JP2008010828A - Heat-conducting module and method for manufacturing the same - Google Patents

Heat-conducting module and method for manufacturing the same Download PDF

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JP2008010828A
JP2008010828A JP2007109422A JP2007109422A JP2008010828A JP 2008010828 A JP2008010828 A JP 2008010828A JP 2007109422 A JP2007109422 A JP 2007109422A JP 2007109422 A JP2007109422 A JP 2007109422A JP 2008010828 A JP2008010828 A JP 2008010828A
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heat
heat conducting
conducting plate
module according
groove
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Phon-Quan Lee
豐寛 李
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Cooler Master Co Ltd
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Cooler Master Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat conducting module for improving heat transfer effects and a method for manufacturing it. <P>SOLUTION: This heat conducting module and a method for manufacturing it are used for isolating the quantity of heat to be generated in an electronic member, and the heat conducting module includes a heat conducting board and a plurality of heat pipes. A plurality of concave grooves which are in parallel with each other are opened on the upper face of the heat conducting board, and each concave groove is put through the front and rear end faces of the heat-conducting board, and an arc-shaped face is formed at the lower part, and a restraint section is extended inward at both sides of the upper part of the concave groove. One end of the thermal tube is formed as a heat receiving end, and the other end is formed as a heat emitting end, and the heat receiving end is put through the concave groove of the heat conducting board, and adhered to and brought into contact with the internal wall of the concave groove and the internal side of the restraint part. Thus, it is possible to hold stability and adhesiveness between the heat conducting board and each thermal tube, and to improve the heat conducting effects of the heat conducting module. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、導熱モジュールおよびその製造方法に関し、特に、電子部材に導熱させることに用いる導熱モジュールおよびその製造方法に関する。   The present invention relates to a heat conducting module and a manufacturing method thereof, and more particularly to a heat conducting module used for conducting heat to an electronic member and a manufacturing method thereof.

現在の電子機器業界は、電磁部材の導散熱方面において、熱管が有する高熱伝導能力、迅速な伝熱、高熱伝導率、軽量、簡易構造および多様性等の特性を利用し、大容量の熱量を伝達し、且つ電力補助を必要としないので、電子製品の放熱・導散熱需要に非常に適し、熱管および導熱板を組み合わせてなる導熱モジュールは、その結合の良好性が導熱モジュールの熱伝導効果および安定性固持に直接影響を及ぼすため、如何に熱管および導熱板の間を安定結合および緊密接触させるかは、既に業界が研究する重要な課題となっている。   The current electronic equipment industry uses heat pipes with high heat conduction capability, rapid heat transfer, high heat conductivity, light weight, simple structure, and diversity in the heat conduction direction of electromagnetic components to increase the amount of heat. Because it transmits heat and does not require power assistance, it is very suitable for the heat dissipation and heat dissipation demand of electronic products. The heat conduction module that combines the heat pipe and the heat conduction plate has the good coupling and the heat conduction effect of the heat conduction module. In order to directly influence stability, how to make a stable coupling and intimate contact between the heat pipe and the heat conducting plate has already become an important issue to be studied by the industry.

公知の導熱モジュールは、主に導熱板および複数の熱管を含み、そのうち、導熱板上面は刃で複数の凹溝を掘り、各凹溝の断面孤形は、２分の１以上が円弧であり、且つ熱管の一端を通し接続させることに用い、導熱板の凹溝に通す熱管上面に対してプレス加工を行い、熱管の外表面を凹溝内壁と貼合接触させる。   The known heat conducting module mainly includes a heat conducting plate and a plurality of heat tubes, of which, on the upper surface of the heat conducting plate, a plurality of concave grooves are dug with a blade. In addition, it is used for connecting through one end of the heat pipe, and press working is performed on the upper surface of the heat pipe passing through the groove of the heat conducting plate, and the outer surface of the heat pipe is bonded to the inner wall of the groove.

