JP5770894B1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- JP5770894B1 JP5770894B1 JP2014157720A JP2014157720A JP5770894B1 JP 5770894 B1 JP5770894 B1 JP 5770894B1 JP 2014157720 A JP2014157720 A JP 2014157720A JP 2014157720 A JP2014157720 A JP 2014157720A JP 5770894 B1 JP5770894 B1 JP 5770894B1
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 9
- 230000005855 radiation Effects 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000008878 coupling Effects 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000001808 coupling effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000036964 tight binding Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
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- Geometry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【課題】放熱フィンとヒートパイプと結合有する放熱装置を提供する。【解決手段】複数の放熱フィン1は、板厚方向に直列に接続されており、いずれも少なくとも1つの貫通穴11が形成されており、貫通穴11から延伸する凸環部111が設けられており、凸環部111の互いに対称である両側に凸環部111と隣接する弧状孔12が形成されており、弧状孔12により凸環部111の互いに対称である両側の局部環状壁111aと放熱フィン1の本体とが分離する。ヒートパイプ2は板厚方向に直列に接続されている複数の放熱フィン1の貫通穴11を貫通する。【選択図】図5Disclosed is a heat dissipation device having a heat dissipation fin and a heat pipe. A plurality of radiating fins 1 are connected in series in the plate thickness direction, each of which has at least one through hole 11 and a convex ring portion 111 extending from the through hole 11 is provided. Further, arc-shaped holes 12 adjacent to the convex ring part 111 are formed on both sides of the convex ring part 111 which are symmetrical to each other, and the local annular wall 111a on both sides of the convex ring part 111 which are symmetrical to each other is dissipated by the arc-shaped hole 12. The main body of the fin 1 is separated. The heat pipe 2 passes through the through holes 11 of the plurality of radiating fins 1 connected in series in the plate thickness direction. [Selection] Figure 5
Description
本発明は、放熱装置に関し、詳しくは、放熱フィンとヒートパイプとの結合に関し、特に放熱フィンとヒートパイプの結合に関する。 The present invention relates to a heat radiating device, and more particularly, to a coupling between a radiating fin and a heat pipe, and more particularly, to a coupling between a radiating fin and a heat pipe.
従来の放熱装置における放熱フィンとヒートパイプとの結合は溶接方式を採用する。溶接作業は、環境保護に不利であり、作業が煩雑で、熱閉塞現象も生じるので、より一層改善する必要がある。 A welding method is used for coupling the heat radiating fin and the heat pipe in the conventional heat radiating device. The welding work is disadvantageous for environmental protection, the work is complicated, and a thermal clogging phenomenon also occurs, so that further improvement is necessary.
特許文献1に記載のヒートパイプと放熱フィンの結合方法は、放熱フィンに貫通穴を開設し、貫通穴に環状突壁を設け、治具及び側圧技術の組み合わせによりヒートパイプを貫通穴に嵌挿した後に、組立体を変形させることによってヒートパイプと放熱フィンとの結合を図る。しかし、前述の結合方法では、単にヒートパイプの上端の片側のみにおいて、側圧変形方式で貫通穴の環状突壁とヒートパイプとの間を結合させるため、前記ヒートパイプも貫通穴の環状突壁もいずれも片辺の効果しか生じないのである。実際は、平均かつ堅固な結合を確実に得ることができない。
In the method of connecting a heat pipe and a heat radiating fin described in
上記の結合方法では、その圧力が完全に変形の片側に偏って集中しているため、前記貫通穴の環状突壁とヒートパイプとの変形量を正確に把握することは不可能である。故に、両者の変形量が完全に同じになるように制御することは難しい。例えば、貫通穴の環状突壁の変形量がヒートパイプの変形量よりも大きい場合には、前記環状突壁がヒートパイプの管体を過度に圧迫することになり、ヒートパイプの損傷が起こる。また、例えばヒートパイプの内壁の毛細管構造が崩れて脱落または離脱すると、熱伝達機能が損う。あるいは、もし、貫通穴の環状突壁の変形量がヒートパイプの変形量よりも小さい場合、前記環状突壁がヒートパイプの管体を完全に圧迫することができず、必ず間隔隙間が生じる。故に、緊迫結合効果を得ることは不可能である。 In the above coupling method, since the pressure is completely concentrated on one side of the deformation, it is impossible to accurately grasp the deformation amount of the annular projecting wall of the through hole and the heat pipe. Therefore, it is difficult to control so that both deformation amounts become the same. For example, when the deformation amount of the annular projecting wall of the through hole is larger than the deformation amount of the heat pipe, the annular projecting wall excessively presses the tube of the heat pipe, and the heat pipe is damaged. Further, for example, if the capillary structure of the inner wall of the heat pipe collapses and falls off or leaves, the heat transfer function is impaired. Alternatively, if the deformation amount of the annular projecting wall of the through hole is smaller than the deformation amount of the heat pipe, the annular projecting wall cannot completely press the tube of the heat pipe, and an interval gap is always generated. Therefore, it is impossible to obtain a tight binding effect.
