JP2007150172A - 基板の処理装置 - Google Patents
基板の処理装置 Download PDFInfo
- Publication number
- JP2007150172A JP2007150172A JP2005345580A JP2005345580A JP2007150172A JP 2007150172 A JP2007150172 A JP 2007150172A JP 2005345580 A JP2005345580 A JP 2005345580A JP 2005345580 A JP2005345580 A JP 2005345580A JP 2007150172 A JP2007150172 A JP 2007150172A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing liquid
- processing apparatus
- oscillator
- supply path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 95
- 239000007788 liquid Substances 0.000 claims abstract description 87
- 238000001816 cooling Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 abstract description 9
- 230000000630 rising effect Effects 0.000 abstract description 2
- 230000010355 oscillation Effects 0.000 abstract 3
- 238000005406 washing Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 15
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
【解決手段】超音波振動を与えた処理液によって基板を処理する基板の処理装置であって、直方体状であって、長手方向の一端部の下面に開口するとともに長手方向の他端部に向かって傾斜して形成された処理液の供給路35を有する発振体32と、発振体の上面に設けられ発振体を超音波振動させる振動子34と、供給路に供給される処理液を冷却する熱交換器とを具備する。
【選択図】図2
Description
直方体状であって、長手方向の一端部の下面に開口するとともに長手方向の他端部に向かって傾斜して形成された上記処理液の供給路を有する発振体と、
この発振体の上面に設けられ発振体を超音波振動させる振動子と、
上記供給路に供給される処理液を冷却する冷却手段と
を具備したことを特徴とする基板の処理装置にある。
この回転テーブルの上面で上記基板の径方向に沿って揺動駆動されるアーム体を有し、
上記アーム体の先端部に上記発振体が下面を上記基板に対向するよう設けられることが好ましい。
まず、冷却体45の流路46に冷却媒体を流すとともに、アーム体22を下方向に駆動し、発振体32の下面を回転テーブル3に保持された基板Wの上面の中央部分にわずかな間隔を介して対向させる。このとき、発振体32は、基板Wの径方向に対して、下面に開口した供給路35の先端が基板Wの回転中心とほぼ一致するよう位置決めする。
Claims (6)
- 超音波振動を与えた処理液によって基板を処理する基板の処理装置であって、
直方体状であって、長手方向の一端部の下面に開口するとともに長手方向の他端部に向かって傾斜して形成された上記処理液の供給路を有する発振体と、
この発振体の上面に設けられ発振体を超音波振動させる振動子と、
上記供給路に供給される処理液を冷却する第1の冷却手段と
を具備したことを特徴とする基板の処理装置。 - 上記発振体には、この発振体を冷却する第2の冷却手段が設けられていることを特徴とする請求項1記載の基板の処理装置。
- 上記供給路に供給された処理液は、加速されずに上記基板に供給されることを特徴とする請求項1記載の基板の処理装置。
- 上記第1の冷却手段は、上記処理液の温度を10〜18℃に冷却することを特徴とする請求項1記載の基板の処理装置。
- 上記処理液の供給路には、この処理液に気体を溶解させる気体溶解手段が設けられていることを特徴とする請求項1記載の基板の処理装置。
- 上記基板を保持して回転駆動される回転テーブルと、
この回転テーブルの上面で上記基板の径方向に沿って揺動駆動されるアーム体を有し、
上記アーム体の先端部に上記発振体が下面を上記基板に対向するよう設けられることを特徴とする請求項1記載の基板の処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005345580A JP4652959B2 (ja) | 2005-11-30 | 2005-11-30 | 基板の処理装置 |
PCT/JP2006/323996 WO2007063962A1 (ja) | 2005-11-30 | 2006-11-30 | 基板の処理装置 |
US11/816,648 US7766021B2 (en) | 2005-11-30 | 2006-11-30 | Substrate treatment apparatus |
CNA2006800035216A CN101111928A (zh) | 2005-11-30 | 2006-11-30 | 基板处理装置 |
KR1020077017482A KR101272668B1 (ko) | 2005-11-30 | 2006-11-30 | 기판 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005345580A JP4652959B2 (ja) | 2005-11-30 | 2005-11-30 | 基板の処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007150172A true JP2007150172A (ja) | 2007-06-14 |
JP4652959B2 JP4652959B2 (ja) | 2011-03-16 |
Family