しかしながら、公知の導熱モジュールは、実際の使用の下、下記の問題点が存在し、前記凹溝上部両側は、円弧方向に沿って延伸し、鋭角形態を呈し、熱管に対する衝撃力を相当小さくし、且つ組み合わせ過程中の接触または動作過程中の震動により、熱管および導熱板が離脱および分離する現象を発生し、熱伝導効果不良および安定性不良等の問題に至るので、改善が必要である。
特開２００６−１５６７２７号公報 However, the known heat conducting module has the following problems under actual use, and both sides of the upper part of the concave groove extend along the arc direction, exhibit an acute angle form, and considerably reduce the impact force on the heat tube. Further, the contact during the combination process or the vibration during the operation process causes a phenomenon that the heat tube and the heat conducting plate are detached and separated, leading to problems such as a poor heat conduction effect and a poor stability.
JP 2006-156727 A

本発明の目的は、各凹溝の係止部の設置を利用し、導熱板および各熱管の間の安定性および緊密性を固持し、導熱モジュールの熱伝導効果を上昇させる導熱モジュールおよびその製造方法を提供することにある。   An object of the present invention is to provide a heat-conducting module that uses the installation of a locking portion of each concave groove, maintains stability and tightness between the heat-conducting plate and each heat pipe, and increases the heat conduction effect of the heat-conducting module and its manufacture It is to provide a method.

上記の目的を達成する為、本発明が提供する導熱モジュールおよびその製造方法は、電子部材が発生する熱量を放熱する導熱板および複数の熱管からなり、そのうち、前記導熱板上面に複数の相互に平行な凹溝を開設し、各凹溝がそれぞれ導熱板の前後端面を貫通し、且つその下方に孤形面を形成し、また凹溝の上方両側にそれぞれ内向きに係止部を延伸する；前記熱管の一端は、受熱端であり、もう一端は、放熱端であり、前記受熱端は、導熱板の凹溝内に通し、凹溝内壁および係止部内側と相互に貼合接触する。
上記の目的を達成する為、本発明は、導熱モジュールとその製造方法を提供することを目的とし、そのステップは、ａ）成型刀具で導熱板上に複数の凹溝を加工し、ｂ）熱管の一端を導熱板の凹溝内に通し、ｃ）プレス部材で導熱板の凹溝内に設置した熱管上面にプレス加工を行い、ｄ）導熱モジュールを完成する。 In order to achieve the above object, a heat conducting module and a method for manufacturing the same provided by the present invention include a heat conducting plate and a plurality of heat tubes that dissipate the amount of heat generated by an electronic member. Parallel grooves are opened, and each groove penetrates the front and rear end faces of the heat conducting plate, forms an arcuate surface below it, and extends a locking portion inward on both sides above the groove. One end of the heat tube is a heat receiving end, the other end is a heat radiating end, and the heat receiving end is passed through the recessed groove of the heat conducting plate and is in contact with the inner wall of the recessed groove and the inside of the engaging portion. .
In order to achieve the above object, an object of the present invention is to provide a heat conducting module and a method for manufacturing the same, the steps of: a) processing a plurality of concave grooves on a heat conducting plate with a molding tool; and b) a heat tube. One end of the heat conducting plate is passed through the recessed groove of the heat conducting plate, c) a press member is pressed on the upper surface of the heat pipe installed in the recessed groove of the heat conducting plate, and d) the heat conducting module is completed.