本発明は、放熱フィンとヒートパイプとが緊締に結合されている放熱装置を提供することを目的とする。 An object of the present invention is to provide a heat radiating device in which a radiating fin and a heat pipe are tightly coupled.
本発明による放熱装置は、複数の放熱フィンとヒートパイプとを備える。複数の前記放熱フィンは、板厚方向に直列に接続されており、いずれも少なくとも1つの貫通穴が形成されており、貫通穴から延伸する凸環部が設けられており、凸環部の互いに対称である両側に凸環部と隣接する弧状孔が形成されており、弧状孔により凸環部の互いに対称である両側の局部環状壁と放熱フィンの本体とが分離する。
ヒートパイプは板厚方向に直列に接続されている複数の放熱フィンの貫通穴を貫通する。
ヒートパイプが複数の放熱フィンの貫通穴を貫通してから、凸環部の互いに対称である両側の局部環状壁をプレス加工により変形させ、複数の放熱フィンの互いに対称である両側の局部環状壁とヒートパイプとの間に互いに対称である結合を形成する。
ことにより、放熱フィンとヒートパイプとの間に、互いに対称である両側の結合が形成される。よって、貫通穴の局部環状壁とヒートパイプとの変形量の平均が完全に同じになるように正確に把握することができる。そのため、最適な安定した結合効果を得ることができ、かつヒートパイプの管体を過度に圧迫することなく、貫通穴の局部環状壁とヒートパイプとを完全に密着にすることが確保される。故に、局部環状壁とヒートパイプとの間には完全にいかなる間隔隙間も存在することなく、緊締に結合する効果を確実に実現することができる。
The heat dissipation device according to the present invention includes a plurality of heat dissipation fins and a heat pipe. The plurality of radiating fins are connected in series in the plate thickness direction, each of which is provided with at least one through hole, and provided with a convex ring portion extending from the through hole. An arcuate hole adjacent to the convex ring part is formed on both sides that are symmetrical, and the local annular walls on both sides of the convex ring part that are symmetrical to each other and the main body of the radiation fin are separated by the arcuate hole.
The heat pipe penetrates through holes of a plurality of radiating fins connected in series in the thickness direction.
After the heat pipe passes through the through holes of the plurality of radiating fins, the local annular walls on both sides of the convex ring portion that are symmetrical to each other are deformed by pressing, and the local annular walls on both sides that are symmetric to each other of the plurality of radiating fins A symmetric bond is formed between the heat pipe and the heat pipe.
Thereby, the coupling | bonding of the both sides which are mutually symmetrical is formed between a radiation fin and a heat pipe. Therefore, it is possible to accurately grasp the average deformation amount of the local annular wall of the through hole and the heat pipe so as to be completely the same. Therefore, it is possible to obtain an optimal and stable coupling effect, and to ensure that the local annular wall of the through hole and the heat pipe are completely brought into close contact without excessively pressing the pipe body of the heat pipe. Therefore, it is possible to reliably realize the effect of tightly coupling without any gap between the local annular wall and the heat pipe.
