN104329828B (zh) * 2014-03-28 2017-01-11 海尔集团公司 半导体制冷冰箱及其热端换热装置
AU2015339717A1 (en) * 2014-10-27 2017-06-15 Ebullient, Llc Heat exchanger with helical passageways
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
US9891002B2 (en) 2014-10-27 2018-02-13 Ebullient, Llc Heat exchanger with interconnected fluid transfer members
US10391831B2 (en) * 2015-07-23 2019-08-27 Hyundai Motor Company Combined heat exchanger module
US10451355B2 (en) * 2016-05-27 2019-10-22 Asia Vital Components Co., Ltd. Heat dissipation element
US11252847B2 (en) * 2017-06-30 2022-02-15 General Electric Company Heat dissipation system and an associated method thereof
CN108644731A (zh) * 2018-05-14 2018-10-12 安徽卡澜特车灯科技有限公司 一种双光灯具散热装置
KR102228042B1 (ko) * 2019-03-22 2021-03-15 주식회사 에이프로템 열전소자를 이용한 다지점 접촉형 냉각 및 가열 장치
CN112954965A (zh) * 2021-02-01 2021-06-11 中国科学院电工研究所 用于高性能计算机的模块化冷却***
CN117293104B (zh) * 2023-11-27 2024-03-22 贵州芯际探索科技有限公司 一种sic器件散热封装结构及封装方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6853554B2 (en) * 2001-02-22 2005-02-08 Hewlett-Packard Development Company, L.P. Thermal connection layer
US6845622B2 (en) * 2003-03-27 2005-01-25 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods

Also Published As

Publication number Publication date
BRPI0702368A (pt) 2008-05-13
US20080078202A1 (en) 2008-04-03
KR20080029756A (ko) 2008-04-03
TW200815968A (en) 2008-04-01

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