すなわち、請求項１の発明は、導熱板であり、その上面に複数の平行な凹溝を開設し、各凹溝がそれぞれ導熱板の前後端面に貫通し、且つその下方に円孤形面を形成し、凹溝の上方両側にそれぞれ内向きに係止部を延伸する導熱板と、複数の熱管であり、前記熱管の一端は、受熱端であり、もう一端は放熱端であり、前記受熱端は、導熱板の凹溝内に通してなり、凹溝内壁および係止部内側と相互に貼合接触する複数の熱管とを含む導熱モジュールである。
請求項２の発明は、前記導熱板がアルミ材料である請求項１記載の導熱モジュールである。
請求項３の発明は、前記導熱板が銅材料である請求項１記載の導熱モジュールである。
請求項４の発明は、前記導熱板の係止部が「コ」の字形態を呈する請求項１記載の導熱モジュールである。
請求項５の発明は、前記凹溝の孤形面両端がそれぞれ上向きに縦方向面を延伸してなる請求項１記載の導熱モジュールである。
請求項６の発明は、前記縦方向面および係止部の相互に接触する箇所に内円角を形成する請求項５記載の導熱モジュールである。
請求項７の発明は、前記熱管が「Ｕ」字形の管体である請求項１記載の導熱モジュールである。
請求項８の発明は、前記熱管が「Ｌ」字形の管体である請求項１記載の導熱モジュールである。
請求項９の発明は、更に、導熱媒介剤を含み、該導熱媒介剤を熱管の受熱端および導熱板の凹溝内壁面の間に塗布する請求項１記載の導熱モジュールである。 That is, the invention of claim 1 is a heat conducting plate, and a plurality of parallel concave grooves are formed on the upper surface of the heat conducting plate. A heat conducting plate that extends inwardly on both sides of the upper side of the groove and a plurality of heat tubes, one end of the heat tube being a heat receiving end, the other end is a heat radiating end, and the heat receiving The end is a heat conducting module that includes a plurality of heat tubes that pass through the recessed groove of the heat conducting plate and that are bonded to the inner wall of the recessed groove and the inside of the locking portion.
The invention of claim 2 is the heat conducting module according to claim 1, wherein the heat conducting plate is made of an aluminum material.
The invention of claim 3 is the heat conducting module according to claim 1, wherein the heat conducting plate is made of a copper material.
The invention according to claim 4 is the heat conducting module according to claim 1, wherein the engaging portion of the heat conducting plate has a “U” shape.
A fifth aspect of the present invention is the heat conducting module according to the first aspect, wherein both ends of the arcuate surface of the concave groove are extended upward in the longitudinal direction.
A sixth aspect of the present invention is the heat conducting module according to the fifth aspect, wherein an inner circular angle is formed at a location where the longitudinal surface and the locking portion contact each other.
A seventh aspect of the present invention is the heat conducting module according to the first aspect, wherein the heat tube is a “U” -shaped tube.
The invention according to claim 8 is the heat conducting module according to claim 1, wherein the heat tube is an “L” -shaped tube.
A ninth aspect of the present invention is the heat conducting module according to the first aspect, further comprising a heat conducting medium, wherein the heat conducting medium is applied between the heat receiving end of the heat tube and the inner wall surface of the groove of the heat conducting plate.

請求項１０の発明は、導熱モジュール製造方法であって、そのステップが、
ａ）成型刀具で導熱板上に複数の凹溝を加工する
ｂ）熱管の一端を導熱板の凹溝内に通す
ｃ）プレス部材で導熱板の凹溝内に設置した熱管上面にプレス加工を行う
ｄ）導熱モジュールを完成させる
工程を含む導熱モジュール製造方法である。
請求項１１の発明は、前記ステップａ）が成型切削刀で導熱板の上面を切削し複数の相互に平行な凹溝を切り出すものである請求項１０記載の導熱モジュール製造方法である。
請求項１２の発明は、前記ステップｂ）が熱管に対して湾曲加工を行い、「Ｕ」字形を呈させ、熱管の一端を導熱板の凹溝に対応させ通すものである請求項１０記載の導熱モジュール製造方法である。
請求項１３の発明は、前記ステップｃ）が予め凸部を有するプレス部材を準備し、各凸部をそれぞれ熱管上に合わせ、下向きにプレス移動させ、各凸部を各熱管に対し加工形成を行わせるものである請求項１０記載の導熱モジュール製造方法である。
請求項１４の発明は、更に、ステップｅ）を含み、前記ステップｅ）は、前記ステップａ）およびｂ）の間に介在し、且つ導熱板の凹溝内に導熱媒介を塗布するものである請求項１０記載の導熱モジュール製造方法である。
請求項１５の発明は、更にステップｆ）を含み、前記ステップｃ）の後にあり、前記ステップｆ）は、導熱板に対して過熱を実行し、導熱媒介を受熱させ、溶解させるものである請求項１０記載の導熱モジュール製造方法である。 The invention of claim 10 is a heat conducting module manufacturing method, the step comprising:
a) Machining a plurality of grooves on the heat conducting plate with a molding tool b) Passing one end of the heat pipe into the groove of the heat conducting plate c) Pressing the upper surface of the heat tube installed in the groove of the heat conducting plate with a press member D) A heat conducting module manufacturing method including a step of completing a heat conducting module.
The invention of claim 11 is the method of manufacturing the heat conducting module according to claim 10, wherein the step a) cuts the upper surface of the heat conducting plate with a molded cutting blade to cut out a plurality of mutually parallel concave grooves.
According to a twelfth aspect of the present invention, in the step b), the heat pipe is bent to form a “U” shape, and one end of the heat pipe is made to correspond to the concave groove of the heat conducting plate. It is a heat conducting module manufacturing method.
In the invention of claim 13, in step c), a pressing member having a convex portion is prepared in advance, each convex portion is aligned on the heat pipe, and pressed downward, and each convex portion is processed and formed on each heat pipe. The method of manufacturing a heat conducting module according to claim 10, which is performed.
The invention of claim 14 further includes a step e), wherein the step e) is interposed between the steps a) and b) and applies a heat conduction medium in the concave groove of the heat conduction plate. It is a heat conductive module manufacturing method of Claim 10.
The invention of claim 15 further includes step f), which is after step c), wherein the step f) performs overheating on the heat conducting plate to receive and melt the heat conducting medium. Item 11. The method for manufacturing a heat conducting module according to Item 10.

