US20110192026A1 - Press fitting method for heat pipe and heat sink - Google Patents

Press fitting method for heat pipe and heat sink Download PDF

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Publication number
US20110192026A1
US20110192026A1 US12/704,518 US70451810A US2011192026A1 US 20110192026 A1 US20110192026 A1 US 20110192026A1 US 70451810 A US70451810 A US 70451810A US 2011192026 A1 US2011192026 A1 US 2011192026A1
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United States
Prior art keywords
heat pipe
heat
heat sink
pipe
sink
Prior art date
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Abandoned
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US12/704,518
Inventor
Shyh-Ming Chen
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Individual
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Individual
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Priority to US12/704,518 priority Critical patent/US20110192026A1/en
Publication of US20110192026A1 publication Critical patent/US20110192026A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/08—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of both metal tubes and sheet metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/06—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of tubes or metal hoses; Combined procedures for making tubes, e.g. for making multi-wall tubes
    • B21C37/15—Making tubes of special shape; Making tube fittings
    • B21C37/22—Making finned or ribbed tubes by fixing strip or like material to tubes
    • B21C37/24—Making finned or ribbed tubes by fixing strip or like material to tubes annularly-ribbed tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K23/00—Making other articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K25/00—Uniting components to form integral members, e.g. turbine wheels and shafts, caulks with inserts, with or without shaping of the components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for 
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/10—Fastening; Joining by force joining
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a press fitting method for heat pipe and heat sink, and particular to a press fitting method applied to computer, electronic or LED lamp device or related heat dissipating technology.
  • Heat pipe with heat sink are commonly used for the purpose of providing a better heat dissipation to a computer, electronic or LED lamp device.
  • the heat sink is usually a heat conducting plate (base) or a fin module.
  • the heat sink is attached to a heat source so that the heat will be quickly dissipated through the heat pipe connected to the heat sink.
  • the primary object of the present invention is to provide a fitting method for heat pipe and heat sink which is fast, effective, and economic so as to ensure the tight connection and well heat dissipation.
  • FIGS. 1A to 1D are schematic views showing the pressing of the first embodiment of the present invention.
  • FIGS. 2A to 2D are schematic views showing the pressing of the second embodiment of the present invention.
  • FIGS. 3A to 3E are schematic views showing the pressing of the third embodiment of the present invention.
  • FIGS. 5A to 5B are schematic views showing the pressing of the fifth embodiment of the present invention.
  • FIG. 1A to 1D the first embodiment of a press fitting method for heat pipe and heat sink according to the present invention is illustrated.
  • the embodiment includes the following steps.
  • At least a heat pipe 10 and a heat sink 20 conducting heat to the heat pipe 10 are provided.
  • the heat pipe 10 is approximately oval-shaped.
  • the heat sink 20 is one of a plate, base, or fin module capable of conducting heat.
  • the heat sink 20 has a groove 21 for receiving the heat pipe 10 on a side thereof. The heat pipe 10 will be protruded from a surface of the heat sink 20 while being received by the groove 21 .
  • the heat pipe 10 is placed into the groove 21 .
  • a conductivity medium 30 is smeared around the junction of the heat pipe 10 and the heat sink 20 .
  • the heat pipe 10 is tightly fitting to the heat sink 20 so as to achieve a better heat dissipation.
  • the second embodiment according to the present invention is illustrated.
  • the embodiment has generally the same steps a, b, and c with the first embodiment.
  • a heat pipe 10 a of the second embodiment is below (or level with) the surface of the heat sink 20 while being received by the groove 21 of the heat sink 20 .
  • the heat pipe 10 a is placed into the groove 21 .
  • the conductivity medium 30 is smeared to the junction of the heat pipe 10 a and the heat sink 20 .
  • a press mold 40 a has a protrusion for the heat pipe 10 a inside the groove 21 . An end of the heat pipe 10 a pointing out the groove will be pressed by the protrusion of the press mold 40 a so as to be deformed and fit to the groove 21 .
  • FIG. 3A to 3E the third embodiment of press fitting method for heat pipe and heat sink according to the present invention is illustrated.
  • the embodiment includes the following steps.
  • At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided.
  • the heat pipe 50 is approximately oval-shaped.
  • the heat sink 60 has a plurality of fin 61 .
  • the plurality of fin 61 has a through hole 62 for receiving the heat pipe 50 .
  • the heat pipe 50 is placed into the through hole 62 .
  • a conductivity medium 70 is smeared to the junction of the heat pipe 50 and the through hole 62 .
  • a jig 80 passing through the fins is holding against one side of the heat pipe 50 .
  • the fourth embodiment according to the present invention is illustrated.
  • the embodiment has the following steps a, b, and c generally the same with the third embodiment.
  • At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided.
  • the heat pipe 50 is approximately oval-shaped.
  • the heat sink 60 has a plurality of fin 61 .
  • the plurality of fin 61 has a through hole 62 for receiving the heat pipe 50 .
  • a press mold 90 has an upper mold 91 and lower mold 92 .
  • the fifth embodiment according to the present invention is illustrated.
  • the embodiment has the following steps a, b, and c generally the same with the third and the fourth embodiments.
  • At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided.
  • the heat pipe 50 is approximately oval-shaped.
  • the heat sink 60 has a plurality of fin 61 .
  • the plurality of fin 61 has a through hole 62 for receiving the heat pipe 50 .
  • each of the fins 61 has a vertical extension portion 63 capable of attaching to a surface of the heat pipe.
  • the heat pipe 50 is placed into the through hole 62 so that the extension portions 63 of the fins 61 are attached to the heat pipe 50 .
  • a conductivity medium 70 is smeared to the junction of the heat pipe 50 and the extension portions 63 .
  • At least one press mold 95 is provided.