ID=38092295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005345580A Expired - Fee Related JP4652959B2 (ja) | 2005-11-30 | 2005-11-30 | 基板の処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7766021B2 (ja) |
JP (1) | JP4652959B2 (ja) |
KR (1) | KR101272668B1 (ja) |
CN (1) | CN101111928A (ja) |
WO (1) | WO2007063962A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012064800A (ja) * | 2010-09-16 | 2012-03-29 | Sumco Corp | ウェーハ洗浄装置 |
JP2013543653A (ja) * | 2010-09-24 | 2013-12-05 | ラム・リサーチ・アーゲー | 改良超音波洗浄方法および装置 |
KR101394090B1 (ko) * | 2007-10-22 | 2014-05-13 | 주식회사 케이씨텍 | 습식세정장치의 냉각구조 |
JP2019161161A (ja) * | 2018-03-16 | 2019-09-19 | 栗田工業株式会社 | 基板の洗浄装置及び基板の洗浄方法 |
KR20190135022A (ko) * | 2017-03-30 | 2019-12-05 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 세정 장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2966046B1 (fr) * | 2010-10-13 | 2013-04-26 | Mg Dev | Dispositif de nettoyage d'une prothese auditive |
US11141762B2 (en) * | 2015-05-15 | 2021-10-12 | Acm Research (Shanghai), Inc. | System for cleaning semiconductor wafers |
JP7032816B2 (ja) * | 2016-09-19 | 2022-03-09 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | 基板の洗浄方法及び洗浄装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10116809A (ja) * | 1996-10-11 | 1998-05-06 | Tadahiro Omi | 洗浄方法及び洗浄システム |
JP2004207469A (ja) * | 2002-12-25 | 2004-07-22 | Shibaura Mechatronics Corp | 処理液の供給装置及びスピン処理装置 |
JP2004273961A (ja) * | 2003-03-12 | 2004-09-30 | Ebara Corp | 金属配線形成基板の洗浄処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766164A (ja) * | 1993-08-30 | 1995-03-10 | Shimada Phys & Chem Ind Co Ltd | 薄板状物の回転洗浄装置 |
JP2900788B2 (ja) * | 1994-03-22 | 1999-06-02 | 信越半導体株式会社 | 枚葉式ウェーハ処理装置 |
KR0164007B1 (ko) * | 1994-04-06 | 1999-02-01 | 이시다 아키라 | 미세 패턴화된 레지스트막을 가지는 기판의 건조처리방법 및 장치 |
JPH0878368A (ja) * | 1994-09-07 | 1996-03-22 | Hitachi Ltd | ワークの処理方法および装置 |
TW494714B (en) * | 1995-04-19 | 2002-07-11 | Tokyo Electron Ltd | Method of processing substrate and apparatus for processing substrate |
JPH1133506A (ja) * | 1997-07-24 | 1999-02-09 | Tadahiro Omi | 流体処理装置及び洗浄処理システム |
US5990060A (en) * | 1997-02-25 | 1999-11-23 | Tadahiro Ohmi | Cleaning liquid and cleaning method |
JPH1154471A (ja) * | 1997-08-05 | 1999-02-26 | Tokyo Electron Ltd | 処理装置及び処理方法 |
ATE506702T1 (de) * | 2001-11-02 | 2011-05-15 | Product Systems Inc | Radialleistungs-megasonic-wandler |
JP4036815B2 (ja) * | 2003-10-31 | 2008-01-23 | シャープ株式会社 | 洗浄装置 |
-
2005
- 2005-11-30 JP JP2005345580A patent/JP4652959B2/ja not_active Expired - Fee Related
-
2006
- 2006-11-30 CN CNA2006800035216A patent/CN101111928A/zh active Pending
- 2006-11-30 US US11/816,648 patent/US7766021B2/en not_active Expired - Fee Related
- 2006-11-30 KR KR1020077017482A patent/KR101272668B1/ko active IP Right Grant
- 2006-11-30 WO PCT/JP2006/323996 patent/WO2007063962A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10116809A (ja) * | 1996-10-11 | 1998-05-06 | Tadahiro Omi | 洗浄方法及び洗浄システム |