本発明の導熱モジュールおよびその製造方法によれば、各凹溝の係止部の設置を利用し、導熱板および各熱管の間の安定性、固定強度、密着性、及び、緊密性が向上し、導熱モジュールの熱伝導効果を上昇させる。   According to the heat conducting module of the present invention and the method for manufacturing the same, the stability, fixing strength, adhesion, and tightness between the heat conducting plate and each heat pipe are improved by using the installation of the engaging portions of the respective concave grooves. , Increase the heat conduction effect of the heat conducting module.

本発明の好適な導熱(放熱)モジュールとその製造方法の実施例を図に沿って説明する。
図１〜図３は、それぞれ、本発明の実施例の立体分解図、組み合わせ説明図、組み合わせ断面図であり、本発明の実施例の導熱モジュールは、導熱板１０および複数の熱管２０を含み、そのうち、前記導熱板１０は、アルミ、銅等の散熱性が良好な矩形体であり、その上面には、複数の相互に平行な凹溝１１を開設し、各凹溝１１は、それぞれ導熱板１０の前後端面を貫通した断面円形状であるが、その断面円形状の下方には断面円形の一部を残した円孤形面１１１を形成し、円孤形面１１１の両端には、成型刀具でそれぞれ上向きに縦方向面１１２を延伸する。凹溝１１の上方両端には、それぞれ内向き水平に「コ」の字形係止部１２を延伸するように形成し、前記係止部１２の下側の内壁には、縦方向面１１２と相互に接する箇所に内円角１３を形成する。 Embodiments of a preferred heat conduction (heat radiation) module and its manufacturing method according to the present invention will be described with reference to the drawings.
1 to 3 are respectively a three-dimensional exploded view, a combination explanatory view, and a combined sectional view of an embodiment of the present invention. The heat conducting module of the embodiment of the present invention includes a heat conducting plate 10 and a plurality of heat tubes 20, Among them, the heat conducting plate 10 is a rectangular body with good heat dissipation such as aluminum and copper, and a plurality of mutually parallel concave grooves 11 are formed on the upper surface thereof, and each of the concave grooves 11 is a heat conducting plate, respectively. 10 has a circular cross section that penetrates through the front and rear end faces, but a circular arc surface 111 is formed below the circular cross section, leaving a part of the circular cross section. The longitudinal surface 112 is extended upward with a sword. At both upper ends of the concave groove 11, a “U” -shaped locking part 12 is formed so as to extend horizontally inwardly. An inner circular angle 13 is formed at a location in contact with.