Abstract

A press fitting method for heat pipe and heat sink includes the following steps. a) At least a heat pipe and a heat sink conducting heat to the heat pipe are provided. The heat sink is one of a heat conducting plate or a fin module. The heat sink has a groove for receiving the heat pipe. b) The heat pipe is placed into the groove. c) An end of the heat pipe or the heat pipe under the fins is pressed by a press mold so as to be deformed and fit to the groove as one. Through the above steps, an efficient and quick method is provided and the heat pipe will be tightly fitted to the heat sink so as to achieve a better heat dissipation.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a press fitting method for heat pipe and heat sink, and particular to a press fitting method applied to computer, electronic or LED lamp device or related heat dissipating technology.
    • DESCRIPTION OF THE PRIOR ART
  • Heat pipe with heat sink are commonly used for the purpose of providing a better heat dissipation to a computer, electronic or LED lamp device. The heat sink is usually a heat conducting plate (base) or a fin module. The heat sink is attached to a heat source so that the heat will be quickly dissipated through the heat pipe connected to the heat sink.
  • Prior fitting of the heat pipe and the fins of the heat sink is through welding which is complicated method and also not friendly to environment. Each fin needs to be welded with heated intermediate. The flowing melting intermediate is hard to control a well uniformity and gaps are sometimes happened so that the fitting between the fins and the heat pipe is hard to achieve. Therefore, the method is not economic.
  • Some maker will use conducting glue between the heat pipe and the heat sink and as an adhesive. But the macromolecule glue will be solidified by time and result in gaps so that the heat dissipation will be effected.
    • SUMMARY OF THE INVENTION
  • Accordingly, the primary object of the present invention is to provide a fitting method for heat pipe and heat sink which is fast, effective, and economic so as to ensure the tight connection and well heat dissipation.
  • Through the method, the production of the assembly is fast, and the heat dissipation performance is also raised for the needs.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1A to 1D are schematic views showing the pressing of the first embodiment of the present invention.
  • FIGS. 2A to 2D are schematic views showing the pressing of the second embodiment of the present invention.
  • FIGS. 3A to 3E are schematic views showing the pressing of the third embodiment of the present invention.
  • of the fourth embodiment of the present invention.
  • FIGS. 5A to 5B are schematic views showing the pressing of the fifth embodiment of the present invention.
    •  BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT
  • In order that those skilled in the art can further understand the present invention, a description will be provided in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.
  • Referring to FIG. 1A to 1D, the first embodiment of a press fitting method for heat pipe and heat sink according to the present invention is illustrated. The embodiment includes the following steps.
  • a) At least a heat pipe 10 and a heat sink 20 conducting heat to the heat pipe 10 are provided. The heat pipe 10 is approximately oval-shaped. The heat sink 20 is one of a plate, base, or fin module capable of conducting heat. The heat sink 20 has a groove 21 for receiving the heat pipe 10 on a side thereof. The heat pipe 10 will be protruded from a surface of the heat sink 20 while being received by the groove 21.
  • b) The heat pipe 10 is placed into the groove 21. A conductivity medium 30 is smeared around the junction of the heat pipe 10 and the heat sink 20.
  • c) The end of the heat pipe 10 protruded from the groove 21 is pressed by a press mold 40 so as to be deformed and fit to the groove 21 as one. (shown in FIG. 1D)
  • Through the above steps, the heat pipe 10 is tightly fitting to the heat sink 20 so as to achieve a better heat dissipation.