また、放熱フィンの貫通穴の互いに対称である両側の局部環状壁とヒートパイプとの間のプレス加工による結合面が平面であることで、両側が平均的に圧合される効果を得ることができる。 In addition, since the connecting surface by press working between the local annular walls on both sides that are symmetrical to each other of the through holes of the heat radiating fins and the heat pipe is a flat surface, it is possible to obtain an effect that the both sides are pressed together on average. it can.
また、放熱フィンの貫通穴の互いに対称である両側の局部環状壁とヒートパイプとの間のプレス加工による結合面が凹面であることで、両側が平均的に圧合される効果を得ることができる。 Moreover, the joint surface by the press work between the local annular walls on both sides that are symmetrical to each other of the through holes of the heat radiating fins and the heat pipe is a concave surface, so that the effect that both sides are pressed together on average can be obtained. it can.
(一実施形態)
図1〜図5に示すように、本発明の一実施形態による放熱装置は、主に複数の放熱フィン1と、1本のヒートパイプ2とを備える。
(One embodiment)
As shown in FIGS. 1 to 5, the heat radiating device according to one embodiment of the present invention mainly includes a plurality of
なお、複数の放熱フィン1は板厚方向に直列に接続されており、各放熱フィン1のいずれにも、少なくとも1つの貫通穴11を有する。貫通穴11は、延伸する凸環部111を有する。凸環部111の互いに対称である両側には、それぞれ隣接する弧状孔12が開設されている。ことにより、前記凸環部111の互いに対称である両側の局部環状壁111aと、放熱フィン1の本体とが分離する。
The plurality of radiating
ヒートパイプ2は、板厚方向に直列に接続されている当該放熱フィン1の貫通穴11を貫通する。
The
ヒートパイプ2が放熱フィン1の貫通穴11(図2、図3参照)を貫通し、凸環部111の互いに対称である両側の局部環状壁111aをプレス加工により変形させ(図4、図5参照)、放熱フィン1の両側の局部環状壁111aとヒートパイプ2との間には、互いに対称である両側の緊締な結合が形成される。
The
前記貫通穴11の局部環状壁111aとヒートパイプ2との変形量は、互いに対称である両側のプレス加工方式を採用するため、局部環状壁111aとヒートパイプ2との変形量の平均が完全に同じになるように正確に把握することができる。そのため、最適な安定した結合効果を得ることができ、ヒートパイプ2の管体を過度に圧迫することなく、局部環状壁111aとヒートパイプ2との間にもいかなる間隔隙間が生じることはない。
The deformation amount of the local
本実施形態では、局部環状壁111aとヒートパイプ2との間のプレス加工による結合面が平面であるため、両側が平均的に圧合される効果を得ることができることを意味している。
In this embodiment, since the joint surface by the press work between the local
(他の実施形態)
プレス加工による結合面は、平面に限定されるものではない。例えば図6、図7に示す他の実施形態では、前記貫通穴11の局部環状壁111aとヒートパイプ2とのプレス加工による結合面は、凹面である。よって、両側が平均的に圧合される効果を得ることができる。
(Other embodiments)
The bonding surface by press working is not limited to a flat surface. For example, in another embodiment shown in FIGS. 6 and 7, the joining surface of the local
従来のヒートパイプの形態において、寸法サイズの相異の他にも、円形管体を有するヒートパイプに限らず、例えば薄平の楕円形のヒートパイプであってもよく、その管体は、薄平の楕円形を呈する。
本発明の他の実施形態では、扁薄型ヒートパイプを適用し、図8に示すように、貫通穴の凸環部111の局部環状壁111aと、薄平の楕円形のヒートパイプ2’の管体との間のプレス加工による結合面は平面である。よって、両側が平均的に圧合される効果を得ることができる。
In the conventional heat pipe configuration, in addition to the difference in size and size, the heat pipe is not limited to a circular pipe, and may be, for example, a thin and elliptical heat pipe. Presents a flat oval shape.
In another embodiment of the present invention, a thin heat pipe is applied. As shown in FIG. 8, the local
また、図9に示すように、前記局部環状壁111aと薄平の楕円形のヒートパイプ2’との間のプレス加工による結合面は凹面である。よって、両側が平均的に圧合される効果を得ることもできる。
Further, as shown in FIG. 9, the bonding surface formed by pressing between the local
本発明による放熱装置の放熱フィンとヒートパイプとの結合において、互いに対称である両側でプレス加工を行うことで、貫通穴の局部環状壁とヒートパイプとの変形量の平均が完全に同じになるよう、より正確に把握することができる。そのため、ヒートパイプを十分に保護することが可能であり、最適かつ安定である緊締な結合効果を兼ね備えることができる。 In the coupling of the heat dissipating fins and the heat pipe of the heat dissipating device according to the present invention, the average deformation amount of the local annular wall of the through hole and the heat pipe becomes completely the same by performing press processing on both sides that are symmetrical to each other. So that it can be grasped more accurately. Therefore, it is possible to sufficiently protect the heat pipe, and it is possible to combine a tight coupling effect that is optimal and stable.
1:放熱フィン
2:ヒートパイプ、
11:貫通穴、
111:凸環部、
12:弧状孔、
111a:局部環状壁、
2’:ヒートパイプ。
1: Radiation fin 2: Heat pipe,
11: through hole,
111: convex ring part,
12: Arc hole,
111a: local annular wall,
2 ': Heat pipe.
Claims (6)
複数の前記放熱フィンは、板厚方向に直列に接続されており、いずれも少なくとも1つの貫通穴が形成されており、前記貫通穴から延伸する凸環部が設けられており、前記凸環部の互いに対称である両側に前記凸環部と隣接する弧状孔が形成されており、前記弧状孔により前記凸環部の互いに対称である両側の局部環状壁と前記放熱フィンの本体とが分離し、
前記ヒートパイプは板厚方向に直列に接続されている複数の前記放熱フィンの前記貫通穴を貫通し、
前記ヒートパイプが複数の前記放熱フィンの前記貫通穴を貫通してから、前記凸環部の互いに対称である両側の前記局部環状壁をプレス加工により変形させ、複数の前記放熱フィンの互いに対称である両側の前記局部環状壁と前記ヒートパイプとの間に互いに対称である結合を形成することを特徴とする放熱装置。 It has a plurality of radiating fins and heat pipes,
The plurality of heat radiating fins are connected in series in the plate thickness direction, all of which are provided with at least one through hole, and are provided with a convex ring portion extending from the through hole, and the convex ring portion Arc-shaped holes adjacent to the convex ring portion are formed on both sides of the convex ring portion, and local circular walls on both sides of the convex ring portion that are symmetrical to each other and the main body of the radiation fin are separated by the arc-shaped hole. ,
The heat pipe passes through the through holes of the plurality of heat radiating fins connected in series in the plate thickness direction,
After the heat pipe passes through the through-holes of the plurality of radiating fins, the local annular walls on both sides that are symmetrical to each other of the convex ring portions are deformed by pressing, and the radiating fins are symmetrical to each other. A heat radiating device characterized in that a symmetric connection is formed between the local annular wall on one side and the heat pipe.