前記熱管２０は、「Ｕ」字形、「Ｌ」字形またはその他の各種異なる幾何学形状であることができ、その一端は、受熱端２１であり、もう一端は、放熱端２２であり、内部に毛細組織および動作流体を装着し、気液相を利用した熱伝導制御により迅速な熱伝導効果を達成し、当初断面円形の前記受熱端２１は、導熱板１０の凹溝１１内に通し、後述するプレス部材５によって、断面円形の熱管２０である受熱端２１の上面をプレスして平坦部とし、凹溝１１内壁および係止部１２内側と相互に密着し貼合接触する。   The heat tube 20 may have a “U” shape, an “L” shape, or various other geometric shapes, one end of which is a heat receiving end 21 and the other end is a heat radiating end 22. A capillary tissue and a working fluid are attached, and a rapid heat conduction effect is achieved by heat conduction control utilizing a gas-liquid phase. The heat receiving end 21 having a circular initial cross section is passed through the recessed groove 11 of the heat conducting plate 10 to be described later. The pressing member 5 presses the upper surface of the heat receiving end 21, which is a heat tube 20 having a circular cross section, to form a flat portion, and is in close contact with the inner wall of the groove 11 and the inner side of the locking portion 12 to make a bonding contact.

また、本発明の実施例の導熱モジュールは、更に、導熱媒介剤３０を含み、前記導熱媒介剤３０は、シリコンオイルやソルダークリーム等の材料が使用でき、熱管２０の受熱端２１および導熱板１０の凹溝１１内壁面の間に塗布され、熱管２０および凹溝１１の間の密閉効果を増加し、通気孔の存在をなくし、大幅に熱伝導効果を向上させる。   In addition, the heat conducting module of the embodiment of the present invention further includes a heat conducting medium 30, and the heat conducting medium 30 can be made of a material such as silicon oil or solder cream, and the heat receiving end 21 of the heat tube 20 and the heat conducting plate 10. It is applied between the inner wall surfaces of the groove 11 to increase the sealing effect between the heat tube 20 and the groove 11, eliminate the presence of air holes, and greatly improve the heat conduction effect.

図４〜図７は、それぞれ、本発明の実施例の製造工程図であり、熱管を導熱板に組み合わせた説明図、プレス部材が導熱板を押し込む前の断面図、プレス部材が導熱板を押し込んだ後の断面図であり、本発明の導熱モジュール製造方法の工程（ステップa〜ｄ）は以下のとおりである。
ａ）図４のフローチャートの図において、まず、ステップａで、成型刀(切削)具で導熱板１０上複数の凹溝１１を形成する；このステップ中、導熱板１０を切削用の作業台に固定した後、成型切削刀で導熱板１０の上面を切削し複数の相互に平行な凹溝１１を切り出す。この凹溝１１は、図６に示すように、下半分は半円形の円孤形面１１１で、円孤形面１１１の両端には上向きに縦方向面１１２を延伸し、凹溝１１の上方両端には、それぞれ内向き水平に「コ」の字形係止部１２を延伸するように形成し、前記係止部１２の下側の内壁には、縦方向面１１２と相互に接する箇所に内円角１３を形成してある。
ｂ）続いて、ステップｂで、図５に示すように、熱管２０の一端を導熱板１０の凹溝１１内に通す。このステップ中、熱管２０に対し湾曲加工を実施し、「Ｕ」字形を呈させ、熱管２０の一端を導熱板１０の凹溝１１に通す。
ｃ）ステップｃで、図６に示すように、プレス部材５で導熱板１０の凹溝１１内に通した熱管２０の上面にプレス加工を行う。このステップ中、プレス部材５を予め準備し、前記プレス部材５は導熱板１０の凹溝１１に対応する位置に複数の凸部５１を有し、各凸部５１をそれぞれ熱管２０の上に合わせ、図６の矢印のように、下向きにプレス部材５を移動し、図７に示すように、各凸部５１を各熱管２０に対し加工形成を行わせ、各熱管２０の対応する部分を、上端平坦で両端を小さな曲率半径で折り曲げるように塑性変形を発生させ、導熱板１０の凹溝１１内壁および係止部１２内側と相互に貼合接触(密着)させ、安定性および緊密性を高める。
ｄ）最後に、ステップdで、プレス部材５を引き上げて、図３に示すように、導熱モジュールを完成することができる。 4 to 7 are manufacturing process diagrams of an embodiment of the present invention, respectively, an explanatory diagram in which a heat tube is combined with a heat conducting plate, a cross-sectional view before the press member pushes the heat conducting plate, and the press member pushes the heat conducting plate. It is sectional drawing after a later, and the process (step ad) of the heat conductive module manufacturing method of this invention is as follows.
a) In the flowchart of FIG. 4, first, in step a, a plurality of concave grooves 11 are formed on the heat conducting plate 10 with a molding tool (cutting tool); during this step, the heat conducting plate 10 is used as a work table for cutting. After fixing, the upper surface of the heat conducting plate 10 is cut with a molded cutting blade, and a plurality of mutually parallel concave grooves 11 are cut out. As shown in FIG. 6, the concave groove 11 has a semicircular arc-shaped surface 111 in the lower half, and a vertical surface 112 is extended upward at both ends of the circular arc surface 111, At both ends, a “U” -shaped locking portion 12 is formed so as to extend horizontally inwardly, and the inner wall on the lower side of the locking portion 12 is formed at a location in contact with the longitudinal surface 112. A circular angle 13 is formed.
b) Subsequently, in step b, as shown in FIG. 5, one end of the heat tube 20 is passed through the recessed groove 11 of the heat conducting plate 10. During this step, the heat pipe 20 is bent to form a “U” shape, and one end of the heat pipe 20 is passed through the concave groove 11 of the heat conducting plate 10.
c) In step c, as shown in FIG. 6, the press member 5 presses the upper surface of the heat tube 20 that has passed through the groove 11 of the heat conducting plate 10. During this step, the press member 5 is prepared in advance, and the press member 5 has a plurality of convex portions 51 at positions corresponding to the concave grooves 11 of the heat conducting plate 10, and each convex portion 51 is aligned on the heat tube 20. 6, the pressing member 5 is moved downward as indicated by an arrow in FIG. 6, and each convex portion 51 is processed and formed on each heat pipe 20 as shown in FIG. 7. Plastic deformation is generated so that the upper end is flat and both ends are bent with a small radius of curvature, and the inner wall of the groove 11 of the heat conducting plate 10 and the inner side of the engaging portion 12 are bonded and brought into close contact with each other to improve stability and tightness. .
d) Finally, in step d, the press member 5 can be pulled up to complete the heat conducting module as shown in FIG.

また、本発明の実施例の製造ステップは、更に、ステップｅ）を含み、前記ステップｅ）は、ステップａ）およびｂ）の間に介在し、且つ導熱板１０の凹溝１１内にシリコンオイルやソルダークリーム等のような熱伝導率を向上させる導熱媒介剤３０を塗布してもよい。また、ステップｃ）の後に更にステップｆ）を含み、前記ステップｆ）は、導熱板１０に対して過熱を実行し、導熱媒介剤３０を受熱させ、安定性および緊密性をより高めるために溶解させるようにしてもよい。   In addition, the manufacturing step of the embodiment of the present invention further includes step e), which is interposed between steps a) and b), and in the groove 11 of the heat conducting plate 10 is silicon oil. You may apply the heat-conductivity mediator 30 which improves heat conductivity like a solder cream. Further, after step c), step f) further includes step f), in which the heat conducting plate 10 is heated to receive the heat conducting agent 30 and dissolved in order to further improve stability and tightness. You may make it make it.