  • Referring to FIGS. 2A to 2D, the second embodiment according to the present invention is illustrated. The embodiment has generally the same steps a, b, and c with the first embodiment.
  • The difference between the two embodiments is that a heat pipe 10 a of the second embodiment is below (or level with) the surface of the heat sink 20 while being received by the groove 21 of the heat sink 20. The heat pipe 10 a is placed into the groove 21. The conductivity medium 30 is smeared to the junction of the heat pipe 10 a and the heat sink 20. A press mold 40 a has a protrusion for the heat pipe 10 a inside the groove 21. An end of the heat pipe 10 a pointing out the groove will be pressed by the protrusion of the press mold 40 a so as to be deformed and fit to the groove 21.
  • Referring to FIG. 3A to 3E, the third embodiment of press fitting method for heat pipe and heat sink according to the present invention is illustrated. The embodiment includes the following steps.
  • a) At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided. The heat pipe 50 is approximately oval-shaped. The heat sink 60 has a plurality of fin 61. The plurality of fin 61 has a through hole 62 for receiving the heat pipe 50.
  • b) The heat pipe 50 is placed into the through hole 62. A conductivity medium 70 is smeared to the junction of the heat pipe 50 and the through hole 62. A jig 80 passing through the fins is holding against one side of the heat pipe 50.
  • c) Another side of the heat pipe 50 against the jig 80 is pressed by a press mold 82. The heat pipe 50 being pressed is deformed towards the fins 61 so that the fins 61 and the heat pipe 50 will be tightly fit together (as shown in FIGS. 3D and 3E).
  • Referring to FIGS. 4A to 4D, the fourth embodiment according to the present invention is illustrated. The embodiment has the following steps a, b, and c generally the same with the third embodiment.
  • a) At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided. The heat pipe 50 is approximately oval-shaped. The heat sink 60 has a plurality of fin 61. The plurality of fin 61 has a through hole 62 for receiving the heat pipe 50.
  • b) The heat pipe 50 is placed into the through hole 62. A conductivity medium 70 is smeared to the junction of the heat pipe 50 and the through hole 62. A press mold 90 has an upper mold 91 and lower mold 92.
  • c) The upper mold 91 and the lower mold 92 is passing through the fins 61 and pressing two opposite sides of the heat pipe 50. The heat pipe 50 being pressed is deformed towards the fins 61 so that the heat pipe 50 and the fins 61 will be tightly fit together (as shown in FIG. 4 b).
  • Referring to FIGS. 5A and 5B, the fifth embodiment according to the present invention is illustrated. The embodiment has the following steps a, b, and c generally the same with the third and the fourth embodiments.
  • a) At least one heat pipe 50 and a heat sink 60 conducting heat to the heat pipe 50 are provided. The heat pipe 50 is approximately oval-shaped. The heat sink 60 has a plurality of fin 61. The plurality of fin 61 has a through hole 62 for receiving the heat pipe 50. However, each of the fins 61 has a vertical extension portion 63 capable of attaching to a surface of the heat pipe.
  • b) The heat pipe 50 is placed into the through hole 62 so that the extension portions 63 of the fins 61 are attached to the heat pipe 50. A conductivity medium 70 is smeared to the junction of the heat pipe 50 and the extension portions 63. At least one press mold 95 is provided.
  • c) The press mold 95 is pressing towards the extension portions 63. The heat pipe 50 is thus pressed and deformed towards the fins 61 so that the heat pipe 50 and the fins 61 will be tightly fit together.
  • In order that those skilled in the art can further understand the present invention, a description will be provided in the following in details. However, these descriptions and the appended drawings are only used to cause those skilled in the art to understand the objects, features, and characteristics of the present invention, but not to be used to confine the scope and spirit of the present invention defined in the appended claims.