Applications Claiming Priority (2)
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CN201410165019.1A CN104089507B (en) | 2014-04-23 | 2014-04-23 | The radiating fin of close-fitting combination and heat pipe |
CN201410165019.1 | 2014-04-23 |
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JP (1) | JP5770894B1 (en) |
KR (1) | KR20150122562A (en) |
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FR2402850A1 (en) * | 1977-09-09 | 1979-04-06 | Ferodo Sa | FINNED TUBE DEVICE FOR A HEAT EXCHANGER, IN PARTICULAR FOR A MOTOR VEHICLE RADIATOR, AND THE MANUFACTURING PROCESS |
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CN2664190Y (en) * | 2003-10-27 | 2004-12-15 | 吴惠然 | Heat pipe combined radiating fin sets improved structure |
CN2736927Y (en) * | 2004-09-28 | 2005-10-26 | 陈世明 | Riveted structure of heat pipe and radiating fin |
CN2736928Y (en) * | 2004-09-28 | 2005-10-26 | 元瑞科技股份有限公司 | Riveted structure of radiator and heat pipe |
US7120026B2 (en) * | 2004-10-06 | 2006-10-10 | Shyh-Ming Chen | Heat-dissipating device with heat conductive tubes |
CN2771790Y (en) * | 2004-12-31 | 2006-04-12 | 力致科技股份有限公司 | Improved combination structure for radiating fin with heat pipe |
TWI270339B (en) * | 2005-12-06 | 2007-01-01 | Shr-Ming Chen | Heat conduits and method for forming heat-dissipating fins by squeeze-shaping |
CN100462159C (en) * | 2006-07-04 | 2009-02-18 | 陈世明 | Vertical combined type heat transfer radiating device manufacturing method |
US20080055857A1 (en) * | 2006-09-05 | 2008-03-06 | Shyh-Ming Chen | Method for connecting heat pipes and a heat sink |
TWM316611U (en) * | 2006-11-30 | 2007-08-01 | Shr-Ming Chen | Connection structure of heat pipe and heat sink for tight attachment |
CN101460042A (en) * | 2007-12-14 | 2009-06-17 | 华硕电脑股份有限公司 | Heat radiating fin and heat radiator |
DE202008003178U1 (en) * | 2008-03-04 | 2008-05-29 | Asia Vital Components Co., Ltd., Hsin Chuan | Cooling ribs of a cooling module |
CN102271483B (en) * | 2010-06-07 | 2015-07-08 | 富瑞精密组件(昆山)有限公司 | Heat-dissipating combined structure |
CN102612298B (en) * | 2011-01-25 | 2016-08-10 | 国网山东省电力公司德州供电公司 | Heat abstractor and manufacture method thereof |
CN102832137A (en) * | 2011-06-15 | 2012-12-19 | 富准精密工业(深圳)有限公司 | Manufacturing method for heat radiation device |
TWM427767U (en) * | 2011-11-18 | 2012-04-21 | Jun-Heng Lin | Fixing structure of cooling module |
CN203869565U (en) * | 2014-04-23 | 2014-10-08 | 东莞汉旭五金塑胶科技有限公司 | Device achieving close-fitting of cooling fins and heat pipe |
-
2014
- 2014-04-23 CN CN201410165019.1A patent/CN104089507B/en active Active
- 2014-07-18 TW TW103212861U patent/TWM492432U/en unknown
- 2014-07-18 TW TW103124701A patent/TWI561788B/en active
- 2014-07-29 US US14/446,101 patent/US20150308749A1/en not_active Abandoned
- 2014-08-01 JP JP2014157720A patent/JP5770894B1/en active Active
- 2014-08-25 DE DE102014112142.2A patent/DE102014112142A1/en not_active Ceased
- 2014-08-29 KR KR1020140114188A patent/KR20150122562A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TWI561788B (en) | 2016-12-11 |
TWM492432U (en) | 2014-12-21 |
TW201541049A (en) | 2015-11-01 |
JP2015210073A (en) | 2015-11-24 |
CN104089507A (en) | 2014-10-08 |
DE102014112142A1 (en) | 2015-10-29 |
KR20150122562A (en) | 2015-11-02 |
CN104089507B (en) | 2017-01-04 |
US20150308749A1 (en) | 2015-10-29 |
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