以上のように、本実施例の導熱モジュールおよびその製造方法によれば、各凹溝１１の係止部１２の形状を利用し、プレス工程により、導熱板１０および各熱管２０の間の安定性、固定強度、密着性、及び、緊密性が向上し、導熱モジュールの熱伝導効果を上昇させることが出来る。
なお、本発明では好ましい実施例を前述の通り開示したが、これらは決して本発明に限定するものではなく、当該技術を熟知する者なら誰でも、本発明の精神と領域を脱しない均等の範囲内で各種の変動や潤色を加えることができることは勿論である。 As described above, according to the heat conducting module of this embodiment and the manufacturing method thereof, the stability between the heat conducting plate 10 and each heat tube 20 is achieved by a pressing process using the shape of the locking portion 12 of each concave groove 11. In addition, the fixing strength, adhesion, and tightness are improved, and the heat conduction effect of the heat conducting module can be increased.
In the present invention, the preferred embodiments have been disclosed as described above, but these are not intended to limit the present invention in any way, and anyone who is familiar with the technology can make an equivalent scope without departing from the spirit and scope of the present invention. Of course, various fluctuations and hydration colors can be added.

本発明の実施例の立体分解図である。It is a three-dimensional exploded view of the Example of this invention. 本発明の実施例の組み合わせ説明図である。It is combination explanatory drawing of the Example of this invention. 本発明の実施例の組み合わせ断面図である。It is combination sectional drawing of the Example of this invention. 本発明の実施例の製造工程図である。It is a manufacturing-process figure of the Example of this invention. 本発明の実施例の熱管を導熱板に通し接続する組み合わせ説明図である。It is combination explanatory drawing which connects the heat pipe of the Example of this invention through a heat conducting plate. 本発明の実施例のプレス部材が導熱板を押し込む前の断面図である。It is sectional drawing before the press member of the Example of this invention pushes in a heat-conducting plate. 本発明の実施例のプレス部材が導熱板を押し込んだ後の断面図である。It is sectional drawing after the press member of the Example of this invention pushed in the heat conducting plate.

符号の説明Explanation of symbols

１０ 導熱板
１１ 凹溝
１１１ 円孤形面
１１２ 縦方向面
１２ 係止部
１３ 内円角
２０ 熱管
２１ 受熱端
２２ 放熱端
３０ 導熱媒介剤
５ プレス部材
５１ 凸部
ａ〜ｆ ステップ(工程)フロー DESCRIPTION OF SYMBOLS 10 Heat-conducting plate 11 Groove | groove 111 Arc-shaped surface 112 Vertical direction surface 12 Locking part 13 Inner circular angle 20 Heat pipe 21 Heat receiving end 22 Heat radiating end 30 Heat-conducting agent 5 Press member 51 Convex part af Step (process) flow

Claims (15)

導熱板であり、その上面に複数の平行な凹溝を開設し、各凹溝がそれぞれ導熱板の前後端面に貫通し、且つその下方に円孤形面を形成し、凹溝の上方両側にそれぞれ内向きに係止部を延伸する導熱板と、
複数の熱管であり、前記熱管の一端は、受熱端であり、もう一端は放熱端であり、前記受熱端は、導熱板の凹溝内に通してなり、凹溝内壁および係止部内側と相互に貼合接触する複数の熱管と
を含む導熱モジュール。 A heat conducting plate having a plurality of parallel grooves on its upper surface, each recessed groove penetrating through the front and rear end surfaces of the heat conducting plate, and forming an arcuate surface below it, on both sides above the groove A heat-conducting plate that extends the locking portion inwardly;
A plurality of heat tubes, one end of the heat tube is a heat receiving end, the other end is a heat radiating end, and the heat receiving end is passed through a recessed groove of the heat conducting plate, A heat transfer module including a plurality of heat pipes that are bonded to each other. 前記導熱板がアルミ材料である請求項１記載の導熱モジュール。   The heat conducting module according to claim 1, wherein the heat conducting plate is made of an aluminum material. 前記導熱板が銅材料である請求項１記載の導熱モジュール。   The heat conducting module according to claim 1, wherein the heat conducting plate is made of a copper material. 前記導熱板の係止部が「コ」の字形態を呈する請求項１記載の導熱モジュール。   The heat conducting module according to claim 1, wherein the engaging portion of the heat conducting plate has a “U” shape. 前記凹溝の孤形面両端がそれぞれ上向きに縦方向面を延伸してなる請求項１記載の導熱モジュール。   The heat conducting module according to claim 1, wherein both ends of the arc-shaped surface of the concave groove are each formed by extending a longitudinal surface upward. 前記縦方向面および係止部の相互に接触する箇所に内円角を形成する請求項５記載の導熱モジュール。   The heat conducting module according to claim 5, wherein an inner circular angle is formed at a location where the vertical surface and the locking portion contact each other. 前記熱管が「Ｕ」字形の管体である請求項１記載の導熱モジュール。   The heat conducting module according to claim 1, wherein the heat tube is a “U” -shaped tube. 前記熱管が「Ｌ」字形の管体である請求項１記載の導熱モジュール。   The heat conducting module according to claim 1, wherein the heat tube is an “L” -shaped tube. 更に、導熱媒介剤を含み、該導熱媒介剤を熱管の受熱端および導熱板の凹溝内壁面の間に塗布する請求項１記載の導熱モジュール。   The heat conducting module according to claim 1, further comprising a heat conducting medium, wherein the heat conducting medium is applied between the heat receiving end of the heat tube and the inner wall surface of the groove of the heat conducting plate. 導熱モジュール製造方法であって、そのステップが、
ａ）成型刀具で導熱板上に複数の凹溝を加工する
ｂ）熱管の一端を導熱板の凹溝内に通す
ｃ）プレス部材で導熱板の凹溝内に設置した熱管上面にプレス加工を行う
ｄ）導熱モジュールを完成させる
工程を含む導熱モジュール製造方法。 A method of manufacturing a heat conducting module, the step comprising:
a) Machining a plurality of grooves on the heat conducting plate with a molding tool b) Passing one end of the heat pipe into the groove of the heat conducting plate c) Pressing the upper surface of the heat tube installed in the groove of the heat conducting plate with a press member D) A heat conducting module manufacturing method including a step of completing a heat conducting module. 前記ステップａ）が成型切削刀で導熱板の上面を切削し複数の相互に平行な凹溝を切り出すものである請求項１０記載の導熱モジュール製造方法。   11. The method of manufacturing a heat conducting module according to claim 10, wherein the step a) cuts the upper surface of the heat conducting plate with a molded cutting knife to cut out a plurality of mutually parallel concave grooves. 前記ステップｂ）が熱管に対して湾曲加工を行い、「Ｕ」字形を呈させ、熱管の一端を導熱板の凹溝に対応させ通すものである請求項１０記載の導熱モジュール製造方法。   The heat conducting module manufacturing method according to claim 10, wherein the step b) performs a bending process on the heat pipe to form a “U” shape, and passes one end of the heat pipe corresponding to the concave groove of the heat conducting plate. 前記ステップｃ）が予め凸部を有するプレス部材を準備し、各凸部をそれぞれ熱管上に合わせ、下向きにプレス移動させ、各凸部を各熱管に対し加工形成を行わせるものである請求項１０記載の導熱モジュール製造方法。   The step c) prepares a pressing member having a convex portion in advance, aligns each convex portion on a heat tube, presses it downward, and causes each convex portion to be processed and formed on each heat tube. The method for manufacturing a heat conducting module according to claim 10. 更に、ステップｅ）を含み、前記ステップｅ）は、前記ステップａ）およびｂ）の間に介在し、且つ導熱板の凹溝内に導熱媒介を塗布するものである請求項１０記載の導熱モジュール製造方法。   11. The heat conducting module according to claim 10, further comprising step e), wherein said step e) is interposed between said steps a) and b) and applies a heat conducting medium in the groove of the heat conducting plate. Production method. 更にステップｆ）を含み、前記ステップｃ）の後にあり、前記ステップｆ）は、導熱板に対して過熱を実行し、導熱媒介を受熱させ、溶解させるものである請求項１０記載の導熱モジュール製造方法。   The heat conducting module manufacturing method according to claim 10, further comprising step f), after step c), wherein the step f) performs heating of the heat conducting plate to receive and melt the heat conducting medium. Method.
JP2007109422A 2006-06-29 2007-04-18 Heat-conducting module and method for manufacturing the same Pending JP2008010828A (en)

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