Claims (11)

1. A press fitting method for heat pipe and heat sink comprising:
at least a heat pipe and a heat sink conducting heat to the heat pipe; the heat sink having a groove for receiving the heat pipe on a side thereof;
b) the heat pipe being placed into the groove;
c) an end of the heat pipe in the groove being pressed by a press mold and being deformed so as to tightly fit to the groove.
2. The press fitting method for heat pipe and heat sink as claimed in claim 1, wherein the heat sink is one of a heat conducting plate or a fin module.
3. The press fitting method for heat pipe and heat sink as claimed in claim 1, wherein the groove of the heat sink is approximately U shape and the heat pipe being received into the groove has a shape of one of a flat cylinder or a long oval-shaped body.
4. The press fitting method for heat pipe and heat sink as claimed in claim 1, wherein a conductivity medium is smeared to junction of the heat pipe and the heat sink.
5. A press fitting method for heat pipe and heat sink comprising:
a) at least a heat pipe and a heat sink conducting heat to the heat pipe; the heat sink having a plurality of fin; the plurality of fin having a through hole for receiving the heat pipe;
b) the heat pipe being placed into the through hole; the heat pipe close to the fins being held against by a jig;
c) an opposite side of the heat pipe against the jig being pressed by a press mold; the heat pipe being deformed towards the fins so that the fins and the heat pipe will be tightly fit together.
6. The press fitting method for heat pipe and heat sink as claimed in claim 5, wherein the plurality of fin of the heat sink has a through hole for receiving the heat pipe; the through hole and the heat pipe have corresponding shape of one of a flat cylinder or a long oval-shaped body.
7. The press fitting method for heat pipe and heat sink as claimed in claim 5, wherein a conductivity medium is smeared to junction of the heat pipe and the through hole.
8. A press fitting method for heat pipe and heat sink comprising:
a) at least a heat pipe and a heat sink conducting heat to the heat pipe; the heat sink having a plurality of fin; the plurality of fin having a through hole for receiving the heat pipe;
b) the heat pipe being put into the through hole; a press mold having an upper mold and a lower mold;
c) the upper mold and the lower mold being passed through the fins and pressed two opposite sides of the heat pipe; the heat pipe being pressed and deformed towards the fins so that the heat pipe and the fins will be tightly fit together.
9. The press fitting method for heat pipe and heat sink as claimed in claim 8, wherein the plurality of fin of the heat sink has a through hole for receiving the heat pipe; the through hole and the heat pipe have corresponding shape of one of a flat cylinder or a long oval-shaped body.
10. The press fitting method for heat pipe and, heat sink as claimed in claim 8, wherein a conductivity medium is smeared to junction of the heat pipe and the through hole.
11. The press fitting method for heat pipe and heat sink as claimed in claim 5, wherein the plurality of fin has a through hole for receiving the heat pipe; each of the fins has an extension portion capable of attaching to a surface of the heat pipe.
US12/704,518 2010-02-11 2010-02-11 Press fitting method for heat pipe and heat sink Abandoned US20110192026A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170082377A1 (en) * 2015-09-17 2017-03-23 Asia Vital Components Co., Ltd. Heat dissipation device
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030005584A1 (en) * 1998-11-20 2003-01-09 Sumitomo Light Metal Industries, Ltd. Assembly including heat pipe and heat conductive member fixed to each other by plastic deformation of the latter, and method of manufacturing the assembly
US6853555B2 (en) * 2002-04-11 2005-02-08 Lytron, Inc. Tube-in-plate cooling or heating plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030005584A1 (en) * 1998-11-20 2003-01-09 Sumitomo Light Metal Industries, Ltd. Assembly including heat pipe and heat conductive member fixed to each other by plastic deformation of the latter, and method of manufacturing the assembly
US6853555B2 (en) * 2002-04-11 2005-02-08 Lytron, Inc. Tube-in-plate cooling or heating plate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170082377A1 (en) * 2015-09-17 2017-03-23 Asia Vital Components Co., Ltd. Heat dissipation device
US10247488B2 (en) * 2015-09-17 2019-04-02 Asia Vital Components Co., Ltd. Heat dissipation device
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink

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