JP2004207469A (ja) * | 2002-12-25 | 2004-07-22 | Shibaura Mechatronics Corp | 処理液の供給装置及びスピン処理装置 |
JP2004273961A (ja) * | 2003-03-12 | 2004-09-30 | Ebara Corp | 金属配線形成基板の洗浄処理装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101394090B1 (ko) * | 2007-10-22 | 2014-05-13 | 주식회사 케이씨텍 | 습식세정장치의 냉각구조 |
JP2012064800A (ja) * | 2010-09-16 | 2012-03-29 | Sumco Corp | ウェーハ洗浄装置 |
JP2013543653A (ja) * | 2010-09-24 | 2013-12-05 | ラム・リサーチ・アーゲー | 改良超音波洗浄方法および装置 |
KR20190135022A (ko) * | 2017-03-30 | 2019-12-05 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 세정 장치 |
JP2020516076A (ja) * | 2017-03-30 | 2020-05-28 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | 基板洗浄装置 |
US11298727B2 (en) | 2017-03-30 | 2022-04-12 | Acm Research (Shanghai) Inc. | Substrate cleaning apparatus |
JP7056969B2 (ja) | 2017-03-30 | 2022-04-19 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | 基板洗浄装置 |
KR102415678B1 (ko) * | 2017-03-30 | 2022-07-04 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 세정 장치 |
JP2019161161A (ja) * | 2018-03-16 | 2019-09-19 | 栗田工業株式会社 | 基板の洗浄装置及び基板の洗浄方法 |
Also Published As
Publication number | Publication date |
---|---|
US7766021B2 (en) | 2010-08-03 |
KR101272668B1 (ko) | 2013-06-10 |
KR20080070795A (ko) | 2008-07-31 |
WO2007063962A1 (ja) | 2007-06-07 |
US20090071511A1 (en) | 2009-03-19 |
JP4652959B2 (ja) | 2011-03-16 |
CN101111928A (zh) | 2008-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4652959B2 (ja) | 基板の処理装置 | |
JP5261077B2 (ja) | 基板洗浄方法および基板洗浄装置 | |
JP5449953B2 (ja) | 基板処理装置および基板処理方法 | |
JP5156488B2 (ja) | 基板洗浄装置および基板洗浄方法 | |
JP5420336B2 (ja) | 基板洗浄装置および基板洗浄方法 | |
JP5955601B2 (ja) | 基板処理装置および基板処理方法 | |
CN106328561B (zh) | 提高清洗均匀度的图形晶圆无损伤清洗装置 | |
JP5680699B2 (ja) | 基板洗浄方法および基板洗浄装置 | |
JP6940281B2 (ja) | 基板処理装置および基板処理方法 | |
JP2009088227A (ja) | 基板の処理装置及び処理方法 | |
JP3071398B2 (ja) | 洗浄装置 | |
JP2009170709A (ja) | 基板の処理装置及び処理方法 | |
JP4957277B2 (ja) | 洗浄装置および洗浄方法 | |
JP2004039843A (ja) | 基板洗浄装置および基板洗浄方法 | |
JP4197612B2 (ja) | 処理液の供給装置及びスピン処理装置 | |
JP4279008B2 (ja) | 基板処理装置および基板処理方法 | |
JP3960516B2 (ja) | 基板処理装置 | |
JP2010238744A (ja) | 超音波洗浄ユニット、超音波洗浄装置 | |
JP4068316B2 (ja) | 基板処理装置および基板処理方法 | |
JP2006040956A (ja) | 基板の処理装置及び処理方法 | |
KR101068710B1 (ko) | 기판세정장치 및 기판세정방법 | |
JP2005046713A (ja) | 振動発生装置及びその製法 | |
JP2006095458A (ja) | 枚葉式洗浄方法及び洗浄装置 | |
JP2003234322A (ja) | 基板の超音波処理装置及び超音波処理方法 | |
CN116779473A (zh) | 晶片清洗装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081112 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100427 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100628 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101214 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101216 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131224 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |