JP2007531322A - 互いに適合性を有する薬剤を用いた基板のブラシスクラブおよび近接洗浄乾燥手順、近接基板前処理手順、並びに、その方法、装置、および、システム - Google Patents
互いに適合性を有する薬剤を用いた基板のブラシスクラブおよび近接洗浄乾燥手順、近接基板前処理手順、並びに、その方法、装置、および、システム Download PDFInfo
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Abstract
【解決手段】 基板の表面および背面を洗浄および乾燥するための方法が開示されている。その方法は、ブラシ・近接洗浄および/または乾燥システム(110)を用いて、基板の背面をブラシスクラブする工程を備える。システムは、チャンバ(104)と、作動要素(114)に固定された表面用および背面用の近接ヘッド(110a)および(110b)と、システム制御部(116)とを備える。チャンバは、ウエハ(102)を保持して回転させるよう構成された複数のローラ(108)を備える。その方法は、背面のブラシスクラブ工程の終了後、基板の表面の上に表面用メニスカスを供給する工程を備える。
【選択図】図1A
Description
Claims (20)
- 基板の表面および背面を洗浄および乾燥するための方法であって、
流体ブラシスクラブ剤を用いて、前記基板の前記背面をブラシスクラブする工程と、
前記背面の前記ブラシスクラブ工程の終了後、前記基板の前記表面の上に表面用メニスカスを供給する工程と、
を備え、
前記表面用メニスカスは、前記流体ブラシスクラブ剤と化学的な適合性を有する表面用洗浄剤を含む、方法。 - 請求項1に記載の方法であって、さらに、
前記基板の前記表面を走査する工程を備える、方法。 - 請求項1に記載の方法であって、さらに、
前記基板の前記背面の上に背面用メニスカスを供給する工程を備え、
前記背面用メニスカスは、前記流体ブラシスクラブ剤と化学的な適合性を有する背面用洗浄剤を含む、方法。 - 請求項3に記載の方法であって、さらに、
前記基板の前記背面を走査する工程を備える、方法。 - 請求項1に記載の方法であって、前記表面用メニスカスの前記表面用洗浄剤と、前記背面用メニスカスの前記背面用洗浄剤とが、前記ブラシスクラブ流体薬剤と化学的な適合性を有するよう構成されていることにより、前記基板の前記表面の化学汚染を防止する、方法。
- 請求項5に記載の方法であって、化学汚染により、粒子状汚染物質が生じる、方法。
- 基板前処理システムであって、
ブラシスクラブ剤を用いて、基板の背面をブラシスクラブするよう構成されたブラシと、
前記基板の表面に近接するよう配置された表面用ヘッドと、
前記基板の前記背面に近接するよう配置された背面用ヘッドと、
を備え、
前記背面用ヘッドは、前記表面用ヘッドのほぼ反対側に配置され、
前記表面用ヘッドと前記背面用ヘッドとは、前記ブラシが前記基板を離れた時に、対になって前記基板に適用される、システム。 - 請求項7に記載のシステムであって、前記表面用ヘッドは、前記基板の前記表面を走査するよう構成されており、前記背面用ヘッドは、ほぼ同調して前記基板の前記背面を走査するよう構成されている、システム。
- 請求項7に記載のシステムであって、前記表面用ヘッドは、第1の表面用導管と、第2の表面用導管と、第3の表面用導管とを備え、前記第1の表面用導管と、前記第2の表面用導管と、前記第3の表面用導管とは、動作中に、ほぼ同時に作動するよう構成されており、前記背面用ヘッドは、第1の背面用導管と、第2の背面用導管と、第3の背面用導管とを備え、前記第1の背面用導管と、前記第2の背面用導管と、前記第3の背面用導管とは、動作中に、ほぼ同時に作動するよう構成されている、システム。
- 請求項7に記載のシステムであって、さらに、
前記表面用ヘッドに固定され、前記表面用ヘッドを前記基板の前記表面に近接するよう移動させる表面用アームと、
前記背面用ヘッドに固定され、前記表面用ヘッドとほぼ同時に前記背面用ヘッドを前記基板の前記背面に近接するよう移動させる背面用アームと、
を備える、システム。 - 基板の表面を前処理するための方法であって、
メニスカスを用いて、前記基板の前記表面を走査する工程と、
前記メニスカスを用いて、前記基板の前記表面を前処理する工程と、
リンス動作を実行せずに、前記前処理後の前記基板の前記表面に対して、次の前処理動作を実行する工程と、
を備える、方法。 - 請求項11に記載の方法であって、前記前処理後の前記基板の前記表面は、乾燥するよう構成されている、方法。
- 請求項11に記載の方法であって、前記メニスカスは、基板表面を前処理する特性を有する流体を含む、方法。
- 請求項11に記載の方法であって、前記基板の前記表面を前処理する工程は、前記基板の前記表面を洗浄する動作と、前記基板の前記表面の上に形成された層を剥離する動作と、の内の一方を備え、前記次の前処理動作は、前記基板の前記表面の上に層を形成する動作と、前記基板を保管する動作と、の内の一方を備える、方法。
- 基板の表面を前処理するための方法であって、
前記基板の前記表面の上に第1のメニスカスを供給して、前記基板の前記表面を前処理する工程と、
前記前処理後の前記基板の前記表面の上に第2のメニスカスを供給して、前記前処理後の前記基板の前記表面に対して、2回目の前処理動作を実行する工程と、
を備え、
前記第2のメニスカスの供給は、リンス動作を実行することなく、前記第1のメニスカスの供給のほぼ直後に行われるよう構成されている、方法。 - 請求項15に記載の方法であって、前記基板の前記表面を前処理する工程は、前記基板の前記表面の上に形成された層を除去する動作を備える、方法。
- 請求項15に記載の方法であって、前記基板の前記表面の上に前記第1のメニスカスを供給する工程は、供給後に前記基板の前記表面が実質的に乾燥するよう構成されている、方法。
- 請求項15に記載の方法であって、前記基板の前記表面の上に前記第1のメニスカスを供給する工程は、沈殿残留物を生成するよう構成されている、方法。
- 請求項15に記載の方法であって、前記前処理後の前記基板の前記表面の上に前記第2のメニスカスを供給する工程は、前記前処理後の前記基板の前記表面の上に材料層を形成する動作を備える、方法。
- 請求項15に記載の方法であって、前記第1のメニスカスは第1の薬剤を含み、前記第2のメニスカスは第2の薬剤を含み、前記前処理後の前記基板の前記表面の上に形成される前記材料層は、前記第2のメニスカスの前記第2の薬剤と沈殿残留物との間の化学反応の結果として形成される、方法。
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US10/816,432 US7045018B2 (en) | 2002-09-30 | 2004-03-31 | Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same |
