DE69828592T8 - Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat - Google Patents

Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat Download PDF

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Publication number
DE69828592T8
DE69828592T8 DE69828592T DE69828592T DE69828592T8 DE 69828592 T8 DE69828592 T8 DE 69828592T8 DE 69828592 T DE69828592 T DE 69828592T DE 69828592 T DE69828592 T DE 69828592T DE 69828592 T8 DE69828592 T8 DE 69828592T8
Authority
DE
Germany
Prior art keywords
liquid
substrate
locally
ambient boundary
doing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE69828592T
Other languages
English (en)
Other versions
DE69828592D1 (de
DE69828592T2 (de
Inventor
Paul Mertens
Marc Meuris
Marc Heyns
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP98870056A external-priority patent/EP0905746A1/de
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of DE69828592D1 publication Critical patent/DE69828592D1/de
Publication of DE69828592T2 publication Critical patent/DE69828592T2/de
Application granted granted Critical
Publication of DE69828592T8 publication Critical patent/DE69828592T8/de
Active legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE69828592T 1997-09-24 1998-09-24 Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat Active DE69828592T8 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US5992997P 1997-09-24 1997-09-24
US59929P 1997-09-24
EP98870056A EP0905746A1 (de) 1997-09-24 1998-03-20 Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat
EP98870056 1998-03-20
US7968898P 1998-03-27 1998-03-27
US79688P 1998-03-27
US9803898P 1998-08-27 1998-08-27
US98038P 1998-08-27
PCT/BE1998/000140 WO1999016109A1 (en) 1997-09-24 1998-09-24 Method and apparatus for removing a liquid from a surface

Publications (3)

Publication Number Publication Date
DE69828592D1 DE69828592D1 (de) 2005-02-17
DE69828592T2 DE69828592T2 (de) 2006-03-23
DE69828592T8 true DE69828592T8 (de) 2006-06-08

Family

ID=27443760

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69828592T Active DE69828592T8 (de) 1997-09-24 1998-09-24 Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat

Country Status (5)

Country Link
EP (1) EP0970511B1 (de)
JP (1) JP4017680B2 (de)
AT (1) ATE287126T1 (de)
DE (1) DE69828592T8 (de)
WO (1) WO1999016109A1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
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US7234477B2 (en) 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
US7584761B1 (en) 2000-06-30 2009-09-08 Lam Research Corporation Wafer edge surface treatment with liquid meniscus
US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
KR100416590B1 (ko) * 2001-01-13 2004-02-05 삼성전자주식회사 반도체 웨이퍼 세정장치 및 이를 이용한 웨이퍼 세정방법
US7100304B2 (en) * 2001-06-12 2006-09-05 Akrion Technologies, Inc. Megasonic cleaner and dryer
DE60218163T2 (de) 2001-06-12 2007-11-22 Akrion Technologies Inc., Wilmington Megaschallreinigungs- und trocknungsvorrichtung
DE10200525A1 (de) * 2002-01-09 2003-10-23 Mattson Wet Products Gmbh Vorrichtung und Verfahren zum Behandeln von scheibenförmigen Substraten
US7389783B2 (en) 2002-09-30 2008-06-24 Lam Research Corporation Proximity meniscus manifold
US7614411B2 (en) 2002-09-30 2009-11-10 Lam Research Corporation Controls of ambient environment during wafer drying using proximity head
US7329321B2 (en) * 2002-09-30 2008-02-12 Lam Research Corporation Enhanced wafer cleaning method
US7045018B2 (en) 2002-09-30 2006-05-16 Lam Research Corporation Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7513262B2 (en) 2002-09-30 2009-04-07 Lam Research Corporation Substrate meniscus interface and methods for operation
US7069937B2 (en) 2002-09-30 2006-07-04 Lam Research Corporation Vertical proximity processor
US7632376B1 (en) 2002-09-30 2009-12-15 Lam Research Corporation Method and apparatus for atomic layer deposition (ALD) in a proximity system
PL208012B1 (pl) * 2002-09-30 2011-03-31 Lam Res Corp Sposób i system do obróbki płytek półprzewodnikowych oraz przyrząd i głowica do stosowania tego sposobu
US7153400B2 (en) 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US7240679B2 (en) 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US8236382B2 (en) 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7293571B2 (en) 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus
TWI230396B (en) * 2002-09-30 2005-04-01 Lam Res Corp System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7704367B2 (en) 2004-06-28 2010-04-27 Lam Research Corporation Method and apparatus for plating semiconductor wafers
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7170190B1 (en) 2003-12-16 2007-01-30 Lam Research Corporation Apparatus for oscillating a head and methods for implementing the same
US7350315B2 (en) 2003-12-22 2008-04-01 Lam Research Corporation Edge wheel dry manifold
US8062471B2 (en) 2004-03-31 2011-11-22 Lam Research Corporation Proximity head heating method and apparatus
US7089687B2 (en) 2004-09-30 2006-08-15 Lam Research Corporation Wafer edge wheel with drying function
US8480810B2 (en) 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US8813764B2 (en) 2009-05-29 2014-08-26 Lam Research Corporation Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
JP4810411B2 (ja) 2006-11-30 2011-11-09 東京応化工業株式会社 処理装置
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US7975708B2 (en) 2007-03-30 2011-07-12 Lam Research Corporation Proximity head with angled vacuum conduit system, apparatus and method
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US8388762B2 (en) 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US20110289795A1 (en) 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
JP5538102B2 (ja) 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
JP2014130883A (ja) * 2012-12-28 2014-07-10 Ebara Corp 基板洗浄装置及び基板洗浄方法
JP6376553B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN108198748B (zh) * 2014-02-27 2022-04-29 斯克林集团公司 基板处理装置
KR102308587B1 (ko) 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP6376554B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI667686B (zh) 2015-01-23 2019-08-01 日本思可林集團股份有限公司 基板處理方法及基板處理裝置暨流體噴嘴
JP6461621B2 (ja) * 2015-01-23 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027686A (en) * 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
JP3351082B2 (ja) * 1994-01-14 2002-11-25 ソニー株式会社 基板乾燥方法と、基板乾燥槽と、ウェーハ洗浄装置および半導体装置の製造方法
DE19522525A1 (de) * 1994-10-04 1996-04-11 Kunze Concewitz Horst Dipl Phy Verfahren und Vorrichtung zum Feinstreinigen von Oberflächen
JPH09162159A (ja) * 1995-12-05 1997-06-20 Dainippon Screen Mfg Co Ltd 回転式基板乾燥装置
EP0905746A1 (de) * 1997-09-24 1999-03-31 Interuniversitair Micro-Elektronica Centrum Vzw Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat
ATE311665T1 (de) * 1997-09-24 2005-12-15 Imec Inter Uni Micro Electr Verfahren und vorrichtung zum entfernen von einer flüssigkeit von der oberfläche eines rotierenden substrats

Also Published As

Publication number Publication date
JP4017680B2 (ja) 2007-12-05
WO1999016109A1 (en) 1999-04-01
JP2001506061A (ja) 2001-05-08
EP0970511A1 (de) 2000-01-12
DE69828592D1 (de) 2005-02-17
EP0970511B1 (de) 2005-01-12
DE69828592T2 (de) 2006-03-23
ATE287126T1 (de) 2005-01-15

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