US10/882,716 US8236382B2 (en) | 2002-09-30 | 2004-06-30 | Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same |
PCT/US2005/010154 WO2005096910A1 (en) | 2004-03-31 | 2005-03-25 | Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and proximity substrate preparation sequence, and methods, apparatus, and systems for implementing the same |
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JP2007531322A true JP2007531322A (ja) | 2007-11-01 |
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US (1) | US8236382B2 (ja) |
EP (1) | EP1729624A1 (ja) |
JP (1) | JP2007531322A (ja) |
KR (3) | KR20060132987A (ja) |
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KR101475994B1 (ko) * | 2009-04-14 | 2014-12-23 | 램 리써치 코포레이션 | 기판상의 입자들을 제거하기 위해 점탄성 세정 물질을 이용하기 위한 장치 및 방법 |
JP2015230942A (ja) * | 2014-06-04 | 2015-12-21 | 株式会社Screenホールディングス | 基板処理方法 |
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US7969548B2 (en) * | 2006-05-22 | 2011-06-28 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cleaning method |
US7615486B2 (en) * | 2007-04-17 | 2009-11-10 | Lam Research Corporation | Apparatus and method for integrated surface treatment and deposition for copper interconnect |
JP4755573B2 (ja) * | 2006-11-30 | 2011-08-24 | 東京応化工業株式会社 | 処理装置および処理方法、ならびに表面処理治具 |
US8021512B2 (en) * | 2007-05-14 | 2011-09-20 | Lam Research Corporation | Method of preventing premature drying |
JP4971078B2 (ja) * | 2007-08-30 | 2012-07-11 | 東京応化工業株式会社 | 表面処理装置 |
US20090101166A1 (en) * | 2007-10-18 | 2009-04-23 | Lam Research Corporation | Apparatus and methods for optimizing cleaning of patterned substrates |
FR3043679B1 (fr) * | 2015-11-12 | 2021-07-23 | Aptar Stelmi Sas | Procede de traitement d'un element de conditionnement en elastomere, et element de conditionnement ainsi traite. |
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- 2005-03-25 WO PCT/US2005/010154 patent/WO2005096910A1/en not_active Application Discontinuation
- 2005-03-25 KR KR1020067020514A patent/KR20060132987A/ko not_active IP Right Cessation
- 2005-03-25 CN CN201010166996.5A patent/CN101853781B/zh not_active Expired - Fee Related
- 2005-03-25 KR KR1020137003879A patent/KR101283307B1/ko not_active IP Right Cessation
- 2005-03-25 JP JP2007506399A patent/JP2007531322A/ja active Pending
- 2005-03-25 KR KR1020127023986A patent/KR101312571B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
CN101853781B (zh) | 2015-08-19 |
WO2005096910A1 (en) | 2005-10-20 |
EP1729624A1 (en) | 2006-12-13 |
KR20060132987A (ko) | 2006-12-22 |
US8236382B2 (en) | 2012-08-07 |
US20050158473A1 (en) | 2005-07-21 |
CN101853781A (zh) | 2010-10-06 |
KR101283307B1 (ko) | 2013-07-12 |
KR20130032394A (ko) | 2013-04-01 |
MY143289A (en) | 2011-04-15 |
KR20120108063A (ko) | 2012-10-04 |
KR101312571B1 (ko) | 2013-09-30 |
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Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120710 |